CN216411471U

CN216411471U - Semiconductor aging cold and hot testing device

Info

Publication number: CN216411471U
Application number: CN202121764055.1U
Authority: CN
Inventors: 姚松阳
Original assignee: Angsheng Shenzhen Intelligent Automation Technology Co ltd
Current assignee: Angsheng Shenzhen Intelligent Automation Technology Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-04-29
Anticipated expiration: 2031-07-30

Abstract

The utility model discloses a semiconductor aging cold and hot testing device, which belongs to the technical field of semiconductor testing, and adopts the technical scheme that the device comprises a bottom end plate and a rotary table, wherein a supporting cylinder is fixedly arranged on the outer wall of the top of the bottom end plate, the top end of the supporting cylinder is rotatably connected with the rotary table through a bearing, a driving mechanism is arranged on one side, opposite to the rotary table, of the supporting cylinder, a plurality of supporting mechanisms which are distributed equidistantly are fixedly arranged on the outer wall of the top of the rotary table, a first mounting frame and a second mounting frame which are symmetrically distributed are respectively and fixedly arranged on the outer wall of the top of the bottom end plate, and testing components are respectively arranged on the first mounting frame and the second mounting frame; the utility model provides a cold and hot testing arrangement of semiconductor aging, through being provided with bearing mechanism, can utilize the bracket that is provided with the through-hole and supports the end pole, carries out effectual spacing placing to the semiconductor of awaiting test to can ensure that the semiconductor can carry out abundant contact with the air, thereby make things convenient for subsequent heat transfer effect, with the effect that improves semiconductor aging testing.

Description

Semiconductor aging cold and hot testing device

Technical Field

The utility model belongs to the technical field of semiconductor testing, and particularly relates to a semiconductor aging cold and hot testing device.

Background

The importance of semiconductors is enormous, both from a technological and economic point of view. Most electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to a semiconductor. The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices fabricated using semiconductors.

In the production and processing process of the semiconductor, a cold and hot test is often required, and the tolerance degree of the semiconductor to cold and hot impact is judged according to the aging degree of the semiconductor; the existing semiconductor testing equipment can only check and process a single semiconductor, and in the actual operation process, in order to ensure the detection efficiency, the semiconductor needs to be taken out before being recovered to normal temperature, and then the next group of tests are carried out, so that certain limitations exist.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a semiconductor aging cold and hot testing device which has the advantages of high testing efficiency and accordance with modern production.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a cold and hot testing arrangement of semiconductor ageing, includes bottom board and revolving stage, the top outer wall fixed mounting of bottom board has a section of thick bamboo of propping, and the top of propping a section of thick bamboo passes through the bearing with the revolving stage and rotates and be connected, prop a section of thick bamboo and install actuating mechanism with relative one side of revolving stage, the top outer wall fixed mounting of revolving stage has the bearing mechanism that a plurality of equidistance distribute, the top outer wall of bottom board fixed mounting respectively has symmetric distribution's mounting bracket one and mounting bracket two, and all installs on mounting bracket one and the mounting bracket two and be provided with the test component, mounting bracket one and mounting bracket two relative one side fixed mounting have the crossbeam, and the crossbeam is provided with the trigger component with relative side-mounting of revolving stage.

Preferably, the supporting mechanism comprises a plurality of brackets which are fixedly arranged on the outer wall of the top of the rotary table at equal intervals, through holes which are uniformly distributed are formed in the inner bottom of each bracket, and a plurality of supporting end rods which are distributed in a staggered mode with the through holes are fixedly arranged on the inner bottom of each bracket.

Preferably, the test assembly comprises electric telescopic rods fixedly installed on the first mounting frame and the second mounting frame respectively, and end cylinders are fixedly installed at the end parts of the extension rods of the electric telescopic rods.

Preferably, both sides of the top end of one of the end cylinders are fixedly provided with a semiconductor refrigerator, the inner wall of the top of the other end cylinder is fixedly provided with a spiral heating wire, and one side of the outer wall of the top of the rotary table, which is close to the bracket, is provided with an annular groove matched with the bottom end of the end cylinder.

Preferably, the trigger assembly comprises a touch switch fixedly installed on one side of the outer wall of the bottom of the cross beam, the outer wall of the top of the rotary table is fixedly installed near the circle center and provided with a plurality of supporting arms in an inclined mode, an annular plate is fixedly installed on the top end of each supporting arm, the outer wall of the top of the annular plate is fixedly installed with touch supporting blocks corresponding to the number of the brackets, and an operation panel is fixedly installed on one side of the first installation frame.

Preferably, actuating mechanism includes fixed mounting in the step motor who props a section of thick bamboo one side outer wall, and step motor's output shaft key is connected with drive gear, the bottom outer wall fixed mounting of revolving stage have with the inner ring gear of drive gear looks adaptation, the bottom outer wall fixed mounting of revolving stage has spacing inner tube, and spacing inner tube with prop and rotate between the section of thick bamboo and be connected.

Preferably, the guide rods are fixedly mounted on two sides of the outer wall of the top of the end barrel, and the guide top barrel connected with the guide rods in a sliding mode is fixedly mounted on the first mounting frame and the second mounting frame.

In summary, the utility model has the following advantages:

1. through the arrangement of the plurality of bearing mechanisms, the semiconductor to be tested can be effectively limited and placed by utilizing the bracket provided with the through holes and the supporting end rods, and the semiconductor can be ensured to be fully contacted with air, so that the subsequent heat exchange effect is facilitated, and the effect of semiconductor aging test is improved; in the test process, a tester can perform loading and unloading treatment after the semiconductor is recovered to normal temperature, and the detection operation is not influenced;

2. the electric telescopic rod is arranged, so that the end barrel can be pushed to move downwards, and the bottom end of the end barrel is embedded into the annular groove to form a sealing effect, so that the semiconductor refrigerator and the spiral heating wire can be respectively utilized to effectively heat and cool two semiconductors to be detected, and the detection effect is greatly improved; by utilizing the arranged driving mechanism, the corresponding bracket can be driven by utilizing the stepping motor through the transmission action of the driving gear and the inner gear ring, and the fixed frequency moves to be right below the end cylinder, so that the detection efficiency is effectively improved;

3. by arranging the trigger assembly, when the touch resisting block rotates to the touch switch along with the rotary table, the electric telescopic rod can be controlled to be started, so that the end barrel is pushed to move downwards, and the automation degree of the testing device is improved; through the guide rod and the guide top cylinder which are arranged, the up-down movement of the end cylinder can be limited and guided, so that the up-down movement stability of the end cylinder is improved, and the smooth operation of the test operation is ensured.

Drawings

FIG. 1 is a perspective view of the present embodiment;

FIG. 2 is an enlarged perspective view taken at A in FIG. 2 of the present embodiment;

FIG. 3 is a schematic diagram showing a half-sectional perspective structure of the present embodiment;

FIG. 4 is a schematic perspective view of an embodiment of a two-end cartridge;

description of reference numerals: 1. a bottom end plate; 2. supporting the cylinder; 3. a first mounting frame; 4. an operation panel; 5. a turntable; 501. a limiting inner cylinder; 502. an inner gear ring; 6. an annular plate; 7. a support arm; 8. touching the butting block; 9. a touch switch; 10. a cross beam; 11. a second mounting frame; 12. an electric telescopic rod; 13. an end barrel; 1301. a semiconductor refrigerator; 14. an annular groove; 15. a bracket; 16. a through hole; 17. supporting the end rod; 18. a stepping motor; 19. a spiral heating wire; 20. a guide bar; 21. and (6) guiding the top cylinder.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.

The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model.

All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It is well within the skill of those in the art to implement, and not to be bound by any theory, the present invention is not limited to the specific details set forth in the specification.

The first embodiment is as follows:

the utility model provides a cold and hot testing arrangement of semiconductor ageing, as shown in fig. 1-3, including bottom end plate 1 and revolving stage 5, the top outer wall fixed mounting of bottom end plate 1 has a section of thick bamboo 2 of propping, and prop the top of a section of thick bamboo 2 and be connected through the bearing rotation with revolving stage 5, prop the relative one side of a section of thick bamboo 2 and revolving stage 5 and install actuating mechanism, the top outer wall fixed mounting of revolving stage 5 has a plurality of equidistance supporting mechanism that distribute, the top outer wall of bottom end plate 1 fixed mounting has symmetric distribution's mounting bracket one 3 and mounting bracket two 11 respectively, and all install on mounting bracket one 3 and the mounting bracket two 11 and be provided with test component, the relative one side fixed mounting of mounting bracket one 3 and mounting bracket two 11 has crossbeam 10, and crossbeam 10 is provided with trigger component with the relative one side installation of revolving stage 5.

By means of the structure, the arranged cross beam 10 can improve the overall structural strength of the device and ensure the smooth operation of the test operation.

Further, the supporting mechanism comprises a plurality of brackets 15 fixedly installed on the outer wall of the top of the rotary table 5 at equal intervals, through holes 16 which are evenly distributed are formed in the inner bottom of each bracket 15, and a plurality of supporting end rods 17 which are distributed in a staggered mode with the through holes 16 are fixedly installed on the inner bottom of each bracket 15.

By means of the structure, the semiconductor is placed on the bracket 15, the through hole 16 and the supporting end rod 17 are arranged, the semiconductor to be tested is effectively limited and placed, and the semiconductor can be fully contacted with air.

Further, the test assembly comprises electric telescopic rods 12 fixedly installed on the first mounting frame 3 and the second mounting frame 11 respectively, and end barrels 13 are fixedly installed at the end portions of the extension rods of the electric telescopic rods 12.

Further, both sides of the top end of one of the end cylinders 13 are fixedly provided with a semiconductor refrigerator 1301, the inner wall of the top of the other end cylinder 13 is fixedly provided with a spiral heating wire 19, and one side of the outer wall of the top of the rotary table 5, which is close to the bracket 15, is provided with an annular groove 14 matched with the bottom end of the end cylinder 13.

By means of the structure, the annular groove 14 is formed, an embedding effect can be formed between the annular groove and the bottom end of the end cylinder 13, and the sealing performance during testing can be guaranteed.

Further, the trigger assembly comprises a touch switch 9 fixedly installed on one side of the outer wall of the bottom of the cross beam 10, a plurality of supporting arms 7 arranged obliquely are fixedly installed on the outer wall of the top of the rotary table 5 close to the circle center, an annular plate 6 is fixedly installed on the top end of each supporting arm 7, a touch abutting block 8 corresponding to the number of the brackets 15 is fixedly installed on the outer wall of the top of the annular plate 6, and an operation panel 4 is fixedly installed on one side of the first installation frame 3.

By means of the structure, the arranged trigger component is utilized, when the touch abutting block 8 rotates to the position below the touch switch 9 along with the rotary table 5, the touch switch 9 is abutted, and then the electric telescopic rod 12 is controlled to be started and the stepping motor 18 is controlled to be closed, so that the automation effect of the device is improved.

Further, actuating mechanism includes step motor 18 of fixed mounting in propping a section of thick bamboo 2 one side outer wall, and step motor 18's output shaft key connection has drive gear, and the bottom outer wall fixed mounting of revolving stage 5 has the interior ring gear 502 with drive gear looks adaptation, and the bottom outer wall fixed mounting of revolving stage 5 has spacing inner tube 501, and spacing inner tube 501 with prop and rotate between the section of thick bamboo 2 and be connected.

By means of the structure, an operator controls and starts the stepping motor 18 by using the operation panel 4, and drives the corresponding bracket 15 through the transmission action of the driving gear and the inner gear ring 502, and the fixed frequency moves to the position right below the end cylinder 13.

The working process and the beneficial effects of the utility model are as follows: when the device is used, a tester firstly controls and starts the semiconductor refrigerator 1301 and the spiral heating wire 19 by using the operation panel 4 to perform pre-cooling and heating treatment; then, a semiconductor to be tested is placed on the bracket 15, the through hole 16 and the supporting end rod 17 are arranged, the semiconductor to be tested is effectively limited and placed, the semiconductor can be ensured to be fully contacted with air, after the semiconductor to be tested is completed, an operator controls and starts the stepping motor 18 by using the operation panel 4, the corresponding bracket 15 is driven by the transmission action of the driving gear and the inner gear ring 502, and the fixed frequency moves to be right below the end cylinder 13; meanwhile, through the trigger assembly that sets up, when the touching supports piece 8 and rotates to touch switch 9 below along with revolving stage 5, can support touch switch 9, and then control starts electric telescopic handle 12 and closes step motor 18, thereby promote end section of thick bamboo 13 and move down, and make its bottom imbed in annular groove 14 and form sealed effect, utilize semiconductor refrigerator 1301 and spiral heating wire 19 respectively, carry out effectual heating and cooling processing to two semiconductors that await measuring respectively simultaneously, guarantee detection efficiency, repeat above-mentioned step, make the semiconductor pass through refrigeration and heating processing in proper order, and follow-up electricity connects its ageing degree of test.

Example two:

compared with the first embodiment, in the present embodiment, with reference to fig. 4, guide rods 20 are fixedly mounted on both sides of the outer wall of the top of an end barrel 13, and a guide top barrel 21 slidably connected with the guide rods 20 is fixedly mounted on a first mounting frame 3 and a second mounting frame 11.

By means of the structure, the guide rod 20 and the guide top cylinder 21 can limit and guide the up-and-down movement of the end cylinder 13, so that the up-and-down movement stability of the end cylinder 13 is improved, and the smooth performance of test operation is ensured.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides a cold and hot testing arrangement of semiconductor ageing, includes bottom end plate (1) and revolving stage (5), its characterized in that: the top outer wall fixed mounting of bottom end board (1) has a section of thick bamboo (2), and the top of propping a section of thick bamboo (2) rotates through the bearing with revolving stage (5) and is connected, prop a section of thick bamboo (2) and install actuating mechanism with the relative one side of revolving stage (5), the top outer wall fixed mounting of revolving stage (5) has a plurality of equidistance bearing mechanisms that distribute, the top outer wall of bottom end board (1) is fixed mounting respectively has mounting bracket one (3) and mounting bracket two (11) of symmetric distribution, and all installs on mounting bracket one (3) and mounting bracket two (11) and be provided with the test subassembly, the relative one side fixed mounting of mounting bracket one (3) and mounting bracket two (11) has crossbeam (10), and crossbeam (10) is provided with trigger subassembly with the relative side-mounting of revolving stage (5).

2. The semiconductor burn-in cold and hot testing device according to claim 1, wherein: the bearing mechanism comprises a plurality of brackets (15) which are fixedly arranged on the outer wall of the top of the rotary table (5) at equal intervals, through holes (16) which are uniformly distributed are formed in the inner bottom of each bracket (15), and a plurality of supporting end rods (17) which are distributed in a staggered mode with the through holes (16) are fixedly arranged on the inner bottom of each bracket (15).

3. The semiconductor burn-in cold and hot testing device according to claim 2, wherein: the test assembly comprises electric telescopic rods (12) which are fixedly installed on the first mounting frame (3) and the second mounting frame (11) respectively, and end cylinders (13) are fixedly installed at the end parts of the extension rods of the electric telescopic rods (12).

4. The semiconductor burn-in cold and heat test apparatus according to claim 3, wherein: the semiconductor refrigerator (1301) is fixedly mounted on two sides of the top end of one end barrel (13), the spiral heating wire (19) is fixedly mounted on the inner wall of the top of the other end barrel (13), and an annular groove (14) matched with the bottom end of the end barrel (13) is formed in one side, close to the bracket (15), of the outer wall of the top of the rotary table (5).

5. The semiconductor burn-in cold and hot testing device according to claim 2, wherein: trigger the subassembly including touch switch (9) of fixed mounting in crossbeam (10) bottom outer wall one side, the top outer wall of revolving stage (5) is close to centre of a circle department fixed mounting has support arm (7) that a plurality of slopes set up, and the top fixed mounting of support arm (7) has annular slab (6), the top outer wall fixed mounting of annular slab (6) has the touching that corresponds with bracket (15) quantity to support piece (8), one side fixed mounting of mounting bracket (3) has operating panel (4).

6. The semiconductor burn-in cold and hot testing device according to claim 1, wherein: actuating mechanism includes fixed mounting in step motor (18) that props a section of thick bamboo (2) one side outer wall, and the output shaft key of step motor (18) is connected with drive gear, the bottom outer wall fixed mounting of revolving stage (5) have with inner ring gear (502) of drive gear looks adaptation, the bottom outer wall fixed mounting of revolving stage (5) has spacing inner tube (501), and spacing inner tube (501) with prop and rotate between a section of thick bamboo (2) and be connected.

7. The semiconductor burn-in cold and heat test apparatus according to claim 3, wherein: the equal fixed mounting in top outer wall both sides of end section of thick bamboo (13) has guide bar (20), and equal fixed mounting has guide top section of thick bamboo (21) with guide bar (20) sliding connection on mounting bracket one (3) and mounting bracket two (11).