CN216391932U - Heat dissipation device and equipment applying same - Google Patents

Abstract

The disclosure relates to a heat dissipation device and equipment using the same, and relates to the technical field of equipment heat dissipation. This heat abstractor is used for the dress on the outer wall of equipment body, includes: a thermal pad, a heat sink, and at least one fan; one side surface of the heat conducting pad is attached to the outer wall surface of the equipment body, the radiating fin comprises a radiating substrate and a radiating fin group, the radiating substrate is attached to the other side surface of the heat conducting pad, and the radiating fin group is connected to one side plate surface of the radiating substrate, which is far away from the heat conducting pad; the cooling fin group is provided with at least one mounting groove, the mounting groove is sunken towards the outer wall surface of the equipment body, and the fan is mounted in the mounting groove. The heat dissipation device has high heat dissipation efficiency, good heat dissipation effect and good equipment safety.

Description

Heat dissipation device and equipment applying same

Technical Field

The disclosure relates to the technical field of equipment heat dissipation, in particular to a heat dissipation device and equipment using the same.

Background

In the operation process of the controller, the processor and other devices, heat is generated, and in order to ensure the normal operation of the devices, the devices are generally required to be cooled.

For a closed device with an IP class (waterproof and dustproof class), because the requirement for sealing performance is high, the casing is usually a fully closed casing, and therefore, a wall-mounted heat dissipation device is usually mounted on the outer wall of the device to dissipate heat. The heat of the equipment is conducted to the outer wall of the equipment, then conducted to the wall-mounted heat dissipation device, and then is exchanged to the outside air through the heat dissipation device.

However, the existing wall-mounted heat dissipation device has low heat dissipation efficiency and poor heat dissipation effect on equipment.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a heat dissipation device and an apparatus using the same, wherein the heat dissipation device has high heat dissipation efficiency, good heat dissipation effect, and good safety of the apparatus.

In one aspect, the present disclosure provides a heat dissipation device for being attached to an outer wall surface of an apparatus body, including: a thermal pad, a heat sink, and at least one fan;

one side surface of the heat conducting pad is attached to the outer wall surface of the equipment body, the radiating fin comprises a radiating substrate and a radiating fin group, the radiating substrate is attached to the other side surface of the heat conducting pad, and the radiating fin group is connected to one side plate surface of the radiating substrate, which is far away from the heat conducting pad;

the cooling fin group is provided with at least one mounting groove, the mounting groove is sunken towards the outer wall surface of the equipment body, and the fan is mounted in the mounting groove.

The utility model provides a heat abstractor, be applicable to the equipment body that has the IP grade, heat abstractor establishes the heat conduction pad through pasting on the outer wall of equipment body, the fin laminating is at the opposite side surface of heat conduction pad, and set up the fan in one side of the fin that deviates from the equipment body, heat transfer to the radiating basal plate of fin through the heat conduction pad with the heat that the equipment body produced, the radiating basal plate is with each radiating fin in heat conduction to the radiating fin group, accelerate the air flow velocity around the radiating fin through the fan, in time with the heat on the radiating fin give off to in the air on every side. The heat radiating fin group is provided with the mounting grooves, the fan is mounted in the heat radiating fin group in an embedded mode, gaps between the fan and the heat radiating fins are small, and an air layer with natural convection hardly exists between the fan and the heat radiating fins, so that the heat radiating efficiency and the heat radiating effect of the heat radiating device can be improved.

In a possible implementation mode, the number of the fans is at least two, the radiating fin group is provided with at least two mounting grooves, the adjacent mounting grooves are arranged at intervals, and the fans are mounted in the mounting grooves in a one-to-one correspondence mode.

In one possible embodiment, the air inlet side of the fan is flush with the top of the set of cooling fins, or the air inlet side of the fan is recessed in the top of the set of cooling fins.

In one possible embodiment, the heat dissipating fin group comprises a plurality of heat dissipating fins, one end of each heat dissipating fin is connected to the heat dissipating base plate, and the other end of each heat dissipating fin extends out in a direction away from the heat dissipating base plate.

In one possible embodiment, each of the heat dissipating fins extends in the same direction;

the area of the radiating substrate, which is positioned at the bottom of the mounting groove, is not provided with radiating fins, or the height of the part, which is positioned at the bottom of the mounting groove, of the radiating fins is lower than the heights of other parts.

In a possible implementation mode, in the circumferential direction of the fan, the radiating fins on the periphery of the fan are arranged at intervals to form a mounting groove.

In one possible embodiment, the heat conducting pad is a silicone pad, and the silicone pad is tightly attached between the outer wall surface of the device body and the heat dissipation substrate.

In one possible embodiment, the heat-dissipating substrate is mechanically connected to the outer wall surface of the device body by a locking member.

In one possible embodiment, the surface area of the heat dissipation substrate is larger than the surface area of the heat conduction pad, and the orthographic projection of the heat conduction pad on the heat dissipation substrate is located within the coverage range of the heat dissipation substrate.

In another aspect, the present disclosure provides an apparatus comprising an apparatus body and a heat sink as described above;

the equipment body comprises a shell, at least one side surface of the shell is a radiating surface, and a radiating device is installed on at least one radiating surface.

The utility model provides an equipment, including equipment body and heat abstractor, heat abstractor pastes the dress on the cooling surface of the casing of equipment body, heat abstractor establishes the heat conduction pad through pasting on the cooling surface at the equipment body, the fin laminating is at the opposite side surface of heat conduction pad, and set up the fan in one side of the fin that deviates from the equipment body, heat transfer to the radiating basal plate of fin through the heat conduction pad with the heat transfer that the equipment body produced, the radiating basal plate is with each radiating fin in heat conduction to the radiating fin group, accelerate the air flow velocity around the radiating fin through the fan, in time give off the heat on the radiating fin in the air on every side. The heat radiating fin group is provided with the mounting grooves, the fan is mounted in the heat radiating fin group in an embedded mode, gaps between the fan and the heat radiating fins are small, and an air layer with natural convection hardly exists between the fan and the heat radiating fins, so that the heat radiating efficiency and the heat radiating effect of the heat radiating device can be improved.

It should be understood that what is described in this summary section is not intended to limit key or critical features of the embodiments of the disclosure, nor is it intended to limit the scope of the disclosure. Other features of the present disclosure will become apparent from the following description.

Drawings

The above and other features, advantages and aspects of various embodiments of the present disclosure will become more apparent by referring to the following detailed description when taken in conjunction with the accompanying drawings. In the drawings, like or similar reference characters designate like or similar elements, and wherein:

fig. 1 is a schematic structural diagram of an apparatus provided in an embodiment of the present disclosure;

FIG. 2 is a schematic structural view of the apparatus body;

FIG. 3 is an exploded view of FIG. 1;

FIG. 4 is a schematic structural diagram of the heat sink of FIG. 3;

fig. 5 is a schematic structural diagram of the fan in fig. 3.

Description of reference numerals:

1-equipment;

100-a heat sink; 200-an apparatus body;

110-a thermally conductive pad; 110 a-silica gel pad; 120-a heat sink; 130-a fan; 210-a housing;

121-a heat-dissipating substrate; 122-a set of fins; 123-mounting grooves; 131-fan blades; 211-outer wall surface; 211 a-radiating surface;

1221-heat sink fins;

a-a positioning hole; b-mounting holes; c-mounting the notch.

Detailed Description

Exemplary embodiments of the present disclosure are described below with reference to the accompanying drawings, in which various details of the embodiments of the disclosure are included to assist understanding, and which are to be considered as merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the present disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The equipment such as the server, the controller, the receiver, the generator and the like can generate a large amount of heat in the operation process, and if the heat cannot be dissipated in time, the equipment is overheated, the circuit of the equipment is damaged, and the operation safety of the equipment is influenced. In order to ensure the normal operation of the equipment, the equipment needs to be radiated so as to work in a safe temperature range.

The equipment needing heat dissipation can be divided into two types, one type is equipment not requiring protection grade, an air inlet and an air outlet are usually formed in the shell of the equipment, the inside of the equipment is located in a ventilation convection environment, and heat dissipation can be carried out on heating devices inside the equipment through natural convection of air. Or, a fan can be arranged in the equipment, the air flow rate in the equipment is increased through the fan, and the heat dissipation efficiency of the equipment is improved.

The other type is equipment with protection grade, namely IP grade (waterproof and dustproof grade), and the shell of the equipment is generally a fully-closed shell due to high requirement on sealing performance, so that a sealed environment is formed inside the equipment. The equipment is cooled by a wall-mounted heat sink mounted on the outer wall of the equipment, heat generated by a heating device inside the equipment is transferred to the shell and then transferred to the heat sink by the shell, and the heat of the equipment is dissipated to the outside air by the heat sink.

However, for a closed device with an IP level, a wall-mounted heat dissipation device in the related art has the problems of low heat dissipation efficiency and poor heat dissipation effect, and cannot timely take away heat generated by the device, so that the operation safety of the device is still difficult to guarantee.

In view of the above, the embodiment of the present disclosure provides a heat dissipation device and an apparatus using the same, where the heat dissipation device is attached to an outer wall of the apparatus, and the heat dissipation apparatus embeds a fan in a heat dissipation fin set, so that the heat dissipation efficiency of the heat dissipation device can be improved, the heat dissipation effect of the heat dissipation device can be improved, and the operation safety of the apparatus can be guaranteed.

Fig. 1 is a schematic structural diagram of an apparatus provided in an embodiment of the present disclosure; FIG. 2 is a schematic structural view of the apparatus body; FIG. 3 is an exploded view of FIG. 1; FIG. 4 is a schematic structural diagram of the heat sink of FIG. 3;

fig. 5 is a schematic structural diagram of the fan in fig. 3.

Referring to fig. 1, the device 1 provided in this embodiment includes a device body 200 and a heat dissipation apparatus 100, where the device body 200 is, for example, a server, a controller, a receiver, a generator, and the like as described above, the device body 200 generates heat during a working process, and the heat dissipation apparatus 100 is used for dissipating heat generated by the device body 200, so as to dissipate the heat generated by the device body 200 in time through the heat dissipation apparatus 100, and ensure normal operation of the device body 200.

In this embodiment, the main object of the present embodiment is to dissipate heat of a sealed device with an IP level, that is, the device body 200 of the present embodiment is a sealed device with an IP level, referring to fig. 2, the device body 200 includes a casing 210, the casing 210 may be a fully-enclosed casing 210, and the casing 210 does not have a cavity such as an air inlet or an air outlet. The heat sink 100 is attached to the outer wall of the casing 210, thereby dissipating heat from the device body 200.

Taking the outer contour of the housing 210 of the device body 200 as an example to be substantially rectangular parallelepiped, the housing 210 may include, for example, a box body with one side open and a cover plate, and the cover plate is sealed and covered on the open side of the box body to form a closed housing 210. The components inside the device 1 can be installed in the housing 210 through the opening, and the cover plate covers the box body after the components inside are assembled.

The heat generated by the heat generating device inside the device body 200 is transferred to the housing 210, and the heat is dissipated outwards through the outer wall of the housing 210. Because the mode that relies on natural convection dispels the heat, the radiating efficiency is lower, to the more equipment body 200 of heat production, can't in time give off the heat that equipment body 200 produced, can lead to equipment body 200 overheat protection to harm the performance of equipment 1 even, leads to the unable normal work of equipment 1.

Therefore, the heat dissipation device 100 is attached to the outer wall of the casing 210 of the equipment body 200, so that the heat exchange rate between the equipment body 200 and the external environment is increased, the heat dissipation efficiency of the equipment body 200 is improved, the heat dissipation effect of the equipment body 200 is improved, the equipment body 200 is guaranteed to work under a proper temperature condition all the time, and the operation safety of the equipment body 200 is guaranteed.

At least one side surface of the housing 210 of the device body 200 is a heat dissipation surface 211a, and continuing to take the case that the outer contour of the housing 210 is substantially rectangular parallelepiped, at least one side surface of each of six surfaces of the housing 210 is a heat dissipation surface 211a, in this embodiment, at least one heat dissipation surface 211a of the housing 210 is attached with the heat dissipation device 100.

It should be noted that, in the present embodiment, a surface of the casing 210 where heat is generated and concentrated is defined as the heat dissipation surface 211a of the casing 210.

The whole casing 210 of the apparatus body 200 is a metal casing 210, that is, each side wall of the casing 210 is made of metal, and since the heat conductivity of metal is good, the heat generated inside the apparatus body 200 can be transferred to each surface, wherein the surface of the casing 210 closer to the heat generating device generates more heat, and therefore, the heat dissipation surface 211a of the casing 210 of the embodiment may refer to the surface closer to the heat generating device and generating more heat.

Or, for the apparatus body 200 generating more heat, each side wall of the casing 210 accumulates more heat, and at this time, each surface of the casing 210 may be referred to as a heat dissipation surface 211a, and then, the heat dissipation device 100 may be mounted on one heat dissipation surface 211a of the casing 210, for example, the heat dissipation device 100 may be mounted on the outer wall surface 211 generating the most heat; alternatively, the heat dissipation device 100 may be attached to a plurality of heat dissipation surfaces 211a of the casing 210, for example, the heat dissipation device 100 is attached to the outer wall surfaces 211 on two opposite sides, the outer wall surfaces 211 on three sides, or the outer wall surfaces 211 on each side of the casing 210, so as to improve the heat dissipation efficiency of the apparatus body 200 and the heat dissipation effect of the apparatus body 200.

Taking as an example that part of the side walls of the casing 210 of the device body 200 is made of metal and part of the side walls is made of non-metal material such as plastic, the heat dissipation surface 211a of the casing 210 may be an outer wall surface 211 made of metal, and the heat dissipation device 100 is attached to the outer wall surface 211 made of metal, in view of the large amount of heat concentrated on the side walls made of metal. Alternatively, the heat dissipating surface 211a of the housing 210 may include an outer wall surface 211 made of other non-metal materials, for example, the heat dissipating surface 211a may include an outer wall surface 211 made of non-metal materials close to the heat generating device, or the heat dissipating apparatus 100 may be attached to the outer wall surface 211 made of non-metal materials.

In summary, the heat dissipation device 100 may be surface-mounted on only one side of the side surfaces of the casing 210 of the apparatus body 200, or more than two heat dissipation devices 100 may be surface-mounted on two sides of the casing, which is not particularly limited in this embodiment.

The heat sink 100 attached to the outer wall surface 211 of the device body 200 will be described in detail below.

Referring to fig. 3, the heat dissipation apparatus 100 includes a thermal pad 110, a heat sink 120, and a fan 130, wherein the thermal pad 110 is attached to an outer wall surface 211 of a housing 210 of the device body 200, the heat sink 120 is attached to the thermal pad 110, and the fan 130 is disposed on a side of the heat sink 120 away from the device body 200.

The heat generated by the heating device inside the device body 200 is transferred to the casing 210, the heat concentrated on the casing 210 is transferred to the thermal pad 110 attached to the outer wall 211 of the casing 210 in a thermal conduction manner, the thermal pad 110 transfers the heat to the heat sink 120 in a thermal conduction manner, and the heat sink 120 has a large heat dissipation area, so that the heat can be dispersed and rapidly dissipated to the external environment. On the basis, the fan 130 accelerates the air flow speed around the heat sink 120, accelerates the heat exchange speed between the heat sink 120 and the external environment, improves the heat dissipation efficiency of the heat dissipation device 100, and improves the heat dissipation effect of the heat dissipation device 100.

The heat sink 120 includes a heat dissipation substrate 121 and a heat dissipation fin set 122, the heat dissipation fin set 122 includes a plurality of heat dissipation fins 1221, the heat dissipation fins 1221 are connected to a side plate surface of the heat dissipation substrate 121, one end of each heat dissipation fin 1221 is connected to the heat dissipation substrate 121, and the other end of each heat dissipation fin 1221 extends out in a direction away from the heat dissipation substrate 121. For example, the heat dissipation fins 1221 may be integrally formed on the heat dissipation substrate 121, and the heat dissipation fins 1221 may be perpendicular to the heat dissipation substrate 121.

Referring to fig. 3, a side of the heat-dissipating substrate 121 not provided with the heat-dissipating fins 1221 is attached to the heat-conducting pad 110, the heat-dissipating fins 1221 are located on a side of the heat-dissipating substrate 121 away from the heat-conducting pad 110, the heat-dissipating substrate 121 serves as a heat-conducting and heat-transferring structure of the heat-dissipating fin 120, the heat-conducting pad 110 transfers heat to the heat-dissipating substrate 121 in a heat-conducting manner, and the heat-dissipating substrate 121 transfers heat to the heat-dissipating fin group 122. Each of the fins 1221 in the fin group 122 can increase the heat dissipation area of the heat sink 120, the heat on the fins 1221 is quickly dissipated to each of the fins 1221, and each of the fins 1221 convectively exchanges the heat to the surrounding environment.

Moreover, the fan 130 is disposed on one side of the heat sink 120 where the heat dissipation fins 1221 are disposed, when the fan 130 works, the fan blades 131 rotate at a high speed to stir surrounding air, so as to accelerate the flow speed of the surrounding air, and the rapidly flowing air continuously contacts and rubs with the heat dissipation fins 1221, thereby accelerating the heat exchange speed between the heat dissipation fins 1221 and the air, improving the heat dissipation efficiency of the heat dissipation device 100, and improving the heat dissipation effect of the heat dissipation device 100.

As shown in fig. 3, the thermal pad 110 attached between the outer wall surface 211 of the device body 200 and the heat dissipation substrate 121 of the heat dissipation plate 120 may be a silicone pad 110a, on one hand, the thermal stability of the silicone pad 110a is good, the silicone pad 110a attached on the heat dissipation surface 211a of the device body 200 can rapidly conduct heat to the heat dissipation plate 120, and the performance of the silicone pad 110 is not affected by temperature, so that the long-term use requirement of the thermal pad 110 can be met.

On the other hand, the silicone pad 110a is a flexible pad, which has good deformability, and can squeeze the silicone pad 110a between the outer wall surface 211 of the apparatus body 200 and the heat dissipation substrate 121, so as to ensure that the two side surfaces of the silicone pad 110a are respectively tightly attached to the outer wall surface 211 of the apparatus body 200 and the heat dissipation substrate 121, and the outer wall surface 211 of the apparatus body 200, the silicone pad 110a and the heat dissipation substrate 121 are attached to each other, so that the contact area between the silicone pad 110a and the outer wall surface 211 of the apparatus body 200 is large, and heat of the apparatus body 200 can be quickly and effectively transferred to the heat dissipation fins 120.

In order to make the thermal pad 110 closely fit between the outer wall surface 211 of the device body 200 and the heat dissipation substrate 121, in this embodiment, the heat sink 120 may be mechanically coupled to the outer wall surface 211 of the device body 200 by a locking member. For example, referring to fig. 3, a positioning hole a may be formed in an outer wall of the housing 210 of the device body 200, a mounting hole b may be formed in the heat dissipation substrate 121 of the heat sink 120, the mounting hole b corresponds to the positioning hole a, and a locking member such as a bolt or a screw may be inserted into the mounting hole b and the positioning hole a to fixedly couple the heat sink 120 to the housing 210 of the device body 200.

Wherein, in the process of screwing up the retaining member, the interval between the outer wall surface 211 of heat dissipation base plate 121 and equipment body 200 constantly reduces, and the pressure that produces between the two acts on the heat conduction pad 110 between the two, extrudes heat conduction pad 110 and produces and warp to make heat conduction pad 110 and the equipment body 200 and the heat dissipation base plate 121 of both sides all laminate closely, guarantee heat transfer efficiency of heat conduction pad 110.

In practical applications, the surface area of the heat dissipation substrate 121 may be larger than the surface area of the thermal pad 110, and the heat dissipation substrate 121 completely covers the thermal pad 110. On one hand, the heat on the thermal pad 110 can be completely transferred to the heat dissipation substrate 121, so as to improve the thermal conduction effect of the thermal pad 110; on the other hand, referring to fig. 3, the mounting hole b on the heat dissipating substrate 121 may be disposed at the edge of the heat dissipating substrate 121, and the positioning hole a on the outer wall of the housing 210 of the device body 200 may be correspondingly located outside the covering area of the heat conducting pad 110, so as to avoid forming a hole on the heat conducting pad 110.

For example, the mounting hole b formed in the heat dissipation substrate 121 may be a complete hole near the edge thereof. Or, referring to fig. 3, the mounting hole b formed in the heat dissipation substrate 121 may also be a mounting notch c located at a side edge thereof, and the heat dissipation substrate 121 may be limited by a locking member inserted into the mounting notches c located at two opposite sides of the heat dissipation substrate 121, so as to ensure that the heat dissipation fins 120 are mounted firmly.

In order to improve the heat dissipation efficiency of the heat dissipation apparatus 100, in the embodiment, the heat dissipation fin set 122 has a mounting groove 123 formed therein, the mounting groove 123 is recessed toward the outer wall surface 211 of the device body 200, and the fan 130 is mounted in the mounting groove 123. As shown in fig. 1 and fig. 3, the fan 130 is embedded in the heat dissipating fin group 122, and the heat dissipating fins 1221 located at the periphery of the mounting groove 123 are surrounded at the outer side of the fan 130, so that the clearance between the fan 130 and the surfaces of the heat dissipating fins 1221 is small, and the fan 130 has a better effect of accelerating the convection velocity of the air around the heat dissipating fins 1221. The heat dissipation efficiency and the heat dissipation effect of the heat dissipation fins 1221 can be improved.

Wherein, the fan 130 is embedded into the heat dissipating fins 1221 through the mounting grooves 123 formed by the heat dissipating fin sets 122, and the fan blades 131 of the fan 130 rotate to stir the surrounding air, thereby accelerating the air flow. Part of the air flows to the bottom of the mounting groove 123, and the heat dissipation efficiency of the heat dissipation fins 120 located at the bottom of the mounting groove 123 is accelerated; most of the air is directly blown to the heat dissipation fins 1221 surrounding the fan 130 from the side of the fan 130, and since the distance between the fan 130 and the heat dissipation fins 1221 at the periphery thereof is small, there is almost no natural convection air layer between the heat dissipation fins 1221 and the fan 130, the air accelerated by the fan 130 rapidly flows to the surface of the heat dissipation fins 1221, and the heat accumulated on the heat dissipation fins 1221 can be more rapidly dissipated to the surrounding air.

Moreover, because the fan 130 is embedded in the heat dissipation fins 1221, at least a part of the thickness space of the fan 130 is located in the thickness space of the heat dissipation fins 120, the space occupied by the fan 130 and the heat dissipation fins 120 is small, the volume of the heat dissipation device 100 can be reduced, the heat dissipation device 100 can be conveniently installed on the equipment body 200, and further, the volume of the equipment 1 can be reduced, which is beneficial to the flexible arrangement of the equipment 1.

In addition, the heat dissipation fins 1221 surrounding the periphery of the fan 130 have a certain protection effect on the fan 130, and particularly in a scene where the device 1 is in an external environment, the fan 130 is embedded in the heat dissipation fins 1221, so that the fan 130 can be protected from foreign matters such as dust and water vapor.

In one embodiment, the air inlet side of the fan 130 may be flush with the top of the set of fins 122, or the air inlet side of the fan 130 may be recessed from the top of the set of fins 122. The top end of the heat dissipating fin group 122 is a plane where one end of each heat dissipating fin 1221 away from the heat dissipating substrate 121 is located, and with reference to fig. 1, the fan 130 is completely embedded in the heat dissipating fin 120, and the fan 130 does not occupy additional space, so that the thickness of the heat dissipating device 100 can be significantly reduced, and even if the device body 200 is located in a small accommodating space, the space at the periphery of the device body 200 can also meet the installation requirement of the heat dissipating device 100.

In practical applications, in addition to the case that the mounting grooves 123 shown in fig. 1 and 3 are communicated with the surfaces of the heat dissipation fin groups 122, the mounting grooves 123 are in an open form, and the air inlet side of the fan 130 is completely exposed to the external environment, the mounting grooves 123 formed in the heat dissipation fin groups 122 may also be in a closed form, where the closed form refers to that the mounting grooves 123 are completely formed inside the heat dissipation fin groups 122, that is, the mounting grooves 123 are channel structures formed in the heat dissipation fin groups 122, and two ends of each channel are respectively communicated with two sides of the heat dissipation fins 120. For the installation groove 123 in the form of a channel, since only both ends of the channel are open, the fan 130 can be inserted into the channel from one end of the channel, and a stopper structure or a catching structure is provided at a port of the channel to restrain the fan 130 in the channel.

In the following description, the mounting grooves 123 formed in the heat dissipating fin groups 122 are taken as an open structure, and as shown in fig. 1 and 3, the heat dissipating fins 120 matching the area of the outer wall surface 211 of the device 1 are designed according to the size of the device body 200, and one or more fans 130 are provided according to the actual size of the heat dissipating fins 120.

For the equipment body 200 with a large volume, the area of the outer wall surface 211 of the equipment body 200 is large, and the area of the heat dissipation fins 120 matched with the outer wall surface is large, for this reason, a plurality of spaced mounting grooves 123 can be formed in the heat dissipation fin group 122, and the fans 130 are mounted in each mounting groove 123, so that the air convection speed of each region of the heat dissipation fin group 122 is increased through the plurality of fans 130, the heat exchange speed between the heat dissipation fin group 122 and the external environment is increased, the heat dissipation uniformity of the heat dissipation fins 120 can be increased, and the heat dissipation effect of the heat dissipation device 100 is improved.

For example, referring to fig. 3, two mounting grooves 123 are formed in the fin group 122, and one fan 130 is mounted in each of the two mounting grooves 123. Alternatively, in other examples, three, four or more mounting slots 123 may be formed in the fin group 122, and each fan 130 is mounted in each mounting slot 123 in a one-to-one correspondence.

As for how to form the mounting grooves 123 in the heat dissipating fin groups 122, as shown in fig. 4, as an embodiment, the heat dissipating fins 1221 connected to the heat dissipating substrate 121 may all extend in the same direction, for example, the heat dissipating fins 1221 extend in the length direction of the heat dissipating substrate 121. In each of the heat dissipating fins 1221, the projecting height of the heat dissipating fin 1221 corresponding to the region where the groove bottom of the mounting groove 123 is located is lower than the projecting height of the heat dissipating fins 1221 located in the other regions, and a height difference is formed between the portion of the heat dissipating fin 1221 located at the groove bottom of the mounting groove 123 and the other portions, so that the mounting groove 123 is formed in the heat dissipating fin group 122. At this time, although the height of the portion of the heat dissipation fin 1221 located at the bottom of the mounting groove 123 is small, the area of the heat dissipation fin 1221 is increased, and thus, the heat dissipation area of the heat dissipation fin 120 can be increased, and the heat dissipation efficiency of the heat dissipation fin 120 can be improved.

Alternatively, when the heat dissipation fins 120 satisfy the heat dissipation requirement of the device body 200, the heat dissipation fins 1221 may not be provided in the region located at the bottom of the mounting groove 123.

It should be understood that the protrusion height of the heat dissipation fins 1221 referred to herein refers to a height of the heat dissipation fins 1221 extending in a direction away from the discrete thermal substrate 121.

As another embodiment, the heat dissipation fins 1221 located in a certain range of the outer periphery of the fan 130 may extend along the direction of the outer contour of the fan 130, and in the circumferential direction of the outer contour of the fan 130, the heat dissipation fins 1221 are sequentially opposite end to end and are arranged at intervals along the circumferential direction of the outer contour of the fan 130. In this way, the heat dissipation fins 1221 located at the outer periphery of the fan 130 enclose a shape substantially matching the outer contour of the fan 130, that is, the mounting groove 123 substantially matching the outer contour of the fan 130 is formed.

Referring to fig. 4 and 5, taking the outer contour of the fan 130 as a rectangle as an example, and taking the heat dissipation fins 1221 located at the outer periphery of the fan 130 as flat heat dissipation fins 1221 as an example, four heat dissipation fins 1221 may be disposed corresponding to the sides of the four sides of the fan 130, each heat dissipation fin 1221 extends along the extension direction of each side of the fan 130, and each heat dissipation fin 1221 is sequentially opposite end to form the mounting groove 123 with a quadrilateral contour.

Taking the outer contour of the fan 130 as a circle as an example, each of the heat dissipation fins 1221 located at the outer periphery of the fan 130 may be an arc-surface type heat dissipation fin 1221, and the plurality of heat dissipation fins 1221 arranged end to end at intervals in sequence surround the installation groove 123 with a circular contour. Alternatively, the heat dissipation fins 1221 positioned on the outer periphery of the fan 130 may be flat heat dissipation fins 1221, and the mounting grooves 123 having polygonal outlines such as a hexagon, an octagon, and a hexadecimal may be defined between the heat dissipation fins 1221, wherein the larger the number of sides of the polygon defined by the heat dissipation fins 1221, the more the outline of the mounting groove 123 is approximated to a circle.

The adjacent heat dissipation fins 1221 should have gaps therebetween, so that the air accelerated by the fan 130 can pass through the gaps between the adjacent heat dissipation fins 1221 and flow toward the outer heat dissipation fins 1221, thereby increasing the flow speed of the air around each part of the heat dissipation fin 120.

For the connection and fixation between the fan 130 and the heat sink 120, as shown in fig. 4 and 5, a mounting hole b may be formed at a corner of the fan 130, a positioning hole a may be formed in a region of the heat sink substrate 121 corresponding to the bottom of the mounting groove 123, the positioning holes a and the mounting holes b may correspond one-to-one, and a locking member such as a bolt or a screw may be inserted into the mounting hole b and the positioning hole a to mount the fan 130 on the heat sink 120.

The above detailed description should not be construed as limiting the scope of the disclosure. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (10)

1. A heat dissipation device is used for being attached to the outer wall surface of an equipment body, and is characterized by comprising: a thermal pad, a heat sink, and at least one fan;

the heat dissipation device comprises a heat conduction pad, a radiating fin, a radiating base plate and a radiating fin group, wherein one side surface of the heat conduction pad is attached to the outer wall surface of the device body;

the cooling fin group is provided with at least one mounting groove, the mounting groove is sunken towards the outer wall surface of the equipment body, and the fan is mounted in the mounting groove.

2. The heat dissipating device of claim 1, wherein the number of the fans is at least two, the heat dissipating fin group is formed with at least two mounting slots, adjacent mounting slots are spaced apart, and each fan is mounted in each mounting slot in a one-to-one correspondence.

3. The heat dissipating device of claim 1, wherein the air inlet side of the fan is flush with the top of the set of fins or the air inlet side of the fan is recessed from the top of the set of fins.

4. The heat dissipating device of any of claims 1 to 3, wherein the set of fins comprises a plurality of fins, one end of the fins being attached to the heat dissipating substrate and the other end of the fins extending away from the heat dissipating substrate.

5. The heat dissipating device of claim 4, wherein each of said fins extends in the same direction;

the radiating base plate is characterized in that the radiating fins are not arranged in the area, located at the bottom of the mounting groove, of the radiating base plate, or the height of the part, located at the bottom of the mounting groove, of the radiating fins is lower than the height of other parts.

6. The heat dissipating device as claimed in claim 4, wherein the heat dissipating fins are spaced apart from each other at the periphery of the fan in the circumferential direction of the fan to define the mounting groove.

7. The heat dissipating device according to any one of claims 1 to 3, wherein the heat conducting pad is a silicone pad, and the silicone pad is tightly attached between the outer wall surface of the device body and the heat dissipating substrate.

8. The heat dissipating device of claim 7, wherein the heat dissipating substrate is mechanically connected to the outer wall surface of the device body by a locking member.

9. The heat dissipating device of claim 8, wherein the surface area of the heat dissipating substrate is larger than the surface area of the thermal pad, and the orthographic projection of the thermal pad on the heat dissipating substrate is within the coverage of the heat dissipating substrate.

10. An apparatus comprising an apparatus body and the heat dissipating device of any one of claims 1 to 9;

the equipment body comprises a shell, at least one side surface of the shell is a radiating surface, and at least one radiating surface is provided with the radiating device.

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