CN216329836U - Plastic mold with automatic material ejection function - Google Patents

Plastic mold with automatic material ejection function Download PDF

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Publication number
CN216329836U
CN216329836U CN202122521218.XU CN202122521218U CN216329836U CN 216329836 U CN216329836 U CN 216329836U CN 202122521218 U CN202122521218 U CN 202122521218U CN 216329836 U CN216329836 U CN 216329836U
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CN
China
Prior art keywords
groove
fixedly connected
plate
inner cavity
lower die
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Expired - Fee Related
Application number
CN202122521218.XU
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Chinese (zh)
Inventor
杜国荣
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Hangzhou Yaboli Technology Co ltd
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Hangzhou Yaboli Technology Co ltd
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Priority to CN202122521218.XU priority Critical patent/CN216329836U/en
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Abstract

The utility model discloses a plastic die with an automatic material ejection function, which comprises a bottom plate and a lower die, wherein supporting rods are fixedly connected to the periphery of the top of the bottom plate, a top plate is fixedly connected to the top of each supporting rod, an upper die plate is fixedly connected to the bottom of the top plate, the lower die is movably connected with the bottom of the upper die plate, a forming groove is formed in the middle end of an inner cavity of the lower die, a groove is formed in the bottom of the inner cavity of the forming groove, a push plate is movably connected to the inner cavity of the groove, vertical rods are fixedly connected to the periphery of the bottom of the push plate, and the bottoms of the vertical rods penetrate through the lower die and are fixedly connected with the top of the bottom plate. The utility model solves the problems that the existing plastic mould does not have an automatic ejection function and is inconvenient for people to use by mutually matching the lower mould, the electric telescopic rod, the upper mould plate, the feeding pipe, the forming groove, the semiconductor refrigerator, the fan, the refrigerating groove, the temperature sensor, the air inlet, the one-way valve, the groove and the push plate.

Description

Plastic mold with automatic material ejection function
Technical Field
The utility model relates to the technical field of plastic molds, in particular to a plastic mold with an automatic material ejection function.
Background
Plastic molds are tools used in the plastic processing industry to complement plastic molding machines to impart a complete configuration and precise dimensions to plastic articles. The plastic mold has various types and structures, and plastic processing mold types corresponding to different technological requirements can be divided according to different molding methods, such as an injection molding mold, an extrusion molding mold, a plastic suction molding mold, a high foaming polystyrene molding mold and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a plastic die with an automatic material ejection function, which has the advantage of an automatic ejection function and solves the problem that the existing plastic die is inconvenient to use because the existing plastic die does not have the automatic ejection function.
In order to achieve the purpose, the utility model provides the following technical scheme: a plastic die with an automatic material ejecting function comprises a bottom plate and a lower die, wherein support rods are fixedly connected to the periphery of the top of the bottom plate, a top plate is fixedly connected to the top of the support rods, an upper die plate is fixedly connected to the bottom of the top plate, the lower die is movably connected with the bottom of the upper die plate, a forming groove is formed in the middle end of an inner cavity of the lower die, a groove is formed in the bottom of the inner cavity of the forming groove, a push plate is movably connected to the inner cavity of the groove, vertical rods are fixedly connected to the periphery of the bottom of the push plate, the bottom of each vertical rod penetrates through the lower die and is fixedly connected with the top of the bottom plate, a refrigerating groove is formed in the outer portion of the forming groove in the inner cavity of the lower die, semiconductor refrigerators are fixedly connected to the left side and the right side of the inner cavity of the refrigerating groove, a radiating surface of each semiconductor refrigerator extends to the outer portion of the side of the lower die, and a temperature sensor is fixedly connected to the right end of the bottom of the inner cavity of the refrigerating groove, the improved refrigeration mould is characterized in that a connecting plate is fixedly connected to the upper portions of the left side and the right side of the refrigeration groove, electric telescopic rods are fixedly connected to the front end and the rear end of the bottom of the connecting plate, the bottom of each electric telescopic rod is fixedly connected with the top of the bottom plate, and a fan is fixedly mounted on the front face of the lower mould.
Preferably, the air suction port of the fan is fixedly connected with the front surface of the inner cavity of the refrigerating groove through a pipeline, and the top of the push plate and the bottom of the inner cavity of the forming groove are positioned on the same horizontal plane.
Preferably, the bottom fixedly connected with inlet pipe of cope match-plate pattern, the other end and the discharge gate fixed connection of external plastics extruder of inlet pipe.
Preferably, the front surface of the bottom plate is fixedly provided with a PLC controller, and the output end of the PLC controller is electrically connected with the input ends of the electric telescopic rod, the semiconductor refrigerator and the fan respectively.
Preferably, the front surface of the top plate is fixedly provided with a display, and the input end of the display is electrically connected with the output end of the temperature sensor.
Preferably, the back of the inner cavity of the refrigerating groove is provided with an air inlet, and the inner cavity of the air inlet is fixedly provided with a one-way valve.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model can send the material into the forming groove through the feeding pipe, thereby forming the material, the semiconductor refrigerator is opened in the forming process, the semiconductor refrigerator can absorb heat for refrigeration, the temperature in the refrigerating groove can be reduced, the temperature in the forming groove can be reduced, the forming speed of the material in the forming groove can be improved, the semiconductor refrigerator is closed after the material is formed, the fan and the electric telescopic rod are opened, the lower die can be driven to move downwards by the electric telescopic rod, when the lower die moves downwards, the formed material can be propped under the matching of the vertical rod, the groove and the push plate, so that the formed material does not move downwards along with the lower die, thereby playing the role of automatically ejecting the material, facilitating people to take the material, the cold air in the refrigerating groove can be discharged by the fan, and avoiding the influence of the cold air on the forming effect of the next material, utilize the air inlet, can guarantee the stability of refrigeration inslot pressure, utilize the check valve, can make outside air get into the refrigeration inslot to prevent the gaseous outflow of refrigeration inslot, solved present plastic mold and not have automatic ejecting function, the problem that people used not convenient for.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application, and in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a left side view of the present invention;
FIG. 3 is a schematic cross-sectional view of the lower mold of the present invention in a top view;
FIG. 4 is an enlarged schematic view of the structure at A of the present invention.
In the figure: 1. a base plate; 2. a vertical rod; 3. a lower die; 4. an electric telescopic rod; 5. a connecting plate; 6. a support bar; 7. mounting a template; 8. a feed pipe; 9. forming a groove; 10. a semiconductor refrigerator; 11. a fan; 12. a PLC controller; 13. a refrigeration tank; 14. a temperature sensor; 15. an air inlet; 16. a one-way valve; 17. a groove; 18. pushing the plate; 19. a top plate; 20. a display.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The bottom plate 1, the vertical rod 2, the lower die 3, the electric telescopic rod 4, the connecting plate 5, the supporting rod 6, the upper die plate 7, the feeding pipe 8, the forming groove 9, the semiconductor refrigerator 10, the fan 11, the PLC 12, the refrigerating groove 13, the temperature sensor 14, the air inlet 15, the one-way valve 16, the groove 17, the push plate 18, the top plate 19 and the display 20 are all universal standard parts or parts known by a person skilled in the art, and the structure and the principle of the utility model can be known by technical manuals or conventional experimental methods.
Referring to fig. 1-4, a plastic mold with automatic material ejection function comprises a bottom plate 1 and a lower mold 3, wherein the periphery of the top of the bottom plate 1 is fixedly connected with a support rod 6, the top of the support rod 6 is fixedly connected with a top plate 19, the bottom of the top plate 19 is fixedly connected with an upper mold plate 7, the lower mold 3 is movably connected with the bottom of the upper mold plate 7, the middle end of the inner cavity of the lower mold 3 is provided with a forming groove 9, the bottom of the inner cavity of the forming groove 9 is provided with a groove 17, the inner cavity of the groove 17 is movably connected with a push plate 18, the periphery of the bottom of the push plate 18 is fixedly connected with a vertical rod 2, the bottom of the vertical rod 2 penetrates through the lower mold 3 and is fixedly connected with the top of the bottom plate 1, the inner cavity of the lower mold 3 is provided with a refrigeration groove 13 outside the forming groove 9, the left side and the right side of the inner cavity of the refrigeration groove 13 are fixedly connected with a semiconductor refrigerator 10, and the heat dissipation surface of the semiconductor refrigerator 10 extends to the outside of the side of the lower mold 3, a temperature sensor 14 is fixedly connected at the right end of the bottom of an inner cavity of a refrigerating groove 13, connecting plates 5 are fixedly connected at the upper parts of the left side and the right side of the refrigerating groove 13, electric telescopic rods 4 are fixedly connected at the front end and the rear end of the bottom of the connecting plates 5, the bottom of the electric telescopic rods 4 is fixedly connected with the top of a bottom plate 1, a fan 11 is fixedly installed at the front of a lower die 3, an air suction port of the fan 11 is fixedly connected with the front of the inner cavity of the refrigerating groove 13 through a pipeline, the top of a push plate 18 and the bottom of the inner cavity of a forming groove 9 are positioned at the same horizontal plane, a feed pipe 8 is fixedly connected at the bottom of an upper die plate 7, the other end of the feed pipe 8 is fixedly connected with a discharge port of an external plastic extruder, a PLC 12 is fixedly installed at the front of the bottom plate 1, the output end of the PLC 12 is respectively electrically connected with the input ends of the electric telescopic rods 4, the semiconductor refrigerator 10 and the fan 11, and a display 20 is fixedly installed at the front of a top plate 19, the input end of the display 20 is electrically connected with the output end of the temperature sensor 14, the back of the inner cavity of the refrigerating tank 13 is provided with an air inlet 15, the inner cavity of the air inlet 15 is fixedly provided with a one-way valve 16, materials can be fed into the forming tank 9 through the feeding pipe 8, so that the materials can be formed, the semiconductor refrigerator 10 is opened in the forming process, the semiconductor refrigerator 10 can absorb heat for refrigeration by utilizing the semiconductor refrigerator 10, the temperature in the refrigerating tank 13 can be reduced, the temperature in the forming tank 9 can be reduced, the forming speed of the materials in the forming tank 9 can be improved, the semiconductor refrigerator 10 is closed after the materials are formed, a fan 11 and an electric telescopic rod 4 are opened, the lower die 3 can be driven to move downwards by utilizing the electric telescopic rod 4, when the lower die 3 moves downwards, the formed materials can be propped under the matching of the vertical rod 2, the groove 17 and the push plate 18, make fashioned material not along with bed die 3 downstream, thereby can play the effect of automatic ejecting material, make things convenient for people to get the material, utilize fan 11, can discharge the air conditioning in refrigeration groove 13, avoid air conditioning to influence the shaping effect of next time material, utilize air inlet 15, can guarantee the stability of pressure in refrigeration groove 13, utilize check valve 16, can make outside air get into in refrigeration groove 13, and prevent the gaseous outflow in refrigeration groove 13, it does not have automatic ejecting function to have solved present plastic mold, the problem of being not convenient for people to use.
When in use, the material can be sent into the forming groove 9 through the feeding pipe 8, so that the material can be formed, the semiconductor refrigerator 10 is opened in the forming process, the semiconductor refrigerator 10 can absorb heat for refrigeration, the temperature in the refrigerating groove 13 can be reduced, so that the temperature in the forming groove 9 can be reduced, the forming speed of the material in the forming groove 9 can be improved, the semiconductor refrigerator 10 is closed after the material is formed, the fan 11 and the electric telescopic rod 4 are opened, the lower die 3 can be driven to move downwards by using the electric telescopic rod 4, when the lower die 3 moves downwards, the formed material can be propped under the matching of the vertical rod 2, the groove 17 and the push plate 18, so that the formed material does not move downwards along with the lower die 3, so that the effect of automatically ejecting the material can be achieved, the material taking is convenient for people, and the cold air in the refrigerating groove 13 can be discharged by using the fan 11, avoid air conditioning to influence the shaping effect of material next time, utilize air inlet 15, can guarantee the stability of the interior pressure of refrigeration groove 13, utilize check valve 16, can make in the outside air gets into refrigeration groove 13 to prevent the gaseous outflow in refrigeration groove 13, solved present plastic mold and not have automatic ejecting function, the problem that the people of being not convenient for used.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a plastic mold who possesses automatic liftout function, includes bottom plate (1) and bed die (3), its characterized in that: the bottom plate is characterized in that supporting rods (6) are fixedly connected to the periphery of the top of the bottom plate (1), a top plate (19) is fixedly connected to the top of the supporting rods (6), an upper template (7) is fixedly connected to the bottom of the top plate (19), a lower die (3) is movably connected to the bottom of the upper template (7), a forming groove (9) is formed in the middle end of the inner cavity of the lower die (3), a groove (17) is formed in the bottom of the inner cavity of the forming groove (9), a push plate (18) is movably connected to the inner cavity of the groove (17), vertical rods (2) are fixedly connected to the periphery of the bottom of the push plate (18), the bottoms of the vertical rods (2) penetrate through the lower die (3) and are fixedly connected to the top of the bottom plate (1), a refrigerating groove (13) is formed in the outer portion of the inner cavity of the lower die (3), and semiconductor refrigerators (10) are fixedly connected to the left side and the right side of the inner cavity of the refrigerating groove (13), the heat dissipation surface of semiconductor cooler (10) extends to the outside of bed die (3) side, the right-hand member fixedly connected with temperature-sensing ware (14) of refrigeration groove (13) inner chamber bottom, the equal fixedly connected with connecting plate (5) in upper portion of refrigeration groove (13) the left and right sides, the equal fixedly connected with electric telescopic handle (4) in both ends around connecting plate (5) bottom, the bottom of electric telescopic handle (4) and the top fixed connection of bottom plate (1), the positive fixed mounting of bed die (3) has fan (11).
2. The plastic mold with the automatic ejection function according to claim 1, wherein: the suction port of the fan (11) is fixedly connected with the front surface of the inner cavity of the refrigerating groove (13) through a pipeline, and the top of the push plate (18) and the bottom of the inner cavity of the forming groove (9) are positioned on the same horizontal plane.
3. The plastic mold with the automatic ejection function according to claim 1, wherein: the bottom fixedly connected with inlet pipe (8) of cope match-plate pattern (7), the other end and the discharge gate fixed connection of external plastics extruder of inlet pipe (8).
4. The plastic mold with the automatic ejection function according to claim 1, wherein: the front surface of the bottom plate (1) is fixedly provided with a PLC (programmable logic controller) (12), and the output end of the PLC (12) is electrically connected with the input ends of the electric telescopic rod (4), the semiconductor refrigerator (10) and the fan (11) respectively.
5. The plastic mold with the automatic ejection function according to claim 1, wherein: the front surface of the top plate (19) is fixedly provided with a display (20), and the input end of the display (20) is electrically connected with the output end of the temperature sensor (14).
6. The plastic mold with the automatic ejection function according to claim 1, wherein: an air inlet (15) is formed in the back face of the inner cavity of the refrigerating groove (13), and a one-way valve (16) is fixedly mounted in the inner cavity of the air inlet (15).
CN202122521218.XU 2021-10-20 2021-10-20 Plastic mold with automatic material ejection function Expired - Fee Related CN216329836U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122521218.XU CN216329836U (en) 2021-10-20 2021-10-20 Plastic mold with automatic material ejection function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122521218.XU CN216329836U (en) 2021-10-20 2021-10-20 Plastic mold with automatic material ejection function

Publications (1)

Publication Number Publication Date
CN216329836U true CN216329836U (en) 2022-04-19

Family

ID=81178587

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122521218.XU Expired - Fee Related CN216329836U (en) 2021-10-20 2021-10-20 Plastic mold with automatic material ejection function

Country Status (1)

Country Link
CN (1) CN216329836U (en)

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Granted publication date: 20220419