CN216313213U - Camera module and electronic equipment - Google Patents

Abstract

The application provides a module and electronic equipment make a video recording, the module of making a video recording includes: the image sensor is arranged on the substrate, one side of the substrate is connected with the circuit board, and a connector is arranged at one end, far away from the image sensor, of the circuit board. The metal cover is covered on the substrate, and one end of the metal cover close to the substrate is provided with a metal cover pin which is connected with the substrate. The motor coil is located between the metal cover and the substrate, a first pin connected with the substrate is arranged at one end of the motor coil, a second pin connected with the substrate is arranged at the other end of the motor coil, and at least one of the metal cover pin, the first pin and the second pin is located on one side, close to the connector, of the substrate. The camera module in this application is through the hookup location of adjustment metal covering pin, first pin and second pin and base plate to camera module easily receives the problem that EMI disturbed the influence among the solution prior art.

Description

Camera module and electronic equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to the field of electronic component circuit board design, in particular to a camera module and electronic equipment.

[ background of the utility model ]

The mobile phone comprises an existing mobile phone panel and the like, wherein a camera module with a focusing function is usually arranged in the existing mobile phone panel and the like, the camera module comprises a PCB (Printed Circuit Board), an image sensor positioned on the PCB, a Board To Board (BTB) connector connected with one end of the PCB and a metal cover used for supporting a focusing motor coil, a metal cover pin connected with the PCB is arranged on the metal cover, and coil pins connected with the PCB are arranged at two ends of the focusing motor coil.

In the camera module in the prior art, the metal cover pin and the coil pin are usually disposed on a side of the image sensor away from the BTB connector, so that EMI (Electromagnetic Interference) generated when the antenna works or static electricity is discharged enters the PCB through the metal cover pin and the coil pin and flows through the image sensor to the BTB connector, so that the image sensor in the camera module is interfered and normal operation of the camera module is affected.

[ Utility model ] content

In view of this, the present application provides a camera module and an electronic device, so as to solve the problem that the camera module is susceptible to EMI interference in the prior art.

In a first aspect, a camera module is provided, which includes: the motor comprises a substrate, a metal cover and a motor coil, wherein an image sensor is arranged on the substrate, one side of the substrate is connected with a circuit board, and a connector is arranged at one end, far away from the image sensor, of the circuit board. The metal cover is covered on the substrate, a metal cover pin is arranged at one end, close to the substrate, of the metal cover, and the metal cover pin is connected with the substrate. The motor coil is positioned between the metal cover and the substrate, one end of the motor coil is provided with a first pin connected with the substrate, the other end of the motor coil is provided with a second pin connected with the substrate, and at least one of the metal cover pin, the first pin and the second pin is positioned on one side of the substrate close to the connector.

In the camera module provided by the embodiment of the utility model, at least one of the metal cover pin, the first pin and the second pin is arranged on one side of the substrate close to the connector, so that when EMI interference generated during the operation of the antenna or the electrostatic discharge is transmitted to the motor coil and the metal cover through electric field coupling, interference current flows to the connector from one side of the substrate close to the connector along the metal cover pin, the first pin or the second pin, thereby avoiding the interference current from passing through the image sensor on the substrate, improving the operation stability of the image sensor and further ensuring the normal operation of the camera module.

With reference to the first aspect, the substrate includes two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the first pin is located at one end of the second side edge, and the second pin and the metal cover pin are located at the other end of the second side edge.

With reference to the first aspect, the arrangement direction of the second pins and the pins of the metal cover is the same as the extending direction of the first side or the second side.

With reference to the first aspect, the substrate includes two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the metal cover pin is located at one end of the second side edge, and the first pin and the second pin are located at the other end of the second side edge.

With reference to the first aspect, the arrangement direction of the first pins and the second pins is the same as the extending direction of the first side or the second side.

With reference to the first aspect, the substrate includes two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the second pin is located at one end of the second side edge, and the first pin and the metal cover pin are located at the other end of the second side edge.

With reference to the first aspect, the arrangement direction of the first pins and the pins of the metal cover is the same as the extending direction of the first side or the second side.

With reference to the first aspect, the metal cap pin, the first pin, and the second pin are all connected to the substrate by solder.

In a second aspect, an electronic device is provided, which includes the camera module of any one of the above embodiments, and obviously has the advantages of the camera module.

With reference to the second aspect, the electronic device is a mobile phone.

Additional features and advantages of embodiments of the present application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of embodiments of the present application. The objectives and other advantages of the embodiments of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a mobile phone in the prior art;

FIG. 2 is a schematic structural diagram of a camera module in the prior art;

fig. 3 is a schematic view of an assembly structure of the camera module according to the embodiment of the present disclosure;

fig. 4 is a schematic structural diagram (one) of a camera module according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram (two) of the camera module provided in the embodiment of the present application;

fig. 6 is a schematic structural diagram (iii) of the camera module provided in the embodiment of the present application;

fig. 7 is a schematic structural diagram (iv) of the camera module provided in the embodiment of the present application;

fig. 8 is a schematic structural diagram (five) of the camera module provided in the embodiment of the present application;

fig. 9 is a schematic structural diagram (vi) of the camera module according to the embodiment of the present application.

Reference numerals:

100-a camera module;

1-a substrate;

11-an image sensor;

12-a circuit board;

13-a connector;

14-a first side edge;

15-a second side edge;

16-camera trim;

2-a metal cover;

21-metal cap pins;

3-motor coils;

31-a first pin;

32-second pin.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

[ detailed description ] embodiments

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.

For clarity and conciseness of the following description of the various embodiments, a brief introduction to related concepts or technologies is first presented:

emi (electromagnetic interference) interference refers to an interference phenomenon generated after electromagnetic waves and electronic components act, and includes both conducted interference and radiated interference. Conducted interference refers to coupling (interfering) a signal on one electrical network to another electrical network through a conductive medium. The radiated interference means that an interference source couples (interferes) a signal to another electric network through space, and in the circuit design in the wireless equipment, a high-frequency signal line, pins of an integrated circuit, various connectors and the like can be radiated interference sources with antenna characteristics, and can emit electromagnetic waves and influence the normal work of other systems or other subsystems in the system.

ESD (electrostatic discharge), the mechanism of electrostatic discharge formation and its damage to electronic products: static electricity is formed by the accumulation of positive and negative charges on two objects when two substances with different dielectric coefficients rub. When the electrostatic source contacts other objects, there is a charge flow to counteract the voltage, and this high rate of charge transfer creates potentially damaging voltages, currents, and electromagnetic fields, which are electrostatic discharges. In the production and use of electronic products, operators are the most active static electricity sources, and may accumulate a certain amount of charges, and when a human body contacts with a component or a device connected with the ground, electrostatic discharge is generated, which is generally represented by ESD.

ESD can cause interference to electronic circuits, and there are two ways to interfere with ESD circuits. One is conduction, if some part of the circuit forms a discharge path, i.e. the ESD current penetrates into the circuit inside the device, the ESD current flows through the input of the chip, causing interference. Another way of ESD interference is radiated interference. That is, a peak current is generated along with a spark during electrostatic discharge, and this current contains a high-frequency component in a large amount. Thereby generating a radiated magnetic field and an electric field, the magnetic field being able to induce a disturbing electromotive force in the respective signal loops of the nearby circuits. This disturbing emf is likely to exceed the threshold level of the logic circuit, causing false triggering. The magnitude of the radiated interference also depends on the distance of the circuit from the point of electrostatic discharge. The magnetic field generated by ESD decays with the square of the distance and the electric field generated by ESD decays with the cube of the distance. When the distance is short, both the electric field and the magnetic field are strong. When ESD occurs, the circuitry in the nearby location is typically affected. ESD in the near field, the fundamental way of radiative coupling can be capacitive or inductive, depending on the impedance of the ESD source and receiver, under which the devices in the circuit are subject to EMI interference.

Electric field coupling (also known as electrostatic coupling or capacitive coupling) is a coupling mode that occurs due to the presence of distributed capacitance. Coupling refers to the process of signal transmission from the first stage to the second stage, and is generally referred to as ac coupling when not noted. Electric field coupling involves the transfer of signals or energy between different nodes of a circuit through capacitance.

In the alternating current circuit, as the voltage of one pin of the capacitor is gradually increased, the electric charges accumulated on the electrode plates connected with the pin are gradually increased, and as the voltage is gradually decreased, the electric charges accumulated on the corresponding electrode plates are gradually decreased, so that the capacitor does not actually pass through the current in the whole process, but seems to pass through the current, and therefore, the capacitor is coupled in the alternating current circuit, and the current can be approximately transferred from the previous stage to the next stage in this way.

The following describes a specific embodiment of the structure of the camera module according to the embodiment of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a mobile phone in the prior art, in which a camera module 100 is disposed on the mobile phone.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a camera module in the prior art, the camera module 100 includes: the voice coil motor mainly comprises a motor coil 3 and an optical lens, the motor coil 3 is arranged in the metal cover 2, the substrate 1 can be a PCB (printed Circuit board), an image sensor 11 is arranged on the substrate 1, one side of the substrate 1 is connected with a Circuit board 12, and a connector 13 is arranged at one end, away from the image sensor 11, of the Circuit board 12. The metal cover 2 covers the substrate 1, a pin of the metal cover 2 is arranged at one end of the metal cover 2 close to the substrate 1, and the pin of the metal cover 2 is connected with the substrate 1. The motor coil 3 is located between the metal cover 2 and the substrate 1, one end of the motor coil 3 is provided with a first pin 31 connected with the substrate 1, the other end of the motor coil 3 is provided with a second pin 32 connected with the substrate 1, and the pin of the metal cover 2, the first pin 31 and the second pin 32 are all located on one side of the substrate 1 away from the connector 13.

The camera module 100 generally receives two kinds of electromagnetic interference in daily use, one is ESD electrostatic discharge interference, and the other is radiation interference generated when the antenna normally works, both of the two kinds of interference can affect the metal cover 2 and the motor coil 3, and the metal cover 2 and the motor coil 3 can generate interference current in the metal cover 2 and the motor coil 3 under the interference of the electromagnetic field coupled in space.

In addition, a camera decoration 16 made of a metal material is usually arranged above the camera module 100, and the distance between the camera decoration 16 and the metal cover 2 is relatively short, usually 0.1-0.2 mm, so that the camera decoration 16 and the metal cover 2 can be equivalently regarded as a capacitor, and because an electric field coupling effect exists between the camera decoration 16 and the metal cover 2, when the camera decoration 16 is interfered by EMI, interference currents can be simultaneously generated on the metal cover 2; the body structure of the motor coil 3 is a winding type multi-layer coil structure, and when the motor coil 3 receives interference of a changing magnetic field or electric field, the motor coil 3 also generates interference current.

In the conventional camera module 100 in the prior art, the pin of the metal cover 2, the first pin 31, and the second pin 32 are all located on one side of the substrate 1 away from the connector 13, so that an interference current generated in the metal cover 2 and the motor coil 3 is transmitted to the substrate 1 through the pin of the metal cover 2, the first pin 31, and the second pin 32, and then the interference current passes through the image sensor 11 located at the center of the substrate 1 to reach the connector 13, and in this process, the interference current passes through the image sensor 11, which inevitably interferes with the normal operation of the image sensor 11, thereby affecting the normal operation of the camera module 100.

In view of the above, the present invention provides a camera module 100, wherein in one embodiment, the camera module 100 includes: the image sensor comprises a substrate 1, a metal cover 2 and a motor coil 3, wherein an image sensor 11 is arranged on the substrate 1, one side of the substrate 1 is connected with a circuit board 12, and one end, far away from the image sensor 11, of the circuit board 12 is provided with a connector 13. The metal cover 2 covers the substrate 1, a pin of the metal cover 2 is arranged at one end of the metal cover 2 close to the substrate 1, and the pin of the metal cover 2 is connected with the substrate 1. The motor coil 3 is located between the metal cover 2 and the substrate 1, one end of the motor coil 3 is provided with a first pin 31 connected with the substrate 1, the other end of the motor coil 3 is provided with a second pin 32 connected with the substrate 1, wherein at least one of the pin of the metal cover 2, the first pin 31 and the second pin 32 is located on one side of the substrate 1 close to the connector 13.

Referring to fig. 3, fig. 3 is an assembly structure diagram of the camera module 100 according to the embodiment of the present disclosure, as shown in fig. 3, the pins of the metal cap 2, the first pins 31, and the second pins 32 are all located on one side of the substrate 1 close to the connector 13, that is, the pins of the metal cap 2, the first pins 31, and the second pins 32 are located on a side of the image sensor 11 close to the connector 13 and do not contact with the image sensor 11. Therefore, even if the camera module 100 is subjected to the two interference sources (ESD electrostatic discharge interference and antenna radiation interference) in daily use, the two interferences all affect the metal cover 2 and the motor coil 3, so that an interference current is generated in the metal cover 2 and the motor coil 3, the interference current generated in the metal cover 2 and the motor coil 3 is transmitted to the substrate 1 through the pins of the metal cover 2, the first pin 31 and the second pin 32, and then reaches the connector 13, and the interference current does not flow through the image sensor 11 in the process, so that the image sensor 11 is prevented from being interfered, and the normal operation of the camera module 100 is ensured. It can be understood that, in the above embodiment, the pins of the metal cover 2, the first pins 31 and the second pins 32 are all disposed on the side of the substrate 1 close to the connector 13, so as to ensure that no interference current generated on the metal cover 2 or the interference current generated by the motor coil 3 flows through the image sensor 11, in practical use, only the pins of the metal cover 2 may be disposed on the side of the substrate 1 close to the connector 13, so as to prevent the interference current generated on the metal cover 2 from interfering with the image sensor 11, or only the first pins 31 and/or the second pins 32 may be disposed on the side of the substrate 1 close to the connector 13, so as to prevent the interference current generated on the motor coil 3 from interfering with the image sensor 11.

In one embodiment, the leads of the metal cap 2, the first leads 31 and the second leads 32 are all connected to the substrate 1 by solder, and the above-mentioned soldering method can improve the stability of the electrical connection between the leads and the substrate 1.

In one embodiment, the Circuit board 12 is a Flexible Printed Circuit (FPC) 12, and the Flexible Printed Circuit 12 is used to facilitate connection of the connector 13 to a motherboard.

In one embodiment, the connector 13 is a BTB (Board to Board) connector, and in the field of electronic devices, the BTB connector is mainly used for connecting components such as a display screen, a touch screen, and a camera with various circuit boards.

Specific examples are given below:

in the first embodiment, the first step is,

referring to fig. 4, as shown in a schematic structural diagram (a) of the camera module according to the embodiment of the present disclosure, the substrate 1 includes two first sides 14 disposed opposite to each other and a second side 15 connected to the two first sides 14, and the second side 15 is connected to the circuit board 12; the first pins 31 are located at one end of the second side 15, the second pins 32 and the pins of the metal cover 2 are located at the other end of the second side 15, and the arrangement direction of the second pins 32 and the pins of the metal cover 2 is the same as the extension direction of the first side 14.

In the second embodiment, the first embodiment of the method,

referring to fig. 5, a structural schematic diagram (two) of the camera module according to the embodiment of the present disclosure is shown, which is different from the first embodiment in that the arrangement direction of the second pins 32 and the pins of the metal cover 2 is the same as the extending direction of the second side 15.

In the third embodiment, the first step is that,

referring to fig. 6, as shown in a schematic structural diagram (iii) of the camera module provided in the embodiment of the present application, the substrate 1 includes two first sides 14 disposed opposite to each other and a second side 15 connected to the two first sides 14, and the second side 15 is connected to the circuit board 12; the metal cover 2 has a pin at one end of the second side 15, and the first pin 31 and the second pin 32 are at the other end of the second side 15. The arrangement direction of the first leads 31 and the second leads 32 is the same as the extending direction of the first side 14.

In the fourth embodiment, the first step is that,

referring to fig. 7, a schematic structural diagram (four) of the camera module according to the embodiment of the present disclosure is shown, which is different from the embodiment in that the arrangement direction of the first pins 31 and the second pins 32 is the same as the extending direction of the second side 15.

In the fifth embodiment, the first step is,

referring to fig. 8, as shown in a schematic structural diagram (v) of the camera module provided in the embodiment of the present application, the substrate 1 includes two first sides 14 disposed opposite to each other and a second side 15 connected to the two first sides 14, and the second side 15 is connected to the circuit board 12; the second pin 32 is located at one end of the second side 15, and the first pin 31 and the pin of the metal cover 2 are located at the other end of the second side 15. The arrangement direction of the first leads 31 and the leads of the metal cover 2 is the same as the extending direction of the first side 14.

In the sixth embodiment, the process is carried out,

referring to fig. 9, as shown in a schematic structural diagram (six) of the camera module according to the embodiment of the present disclosure, compared to the fifth embodiment, the arrangement direction of the first pins 31 and the pins of the metal cover 2 is the same as the extending direction of the first side 14 or the second side 15.

The application still provides an electronic equipment, it includes any one of the aforesaid module 100 of making a video recording, it obviously has the above-mentioned advantage of making a video recording module 100, and electronic equipment can be for cell-phone, panel computer, notebook computer, car machine, point of sale terminal, personal stereo, intelligent bracelet, intelligent wrist-watch, augmented reality equipment or virtual reality equipment etc. have the product of the module of making a video recording wantonly.

In one embodiment, the electronic device is a mobile phone, and a lens of the mobile phone using the camera module 100 has high EMI interference resistance, high stability and high imaging quality.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (10)

1. The utility model provides a module of making a video recording, its characterized in that, the module of making a video recording includes:

the image sensor is arranged on the substrate, one side of the substrate is connected with a circuit board, and one end, far away from the image sensor, of the circuit board is provided with a connector;

the metal cover is covered on the substrate, one end of the metal cover close to the substrate is provided with a metal cover pin, and the metal cover pin is connected with the substrate; and

the motor coil is positioned between the metal cover and the substrate, one end of the motor coil is provided with a first pin connected with the substrate, and the other end of the motor coil is provided with a second pin connected with the substrate;

at least one of the metal cover pin, the first pin and the second pin is located on one side of the substrate close to the connector.

2. The camera module according to claim 1, wherein the substrate comprises two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the first pin is located at one end of the second side edge, and the second pin and the metal cover pin are located at the other end of the second side edge.

3. The camera module of claim 2, wherein the second leads and the metal cap leads are arranged in the same direction as the first side or the second side.

4. The camera module according to claim 1, wherein the substrate comprises two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the metal cover pin is located at one end of the second side edge, and the first pin and the second pin are located at the other end of the second side edge.

5. The camera module of claim 4, wherein the first leads and the second leads are arranged in the same direction as the first side or the second side.

6. The camera module according to claim 1, wherein the substrate comprises two first sides disposed opposite to each other and a second side connected to the two first sides, and the second side is connected to the circuit board; the second pin is located at one end of the second side edge, and the first pin and the metal cover pin are located at the other end of the second side edge.

7. The camera module of claim 6, wherein the first leads and the metal cover leads are arranged in the same direction as the first side or the second side.

8. The camera module of claim 1, wherein the metal cap lead, the first lead and the second lead are all connected to the substrate by solder.

9. An electronic device comprising the camera module of any one of claims 1-8.

10. The electronic device of claim 9, wherein the electronic device is a cell phone.

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