CN216252803U

CN216252803U - Modularization embedded intelligent gateway

Info

Publication number: CN216252803U
Application number: CN202123022900.0U
Authority: CN
Inventors: 廖孟南; 陈良柱; 杨冬林
Original assignee: Shenzhen Toptec Software Technology Co ltd
Current assignee: Shenzhen Toptec Software Technology Co ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-04-08
Anticipated expiration: 2031-12-03

Abstract

The utility model discloses a modularized embedded intelligent gateway, which comprises a first PCB and brackets respectively arranged at two ends of the first PCB, wherein two brackets are arranged on the same side surface of the first PCB, the brackets are vertically arranged with the first PCB, a plurality of functional components with the same shape and size are also arranged on the first PCB, the functional components are detachably connected with the first PCB through connectors, the functional components are in modularized design, the shape and the size of each functional component are not only consistent, but also the structure of the connector for connecting each functional component with the first PCB is consistent, the installation positions of the connectors on the functional components are the same, so that the types of the functional components can be randomly replaced by the functional components, electrical signals are exchanged among the functional components through the first PCB, the use of connecting lines among the functional components is reduced, and the later maintenance difficulty is greatly reduced, replacement and maintenance of functional components are easier.

Description

Modularization embedded intelligent gateway

Technical Field

The utility model relates to the field of intelligent gateways, in particular to a modular embedded intelligent gateway.

Background

The gateway is also called an internetwork connector and a protocol converter. The gateways realize network interconnection above a network layer, can realize conversion between two systems with different communication protocols, data formats or languages and even completely different architectures, and intelligent devices on the market are all in a large variety, the adopted communication protocols are various, if the intelligent devices need to be integrated together, various gateways with different numbers need to be equipped, and the gateways applied in different occasions are different, so that a new gateway needs to be redesigned to meet different application requirements, and the problems of resource waste and cost increase are caused.

The Chinese patent name 'a modular and extensible intelligent power monitoring and protecting device', patent application number 201721203885.0, discloses a modular and extensible intelligent power monitoring and protecting device, wherein unit modules are designed in a modular manner, all the unit modules are installed on an array bookshelf through connecting pieces, ports are arbitrarily expanded and closed through software programs or customized physical function interfaces, and functions of the unit modules are expanded through the software programs to provide different monitoring functions for different loads; and what above-mentioned prior art adopted is that connecting wire connects each unit module, and the connecting wire exposes and puts together with unit module connection external equipment in mixture at the box surface, greatly increased the maintenance degree of difficulty in later stage, made maintenance efficiency reduce greatly.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a modularized embedded intelligent gateway, which aims to solve the problem that the existing gateway in the background technology cannot configure a communication protocol according to requirements, so that the requirements of different applications are met.

In order to solve the technical problems, the following technical scheme is proposed:

the utility model provides a modular embedded intelligent gateway, includes functional component, functional component is the modularized design, functional component includes second PCB board, public inserting and baffle, public inserting sets up one side of second PCB board, the baffle sets up the second PCB board is kept away from public one side of inserting still includes first PCB board and support, two support parallel arrangement is in the both sides of first PCB board, first PCB board is connected one side of support still be equipped with public corresponding female the inserting, still be equipped with on the support and be used for accepting the draw-in groove of second PCB board, female inserting sets up at equidistant setting on the first PCB board, makes second PCB board with first PCB board passes through public inserting with female when inserting the detachable connection, adjacent two the lateral wall of baffle laminates each other.

Preferably, the number of the female plugs on the first PCB is 7, and when the functional components are fully inserted into the first PCB, the baffle plates can be combined into a complete plate surface, and the plate surface can just cover a plane formed by the two brackets.

Preferably, the functional assembly further comprises a functional chip and a functional interface, the chip is arranged on the second PCB, the functional interface is arranged at one end of the baffle plate arranged on the second PCB, and the baffle plate is further provided with an opening for enabling the functional interface to extend out.

Preferably, the bracket is further provided with a threaded hole for fixing the baffle, and one female plug is provided with one threaded hole on the bracket corresponding to two sides of the first PCB respectively and on the same horizontal plane.

Preferably, the baffle is further provided with a through hole corresponding to the threaded hole, and the baffle is detachably connected with the support through a screw.

Preferably, the male plug and the female plug are one of a euro-type socket or a magnetic-type connector.

Preferably, the PCB further comprises a shell, and the first PCB, the bracket and the functional component are all arranged in the shell.

Preferably, the outer surface of the side wall of the housing is further provided with a convex edge extending outwards, and the convex edge is used for connecting the housing with external equipment.

Has the advantages that: a modularized embedded intelligent gateway comprises a first PCB and brackets respectively arranged at two ends of the first PCB, the two brackets are arranged on the same side surface of the first PCB, the bracket is arranged vertically to the first PCB board, a plurality of functional components with the same shape and size are also arranged on the first PCB board, the functional components are detachably connected with the first PCB board through connectors, the functional components are in modular design, each functional component not only has the same shape and size, and the structure of the connector for connecting each functional module with the first PCB is consistent, the same is true for the installation position of the connector at the functional module, and then make functional unit can change functional unit's kind at will, exchange the signal of telecommunication through first PCB board between the functional unit moreover, reduced the use of the connecting wire between the functional unit, greatly reduced the maintenance degree of difficulty in later stage, be liable to functional unit's change and maintenance more.

Drawings

FIG. 1 is a block diagram of the present invention;

FIG. 2 is an internal structural view of the present invention;

FIG. 3 is a sectional view of the present application;

fig. 4 is a functional block diagram.

The main element symbols are as follows:

1. a housing; 11. a convex edge; 2. a support; 3. a first PCB board;

4. a functional component; 41. a second PCB board; 42. a baffle plate; 43. a functional interface; 44. a through hole;

5. a connector assembly; 51. male insertion; 52. mother insertion; 6. a clamping groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

The following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model discloses a modularized embedded intelligent gateway, which participates in figures 1-3, and comprises a functional component 4, wherein the functional component 4 is in modularized design, the functional component 4 comprises a second PCB board 41, a male plug 51 and a baffle 42, the male plug 51 is arranged at one side of the second PCB board 41, the baffle 42 is arranged at one side of the second PCB board 41 far away from the male plug 51, the gateway also comprises a first PCB board 3 and supports 2, the two supports 2 are arranged at two sides of the first PCB board 3 in parallel, one side of the first PCB board 3 connected with the supports 2 is also provided with a female plug 52 corresponding to the male plug 51, the male plug 51 and the female plug 52 form a group of complete connectors 5, the structure of the connectors 5 of each functional component 4 connected with the first PCB board 3 is consistent, the installation positions of the connectors 5 at the functional components 4 are also the same, so that the functional components 4 can freely change the types of the functional components 4, and electrical signals are exchanged between the functional components 4 through the first PCB board 33, the use of the connecting wire between the functional unit 4 has been reduced, greatly reduced the maintenance degree of difficulty in later stage, be easier for the change and the maintenance of functional unit 4, still be equipped with the draw-in groove 6 that is used for accepting second PCB board 41 on the support 2, female 52 setting of inserting is on first PCB board 3 at equidistant setting, make second PCB board 41 and first PCB board 3 through public 51 and female 52 of inserting can dismantle when being connected, the lateral wall of two adjacent baffles 42 laminates each other, when installing functional unit 4, the one end that is equipped with public 51 of second PCB board 41 is pushed in to first PCB board 3 direction along draw-in groove 6, until public 51 and female 52 joint of inserting, between two adjacent functional unit 4, can constitute a complete face.

Furthermore, 7 female plugs 52 are arranged on the first PCB 3, so that at most 7 functional components 4 can be connected to the first PCB 3, when the functional components 4 are fully inserted into the first PCB 3, the baffles 42 of the functional components 4 can be combined into a complete board, and the baffles 42 can just cover the plane formed by the two brackets 2.

In this embodiment, the functional assembly 4 further includes a functional chip and a functional interface 43, the chip is disposed on the second PCB 41, the functional interface 43 is disposed at one end of the second PCB 41 where the baffle 42 is disposed, the baffle 42 is further provided with an opening for extending the functional interface 43, the functional chip can enable the functional assembly 4 to realize different functions, different functional chips are disposed on the second PCB 41, thereby meeting actual requirements, the functional chips include a power functional chip, a CPU chip, a 4G communication chip, a switch chip, etc., the functional interface 43 is disposed in cooperation with types of the functional chips, functions realized by the functional assembly 4 with different functional chips are different, and therefore, when being connected with external devices, communication protocols used are also different, so that different functional interfaces 43 need to be disposed, thereby meeting actual requirements.

In this embodiment, the bracket 2 is further provided with a threaded hole for fixing the baffle plate 42, one female plug 52 corresponds to one set of threaded hole, the baffle plate 42 is further provided with a through hole 44 corresponding to the threaded hole, the baffle plate 42 is detachably connected with the bracket 2 through a screw, and the stability between the second PCB 41 and the first PCB 3 is further enhanced.

In this embodiment, the male plug 51 and the female plug 52 are one of the european style socket or the magnetic connector, and the european style socket can be adopted to make the connection between the first PCB 3 and the second PCB 41 more stable, and the magnetic connector is connected to the second PCB 41 more conveniently.

In this embodiment, further include shell 1, first PCB 3, support 2 and functional unit 4 set up in shell 1, and shell 1 is used for protecting first PCB 3 and functional unit 4, and is more stable when making to be connected with external equipment moreover.

Preferably, both ends of the housing 1 are further provided with flanges 11 extending outwards, the flanges 11 are further provided with through holes 44 for fixedly connecting with external equipment, and the intelligent gateway is connected with the external equipment through the flanges 11.

Has the advantages of

1. The baffle not only can protect the second PCB to make functional component and first PCB board be connected, but also can restrict the process of second PCB board, prevent that the second PCB board from leading to first PCB board to damage because exert oneself too greatly when being connected with first PCB board.

2. The utility model connects a plurality of functional components through the first PCB and the connector, and the functional components realize the exchange of electric signals through the first PCB.

Claims

1. The utility model provides an embedded intelligent gateway of modularization, a serial communication port, including functional assembly, functional assembly is the modularized design, functional assembly includes second PCB board, public inserting and baffle, public inserting sets up one side of second PCB board, the baffle sets up the second PCB board is kept away from public one side of inserting still includes first PCB board and support, two support parallel arrangement is in the both sides of first PCB board, first PCB board is connected one side of support still be equipped with public corresponding female inserting, still be equipped with on the support and be used for accepting the draw-in groove of second PCB board, female inserting sets up at equidistant setting on the first PCB board, makes second PCB board with first PCB board passes through public inserting with when female inserting the connection, adjacent two the lateral wall of baffle laminates each other.

2. The intelligent gateway of claim 1, wherein the first PCB board has 7 female connectors, and when the first PCB board is fully inserted with the functional components, the baffle can be assembled into a complete board, and the board can just cover a plane formed by two brackets.

3. The modular embedded intelligent gateway of claim 1, wherein the functional assembly further comprises a functional chip and a functional interface, the chip is disposed on the second PCB, the functional interface is disposed at an end of the second PCB where the baffle is disposed, and the baffle is further provided with an opening for extending the functional interface.

4. The modular embedded intelligent gateway of claim 1, wherein the bracket is further provided with a threaded hole for fixing the baffle, and one of the female connectors is provided with one threaded hole on the bracket corresponding to each of two sides of the first PCB and is located on the same horizontal plane.

5. The modular embedded intelligent gateway of claim 4, wherein the baffle plate is further provided with a through hole corresponding to the threaded hole, and the baffle plate is detachably connected with the bracket through a screw.

6. The modular embedded smart gateway of claim 1, wherein the male plug and the female plug are one of a euro-type socket or a magnetic-type connector.

7. The modular embedded smart gateway as recited in claim 1, further comprising a housing, wherein the first PCB board, the bracket and the functional component are disposed within the housing.

8. The modular embedded smart gateway as claimed in claim 7, wherein the outer surface of the side wall of the housing is further provided with a flange extending outwards, and the flange is used for connecting the housing with an external device.