CN216177418U - Cooling device for reflow soldering - Google Patents
Cooling device for reflow soldering Download PDFInfo
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- CN216177418U CN216177418U CN202122366373.9U CN202122366373U CN216177418U CN 216177418 U CN216177418 U CN 216177418U CN 202122366373 U CN202122366373 U CN 202122366373U CN 216177418 U CN216177418 U CN 216177418U
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- placing
- subassembly
- reflow soldering
- feeding
- frame body
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Abstract
The utility model discloses a cooling device for reflow soldering, which comprises an installation frame body, wherein a baffle is fixedly installed on one side of the installation frame body, a feeding plate is fixedly installed outwards on the baffle, a discharging plate is fixedly installed on the other side of the installation frame body, a feeding assembly is arranged on the feeding plate, a discharging assembly is arranged on the discharging plate, two parallel placing frames are installed in the installation frame body through a horizontal moving assembly, a placing frame is connected in the placing frames through a vertical moving assembly, a plurality of placing assemblies are arranged in the placing frames along the vertical direction, a plurality of through holes are formed in the placing frames and are right opposite to each placing assembly, the through holes corresponding to each placing assembly are connected with a pipeline, the pipeline is connected with a fan, and the fan is installed on the placing frames. This cooling device for reflow soldering has convenient to use, can directly increase the discharge end at reflow soldering, and the convenience is used with current reflow soldering cooperation, improves the advantage of cooling effect.
Description
Technical Field
The utility model relates to the technical field of reflow soldering, in particular to a cooling device for reflow soldering.
Background
Reflow soldering technology is not strange in the field of electronic manufacturing, components on various board cards used in computers are all soldered on a circuit board through the process, a heating circuit is arranged in the equipment, air or nitrogen is heated to a high enough temperature and then blown to the circuit board with the components attached, solder on two sides of the components is bonded with a main board after being melted, the circuit board with the components attached is conveyed out, and the circuit board is taken out after being cooled by a cooling fan, so that the soldering process is completed. The existing cooling fan is used for cooling a circuit board, if the temperature is high or the temperature in a workshop is high due to long-time operation, the cooling effect is poor, and if the temperature is not timely cooled, the brightness of a welding spot is not high, the welding spot is easy to break and peel, and the welding quality is directly influenced.
Disclosure of Invention
To the not enough of above-mentioned prior art, the technical problem that this patent application will solve how to provide a convenient to use can directly increase at the discharge end of reflow soldering, and convenient and current reflow soldering cooperation is used, improves cooling effect's cooling device for reflow soldering.
In order to solve the technical problems, the utility model adopts the following technical scheme:
the utility model provides a cooling device for reflow soldering, includes the installation framework, one side fixed mounting of installation framework has the baffle, the outside fixed mounting of baffle has the flitch, the opposite side fixed mounting of installation framework has down the flitch, upward be provided with the material loading subassembly on the flitch, be provided with the unloading subassembly down, install two racks that set up side by side through the horizontal migration subassembly in the installation framework, be connected with through vertical removal subassembly in the rack and place the frame, it is provided with a plurality of subassemblies of placing to follow vertical direction in the frame to place, it just all is provided with a plurality of perforation to every subassembly of placing to place the frame, and the perforation that corresponds every subassembly of placing all with the pipe connection, the pipe connection has the fan, the fan is installed on the rack.
Like this, reflow soldering's circuit board reachs the material loading subassembly after the discharge mechanism ejection of compact of reflow soldering passes through, horizontal migration subassembly drives the rack and corresponds with the material loading subassembly, vertical migration subassembly drives and places the frame and remove, make and place the subassembly just to the material loading subassembly, the material loading subassembly transmits the circuit board to the material loading subassembly, at follow-up material loading at every turn, vertical migration mechanism drives the subassembly of placing that is located the below and removes to just right with the material loading subassembly, the circuit board has all been placed on placing the subassembly until placing in the frame, then horizontal migration mechanism drives the rack and removes, make another rack just to the material loading subassembly, repeat above-mentioned process and continue to carry out the material loading. The fan is in the open mode, carry out cooling through pipeline and perforation to the circuit board of placing on the subassembly, after the cooling, under the action of horizontal migration subassembly and vertical removal subassembly, make the circuit board that reaches the subassembly at first just to the unloading subassembly, place the subassembly and transmit the circuit board to the unloading subassembly and carry out the unloading, the unloading is carried out in proper order, when one of them is placed the frame and is in the material loading state, another one is placed the frame and is in the unloading state, realize continuous material loading and unloading, need not to shut down, improve the cooling effect to the circuit board.
The feeding assembly comprises two feeding synchronous belts, the feeding synchronous belts are arranged oppositely and mounted on a feeding support plate, the feeding support plate is fixedly mounted on a feeding plate, an air blower is fixedly mounted on the feeding plate through a support, and an air outlet of the air blower is arranged downwards; the blanking assembly comprises two blanking synchronous belts, the blanking synchronous belts are arranged oppositely and are arranged on a blanking support plate, and the blanking support plate is fixedly arranged on a blanking plate; the placing component comprises two placing synchronous belts, and the placing synchronous belts are just opposite to the setting and are arranged on the placing frame. The feeding synchronous belt supports the two sides of the circuit board and conveys the circuit board, the air blower cools the circuit board from the feeding synchronous belt, the discharging synchronous belt supports the two sides of the circuit board and conveys the circuit board, the placing synchronous belt supports the two sides of the circuit board and conveys the circuit board, the feeding synchronous belt, the discharging synchronous belt and the placing synchronous belt have the same structure and are all the existing structures, and the circuit board is assembled and used after being selected according to actual needs.
The horizontal moving assembly comprises a screw rod which is rotatably installed at the lower end of the installation frame body through a bearing, two nut blocks are screwed and matched on the screw rod, each nut block is provided with a threaded hole screwed and matched with the screw rod, a first motor is fixedly installed on the outer side of the installation frame body, an output shaft of the first motor penetrates through the installation frame body and is fixedly connected with one end of the screw rod, and the lower end of the placing frame is fixedly connected with the nut block; the upper end of the placing frame is fixedly provided with a guide block, guide holes are formed in the guide block and the nut block, guide rods are fixedly arranged at the upper end and the lower end of the installing frame body, and the guide block and the nut block are in sliding fit with the guide rods; the vertical moving assembly comprises four lead screws rotatably installed in the placing frame through bearings, four second motors are fixedly installed at the upper end of the placing frame, output shafts of the second motors penetrate through the placing frame and are fixedly connected with the upper ends of the lead screws, and threaded holes matched with the lead screws in a screwed mode are formed in the upper end of the placing frame. The first motor drives the screw rod to rotate, the screw rod drives the nut block to move under the guiding action of the guide rod, the placing frame is further driven to move, and the second motor drives the screw rod to rotate, and further the placing frame is driven to move.
Wherein, the unloading subassembly is provided with two and sets up the both sides at the material loading subassembly. The blanking is convenient to realize, and the efficiency is improved.
And a support plate is fixedly arranged between the blanking plate and the mounting frame body. The supporting strength is improved.
The lower end of the mounting frame body is fixedly provided with a sliding rail, and the lower end of the nut block is provided with a sliding groove in sliding fit with the sliding rail. The movement of the placing frame is guided and supported.
To sum up, this cooling device for reflow soldering has convenient to use, can directly increase at the discharge end of reflow soldering, and the convenience is used with current reflow soldering cooperation, improves the advantage of cooling effect.
Drawings
Fig. 1 is a schematic structural diagram of a cooling device for reflow soldering according to the present invention.
Fig. 2 is a schematic view of another orientation of fig. 1.
Fig. 3 is a schematic view of fig. 1 with the mounting frame and first motor removed.
Fig. 4 is a schematic view of the placement frame and the placement assembly.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings. In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "upper, lower" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
As shown in fig. 1-4, a cooling device for reflow soldering comprises an installation frame body 1, a baffle 2 is fixedly installed on one side of the installation frame body, an upper material plate 3 is fixedly installed on the baffle outwards, a lower material plate 4 is fixedly installed on the other side of the installation frame body, a feeding assembly is arranged on the upper material plate, a discharging assembly is arranged on the lower material plate, two placing frames 5 which are arranged side by side are installed in the installation frame body through horizontal moving assemblies, a placing frame 6 is connected in the placing frames through vertical moving assemblies, a plurality of placing assemblies are arranged in the placing frames along the vertical direction, the placing frames are provided with a plurality of through holes right for each placing assembly, the through holes corresponding to each placing assembly are connected with pipelines, the pipelines are connected with a fan 7, and the fan is installed on the placing frames.
Like this, reflow soldering's circuit board reachs the material loading subassembly after the discharge mechanism ejection of compact of reflow soldering passes through, horizontal migration subassembly drives the rack and corresponds with the material loading subassembly, vertical migration subassembly drives and places the frame and remove, make and place the subassembly just to the material loading subassembly, the material loading subassembly transmits the circuit board to the material loading subassembly, at follow-up material loading at every turn, vertical migration mechanism drives the subassembly of placing that is located the below and removes to just right with the material loading subassembly, the circuit board has all been placed on placing the subassembly until placing in the frame, then horizontal migration mechanism drives the rack and removes, make another rack just to the material loading subassembly, repeat above-mentioned process and continue to carry out the material loading. The fan is in the open mode, carry out cooling through pipeline and perforation to the circuit board of placing on the subassembly, after the cooling, under the action of horizontal migration subassembly and vertical removal subassembly, make the circuit board that reaches the subassembly at first just to the unloading subassembly, place the subassembly and transmit the circuit board to the unloading subassembly and carry out the unloading, the unloading is carried out in proper order, when one of them is placed the frame and is in the material loading state, another one is placed the frame and is in the unloading state, realize continuous material loading and unloading, need not to shut down, improve the cooling effect to the circuit board.
The feeding assembly comprises two feeding synchronous belts 8 which are arranged oppositely and mounted on a feeding support plate 9, the feeding support plate is fixedly mounted on a feeding plate, an air blower 10 is fixedly mounted on the feeding plate through a support, and an air outlet of the air blower is arranged downwards; the blanking assembly comprises two blanking synchronous belts 11 which are arranged oppositely and are arranged on a blanking support plate 12, and the blanking support plate is fixedly arranged on a blanking plate; the placing component comprises two placing synchronous belts 13, and the placing synchronous belts are just opposite to the setting and are installed on the placing frame. The feeding synchronous belt supports the two sides of the circuit board and conveys the circuit board, the air blower cools the circuit board from the feeding synchronous belt, the discharging synchronous belt supports the two sides of the circuit board and conveys the circuit board, the placing synchronous belt supports the two sides of the circuit board and conveys the circuit board, the feeding synchronous belt, the discharging synchronous belt and the placing synchronous belt have the same structure and are all the existing structures, and the circuit board is assembled and used after being selected according to actual needs.
The horizontal moving assembly comprises a screw 14 which is rotatably installed at the lower end of the installation frame body through a bearing, two nut blocks 15 are screwed and matched on the screw, the nut blocks are provided with threaded holes matched with the screw in a screwed mode, a first motor 16 is fixedly installed on the outer side of the installation frame body, an output shaft of the first motor penetrates through the installation frame body and is fixedly connected with one end of the screw, and the lower end of the placing frame is fixedly connected with a nut block; the upper end of the placing frame is fixedly provided with a guide block 17, guide holes are formed in the guide block and the nut block, guide rods 18 are fixedly arranged at the upper end and the lower end of the installing frame body, and the guide block and the nut block are in sliding fit with the guide rods; the vertical moving assembly comprises four lead screws 19 which are rotatably installed in the placing frame through bearings, four second motors 20 are fixedly installed at the upper end of the placing frame, output shafts of the second motors penetrate through the placing frame and are fixedly connected with the upper ends of the lead screws, and threaded holes matched with the lead screws in a screwed mode are formed in the upper end of the placing frame. The first motor drives the screw rod to rotate, the screw rod drives the nut block to move under the guiding action of the guide rod, the placing frame is further driven to move, and the second motor drives the screw rod to rotate, and further the placing frame is driven to move.
Wherein, the unloading subassembly is provided with two and sets up the both sides at the material loading subassembly. The blanking is convenient to realize, and the efficiency is improved.
And a support plate 21 is fixedly arranged between the blanking plate and the mounting frame body. The supporting strength is improved.
The lower end of the mounting frame body is fixedly provided with a slide rail 22, and the lower end of the nut block is provided with a slide groove in sliding fit with the slide rail. The movement of the placing frame is guided and supported.
Specifically, the system also comprises a PLC controller used for controlling the action of the electric elements, and a specific control program can be programmed according to actual needs.
The principle is as follows:
reflow soldering's circuit board reachs the material loading subassembly after the discharge mechanism ejection of compact of reflow soldering passes through, the horizontal migration subassembly drives the rack and corresponds with the material loading subassembly, vertical moving assembly drives and places the frame and move, make and place the subassembly just to the material loading subassembly, the material loading subassembly transmits the circuit board to the material loading subassembly, at follow-up at every time material loading, vertical moving mechanism drives the subassembly of placing that is located the below and moves to just right with the material loading subassembly, the circuit board has all been placed on placing the subassembly until placing in placing the frame, then horizontal moving mechanism drives the rack and removes, make another rack just to the material loading subassembly, repeat above-mentioned process and continue to carry out the material loading. The fan is in the open mode, carry out cooling through pipeline and perforation to the circuit board of placing on the subassembly, after the cooling, under the action of horizontal migration subassembly and vertical removal subassembly, make the circuit board that reaches the subassembly at first just to the unloading subassembly, place the subassembly and transmit the circuit board to the unloading subassembly and carry out the unloading, the unloading is carried out in proper order, when one of them is placed the frame and is in the material loading state, another one is placed the frame and is in the unloading state, realize continuous material loading and unloading, need not to shut down, improve the cooling effect to the circuit board.
Finally, it should be noted that: various modifications and alterations of this invention may be made by those skilled in the art without departing from the spirit and scope of this invention. Thus, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cooling device for reflow soldering, its characterized in that, includes the installation framework, one side fixed mounting of installation framework has the baffle, the outside fixed mounting of baffle has last flitch, the opposite side fixed mounting of installation framework has down the flitch, upward be provided with the material loading subassembly on the flitch, be provided with the unloading subassembly down on the flitch, install two racks that set up side by side through the horizontal migration subassembly in the installation framework, be connected with through vertical removal subassembly in the rack and place the frame, it is provided with a plurality of subassemblies of placing along vertical direction in the frame to place, it all is provided with a plurality of perforation to place the subassembly just to every to place the frame, and the perforation that corresponds every subassembly of placing all with pipe connection, pipe connection has the fan, the fan is installed on the rack.
2. A cooling device for reflow soldering according to claim 1, wherein the feeding assembly comprises two feeding synchronous belts, the feeding synchronous belts are arranged oppositely and mounted on a feeding support plate, the feeding support plate is fixedly mounted on a feeding plate, an air blower is fixedly mounted on the feeding plate through a support, and an air outlet of the air blower is arranged downwards; the blanking assembly comprises two blanking synchronous belts, the blanking synchronous belts are arranged oppositely and are arranged on a blanking support plate, and the blanking support plate is fixedly arranged on a blanking plate; the placing component comprises two placing synchronous belts, and the placing synchronous belts are just opposite to the setting and are arranged on the placing frame.
3. The cooling device for reflow soldering of claim 2, wherein the horizontal moving assembly comprises a screw rod rotatably mounted at the lower end of the mounting frame body through a bearing, two nut blocks are rotatably fitted on the screw rod, the nut blocks are provided with threaded holes rotatably fitted with the screw rod, a first motor is fixedly mounted at the outer side of the mounting frame body, an output shaft of the first motor penetrates through the mounting frame body to be fixedly connected with one end of the screw rod, and the lower end of the placing frame is fixedly connected with the nut blocks; the upper end of the placing frame is fixedly provided with a guide block, guide holes are formed in the guide block and the nut block, guide rods are fixedly arranged at the upper end and the lower end of the installing frame body, and the guide block and the nut block are in sliding fit with the guide rods; the vertical moving assembly comprises four lead screws rotatably installed in the placing frame through bearings, four second motors are fixedly installed at the upper end of the placing frame, output shafts of the second motors penetrate through the placing frame and are fixedly connected with the upper ends of the lead screws, and threaded holes matched with the lead screws in a screwed mode are formed in the upper end of the placing frame.
4. A cooling device for reflow soldering according to claim 1, wherein the blanking assembly is provided with two and is provided on both sides of the feeding assembly.
5. A cooling device for reflow soldering according to claim 1, wherein a support plate is further fixedly mounted between the blanking plate and the mounting frame body.
6. A cooling device for reflow soldering according to claim 1, wherein a slide rail is fixedly mounted at a lower end of the mounting frame body, and a slide groove which is slidably fitted with the slide rail is provided at a lower end of the nut block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122366373.9U CN216177418U (en) | 2021-09-28 | 2021-09-28 | Cooling device for reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122366373.9U CN216177418U (en) | 2021-09-28 | 2021-09-28 | Cooling device for reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216177418U true CN216177418U (en) | 2022-04-05 |
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ID=80928108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122366373.9U Active CN216177418U (en) | 2021-09-28 | 2021-09-28 | Cooling device for reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216177418U (en) |
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2021
- 2021-09-28 CN CN202122366373.9U patent/CN216177418U/en active Active
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Address after: 528400 3rd floor, building 1 and 1st floor, building 2, No. 196, Banfu North Road, Huzhou village, Banfu Town, Zhongshan City, Guangdong Province Patentee after: Guangdong Foxin Technology Co.,Ltd. Address before: 528400 3rd floor, building 1 and 1st floor, building 2, No. 196, Banfu North Road, Huzhou village, Banfu Town, Zhongshan City, Guangdong Province Patentee before: Zhongshan foxin Technology Co.,Ltd. |