CN216177273U

CN216177273U - Cutting device for semiconductor parts

Info

Publication number: CN216177273U
Application number: CN202122514657.8U
Authority: CN
Inventors: 聂可松
Original assignee: Suzhou Yunli Metal Products Co ltd
Current assignee: Suzhou Yunli Metal Products Co ltd
Priority date: 2021-10-19
Filing date: 2021-10-19
Publication date: 2022-04-05
Anticipated expiration: 2031-10-19

Abstract

The utility model discloses a cutting device for semiconductor parts, which comprises a device body, wherein a processing cavity is formed in the device body, clamping mechanisms are respectively arranged at the left side and the right side of the processing cavity, an adjusting mechanism is arranged on the inner top wall of the device body, a cutting device is arranged below the adjusting mechanism, a scrap collecting tank is arranged below the processing cavity, a scraping mechanism is arranged in the scrap collecting tank, the cutting device for the semiconductor parts ensures that scraps generated during cutting can fall into the scrap collecting tank through the scrap collecting tank arranged below the clamping mechanisms, and after cutting is finished, the scraps in the scraps can be scraped into a collecting box in the collecting cavity through the arranged scraping mechanism, so that the effect of removing the scraps is achieved, manual cleaning by workers is not needed, and the labor intensity of the workers is reduced, the working efficiency is improved.

Description

Cutting device for semiconductor parts

Technical Field

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a cutting device for semiconductor parts.

Background

The semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power conversion, and the like. Such as diodes, are devices fabricated using semiconductors. The importance of semiconductors is enormous, both from a technological and economic point of view.

Semiconductor need cut into equal size according to required size man-hour, but current semiconductor cutting device still has some weak points when using, at first, accomplish the back to the machined part cutting, a large amount of sweeps can be remained in the processing intracavity, it is manual clean to need the staff, waste time and energy, secondly, cutting device is mostly fixed, can't adjust, need the position of staff manual regulation machined part and cutting tool, just can cut out the size of wanting, degree of automation is low, the production efficiency is reduced, to this we propose a cutting device for semiconductor spare part.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a cutting device for semiconductor components to solve the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a cutting device for semiconductor parts, includes the device body, the process chamber has been seted up to the inside of device body, fixture is all installed to the left and right sides in process chamber, adjustment mechanism is installed to the interior roof of device body, cutting device is installed to adjustment mechanism's below, the sweeps collecting vat has been seted up to the below in process chamber, be provided with scraping mechanism in the sweeps collecting vat.

Preferably, two fixture all includes the cylinder, two the cylinder symmetry is installed in the left and right sides in the process chamber, two the equal swing joint in inside of cylinder has the telescopic link, two the equal fixed mounting of output of telescopic link has the grip block.

Preferably, the adjusting mechanism comprises an adjusting motor, the adjusting motor is fixedly installed at the left end of the inner top wall of the device body, the output end of the adjusting motor is connected with a first lead screw through a coupler in a transmission mode, the outer surface of the first lead screw is in threaded connection with a moving block, and the bottom of the moving block is fixedly connected with the top end of the cutting device.

Preferably, the inner top wall of the processing cavity is provided with a moving groove, and the moving block is slidably connected in the moving groove.

Preferably, strike off the mechanism and include servo motor, servo motor fixed mounting is in the rear side wall of sweeps collecting vat, servo motor's output is connected with the second lead screw through the shaft coupling transmission, the surface threaded connection of second lead screw has first slider, the front end of first slider passes through connecting rod fixedly connected with scraper blade, just scraper blade sliding connection is in the sweeps collecting vat.

Preferably, a sliding groove is formed in the front wall of the waste chip collecting groove, a second sliding block is arranged in the sliding groove, a roller is installed at the bottom end of the second sliding block, the second sliding block is connected in the sliding groove in a sliding mode through the roller, and the rear end of the second sliding block is fixedly connected with the front end of the scraper through a connecting rod.

Preferably, the right side of sweeps collecting vat is provided with the slide, the below of sweeps collecting vat is provided with collects the chamber, it is provided with the collection box to collect the intracavity, the sweeps collecting vat is linked together through slide and collection chamber.

Compared with the prior art, the utility model has the beneficial effects that:

(1) this cutting device of semiconductor spare part, the sweeps collecting vat that sets up through fixture below for the sweeps that produce during the cutting can both fall into to the sweeps collecting vat in, after the cutting is accomplished again, the mechanism of striking off that the rethread set up just can strike off the sweeps in the sweeps collecting vat to the collection box in collecting the intracavity, thereby reached the effect of cleaing away the sweeps, need not staff's manual cleanness, staff's intensity of labour has been reduced, and work efficiency is improved.

(2) This semiconductor parts's cutting device, when the machined part was fixed on two fixture, the staff started adjustment mechanism, and adjustment mechanism can drive cutting device and carry out horizontal migration, and when the cutter in the cutting device removed the position that the machined part waited to cut, can carry out cutting work, need not the position of staff manual regulation machined part, has practiced thrift adjust time, has improved holistic production efficiency.

Drawings

Fig. 1 is a perspective view of the scraping mechanism of the present invention;

FIG. 2 is a front cross-sectional view of the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 2 according to the present invention;

fig. 4 is a top sectional view of the present invention.

In the figure: 1. a device body; 2. a processing cavity; 3. a clamping mechanism; 301. a cylinder; 302. a telescopic rod; 303. a clamping plate; 4. an adjustment mechanism; 401. adjusting the motor; 402. a first lead screw; 403. a moving block; 5. a cutting device; 6. a scrap collecting tank; 7. a scraping mechanism; 701. a servo motor; 702. a second lead screw; 703. a first slider; 704. a squeegee; 8. a slideway; 9. a collection chamber; 10. a collection box; 11. a moving groove; 12. a chute; 13. a second slider; 14. and a roller.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 4, the utility model provides a cutting device for semiconductor parts, which includes a device body 1, a processing cavity 2 is formed in the device body 1, clamping mechanisms 3 are mounted on the left side and the right side of the processing cavity 2, an adjusting mechanism 4 is mounted on the inner top wall of the device body 1, a cutting device 5 is mounted below the adjusting mechanism 4, a waste chip collecting tank 6 is formed below the processing cavity 2, and a scraping mechanism 7 is arranged in the waste chip collecting tank 6.

In this embodiment, it is preferred, two fixture 3 all include cylinder 301, the left and right sides at processing chamber 2 is installed to two cylinder 301 symmetries, the equal swing joint in inside of two cylinders 301 has telescopic link 302, the equal fixed mounting of output of two telescopic links 302 has grip block 303, when the machined part is placed between two grip block 303, start two cylinders 301, two cylinders 301 can drive two telescopic links 302 and carry out horizontal migration, two telescopic links 302 can drive two grip block 303 horizontal migration, when two grip block 303 all contact with the machined part, just can carry out the centre gripping to it fixedly, guarantee is provided for subsequent cutting work.

In this embodiment, preferably, the adjusting mechanism 4 includes an adjusting motor 401, the adjusting motor 401 is fixedly installed at the left end of the inner top wall of the device body 1, the output end of the adjusting motor 401 is connected with a first lead screw 402 through a coupling transmission, the outer surface of the first lead screw 402 is connected with a moving block 403 through a thread, the bottom of the moving block 403 is fixedly connected with the top end of the cutting device 5, the adjusting motor 401 is started, the adjusting motor 401 can drive the first lead screw 402 to rotate, the first lead screw 402 can drive the moving block 403 to move horizontally, the moving block 403 can drive the cutting device 5 to move horizontally, when a cutting knife in the cutting device 5 is located at a position to be cut by a workpiece, the workpiece can be cut, the position of the workpiece does not need to be manually adjusted by a worker, the adjusting time is saved, and the overall production efficiency is improved.

In this embodiment, preferably, the inner top wall of the processing chamber 2 is provided with a moving groove 11, the moving block 403 is slidably connected in the moving groove 11, and a space is provided for the horizontal movement of the moving block 403 through the moving groove 11.

In this embodiment, preferably, the scraping mechanism 7 includes a servo motor 701, the servo motor 701 is fixedly installed in the rear side wall of the waste chip collecting tank 6, the output end of the servo motor 701 is connected with a second lead screw 702 through a coupling transmission, the outer surface of the second lead screw 702 is connected with a first slider 703 in a threaded manner, the front end of the first slider 703 is fixedly connected with a scraper 704 through a connecting rod, the scraper 704 is slidably connected in the waste chip collecting tank 6, the servo motor 701 is started, the servo motor 701 can drive the second lead screw 702 to rotate, the second lead screw 702 can drive the first slider 703 to horizontally move, the first slider 703 can drive the scraper 704 to horizontally move, when the scraper 704 moves from the left end to the right end of the waste chip 6, the waste chips in the waste chip collecting tank 6 can be scraped and cleaned, the structure is designed without manually cleaning the waste chips by a worker, the labor intensity of workers is reduced, and the working efficiency is improved.

In this embodiment, preferably, the front wall of the waste chip collecting tank 6 has been provided with a chute 12, a second slider 13 is arranged in the chute 12, a roller 14 is installed at the bottom end of the second slider 13, the second slider 13 is connected in the chute 12 through the roller 14 in a sliding manner, the rear end of the second slider 13 is fixedly connected with the front end of the scraper 704 through a connecting rod, through the second slider 13, the connecting rod and the roller 14, the scraper 704 can be assisted to move horizontally, the effect of limiting and supporting the scraper can be achieved, and the stability of the scraper 704 during moving is improved.

In this embodiment, preferentially, the right side of sweeps collecting vat 6 is provided with slide 8, and the below of sweeps collecting vat 6 is provided with collects chamber 9, is provided with in the collection chamber 9 and collects box 10, and sweeps collecting vat 6 is linked together through slide 8 and collection chamber 9, and when scraping mechanism 7 and sweeping the sweeps to slide 8 in, the sweeps can fall into to the collection box 10 in collecting chamber 9 through slide 8 to it is convenient to provide for subsequent processing work.

The working principle and the using process of the utility model are as follows: when the cutting device for the semiconductor parts is used, a worker firstly places a workpiece between the two clamping plates 303, then starts the two air cylinders 301, the two air cylinders 301 can drive the two telescopic rods 302 to horizontally move, the two telescopic rods 302 can drive the two clamping plates 303 to horizontally move, when the two clamping plates 303 are both contacted with the workpiece, the workpiece can be clamped and fixed, at the moment, the adjusting motor 401 is started again, the adjusting motor 401 can drive the first lead screw 402 to rotate, the first lead screw 402 can drive the moving block 403 to horizontally move, the moving block 403 can drive the cutting device 5 to horizontally move, when a cutting knife in the cutting device 5 is positioned at a position to be cut by the workpiece, the workpiece can be cut, after the cutting is completed, the worker restarts the servo motor 701, and the servo motor 701 can drive the second lead screw 702 to rotate, second lead screw 702 can drive first slider 703 and carry out horizontal migration, and first slider 703 can drive scraper blade 704 and carry out horizontal migration, and when scraper blade 704 removed the in-process to the right-hand member from the left end of sweeps collecting vat 6, just can sweep the sweeps in the sweeps collecting vat 6 to slide 8 to fall into to the collection box 10 in collecting the chamber 9 through slide 8, thereby realized the function that the sweeps clearance was collected.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A dicing apparatus for semiconductor parts, comprising an apparatus body (1), characterized in that: processing chamber (2) have been seted up to the inside of device body (1), fixture (3) are all installed to the left and right sides in processing chamber (2), adjustment mechanism (4) are installed to the interior roof of device body (1), cutting device (5) are installed to the below of adjustment mechanism (4), sweeps collecting vat (6) have been seted up to the below in processing chamber (2), be provided with in sweeps collecting vat (6) and strike off mechanism (7).

2. The dicing apparatus for semiconductor parts according to claim 1, wherein: two fixture (3) all includes cylinder (301), two the left and right sides at processing chamber (2) is installed to cylinder (301) symmetry, two the equal swing joint in inside of cylinder (301) has telescopic link (302), two the equal fixed mounting of output of telescopic link (302) has grip block (303).

3. The dicing apparatus for semiconductor parts according to claim 1, wherein: the adjusting mechanism (4) comprises an adjusting motor (401), the adjusting motor (401) is fixedly installed at the left end of the inner top wall of the device body (1), the output end of the adjusting motor (401) is connected with a first lead screw (402) through a coupler in a transmission mode, the outer surface of the first lead screw (402) is in threaded connection with a moving block (403), and the bottom of the moving block (403) is fixedly connected with the top end of the cutting device (5).

4. A cutting apparatus for semiconductor parts according to claim 3, wherein: the inner top wall of the processing cavity (2) is provided with a moving groove (11), and the moving block (403) is connected in the moving groove (11) in a sliding mode.

5. The dicing apparatus for semiconductor parts according to claim 1, wherein: scraping mechanism (7) includes servo motor (701), servo motor (701) fixed mounting is in the rear side wall of sweeps collecting vat (6), the output of servo motor (701) is connected with second lead screw (702) through the shaft coupling transmission, the surface threaded connection of second lead screw (702) has first slider (703), connecting rod fixedly connected with scraper blade (704) is passed through to the front end of first slider (703), just scraper blade (704) sliding connection is in sweeps collecting vat (6).

6. The dicing apparatus for semiconductor parts according to claim 5, wherein: the front wall of the waste chip collecting tank (6) is provided with a sliding groove (12), a second sliding block (13) is arranged in the sliding groove (12), a roller (14) is installed at the bottom end of the second sliding block (13), the second sliding block (13) is connected in the sliding groove (12) in a sliding mode through the roller (14), and the rear end of the second sliding block (13) is fixedly connected with the front end of the scraper (704) through a connecting rod.

7. The dicing apparatus for semiconductor parts according to claim 1, wherein: the right side of sweeps collecting vat (6) is provided with slide (8), the below of sweeps collecting vat (6) is provided with collects chamber (9), be provided with in collecting chamber (9) and collect box (10), sweeps collecting vat (6) are linked together through slide (8) and collection chamber (9).