CN216152446U

CN216152446U - Base plate cutting device for semiconductor material processing

Info

Publication number: CN216152446U
Application number: CN202122260628.3U
Authority: CN
Inventors: 杨丽红
Original assignee: Ganzhou Yunxia Electronic Technology Co ltd
Current assignee: Ganzhou Yunxia Electronic Technology Co ltd
Priority date: 2021-09-17
Filing date: 2021-09-17
Publication date: 2022-04-01
Anticipated expiration: 2031-09-17

Abstract

The present invention relates to a cutting device, and more particularly, to a substrate cutting device for processing semiconductor materials. The technical problem to be solved is as follows: provided is a safe and reliable substrate cutting device for processing a semiconductor material. The technical implementation scheme of the utility model is as follows: the utility model provides a base plate cutting device is used in semiconductor material processing, is including bottom plate, first support column, lead screw, handle, sliding block, motor, cutting saw bit, second support column, guide bar, rack, dead lever and elevator, and bottom plate top front side bilateral symmetry is equipped with first support column, is connected with the lead screw through threaded connection's mode between the first support column, and the lead screw right side is equipped with the handle, is connected with the sliding block through threaded connection's mode on the lead screw. Has the advantages that: people drive the cutting saw blade to move towards the right side to cut the substrate by rotating the handle, so that the saw blade does not need to be manually used for cutting.

Description

Base plate cutting device for semiconductor material processing

Technical Field

The present invention relates to a cutting device, and more particularly, to a substrate cutting device for processing semiconductor materials.

Background

The base plate is the basic material who makes PCB, and along with present cutting process's requirement is higher and higher, current cutting device has certain defect, when cutting the operation, the manual work uses the saw bit to cut the base plate, can't once only cut completely, and the product produces deckle edge's problem easily, has reduced the quality of product to lack certain fail safe nature, and the produced piece when the base plate cuts, need the manual work to clear up, unable timely quick processing dust piece.

Therefore, it is necessary to design a safe and reliable substrate cutting apparatus for processing a semiconductor material.

SUMMERY OF THE UTILITY MODEL

In order to overcome the artifical saw bit that uses and cut the base plate, unable disposable complete cutting, the product produces deckle edge easily, has reduced the quality of product to lack certain fail safe nature's shortcoming, the technical problem that solves is: provided is a safe and reliable substrate cutting device for processing a semiconductor material.

The technical implementation scheme of the utility model is as follows: a substrate cutting device for processing semiconductor material comprises a bottom plate, a first supporting column, a screw rod, a handle, a sliding block and a motor, cutting saw bit, the second support column, the guide bar, the rack, dead lever and elevator, bottom plate top front side bilateral symmetry is equipped with first support column, be connected with the lead screw through threaded connection's mode between the first support column, the lead screw right side is equipped with the handle, be connected with the sliding block through threaded connection's mode on the lead screw, the sliding block top is equipped with the motor, be equipped with the cutting saw bit on the motor output shaft, bottom plate top front side bilateral symmetry is equipped with the second support column, the second support column all is located the front side of first support column, be equipped with the guide bar between the second support column, sliding block and guide bar sliding type connection, the sliding block rear side is equipped with the dead lever, be equipped with the rack in the middle of the bottom plate top, the side gliding type is equipped with the elevator before the rack.

Further, still collect the frame including slide rail, push rod, third support column, first collection frame and second, bottom plate top left side is equipped with the slide rail, and the gliding style is equipped with the push rod on the slide rail, and push rod and rack cooperation, bottom plate top rear side evenly are equipped with four third support columns, are equipped with first collection frame between the third support column medial surface, and the gliding style is equipped with the second and collects the frame before the bottom plate top.

Further, the motor is a servo motor.

Furthermore, the material of the cutting saw blade is high-speed steel.

Further, the first collecting frame is square in shape.

Further, the number of the first supporting columns is two.

The utility model has the beneficial effects that: 1. people drive the cutting saw blade to move to the right side to cut the substrate by rotating the handle, so that the saw blade does not need to be used manually for cutting;

2. people are through pushing away the push rod to the rear side for push rod and rack contact, the push rod to the rear side move alright clear up the base plate piece on the rack, thereby do not need the manual work to clear up the piece.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a partial perspective view of the present invention.

The meaning of the reference symbols in the figures: 1. the cutting device comprises a base plate, 2, a first supporting column, 3, a screw rod, 4, a handle, 5, a sliding block, 6, a motor, 7, a cutting saw blade, 8, a second supporting column, 9, a guide rod, 10, a placing frame, 11, a fixing rod, 12, a lifting block, 13, a sliding rail, 14, a push rod, 15, a third supporting column, 16, a first collecting frame, 17 and a second collecting frame.

Detailed Description

The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions used in the examples may be further adjusted according to the conditions of the particular manufacturer, and the conditions not specified are generally the conditions in routine experiments.

Example 1

A base plate cutting device for processing semiconductor materials is disclosed, as shown in figure 1-2, and comprises a bottom plate 1, first support columns 2, a screw rod 3, a handle 4, a sliding block 5, a motor 6, a cutting saw blade 7, second support columns 8, a guide rod 9, a placing frame 10, a fixed rod 11 and a lifting block 12, wherein the first support columns 2 are symmetrically arranged at the left and right sides of the front side of the top of the bottom plate 1, the screw rod 3 is connected between the first support columns 2 in a threaded connection mode, the handle 4 is arranged at the right side of the screw rod 3, the sliding block 5 is connected on the screw rod 3 in a threaded connection mode, the motor 6 is arranged at the top of the sliding block 5, the cutting saw blade 7 is arranged on an output shaft of the motor 6, the second support columns 8 are symmetrically arranged at the left and right sides of the front side of the top of the bottom plate 1, the second support columns 8 are all positioned at the front sides of the first support columns 2, the guide rod 9 is arranged between the second support columns 8, and the sliding connection of the sliding block 5 and the guide rod 9, the sliding block 5 rear side is equipped with dead lever 11, is equipped with rack 10 in the middle of the 1 top of bottom plate, and the movable type is equipped with elevator 12 before rack 10.

When people need to cut the substrate, people can place the substrate on the placing rack 10, the motor 6 is started to work, the output shaft of the motor 6 rotates to drive the cutting saw blade 7 to rotate, then the handle 4 is rotated to drive the screw rod 3 to rotate, so as to drive the sliding block 5 and the motor 6 to move towards the right side and further drive the cutting saw blade 7 to move towards the right side, when the cutting saw blade 7 is contacted with the substrate, the substrate can be cut, when the first substrate is cut, people reversely rotate the handle 4 to drive the screw rod 3 to reversely rotate, so as to drive the sliding block 5 and the motor 6 to move towards the left side and further drive the cutting saw blade 7 to move towards the left side, people push the substrate a little towards the front side, the cutting saw blade 7 is contacted with the substrate, the second substrate can be cut, the steps are repeated, the substrate can be uniformly cut into strips, when people need to collect the cut substrate, people can move the lifter plate upwards, so that the lifter 12 blocks the base plate, the base plate on the placing rack 10 can be prevented from moving towards the front side, when people need to continue to cut the base plate, the lifter 12 is moved downwards, so that the lifter 12 does not block the base plate, people can continue to push the base plate towards the front side for cutting, and after the base plate is cut, people loosen the handle 4 and close the motor 6.

Still including slide rail 13, push rod 14, third support column 15, first collection frame 16 and

second collection frame

17, 1 top left side of bottom plate is equipped with slide rail 13, and the slidingtype is equipped with push rod 14 on slide rail 13, and push rod 14 and rack 10 cooperation evenly are equipped with four third support columns 15 at 1 top rear side of bottom plate, are equipped with first collection frame 16 between the 15 medial surfaces of third support column, and the slidingtype is equipped with the second collection frame 17 before 1 top of bottom plate.

When people need cut the base plate, people can place the base plate that needs the cutting in first collection frame 16, people of being convenient for take, the base plate that the cutting finishes will drop to the second in collecting frame 17, finish when the base plate cutting, people can push rod 14 to the rear side, make push rod 14 and rack 10 contact, alright clear up the base plate piece on rack 10, be convenient for carry out next cutting work, the piece clearance finishes, people push rod 14 to the front side and reset, when people need collect the base plate that the cutting finishes, people pull second collection frame 17 to the front side, alright take out second collection frame 17, collect the base plate that the cutting finishes.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A substrate cutting device for processing semiconductor materials is characterized in that: comprises a bottom plate (1), first supporting columns (2), a screw rod (3), a handle (4), sliding blocks (5), motors (6), cutting saw blades (7), second supporting columns (8), a guide rod (9), a placing rack (10), a fixed rod (11) and a lifting block (12), wherein the first supporting columns (2) are symmetrically arranged on the left and right of the front side of the top of the bottom plate (1), the screw rod (3) is connected between the first supporting columns (2) in a threaded connection mode, the handle (4) is arranged on the right side of the screw rod (3), the sliding blocks (5) are connected on the screw rod (3) in a threaded connection mode, the motors (6) are arranged on the top of the sliding blocks (5), the cutting saw blades (7) are arranged on output shafts of the motors (6), the second supporting columns (8) are symmetrically arranged on the left and right of the front side of the top of the bottom plate (1), and the second supporting columns (8) are all positioned on the front sides of the first supporting columns (2), be equipped with guide bar (9) between second support column (8), sliding block (5) and guide bar (9) sliding type are connected, and sliding block (5) rear side is equipped with dead lever (11), is equipped with rack (10) in the middle of bottom plate (1) top, and rack (10) front side sliding type is equipped with elevator (12).

2. The apparatus for cutting a substrate for processing a semiconductor material as set forth in claim 1, wherein: still collect frame (17) including slide rail (13), push rod (14), third support column (15), first collection frame (16) and second, bottom plate (1) top left side is equipped with slide rail (13), the gliding style is equipped with push rod (14) on slide rail (13), push rod (14) and rack (10) cooperation, bottom plate (1) top rear side evenly is equipped with four third support columns (15), be equipped with first collection frame (16) between third support column (15) medial surface, bottom plate (1) top front side sideslip dynamic formula is equipped with second collection frame (17).

3. The apparatus for cutting a substrate for processing a semiconductor material as set forth in claim 1, wherein: the motor (6) is a servo motor.

4. The apparatus for cutting a substrate for processing a semiconductor material as set forth in claim 1, wherein: the material of the cutting saw blade (7) is high-speed steel.

5. The apparatus for cutting a substrate for processing a semiconductor material as set forth in claim 2, wherein: the first collection frame (16) is square in shape.

6. The apparatus for cutting a substrate for processing a semiconductor material as set forth in claim 1, wherein: the number of the first supporting columns (2) is two.