CN216151990U

CN216151990U - Silicon wafer finish polishing device

Info

Publication number: CN216151990U
Application number: CN202122056589.5U
Authority: CN
Inventors: 程书萌; 刘婷婷
Original assignee: Suzhou Xinderisi Electronic Technology Co ltd
Current assignee: Suzhou Xinderisi Electronic Technology Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2022-04-01
Anticipated expiration: 2031-08-30

Abstract

The utility model provides a silicon wafer finish polishing device which comprises a bracket, a partition plate, a polishing mechanism, a lifting seat and an adjusting mechanism, wherein the partition plate is arranged on the bracket; the lower end of the bracket is provided with a movable wheel; the partition board is arranged at the upper end of the bracket and is provided with a groove structure; the polishing mechanism is arranged on the partition plate; four groups of lifting rods are arranged at the lower end of the lifting seat, and the lower ends of the lifting rods are arranged on the partition plate; the adjusting mechanism is arranged at the upper end of the lifting seat; the polishing belt is provided with the brush wheel, the polishing belt can drive the brush wheel to rotate when rotating, the brush wheel can clean powder on the polishing belt, and the polishing effect of the polishing belt is improved; be equipped with the hydraulic stem between digging arm and the mount pad, after the polishing belt is lax, through the elasticity of the adjustable polishing belt of the flexible of regulation hydraulic stem, and be equipped with anticollision piece and locking mechanism on the adjustment mechanism, the anticollision piece can play the effect of shock attenuation buffering, and locking mechanism can lock the threaded rod, prevents that the mistake from touching the rocking handle and leading to the work piece position to change to influence polishing precision.

Description

Silicon wafer finish polishing device

Technical Field

The utility model belongs to the technical field of polishing, and particularly relates to a silicon wafer fine polishing device.

Background

The utility model relates to a device for polishing silicon wafers, wherein the silicon wafers are purified by silicon element (99.999%), then the pure silicon is made into long silicon crystal bars to become the material of quartz semiconductors for manufacturing integrated circuits, and the polycrystalline silicon is melted and pulled out of a monocrystalline silicon crystal bar through the procedures of photoengraving, grinding, polishing, slicing and the like, and then the monocrystalline silicon crystal bar is cut into thin wafers.

If the application number is: CN201821502426.7 discloses a multi-directional automatic polishing machine, which comprises a PLC control unit, a base, a polishing body assembly, and an abrasive supplying device used in cooperation with the polishing body assembly; an upright post capable of moving back and forth along the Y axis is arranged above the base; a box body capable of lifting along the Z axis is arranged above the upright post; the box body is connected with a polishing body assembly capable of revolving around the Y axis. According to the multidirectional automatic polishing machine, the polishing body assembly can complete reciprocating motion of the Y axis and the Z axis and revolution around the Y axis under the control of the PLC control unit, and abrasives are attached to the polishing body assembly to polish workpieces, so that the workpieces achieve a bright effect. The automatic polishing machine can replace manual work to realize automation of the polishing process, avoids the potential safety hazard of manual operation, ensures the quality consistency of products and improves the working efficiency.

Based on the above, the conventional polishing device may have residual powder on the polishing belt when in use, and if the powder is not processed in time, the polishing effect may be affected, and the polishing belt may be loosened after being used for a period of time, so that the silicon wafer may not meet the polishing requirement.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the utility model provides a silicon wafer fine polishing device which aims to solve the problems that residual powder on a polishing belt and the looseness of the polishing belt cannot meet the processing requirements when a traditional polishing device is used.

The utility model relates to a silicon wafer fine polishing device, which is achieved by the following specific technical means:

a silicon wafer finish polishing device is characterized in that: comprises a bracket;

the lower end of the bracket is provided with a movable wheel, the movable wheel is provided with a support rod, and the lower end of the support rod is fixed with a fixed seat; the partition plate is arranged at the upper end of the bracket and is provided with a groove structure;

the polishing mechanism is arranged on the partition plate; the lifting seat is provided with four groups of lifting rods, the lower ends of the lifting rods are arranged on the partition plate and are positioned above the grooves, the lifting seat is provided with a motor, belt wheels are fixed on a rotating shaft of the motor, the upper end of the lifting seat is connected with the belt wheels in a shaft coupling mode, and the two groups of belt wheels are connected through a belt;

and the adjusting mechanism is arranged at the upper end of the lifting seat.

Furthermore, a hydraulic rod is arranged between the mounting seat and the movable arm.

Furthermore, two groups of supports are installed on the installation seat, and vertical plates are installed on the supports.

Furthermore, a group of big belt wheels and two groups of small belt wheels are coupled to the mounting base, a motor is fixed to the mounting base, a rotating shaft of the motor is connected with the big belt wheels, the upper end of the movable arm is coupled with the belt wheels, and the belt wheels are sleeved with polishing belts.

Furthermore, the adjusting mechanism comprises a first track plate, a second track plate and a positioning plate; the first track plate is arranged on a belt wheel at the upper end of the lifting seat, anti-collision pieces are arranged at two ends of a track on the first track plate, two groups of bearing seats are arranged on the first track plate, threaded rods are arranged on the bearing seats, and rocking handles are arranged on the threaded rods; the lower end of the second track plate is provided with a clamping block, and the clamping block slides on the track of the first track plate; the positioning plate is movably arranged on the second track plate, and four groups of fixing clamps are arranged on the positioning plate.

Furthermore, locking mechanisms are installed on the first track plate and the second track plate and are sleeved on the threaded rods.

Further, the polishing mechanism comprises a mounting seat, a movable arm and a connecting sheet; the mounting seat is fixed on the partition plate through bolts; the movable arm is connected to the upper end of the mounting seat in a shaft mode; the connecting sheet is arranged on the mounting seat, and a brush wheel is coupled on the connecting sheet.

The utility model at least comprises the following beneficial effects:

1. according to the utility model, the connecting sheet is arranged at the lower end of the mounting seat, the brush wheel is coupled on the connecting sheet, when the polishing machine is used, the mounted motor drives the large belt wheel to rotate, so that the polishing belt rotates, the lifting seat and the adjusting mechanism are adjusted to enable the polishing belt to polish and polish workpieces on the positioning plate, the polishing belt can drive the brush wheel to rotate when rotating, the brush wheel can clean powder on the polishing belt, and the polishing effect of the polishing belt is improved.

2. According to the utility model, the movable arm is arranged on the mounting seat, the belt wheel is axially connected to the movable arm, the hydraulic rod is arranged between the movable arm and the mounting seat, when the polishing belt is loosened, the tightness of the polishing belt can be adjusted by adjusting the extension and retraction of the hydraulic rod, the adjusting mechanism is provided with the anti-collision piece and the locking mechanism, the anti-collision piece can play a role in damping and buffering, the locking mechanism can lock the threaded rod, and the phenomenon that the position of a workpiece is changed due to mistaken touch of the rocking handle is prevented, so that the polishing precision is influenced.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic structural view of the polishing mechanism of the present invention.

Fig. 3 is an enlarged schematic view of the structure at a in fig. 2 of the present invention.

Fig. 4 is an enlarged schematic view of the structure at B in fig. 2 of the present invention.

Fig. 5 is a schematic structural view of the lifting seat of the present invention.

Fig. 6 is a schematic view of the structure of the adjusting mechanism of the present invention.

Fig. 7 is a schematic diagram of the structure of fig. 6 at C in accordance with the present invention.

In the drawings, the corresponding relationship between the component names and the reference numbers is as follows:

1. a support; 2. a partition plate;

3. a polishing mechanism;

301. a mounting seat; 302. a movable arm; 303. connecting sheets;

4. a lifting seat;

5. an adjustment mechanism;

501. a first track plate; 502. a second track plate; 503. and (7) positioning the plate.

Detailed Description

The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "coaxial," "bottom," "one end," "top," "middle," "other end," "upper," "side," "top," "inner," "front," "center," "two ends," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing and simplifying the description, and are not intended to indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be understood broadly, and for example, they may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Example (b):

as shown in figures 1 to 7:

the utility model provides a silicon wafer finish polishing device, which comprises a bracket 1;

the lower end of the bracket 1 is provided with a movable wheel, the movable wheel is provided with a support rod, and the lower end of the support rod is fixed with a fixed seat; the partition board 2 is arranged at the upper end of the bracket 1, and a groove structure is arranged on the partition board 2;

the polishing mechanism 3 is arranged on the partition plate 2; the lifting seat 4 is provided with four groups of lifting rods at the lower end of the lifting seat 4, the lower ends of the lifting rods are arranged on the partition plate 2 and are positioned above the groove, a motor is arranged on the lifting seat 4, belt wheels are fixed on a rotating shaft of the motor, the upper end of the lifting seat 4 is connected with the belt wheels in a shaft mode, and the two groups of belt wheels are connected through a belt;

and the adjusting mechanism 5 is arranged at the upper end of the lifting seat 4.

As shown in fig. 2, the polishing mechanism 3 includes a mounting base 301, a movable arm 302, and a connecting piece 303; the mounting seat 301 is fixed on the partition plate 2 through bolts; the movable arm 302 is coupled to the upper end of the mounting base 301; connection piece 303 is installed on mount pad 301, and the coupling has the brush wheel on connection piece 303, and its effect is: the polishing belt can drive the brush wheel to rotate when rotating, and the brush wheel can clean the powder on the polishing belt, so that the polishing effect of the polishing belt is improved.

As shown in fig. 2, there are a set of big band pulley and two sets of little band pulleys to the coupling on mount pad 301, are fixed with the motor on the mount pad 301, and the pivot and the big band pulley of motor are connected, install two sets of supports on the mount pad 301, install the riser on the support, and the last end coupling of digging arm 302 has the band pulley, and the cover has the polishing belt on the band pulley, installs the hydraulic stem between mount pad 301 and the digging arm 302, and its effect is: when the polishing belt is loosened, the tightness of the polishing belt can be adjusted by adjusting the extension and retraction of the hydraulic rod.

As shown in fig. 6 and 7, the adjusting mechanism 5 includes a first track plate 501, a second track plate 502, and a positioning plate 503; a track board 501 is installed on the band pulley of lift seat 4 upper end, and the track both ends on a track board 501 are equipped with anticollision piece, and its effect is: the anti-collision piece can play a role in shock absorption and buffering; two groups of bearing blocks are arranged on the first track plate 501, threaded rods are arranged on the bearing blocks, and rocking handles are arranged on the threaded rods; the lower extreme of No. two track boards 502 is equipped with the fixture block, and the fixture block slides on track of a track board 501, installs locking mechanism on track board 501 and No. two track boards 502, and locking mechanism overlaps on the threaded rod, and its effect is: the locking mechanism can lock the threaded rod, so that the phenomenon that the position of a workpiece is changed due to mistaken touch of the rocking handle is avoided, and the polishing precision is influenced; the positioning plate 503 is movably arranged on the second track plate 502, and four sets of fixing clamps are arranged on the positioning plate 503.

In another embodiment, a dust suction device can be arranged on the partition board 2, the dust suction device is positioned above the polishing belt, a large amount of fine particles are generated during polishing, and the fine particles are extracted through the dust suction device, so that the environmental quality of a polishing workshop is improved.

The specific use mode and function of the embodiment are as follows:

in the utility model, when the polishing belt is used, a silicon wafer workpiece is fixed on the positioning plate 503 by the fixing clamp, the motor on the polishing mechanism 3 is started to rotate the polishing belt, the lifting seat 4 is adjusted to enable the angle and the height of the workpiece to be matched with the polishing belt, the handle is shaken to enable the first track plate 501 and the second track plate 502 to move, the purpose of adjusting the position of the workpiece is achieved, the anti-collision piece can play a role of damping and buffering, then the threaded rod is locked by the locking mechanism, the phenomenon that the position of the workpiece is changed due to mistaken touch of the rocking handle is prevented, and therefore the polishing precision is influenced, wherein after the polishing belt is loosened, the tightness of the polishing belt can be adjusted by adjusting the expansion of the hydraulic rod, the polishing belt can drive the brush wheel to rotate when rotating, the brush wheel can clean powder on the polishing belt, and the polishing effect of the polishing belt is improved.

The utility model is not described in detail, but is well known to those skilled in the art.

The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. A silicon wafer finish polishing device is characterized in that: comprises a bracket (1);

the lower end of the bracket (1) is provided with a movable wheel, the movable wheel is provided with a support rod, and the lower end of the support rod is fixed with a fixed seat; the partition plate (2) is installed at the upper end of the support (1), and a groove structure is arranged on the partition plate (2);

the polishing mechanism (3), the polishing mechanism (3) is installed on the partition plate (2); the lifting seat (4), four groups of lifting rods are installed at the lower end of the lifting seat (4), the lower ends of the lifting rods are installed on the partition plate (2) and located above the groove, a motor is installed on the lifting seat (4), belt wheels are fixed on a rotating shaft of the motor, the upper end of the lifting seat (4) is connected with the belt wheels in a shaft mode, and the two groups of belt wheels are connected through a belt;

the adjusting mechanism (5), the adjusting mechanism (5) is installed on the upper end of the lifting seat (4).

2. A silicon wafer finish polishing apparatus according to claim 1, wherein said polishing mechanism (3) comprises:

the mounting seat (301), the mounting seat (301) is fixed on the partition plate (2) through bolts;

the movable arm (302), the movable arm (302) is connected to the upper end of the mounting base (301) by the shaft;

the connecting piece (303), connecting piece (303) are installed on mount pad (301), and the hub connection has the brush wheel on connecting piece (303).

3. The silicon wafer polishing device according to claim 2, wherein a set of large pulleys and two sets of small pulleys are coupled to the mounting base (301), a motor is fixed to the mounting base (301), a rotating shaft of the motor is connected to the large pulleys, the upper end of the movable arm (302) is coupled to the pulleys, and polishing belts are sleeved on the pulleys.

4. A silicon wafer finish polishing apparatus according to claim 3, characterized in that a hydraulic rod is installed between said mounting base (301) and said movable arm (302).

5. A silicon wafer finish polishing apparatus according to claim 4, characterized in that two sets of supports are mounted on said mounting base (301), and risers are mounted on said supports.

6. A silicon wafer fine polishing apparatus according to claim 1, characterized in that said adjusting mechanism (5) comprises:

the track lifting device comprises a first track plate (501), wherein the first track plate (501) is installed on a belt wheel at the upper end of a lifting seat (4), anti-collision pieces are arranged at two ends of a track on the first track plate (501), two groups of bearing seats are arranged on the first track plate (501), threaded rods are installed on the bearing seats, and rocking handles are installed on the threaded rods;

the lower end of the second track plate (502) is provided with a fixture block, and the fixture block slides on the track of the first track plate (501);

the positioning plate (503) is movably arranged on the second track plate (502), and four groups of fixing clamps are arranged on the positioning plate (503).

7. The silicon wafer finishing polishing device according to claim 6, wherein the first track plate (501) and the second track plate (502) are provided with locking mechanisms, and the locking mechanisms are sleeved on the threaded rods.