CN216139714U - Pattern transfer sheet and pattern transfer system - Google Patents
Pattern transfer sheet and pattern transfer system Download PDFInfo
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- CN216139714U CN216139714U CN202122130645.5U CN202122130645U CN216139714U CN 216139714 U CN216139714 U CN 216139714U CN 202122130645 U CN202122130645 U CN 202122130645U CN 216139714 U CN216139714 U CN 216139714U
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Abstract
The utility model provides a pattern transfer sheet and a pattern transfer system. A pattern transfer sheet comprising: a plurality of grooves arranged in a prescribed pattern and configured to receive a printing paste and to release the printing paste from the grooves onto a receiving substrate when irradiated by a laser beam, the pattern transfer sheet including at least one of: (i) at least one trace mark located outside the designated pattern and configured to receive the printing paste, wherein the at least one trace mark is aligned with respect to at least one of the trenches and is wider than a width of the laser beam; and (ii) a plurality of working window indicia located outside of the specified pattern and configured to receive the printing paste, wherein the working window indicia are disposed at a specified offset relative to the specified grooves of the specified pattern and different working window indicia are disposed at different offsets. With the pattern transfer sheet, the position and power of laser irradiation can be monitored and corrected as needed to improve print quality.
Description
Technical Field
The present invention relates to the field of transfer printing, and more particularly, to control of irradiation alignment and process control of transfer printing.
Background
U.S. patent No.9,616,524, which is incorporated herein by reference in its entirety, teaches a method of depositing a material on a receiving substrate, the method comprising: providing a source substrate having a back surface and a front surface, the back surface carrying at least one sheet of coating material; providing a receiving substrate disposed adjacent to the source substrate and facing the coating material; and irradiating light toward a front surface of the source substrate to remove at least one sheet of the coating material from the source substrate and deposit the removed at least one sheet as a whole onto the receiving substrate.
Lossen et al (2015) proposed pattern transfer for metallization of c-Si solar cells (PTP) in seminar 5 for metallization of crystalline silicon solar cellsTM) Energy Procedia67:156-162, incorporated herein by reference in its entirety, teaches pattern transfer as a non-contact printing technique for advanced front side metallization of c-Si PV solar cells based on laser induced deposition from a polymer substrate.
Since the tolerance budget for alignment of the laser beam with the trench pattern is very tight and the process operating window for qualitative printing (which depends primarily on the slurry conditions) is relatively small, any variation in environmental or internal conditions in the module can lead to degradation in print quality. Therefore, monitoring and correcting (if necessary) the position and power of the laser irradiation to properly release the metal paste from the polymer substrate remains a challenge.
SUMMERY OF THE UTILITY MODEL
The following is a simplified summary that provides a preliminary understanding of the utility model. This summary does not necessarily identify key elements nor limit the scope of the utility model, but is merely used as an introduction to the following description.
One aspect of the present invention provides a pattern transfer sheet comprising:
a plurality of grooves arranged in a prescribed pattern and configured to receive a printing paste and to release the printing paste from the grooves onto a receiving substrate when irradiated by a laser beam,
the pattern transfer sheet comprises at least one of:
(i) at least one trace mark (trace mark) located outside the designated pattern and configured to receive the printing paste, wherein the at least one trace mark is aligned relative to at least one of the trenches and is wider than a width of the laser beam; and
(ii) a plurality of working window marks (working window marks) located outside the specified pattern and configured to receive the printing paste, wherein the working window marks are disposed at specified offsets relative to specified trenches of the specified pattern, and wherein different working window marks are disposed at different offsets.
Further, the pattern transfer sheet further includes a plurality of alignment marks located outside the specified pattern and configured to receive the printing paste, wherein the alignment marks are aligned with the respective grooves.
Further, the alignment marks are arranged in an asymmetric pattern.
Further, the pattern transfer sheet is transparent to the laser beam irradiation, and the grooves are formed in the pattern transfer sheet by means of imprint molding, pneumatic molding, or laser molding.
Further, the cross section of the groove is trapezoidal, rectangular, circular or triangular.
Further, the pattern transfer sheet is at least one polymer layer made of one of the following materials: polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, wholly aromatic polyester, aliphatic-aromatic copolyester, a copolymerized acrylate, polycarbonate, polyamide, polysulfone, polyethersulfone, polyether ketone, polyamideimide, polyetherimide, aromatic polyimide, alicyclic polyimide, fluorinated polyimide, cellulose acetate, cellulose nitrate, aromatic polyamide, polyvinyl chloride, polyphenol, polyarylate, polyphenylene sulfide, polyphenylene ether, polystyrene.
Further, the shift amount of the working window mark ranges from-30 μm to-60 μm, and from +30 μm to +60 μm, with a step size of 10 μm.
A pattern transfer sheet transparent to laser beam irradiation and containing a plurality of grooves arranged in a specified pattern and configured to receive a printing paste and release the printing paste from the grooves onto a receiving substrate when irradiated by a laser beam, the pattern transfer sheet being at least one polymer layer on which at least one trace marker is provided.
Further, the pattern transfer sheet includes at least: a top polymer layer, the trench and the at least one trace marker disposed on the top polymer layer; and a bottom polymer layer having a melting temperature higher than an imprint temperature of the top polymer layer.
Further, the top polymer layer has a melting temperature below 170 ℃ in case the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 160 ℃ in case the top polymer layer is made of an amorphous polymer.
Further, the top polymer layer has a melting temperature below 110 ℃ in case the top polymer layer is made of a semi-crystalline polymer, or a glass transition temperature below 100 ℃ in case the top polymer layer is made of an amorphous polymer.
Further, the thickness of the top polymer layer and the bottom polymer layer are each in the range of 10 μm to 100 μm, the top polymer layer and the bottom polymer layer are attached by an adhesive layer thinner than 10 μm transparent to the laser irradiation, and wherein the bottom polymer layer is at least as thick as the top polymer layer.
Further, the thickness of the top polymer layer and the bottom polymer layer are each in the range of 25 μm to 40 μm, the top polymer layer and the bottom polymer layer are attached by an adhesive layer thinner than 2 μm transparent to the laser irradiation, and wherein the bottom polymer layer is at least as thick as the top polymer layer.
Further, the cross section of the groove is trapezoidal, circular, square, rectangular or triangular.
Another aspect of the present invention provides a pattern transfer system, comprising:
at least one laser scanner configured to irradiate a pattern transfer sheet with at least one laser beam, the pattern transfer sheet including a plurality of grooves arranged in a specified pattern and accommodating a printing paste, wherein the pattern transfer sheet is configured to release the printing paste from the grooves and onto a receiving substrate when irradiated by the laser beam,
at least one imaging unit configured to monitor at least a portion of the pattern transfer sheet during and/or after release of the printing paste, and
a controller configured to adjust the laser beam irradiation in accordance with the monitoring by the at least one imaging unit, in particular:
the pattern transfer sheet comprises at least one of:
(i) at least one trace mark located outside of the specified pattern and configured to receive the printing paste, wherein the at least one trace mark is aligned with respect to at least one of the trenches and is wider than a width of the laser beam, an
(ii) A plurality of working window marks located outside of the specified pattern and configured to receive the printing paste, wherein the working window marks are disposed at specified offsets relative to specified trenches of the specified pattern, and wherein different working window marks are disposed at different offsets, an
The controller is configured to be capable of performing at least one of:
(i) calculating a misalignment of the laser beam from at least one of the at least one trace mark after pattern transfer and correcting the calculated misalignment of the laser beam by adjusting a positioning of the laser beam, an
(ii) Calculating an effective working window of the laser beam from the working window marks transferred after the pattern transfer, and correcting the effective working window by adjusting the power of the laser beam.
Further, the pattern transfer sheet further includes a plurality of alignment marks located outside the specified pattern and configured to receive the printing paste, wherein the alignment marks are aligned with the respective grooves, and the at least one image forming unit is further configured to detect the specified grooves on the pattern transfer sheet using the alignment marks.
In various embodiments, one or more trace marks are used to optically monitor and calculate misalignment of the laser beam and enable correction of the calculated misalignment of the laser beam by adjusting the positioning of the laser beam.
In various embodiments, a plurality of working window markings are used to optically monitor and calculate the actual effective working window of the printing process, and the effective working window is corrected by adjusting the power of the laser beam.
These, additional and/or other aspects and/or advantages of the present invention are set forth in the detailed description that follows; may be inferred from the detailed description; and/or may be learned by practice of the utility model.
Drawings
For a better understanding of embodiments of the utility model, and to show how embodiments of the same may be carried into effect, reference will now be made, by way of example only, to the accompanying drawings in which like reference numerals refer to corresponding elements or parts throughout.
In the drawings:
fig. 1A and 1B are highly schematic views of portions of a pattern transfer sheet according to some embodiments of the present invention.
Fig. 2A and 2B are highly schematic views of a pattern transfer sheet having trace marks for laser beam position measurement according to some embodiments of the present invention.
Fig. 3 and 4 are highly schematic views of a pattern transfer sheet having trace marks and working window marks for monitoring the position and power of laser beam irradiation, respectively, according to some embodiments of the present invention.
FIG. 5A is a highly schematic view of a PTP system according to some embodiments of the present invention.
Fig. 5B is a highly schematic cross-sectional view of a pattern transfer sheet according to some embodiments of the present invention.
FIG. 6 is a high level flow chart illustrating a method of monitoring pattern transfer according to some embodiments of the present invention.
Detailed Description
In the following description, various aspects of the present invention are described. For purposes of explanation, specific configurations and details are set forth in order to provide a thorough understanding of the present invention. However, it will also be apparent to one skilled in the art that the present invention may be practiced without the specific details presented herein. Furthermore, well-known features may have been omitted or simplified in order not to obscure the present invention. With specific reference to the drawings, it is stressed that the particulars shown are by way of example and for purposes of illustrative discussion of the present invention only, and are presented in the cause of providing what is believed to be the most useful and readily understood description of the principles and conceptual aspects of the utility model. In this regard, no attempt is made to show structural details of the utility model in more detail than is necessary for a fundamental understanding of the utility model, the description taken with the drawings making apparent to those skilled in the art how the several forms of the utility model may be embodied in practice.
Before explaining at least one embodiment of the utility model in detail, it is to be understood that the utility model is not limited in its application to the details of construction and the arrangement of the components set forth in the following description or illustrated in the drawings. The utility model is applicable to other embodiments and combinations of the disclosed embodiments, which may be practiced or carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting.
Embodiments of the present invention provide efficient and economical methods and mechanisms for controlling a transfer process, thereby providing improvements in the art of producing electrical circuits. The diagnostic pattern is provided on a dedicated donor substrate that serves as a pattern transfer sheet. The diagnostic pattern is configured to assist in evaluating a system and method of Pattern Transfer (PTP) and is used for PTP process control to monitor and improve transfer pattern quality. The pattern on the donor substrate (e.g., tape or sheet) includes features that are transferred (e.g., deposited or printed) to a receiving structure or pattern (e.g., metal lines on a photovoltaic cell or other circuit board). For example, the transfer of the features may be performed using laser irradiation that separates the feature material (e.g., a metallic high viscosity paste) from the donor substrate and facilitates deposition of the separated material onto the receiving structure. The pattern on the donor substrate also includes additional features and/or marks that are located outside the transferred pattern and are used for real-time control of the printing process, in particular the position and power of the irradiating laser beam, in order to maximize or optimize the quality of the printed pattern.
The pattern transfer process is typically performed by a PTP system and method that utilizes imaging to monitor and control pattern deposition, for example by monitoring the alignment of a basic laser scanner with the transfer pattern sheet (also referred to as the donor substrate pattern). The detection of the additional features and/or markers may be performed by the same imaging device, e.g. a camera (or possibly an auxiliary imaging device), and corresponding algorithms and software running on the system computer. Typically, the slurry remaining on the pattern transfer sheet is optically detected and used to assess possible laser misalignment.
Pattern transfer sheets and related systems and methods are provided for monitoring and adjusting laser illumination used to transfer a slurry pattern from a trench on the sheet onto a substrate, such as a circuit and/or solar cell substrate. The pattern transfer sheet includes, outside the pattern: (i) a trace mark configured to receive printing paste, aligned with the trench and wider than a width of the impinging laser beam, to detect a misalignment of the paste released from within the trace mark, and/or (ii) a working window mark configured to receive printing paste, set at a specified offset relative to the specified trench, wherein different working window marks are set at different offsets to correct the effective working window by adjusting the power of the laser beam.
Fig. 1A and 1B are highly schematic views of portions of a pattern transfer sheet 100 according to some embodiments of the present invention. The portions depicted by dashed lines illustrate the patterning principles and are not limiting with respect to the arrangement, relative position, and size of the elements shown.
The pattern transfer sheet 100 includes a plurality of grooves 110 arranged in a specified pattern and configured to receive a printing paste and release the printing paste from the grooves 110 onto a receiving substrate (see, e.g., substrate 90 in fig. 5A) when irradiated by a laser (see, e.g., a schematic view of PTP system 150 in fig. 5A). Fig. 1A schematically illustrates filling of a groove 110 on an empty pattern transfer sheet 100A with a slurry to produce a filled pattern transfer sheet 100B, as schematically illustrated in an enlarged portion of the pattern transfer sheet 100. In fig. 1B, all trenches 110 are shown empty prior to the step of slurry filling.
In some embodiments, pattern transfer sheet 100 may include both trace indicia 120 and working window indicia 130. The trace marker 120 and the working window marker 130 are configured to enable unambiguous detection by image processing (e.g., by one or more imaging units 170 shown schematically in fig. 5A).
Fig. 2A and 2B are highly schematic views of a pattern transfer sheet 100 having trace indicia 120 for laser beam position measurement according to some embodiments of the present invention. Since the trace mark 120 is aligned with and wider than the designated trench 110A, the precise laser beam location removes the slurry from the center of the trace mark 120, leaving a symmetrical trace of the remaining slurry; while an inaccurate laser beam position removes the paste from the center of trace mark 120, leaving an asymmetric trace of the remaining paste.
Fig. 2A schematically illustrates the precise alignment of the laser beam 140 with the trench 110A and the corresponding center position of the laser beam 140 relative to the filled trace mark 120B. In particular, the remaining traces include paste 123A on either side of gap 121A, which corresponds to the paste removed from mark 120B by laser beam 140. The remaining paste trace 120C is symmetrical and indicates the precise alignment of the laser beam 140.
Fig. 2B schematically illustrates an inaccurate alignment of the laser beam 140 with the trench 110A, and an off-center position of the laser beam 140 relative to the filled trace mark 120B. In particular, the remaining traces include paste 123B on either side of gap 121B, which corresponds to the paste removed from mark 120B by laser beam 140. The remaining paste trace 120C is asymmetric and indicates misalignment of the laser beam 140.
After slurry deposition, the slurry trace 120C may be measured by a corresponding PTP system 150 (see, e.g., fig. 5A) for readjusting the laser beam position in the next slurry transfer cycle, e.g., when printing the next wafer, e.g., by applying a calculated offset (related to the asymmetry of the slurry trace 120C with respect to the laser beam position).
The pattern transfer sheet 100 may include a plurality of trace marks 120, and the controller 180 (see, e.g., fig. 5A) in the PTP system 150 may be configured to derive the laser misalignment relative to the plurality of respective trace marks 120, e.g., applying statistical methods to enhance the accuracy of the calculated misalignment.
Fig. 3 and 4 are highly schematic views of a pattern transfer sheet 100 having a trace mark 120 and a working window mark 130 for monitoring the position and power of laser beam irradiation, respectively, according to some embodiments of the present invention. In fig. 3, the full and empty working window marks 130 are shown in enlarged detail to illustrate the difference between marks 130A, 130B filled with paste during the pattern transfer process and marks 130C that have been emptied from the paste by the laser beam 140.
The working window indicia 130 is designed to have a specified offset wherein the indicia 130 is displaced relative to the specified grooves 110 on the pattern transfer sheet 100. For example, in the illustrative, non-limiting example, the displacement (offset δ) ranges from-30 μm to-60 μm, and from +30 μm to +60 μm, with a step size of 10 μm.
Fig. 3 and 4 schematically show pattern transfer sheet 100B with filled slurry (before laser irradiation and slurry deposition) and pattern transfer sheet 100C after pattern transfer (emptying of trenches 110 from filled slurry by laser irradiation). Accordingly, all of the working window marks 130A are filled with paste before pattern transfer, while some of the working window marks 130C may be emptied after pattern transfer, while other working window marks 130B may remain filled with paste without the laser beam irradiating them during the printing process.
As shown in the non-limiting example of FIG. 3, after the printing process, the working window marks 130 shifted by the offsets δ between-30 μm and-50 μm and between +30 μm and +50 μm are cleared by the laser irradiation and become empty marks 130C, while the working window marks 130 shifted by the offsets +60 μm and-60 μm are not cleared by the laser irradiation and remain full marks 130B. Image analysis may be applied to detect full working window marks 130B (which remain filled with paste after the pattern transfer process) and empty working window marks 130C (from which paste is removed during the pattern transfer process), and to derive therefrom an effective working window based on the laser power, since at a specified offset the laser beam is not effective in removing paste from the corresponding working window mark 130B (e.g., due to a lower effective power or other reason). Thus, the actual effective laser beam width (referred to as the working window) may be less than desired and insufficient to compensate for laser-to-trench alignment tolerances, resulting in partial or no slurry deposition. For example, in the case shown in fig. 3, the laser power is only effective over an effective operating window of 100 μm to 50 μm +50 μm. One or more controllers 180 (described below) of the PTP system 150 may be configured to control the operating window at least to some extent by modifying the applied laser power: the higher the laser power, the wider the laser beam and therefore the larger the working window.
FIG. 5A is a highly schematic view of a PTP system 150, according to some embodiments of the present invention. Highly schematic fig. 5A shows the transfer of patterned slurry from pattern transfer sheet 100 to substrate 90 using laser beam 140 of one or more laser scanners 160. The one or more imaging units 170 may be configured to optically monitor the pattern transfer process, e.g., to monitor the transfer of printing paste onto the substrate through the clear trench 110 and trace marks 120, the working window 130, as explained herein. The one or more controllers 180 may be in communication with the one or more laser scanners 160 and the one or more imaging units 170, and configured to adjust optical parameters of the laser beam 140 by modifying settings for the power and position of the laser scanners 160 based on analysis of images taken by the imaging units 170. For example, controller 180 may be configured to calculate the alignment of laser beam 140 from slurry trace 120C (shown in fig. 2A, 2B, and 3) on pattern transfer sheet 100. The controller 180 may also be configured to detect misalignment of the laser scanner 160 when an asymmetric slurry track 120C is detected (see, e.g., fig. 2B). The controller 180 may also be configured to calculate the effective working window of the laser beam 140 using the remaining working window marks 130 on the pattern transfer sheet 100 and adjust the laser power of the laser scanner 160 accordingly. Additional non-limiting details of PTP systems are provided, for example, in U.S. Pat. No.9,616,524.
The disclosed system 150 and pattern transfer sheet 100 may be used to print thin lines 165 of thick metal paste to create circuits, such as wires or pads or other features on a laminate for a PCB or other printed circuit board or on a silicon wafer, such as for a Photovoltaic (PV) cell. Other applications may include the creation of conductive features during the manufacturing of mobile phone antennas, decorative and functional automotive glass, semiconductor Integrated Circuits (ICs), semiconductor IC package connections, Printed Circuit Boards (PCBs), PCB component assemblies, optical biological, chemical and environmental sensors and detectors, Radio Frequency Identification (RFID) antennas, Organic Light Emitting Diode (OLED) displays (passive or active matrices), OLED illumination sheets, printed batteries, and other applications. For example, in non-limiting solar applications, the metal paste may include one or more metal powders, optionally a glass frit and one or more modifiers, one or more volatile solvents and one or more non-volatile polymers and/or one or more resins. Non-limiting examples of slurries include those from HeraeusTMSOL9651B (g)TM。
Filling of the slurry into the trench 110, the trace flag 120, and the working window flag 130 may be performed by any type of slurry fill head operating within any type of PTP system. The filling process can be controlled to ensure that the trenches and marks are continuously and uniformly filled with the slurry.
Fig. 5B is a highly schematic cross-sectional view of pattern transfer sheet 100 according to some embodiments of the present invention.
In some embodiments, pattern transfer sheet 100 may be transparent to laser beam 140 and include at least a top polymer layer 114 including grooves 110 and marks 120, 130 (shown in fig. 1A-5A) formed thereon by imprint molding, pneumatic molding, or laser molding. In the non-limiting example shown, the grooves 110 are shown as being trapezoidal in cross-section.
It should be noted that while the schematic diagram 5B shows periodic grooves 110, the markings 120 and/or 130 (shown in fig. 1A-5A) may include grooves, recesses, and/or indentations that are stamped, pneumatically formed, or laser formed into the top polymer layer 114 in a similar manner, and may have similar or different profiles. For example, the trenches 110, the trace marks 120 and/or the working window marks 130 and the alignment marks 124 may have various profiles (cross-sectional shapes), such as trapezoidal, circular, square, rectangular and/or triangular profiles. In various embodiments, the pattern of grooves 110 on pattern transfer sheet 100 may include an array of continuous grooves 110 and/or separate indentations. It should be noted that the term "groove" should not be construed to limit the shape of the groove 110 to a linear element, but rather is to be construed broadly to include any shape of groove 110.
In certain embodiments, the top polymer layer 114 and the bottom polymer layer 112 are made of one of the following various materials: polyethyleneExamples of the thermoplastic polymer include, but are not limited to, polyolefin, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, wholly aromatic polyester, other copolyester, polymethyl methacrylate, other polyacrylate, polycarbonate, polyamide, polysulfone, polyether sulfone, polyether ketone, polyamide imide, polyether imide, aromatic polyimide, alicyclic polyimide, fluorinated polyimide, cellulose acetate, cellulose nitrate, aromatic polyamide, polyvinyl chloride, polyphenol, polyarylate, polyphenylene sulfide, polyphenylene ether, and polystyrene. As long as the melting temperature or glass transition temperature (T) of the top polymer layer 114m/Tg) Below the melting temperature or glass transition temperature (T) of the bottom polymer layer 112m/Tg) And/or as long as the bottom polymer layer 112 is not affected by the processing conditions of the top polymer layer 114.
In certain embodiments, the thickness of the bottom polymer layer 112 and the top polymer layer 114 may each be in the range of 10 μm to 100 μm, preferably between 15 μm thick and 80 μm thick, 20 μm thick and 60 μm thick, 25 μm thick and 45 μm thick, 25 μm thick and 40 μm thick, with the thickness of the bottom polymer layer 112 being at least the same as the thickness of the top polymer layer 114. The polymer layer may be attached by an adhesive layer 113, the adhesive layer 113 being thinner than 10 μm and also transparent to laser irradiation, more preferably thinner than 8 μm, 6 μm, 4 μm or 2 μm. For example, in some embodiments, the top polymer layer 114 may be several microns thicker than the depth of the trench 110 (and/or the indicia 120 and/or 130), e.g., 5 μm thick, 3 μm to 7 μm thick, 1 to 9 μm thick, or up to 10 μm thick. For example, the trenches 110 may be 20 μm deep, the top polymer layer 114 may be 20 μm to 30 μm thick, and the thickness of the bottom polymer layer 112 may be in the range of 25 μm to 45 μm (note that a thicker bottom polymer layer 112 provides better mechanical properties).
The temperature and thickness of the top polymer layer and the bottom polymer layer are designed so that the top polymer layer has good formability, ductility and a certain mechanical strength, the bottom polymer layer has good mechanical strength, and the two layers have good adhesion performance.
The elements of fig. 1A, 1B, 2A, 2B, 3, 4, 5A and 5B may be combined in any operable combination, and the description of certain elements in certain figures, but not others, is for illustrative purposes only and is not limiting. It should be noted that the disclosed values may be modified by at least ± 10% of the corresponding values.
FIG. 6 is a high-level flow diagram illustrating a method 200 of monitoring pattern transfer according to some embodiments of the present invention. This method stage may be performed using one or more pattern transfer sheets 100 and/or with respect to PTP system 150 described above, which may optionally be configured to implement method 200. The method 200 may be implemented at least in part by at least one computer processor in, for example, a PTP system. Certain embodiments include a computer program product comprising a computer readable storage medium having a computer readable program embodied therewith and configured to perform the relevant stages of the method 200. Method 200 may include the following stages, regardless of their order.
In some embodiments, method 200 also includes adding one or more alignment marks to the pattern transfer sheet, the alignment marks being aligned with respective grooves (stage 230), and detecting the designated grooves on the pattern transfer sheet using the alignment marks (stage 240).
In the foregoing description, an embodiment is an example or implementation of the present invention. The various appearances of "one embodiment," "an embodiment," "some embodiments," or "some embodiments" are not necessarily all referring to the same embodiments. Although various features of the utility model may be described in the context of a single embodiment, the features may also be provided separately or in any suitable combination. Conversely, although the utility model may be described in the context of separate embodiments for clarity, the utility model may also be implemented in a single embodiment. Certain embodiments of the utility model may include features from different embodiments disclosed above, and certain embodiments may combine elements from other embodiments disclosed above. The disclosure of elements of the utility model in the context of particular embodiments is not intended to limit its use to particular embodiments only. Further, it is to be understood that the utility model may be carried out or practiced in various ways, and that the utility model may be practiced in certain embodiments other than those outlined in the description above.
The utility model is not limited to those figures or to the corresponding description. For example, flow need not move through each illustrated box or state, or in exactly the same order as illustrated and described. Unless defined otherwise, the meanings of technical and scientific terms used herein are generally understood by those of ordinary skill in the art to which the utility model belongs. While the utility model has been described with respect to a limited number of embodiments, these should not be construed as limitations on the scope of the utility model, but rather as exemplifications of some of the preferred embodiments. Other possible variations, modifications, and applications are also within the scope of the utility model. Accordingly, the scope of the utility model should be limited not by what has been described so far, but by the appended claims and their legal equivalents.
Claims (16)
1. A pattern transfer sheet comprising:
a plurality of grooves arranged in a prescribed pattern and configured to receive a printing paste and to release the printing paste from the grooves onto a receiving substrate when irradiated by a laser beam,
characterized in that the pattern transfer sheet comprises at least one of:
(i) at least one trace mark located outside of the specified pattern and configured to receive the printing paste, wherein the at least one trace mark is aligned with respect to at least one of the trenches and is wider than a width of the laser beam; and
(ii) a plurality of working window indicia located outside of the designated pattern and configured to receive the printing paste, wherein the working window indicia are disposed at a designated offset relative to a designated groove of the designated pattern, and wherein different working window indicia are disposed at different offsets.
2. The pattern transfer sheet according to claim 1, further comprising a plurality of alignment marks located outside the specified pattern and configured to receive the printing paste, wherein the alignment marks are aligned with the respective grooves.
3. The pattern transfer sheet according to claim 2, wherein the alignment marks are arranged in an asymmetric pattern.
4. The pattern transfer sheet according to claim 1, wherein the pattern transfer sheet is transparent to the laser beam irradiation, and the grooves are formed in the pattern transfer sheet by means of imprint molding, pneumatic molding or laser molding.
5. The pattern transfer sheet according to any one of claims 1 to 4, wherein the grooves have a trapezoidal, rectangular, circular or triangular cross-section.
6. The pattern transfer sheet according to claim 1, wherein the pattern transfer sheet is at least one polymer layer made of one of the following materials: polyethylene, polypropylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, wholly aromatic polyester, aliphatic-aromatic copolyester, a copolymerized acrylate, polycarbonate, polyamide, polysulfone, polyethersulfone, polyether ketone, polyamideimide, polyetherimide, aromatic polyimide, alicyclic polyimide, fluorinated polyimide, cellulose acetate, cellulose nitrate, aromatic polyamide, polyvinyl chloride, polyphenol, polyarylate, polyphenylene sulfide, polyphenylene ether, polystyrene.
7. The pattern transfer sheet according to claim 1, wherein the shift amount of the working window mark ranges from-30 μm to-60 μm, and from +30 μm to +60 μm, with a step size of 10 μm.
8. A pattern transfer sheet which is transparent to laser beam irradiation and contains a plurality of grooves arranged in a prescribed pattern, and the grooves are configured to receive a printing paste and to discharge the printing paste from the grooves onto a receiving substrate when irradiated by a laser beam, characterized in that,
the pattern transfer sheet is at least one polymer layer having at least one trace indicia disposed thereon.
9. The pattern transfer sheet according to claim 8,
the pattern transfer sheet includes at least:
a top polymer layer, the trench and the at least one trace marker disposed on the top polymer layer; and a bottom polymer layer having a melting temperature higher than an imprint temperature of the top polymer layer.
10. The pattern transfer sheet according to claim 9, wherein the top polymer layer has a melting temperature below 170 ℃ in case the top polymer layer is made of a semi-crystalline polymer or a glass transition temperature below 160 ℃ in case the top polymer layer is made of an amorphous polymer.
11. The pattern transfer sheet according to claim 9, wherein the top polymer layer has a melting temperature below 110 ℃ in case the top polymer layer is made of a semi-crystalline polymer or a glass transition temperature below 100 ℃ in case the top polymer layer is made of an amorphous polymer.
12. The pattern transfer sheet according to claim 9, wherein the thickness of the top polymer layer and the bottom polymer layer are each in the range of 10 μ ι η to 100 μ ι η, the top polymer layer and the bottom polymer layer being attached by an adhesive layer thinner than 10 μ ι η transparent to the laser irradiation, and wherein the bottom polymer layer is at least as thick as the top polymer layer.
13. The pattern transfer sheet according to claim 9, wherein the thickness of the top polymer layer and the bottom polymer layer are each in the range of 25 μ ι η to 40 μ ι η, the top polymer layer and the bottom polymer layer being attached by an adhesive layer thinner than 2 μ ι η transparent to the laser irradiation, and wherein the bottom polymer layer is at least as thick as the top polymer layer.
14. The pattern transfer sheet according to any one of claims 8 to 13, wherein the grooves have a trapezoidal, circular, square, rectangular or triangular cross-section.
15. A pattern transfer system, comprising:
at least one laser scanner configured to irradiate a pattern transfer sheet with at least one laser beam, the pattern transfer sheet including a plurality of grooves arranged in a specified pattern and accommodating a printing paste, wherein the pattern transfer sheet is configured to release the printing paste from the grooves and onto a receiving substrate when irradiated by the laser beam,
at least one imaging unit configured to monitor at least a portion of the pattern transfer sheet during and/or after release of the printing paste, and
a controller configured to adjust the laser beam irradiation according to monitoring by the at least one imaging unit, characterized in that:
the pattern transfer sheet comprises at least one of:
(i) at least one trace mark located outside of the specified pattern and configured to receive the printing paste, wherein the at least one trace mark is aligned with respect to at least one of the trenches and is wider than a width of the laser beam, an
(ii) A plurality of working window marks located outside of the specified pattern and configured to receive the printing paste, wherein the working window marks are disposed at specified offsets relative to specified trenches of the specified pattern, and wherein different working window marks are disposed at different offsets, an
The controller is configured to be capable of performing at least one of:
(i) calculating a misalignment of the laser beam from at least one of the at least one trace mark after pattern transfer and correcting the calculated misalignment of the laser beam by adjusting a positioning of the laser beam, an
(ii) Calculating an effective working window of the laser beam from the working window marks transferred after the pattern transfer, and correcting the effective working window by adjusting the power of the laser beam.
16. The pattern transfer system according to claim 15, wherein:
the pattern transfer sheet further comprises a plurality of alignment marks located outside the specified pattern and configured to receive the printing paste, wherein the alignment marks are aligned with the respective grooves, and
the at least one imaging unit is further configured to detect a specified groove on the pattern transfer sheet using the alignment mark.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP22183297.5A EP4120023A1 (en) | 2021-07-15 | 2022-07-06 | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
| IL294607A IL294607A (en) | 2021-07-15 | 2022-07-07 | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
| US17/864,419 US20230019668A1 (en) | 2021-07-15 | 2022-07-14 | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
| KR1020220087203A KR20230012438A (en) | 2021-07-15 | 2022-07-14 | Pattern transfer sheet, method of monitoring pattern transfer printing, and pattern transfer printing system |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121615187 | 2021-07-15 | ||
| CN2021216151878 | 2021-07-15 |
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| CN216139714U true CN216139714U (en) | 2022-03-29 |
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| CN202122130645.5U Active CN216139714U (en) | 2021-07-15 | 2021-09-03 | Pattern transfer sheet and pattern transfer system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11910537B2 (en) | 2021-11-09 | 2024-02-20 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing systems and methods |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11910537B2 (en) | 2021-11-09 | 2024-02-20 | Wuhan Dr Laser Technology Corp,. Ltd | Pattern transfer printing systems and methods |
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