CN216117886U

CN216117886U - Mainboard testing device

Info

Publication number: CN216117886U
Application number: CN202121408042.0U
Authority: CN
Inventors: 陈灿; 刘鑫; 陶帅
Original assignee: Hunan Zhihaohang Precision Technology Co ltd
Current assignee: Hunan Zhihaohang Precision Technology Co ltd
Priority date: 2021-06-24
Filing date: 2021-06-24
Publication date: 2022-03-22
Anticipated expiration: 2031-06-24

Abstract

The utility model discloses a mainboard testing device, which comprises a needle plate, a carrier plate and a micro-needle module; the surface of the carrier plate is provided with a placement position for placing the main board, and the carrier plate can be movably arranged right above the needle plate up and down; the micro-needle module can be vertically and floatingly mounted on the needle plate, and is connected with a switching flat cable. Through installing the micropin module on the faller with can floating from top to bottom to the cooperation micropin module is connected with the switching winding displacement, makes the connector on the mainboard can be automatic leading-in be connected with micropin module lock, need not the manual work and presses the lock, avoids detaining bad mainboard connector, can not damage the switching winding displacement, offers convenience for the test operation, thereby can test the mainboard fast and whether bad.

Description

Mainboard testing device

Technical Field

The utility model relates to the technical field of testing devices, in particular to a mainboard testing device.

Background

The mainboard testing device is used for simulating finished product testing before mainboard assembly, the separated mainboard is in conduction connection with a screen through the manufactured FPC, and whether the mainboard is correctly connected with the screen is tested by utilizing the principle of a conduction circuit. The good product screen is fixed inside the tool, and is fixed as the test article. The test platform is connected with the screen through the buckling connector, and the USB plugging mechanism provides power for the mainboard.

The winding displacement lock of present mainboard testing arrangement mainly adopts the manual work to press the lock, easily buckles bad mainboard connector, and the switching winding displacement is fragile simultaneously to test part connector, with current micropin test unstable, the micropin lock test is easily influenced to mainboard connection welded tolerance. Therefore, there is a need for an improved motherboard testing apparatus.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention is directed to a main board testing apparatus for rapidly testing whether a main board is defective.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a mainboard testing device comprises a needle plate, a carrier plate and a micro-needle module; the surface of the carrier plate is provided with a placement position for placing the main board, and the carrier plate can be movably arranged right above the needle plate up and down; the micro-needle module can be vertically and floatingly mounted on the needle plate, and is connected with a switching flat cable.

Preferably, the needle plate is provided with a mounting hole, a linear bearing is arranged in the mounting hole, the carrier plate is fixed with a guide pin, the guide pin is inserted in the linear bearing, and the carrier plate moves up and down under the guiding of the linear bearing and the guide pin.

Preferably, the mounting position is internally provided with a positioning pin used for being matched and positioned with the positioning hole in the main board.

Preferably, the needle plate is provided with a power supply probe.

Preferably, the microneedle module is in plurality.

Preferably, the needle plate and the carrier plate are both made of antistatic materials.

Preferably, the support plate and the needle plate are fixed by magnet adsorption.

Preferably, the probe in the microneedle module is of an integrated structure made of beryllium copper.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:

through installing the micropin module on the faller with can floating from top to bottom to the cooperation micropin module is connected with the switching winding displacement, makes the connector on the mainboard can be automatic leading-in be connected with micropin module lock, need not the manual work and presses the lock, avoids detaining bad mainboard connector, can not damage the switching winding displacement, offers convenience for the test operation, thereby can test the mainboard fast and whether bad.

To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments:

drawings

FIG. 1 is an exploded perspective view of the preferred embodiment of the present invention.

The attached drawings indicate the following:

10. needle plate 11, mounting hole

12. Linear bearing 20, carrier plate

21. Mounting position 22 and positioning pin

23. Guide pin 30 and microneedle module

31. Probe 40, power feeding probe

50. Main plate 51, positioning hole

60. Switching winding displacement

Detailed Description

Referring to fig. 1, a specific structure of a preferred embodiment of the utility model is shown, which includes a needle plate 10, a carrier 20 and a micro-needle module 30.

The needle plate 10 is made of antistatic materials, a power supply probe 40 is arranged on the needle plate 10, the power supply probe 40 is used for supplying power to a main board 50, a test point transmits signals, a mounting hole 11 is formed in the needle plate 10, and a linear bearing 12 is arranged in the mounting hole 11.

The surface of the carrier plate 20 is formed with a mounting position 21 for placing the main board 50, and the carrier plate 20 is movably arranged right above the needle plate 10 up and down; in this embodiment, the carrier plate 20 is made of an antistatic material, and the positioning pin 22 for matching with the positioning hole 51 on the main board 50 is disposed in the mounting position 21, so that the positioning accuracy of the main board 50 can be improved; a plurality of guide pins 23 are fixed on the carrier plate 20, the guide pins 23 are inserted in the linear bearings 12, the carrier plate 20 moves up and down under the guiding of the linear bearings 12 and the guide pins 23, so as to ensure the smooth up and down floating and the position degree of the main board 50, and correspondingly, a plurality of linear bearings 12 are also provided; and, the carrier plate 20 and the needle plate 10 are fixed by magnet (not shown) to prevent the connector cable from prying, and meanwhile, the carrier plate is pre-pressed to prevent the product from being buckled and pressed badly.

The micro-needle module 30 can be vertically and floatingly mounted on the needle plate 10, so that the connector cannot be led into the micro-needle module 30 under the condition that the connector on the main board 50 is welded to be deviated, and the smooth leading-in of the connector of the main board 50 is ensured; the micro-needle module 30 is connected with a switching flat cable 60, so that the rapid installation, disassembly and maintenance are convenient; in this embodiment, the microneedle module 30 is provided in plurality, and the probe 31 in the microneedle module 30 is an integrated structure made of beryllium copper, so that the service life of the probe 31 and the test stability can be ensured.

Detailed description the working principle of the present embodiment is as follows:

when the micro needle micro.

The design key points of the utility model are as follows: through installing the micropin module on the faller with can floating from top to bottom to the cooperation micropin module is connected with the switching winding displacement, makes the connector on the mainboard can be automatic leading-in be connected with micropin module lock, need not the manual work and presses the lock, avoids detaining bad mainboard connector, can not damage the switching winding displacement, offers convenience for the test operation, thereby can test the mainboard fast and whether bad.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims

1. A mainboard testing device is characterized in that: comprises a needle plate, a carrier plate and a micro-needle module; the surface of the carrier plate is provided with a placement position for placing the main board, and the carrier plate can be movably arranged right above the needle plate up and down; the micro-needle module can be vertically and floatingly mounted on the needle plate, and is connected with a switching flat cable.

2. A motherboard testing apparatus as recited in claim 1, wherein: the needle plate is provided with a mounting hole, a linear bearing is arranged in the mounting hole, a guide pin is fixed on the carrier plate, the guide pin is inserted in the linear bearing, and the carrier plate moves up and down under the guide of the linear bearing and the guide pin.

3. A motherboard testing apparatus as recited in claim 1, wherein: and the mounting position is internally provided with a positioning pin which is used for being matched and positioned with the positioning hole on the main board.

4. A motherboard testing apparatus as recited in claim 1, wherein: the needle plate is provided with a power supply probe.

5. A motherboard testing apparatus as recited in claim 1, wherein: the micro needle module is multiple.

6. A motherboard testing apparatus as recited in claim 1, wherein: the needle plate and the carrier plate are made of antistatic materials.

7. A motherboard testing apparatus as recited in claim 1, wherein: the support plate and the needle plate are fixed through magnet adsorption.

8. A motherboard testing apparatus as recited in claim 1, wherein: the probe in the micro-needle module is of an integrated structure made of beryllium copper.