CN216097243U

CN216097243U - Lead bonding clamp

Info

Publication number: CN216097243U
Application number: CN202122562839.2U
Authority: CN
Inventors: 尹晓旭; 王志; 张晋
Original assignee: Cosmos Wealth Co ltd
Current assignee: Cosmos Wealth Co ltd
Priority date: 2021-10-23
Filing date: 2021-10-23
Publication date: 2022-03-22
Anticipated expiration: 2031-10-23

Abstract

The application relates to a lead bonding clamp which is used for bonding a chip lead on a lead frame in cooperation with lead bonding equipment and comprises a bottom plate and a pressing plate which is matched with the bottom plate to clamp and fix the lead frame, wherein the pressing plate comprises a pressing part and a clamping part, the pressing part is provided with a plurality of bonding windows, the bonding windows are arranged in multiple rows transversely, the bonding windows in odd rows are arranged orderly in the longitudinal direction, the bonding windows in even rows are arranged orderly in the longitudinal direction, and the bonding windows in counting rows and the bonding windows in even rows are arranged in a staggered way; the clamping parts are symmetrically arranged on two sides of the pressing part; the clamping portion is used for being clamped by the wire bonding equipment. The method and the device have the effect of improving the efficiency of the wire bonding of the integrated circuit chip.

Description

Lead bonding clamp

Technical Field

The application relates to the technical field of semiconductor chip packaging, in particular to a lead bonding clamp.

Background

The wire bonding uses a thin metal wire, and uses heat, pressure and ultrasonic energy to tightly weld the metal wire and a substrate bonding pad, so as to realize the electrical interconnection between the chips and the substrate and the information intercommunication between the chips. The wire bonding process is simple and low in cost, and is often used in a semiconductor chip packaging process.

With the rapid development of electronic components, the types of electronic components are various. The related art lead bonding clamp has the defect of low efficiency and cannot meet the production requirement.

In view of the above-mentioned related art, the inventor believes that the conventional wire bonding jig has a defect of low working efficiency.

SUMMERY OF THE UTILITY MODEL

In order to solve the problem that the related technology has low working efficiency as much as possible, the application provides a wire bonding clamp.

A lead bonding clamp is used for being matched with lead bonding equipment to bond chip leads on a lead frame and comprises a bottom plate and a pressing plate which is matched with the bottom plate to clamp and fix the lead frame, wherein the pressing plate comprises a pressing part and a clamping part, the pressing part is provided with a plurality of bonding windows, the bonding windows are arranged in a plurality of transverse rows, the bonding windows in two adjacent rows are staggered, and the bonding windows in two alternate rows are aligned in the longitudinal direction; the clamping parts are symmetrically arranged on two sides of the pressing part; the clamping portion is used for being clamped by the wire bonding equipment.

Through adopting above-mentioned technical scheme, the mode of setting up of bonding window is the same with the arrangement of electronic device on the lead frame, accurate adaptation, the benefit that sets up like this lies in, the bonding window is arranged inseparabler, the same area can set up more bonding windows, can not increase the width of lead frame moreover, has saved the material promptly, the material number of times of drawing of equipment when making the welding again, heating time, the time and the number of times that equipment read electronic device reduce by a wide margin, and then improved integrated circuit chip lead bonding's efficiency.

Optionally, the bottom plate includes an installation portion and a bearing portion, the installation portion and the bearing portion are fixedly connected, and a bearing end face of the bearing portion is higher than an installation end face of the installation portion.

By adopting the technical scheme, the mounting part and the bearing part have a height difference, and the bearing end surface of the bearing part is higher than the mounting end surface of the mounting part; the advantage of setting up like this is, for the required space of electronics lead frame reversible deformation, with the part lift that the lead frame needs the bonding, has made things convenient for bonding work.

Optionally, the bearing portion is provided with a plurality of cross grooves, the arrangement mode of the cross grooves is the same as that of the bonding windows, and the center positions of the groove walls of the cross grooves are provided with air suction holes.

Through adopting above-mentioned technical scheme, the cross recess can fix a position the electron device on the lead frame, and the suction hole of central point position can be steady to the absorption of lead frame, guarantees the high steadiness of lead frame among the wire bonding process.

Optionally, the pressing portion is symmetrically provided with buffering members in the transverse direction of the bonding window.

By adopting the technical scheme, the buffer part has the advantages that the chip and the leads are fully distributed on the lead frame, and when the bottom plate and the pressing plate are matched and tightly pressed and fixed, the possibility of damaging the chip on the lead frame exists, so that the pressure on the lead frame formed between the bottom plate and the pressing plate can be buffered by the buffer part, and a certain protection effect is realized; in addition, the vibration amplitude of the lead frame can be reduced, and the lead bonding work is facilitated; on the other hand, the lead frame can be assisted to be smoothly separated from the pressing plate after the lead bonding of the electronic device is finished.

Optionally, the pressing portion is further provided with a notch.

By adopting the technical scheme, the welding device of the lead bonding equipment needs to reset after welding and bonding the electronic device on the lead frame, and the gap is arranged at the pressing part to provide enough moving space for the welding device in order to avoid the damage of the equipment caused by collision between the welding device and the pressing plate in the resetting process as much as possible.

Optionally, a positioning hole is formed in the middle of the clamping portion, and the positioning hole is used for being matched with a lead bonding device to mount and fix the pressing plate.

Through adopting above-mentioned technical scheme, set up the locating hole, can be very simple and convenient install and fix a position the clamp plate.

Optionally, the clamping portion is further provided with a guide groove, the guide groove extends from one end of the clamping portion to the positioning hole, the end face of the bottom wall of the guide groove is obliquely arranged, and the height of the end face of the bottom wall close to one end of the positioning hole is larger than that of the end face of the bottom wall far away from one end of the positioning hole.

Through adopting above-mentioned technical scheme, the existence of guide way, the bolt of installation clamp plate or hosel can slide into the locating hole along the guide way, make things convenient for the installation of clamp plate more.

Optionally, the pressing portion is fixedly connected with the clamping portion, a height difference exists between the clamping portion and the pressing portion, one surface of the pressing portion, which is far away from the bottom plate, is a bonding end surface, and the bonding end surface is lower than the clamping portion.

By adopting the technical scheme, when in bonding work, the lead bonding equipment clamps the clamping part, the pressing plate is pressed downwards to be matched with the bottom plate to clamp and fix the lead frame, the clamping part is higher than the pressing part, the pressing part is closer to the lead frame, and the distance between the clamping part and the pressing part is smaller; secondly, the distance between the clamping part and the lead frame is large, so that enough space is provided for a clamping device of the lead bonding equipment to clamp the pressing plate, and the lead bonding equipment is prevented from colliding with the lead frame to cause loss.

Optionally, one surface of the clamping part, which is provided with the guide groove, is a clamping end surface, and the joint of the clamping end surface and the bonding end surface is an inclined surface and is in smooth transition.

Through adopting above-mentioned technical scheme, avoid the operator as far as possible when installation and dismantlement clamp plate, cause the condition of cutting the hand, also can avoid causing the condition emergence of damage to the lead frame in addition as far as possible.

In summary, the present application includes at least one of the following beneficial technical effects:

by arranging more bonding windows, more electronic devices can be subjected to lead bonding operation, the material pulling times and heating time of lead bonding equipment and the time and times for reading the electronic devices by the equipment during bonding are reduced, and the lead bonding efficiency of the integrated circuit chip is improved;

the matching degree of the pressing plate and the bottom plate is improved, and the pressing plate is more convenient and simpler to mount;

the vibration amplitude of the lead frame can be reduced, so that the stability of the lead frame during welding and bonding is improved, and the bonding quality is improved.

Drawings

FIG. 1 is a schematic diagram of a wire bonding jig;

FIG. 2 is a schematic diagram of a base plate configuration of a wire bonding jig;

FIG. 3 is an enlarged view at FIG. 2A;

fig. 4 is a schematic view of a platen structure of the wire bonding jig.

Description of reference numerals: 1. a base plate; 11. an installation part; 12. a bearing part; 120. a cross groove; 130. a suction hole; 2. pressing a plate; 21. a press-fit portion; 210. a bonding window; 211. a buffer member; 212. a notch; 213. a bonding end face; 22. a clamping portion; 220. positioning holes; 221. a guide groove; 222. clamping the end face; 100. a lead frame.

Detailed Description

The present application is described in further detail below with reference to fig. 1 to 4.

The existing wire bonding process is completed on an assembly line, and automation is basically realized. Existing wire bonding equipment typically includes a table, a clamping device and a solder bonding device. The main working procedure is that the bottom plate is fixed on the workbench, the clamping device clamps and fixes the pressing plate, when the lead frame is transported to the position of the bottom plate, the bottom plate can be jacked up, the pressing plate presses down, the bottom plate and the pressing plate are matched to clamp and fix the lead frame, and leads of electronic devices on the lead frame are welded and bonded.

The embodiment of the application discloses a lead bonding clamp. Referring to fig. 1, a wire bonding fixture includes a pressing plate 2 and a bottom plate 1, where the pressing plate 2 cooperates with the bottom plate 1 to compress and fix a lead frame 100, so as to facilitate a wire bonding apparatus to perform welding bonding on a lead of an electronic device on the lead frame 100.

In the bonding work, firstly, the bottom plate 1 is fixedly installed, then the pressing plate 2 is installed on the lead bonding equipment, after the lead frame 100 is located, the bottom plate 1 jacks up the lead frame 100, the lead frame 100 is heated and adsorbed, the pressing plate 2 is pressed and matched with the bottom plate 1 to clamp and fix the lead frame 100, and then welding bonding is carried out.

Specifically, referring to fig. 2 and 3, the bottom plate 1 includes a bearing portion 12 and a mounting portion 11, the bearing portion 12 and the mounting portion 11 are integrally formed, the mounting portion 11 is symmetrically disposed at both sides of the bearing portion 12, the bearing portion 12 is higher than the mounting portion 11, that is, the front view of the entire bottom plate 1 forms a shape of "convex", the mounting portion 11 is provided with a screw hole, and the bottom plate 1 is fixed by cooperating with a bolt (not shown). The bearing part 12 is provided with 24 cross grooves 120, the 24 cross grooves 120 are arranged in 12 rows and 2 columns, two adjacent rows of cross grooves 120 are staggered, and two alternate rows of cross grooves 120 are aligned. The air suction hole 130 is formed in the center of the cross groove 120, the lead frame can be stably adsorbed through the air suction hole 130 and the cooperation with the cross groove 120, and the situation that the bonding is unqualified due to the vibration of the lead frame during bonding is reduced.

Referring to fig. 4, the pressing plate 2 includes a pressing portion 21 and a clamping portion 22, the clamping portion 22 is symmetrically disposed at two ends of the pressing portion 21, and in the embodiment, the pressing portion 21 and the clamping portion 22 are integrally formed, which is advantageous in that the stability of the whole pressing plate 2 can be improved.

Specifically, 24 key windows 210 are formed in the pressing portion 21, the 24 key windows 210 are arranged in 12 rows and 2 columns, two adjacent rows are arranged in a staggered manner, and two alternate rows are arranged in an aligned manner. The advantage of this arrangement is that it saves material, i.e. does not increase the width of the lead frame, and in addition, reduces the number of times the wire bonding apparatus draws material and the heating time, thereby improving bonding efficiency.

Further, the buffering members 211 are disposed on the pressing portion 21, in this embodiment, the buffering members 211 are specifically metal elastic sheets, and the buffering members 211 are symmetrically disposed on two sides of the bonding window 210. The advantage of this setting is that can alleviate clamp plate 2 and bottom plate 1 to meeting the pressure of lead frame, also convenient lead frame and the separation of clamp plate 2 in addition.

Further, a notch 212 is formed in the pressing portion 21, and the notch 212 provides a sufficient space for a welding device of the wire bonding equipment, so that the welding device is prevented from colliding with the pressure plate 2 to cause loss.

Further, in order to facilitate the installation, the clamping portion 22 is provided with positioning holes 220, wherein one positioning hole 220 is oval, so that the purpose of the arrangement is to fix the clamping portion with the wire bonding equipment through the positioning hole 220, and to position the clamping portion according to the oval positioning hole 220 so as to distinguish the installation direction. Further, a guide groove 221 is provided in the longitudinal direction of the clamping portion 22, the guide groove 221 extends from the end of the clamping portion 22 to the positioning hole 220, the bottom wall of the guide groove 221 is provided as an inclined surface, and one end of the guide groove 221 away from the positioning hole 220 is lower than one end of the guide groove 221 close to the positioning hole 220. The advantage that sets up like this is that, install clamp plate 2 at the bolt or the plug bush of wire bonding equipment, can follow guide way 221 and enter into locating hole 220, and the installation is very convenient and fast.

Further, the surface of the clamping portion 22 with the positioning hole 220 is a clamping end surface 222, and the surface of the pressing portion 21 away from the lead frame is a bonding end surface 213. The clamping end face 222 and the bonding end face 213 have a height difference, and the clamping end face 222 is higher than the bonding end face 213, i.e. the front view of the pressure plate 2 is concave. The advantage that sets up like this lies in, and the range that nip portion 21 and lead frame are closer, and the range that clamp plate 2 pushed down is just little, thereby the energy saving has improved efficiency, also forms the accommodation space between clamping part 22 and the lead frame in addition, and this accommodation space can hold the clamping device of wire bonding equipment to clamp plate 2. This has the advantage that damage to the lead frame is avoided.

Further, the joint between the clamping end face 222 and the key end face 213 is a bevel and has smooth transition, so that the material can be saved, and the damage to the lead frame or the hand of the operator caused by the formation of the corner can be avoided as much as possible.

The implementation principle of the wire bonding clamp in the embodiment of the application is as follows: by arranging more bonding windows 210, the material pulling times and the heating time of the lead bonding equipment are reduced, so that the bonding efficiency is improved, specifically, the bonding windows 210 are arranged in 2 rows, the total number is 12 rows, and the bonding windows 210 in two adjacent rows are arranged in a staggered manner, so that the arrangement of the bonding windows 210 is tighter, the width of a lead frame cannot be increased, the efficiency is improved, and the material is also saved.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides a wire bonding anchor clamps for with the cooperation of wire bonding equipment chip lead on to the lead frame bond, including bottom plate (1) and press plate (2) fixed with the lead frame clamp is tight with bottom plate (1) cooperation, its characterized in that:

the pressing plate (2) comprises a pressing part (21) and a clamping part (22), the pressing part (21) is provided with a plurality of bonding windows (210), the bonding windows (210) are arranged in a plurality of transverse rows, the bonding windows (210) in two adjacent rows are staggered, and the bonding windows (210) in two alternate rows are aligned in the longitudinal direction;

the clamping parts (22) are symmetrically arranged on two sides of the pressing part (21); the clamping portion (22) is used for being clamped by a wire bonding device.

2. The wire bonding jig of claim 1, wherein: the bottom plate (1) comprises an installation part (11) and a bearing part (12), the installation part (11) is fixedly connected with the bearing part (12), and the bearing end face of the bearing part (12) is higher than the installation end face of the installation part (11).

3. The wire bonding jig of claim 2, wherein: the bearing part (12) is provided with a plurality of cross grooves (120), the arrangement mode of the cross grooves (120) is the same as that of the bonding windows (210), and the center positions of the groove walls of the cross grooves (120) are provided with air suction holes (130).

4. The wire bonding jig of claim 1, wherein: the pressing part (21) is symmetrically provided with buffer pieces (211) in the transverse direction of the bonding window (210).

5. The wire bonding jig of claim 4, wherein: the pressing part (21) is also provided with a notch (212).

6. The wire bonding jig of claim 1, wherein: the middle part of the clamping part (22) is provided with a positioning hole (220), and the positioning hole (220) is used for being matched with a lead bonding device to install and fix the pressing plate (2).

7. The wire bonding jig of claim 6, wherein: guide way (221) have still been seted up to clamping part (22), guide way (221) follow the one end of clamping part (22) extends to locating hole (220) department, the diapire terminal surface slope of guide way (221) sets up, and the diapire terminal surface height that is close to locating hole (220) one end is greater than the diapire terminal surface height of keeping away from locating hole (220) one end.

8. The wire bonding jig of claim 7, wherein: the pressing portion (21) is fixedly connected with the clamping portion (22), a height difference exists between the clamping portion (22) and the pressing portion (21), one surface, far away from the bottom plate (1), of the pressing portion (21) is a bonding end surface (213), and the bonding end surface (213) is lower than the clamping portion (22).

9. The wire bonding jig of claim 8, wherein: one surface of the clamping part (22) provided with the guide groove (221) is a clamping end surface (222), and the joint of the clamping end surface (222) and the bonding end surface (213) is an inclined surface and is in smooth transition.