CN216096874U - Tin dispensing device for semiconductor element production - Google Patents

Tin dispensing device for semiconductor element production Download PDF

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Publication number
CN216096874U
CN216096874U CN202122071188.7U CN202122071188U CN216096874U CN 216096874 U CN216096874 U CN 216096874U CN 202122071188 U CN202122071188 U CN 202122071188U CN 216096874 U CN216096874 U CN 216096874U
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plate
semiconductor element
moving plate
movable plate
fixed
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CN202122071188.7U
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Chinese (zh)
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杨洁
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Xi'an Changrui Electromechanical Technology Co ltd
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Individual
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Abstract

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a tin dispensing device for semiconductor element production, which comprises an operation table, a box body and supporting plates, wherein the box body is fixedly arranged at the top of the operation table, the two supporting plates are fixedly arranged at two sides of the bottom of the operation table, a strip-shaped opening is formed in the top of the box body, a first moving plate and a second moving plate are slidably arranged in the strip-shaped opening, strip-shaped plates are fixedly arranged at the mutually close sides of the first moving plate and the second moving plate, toothed plates are fixedly arranged at the mutually close sides of the two strip-shaped plates, the top ends of the first moving plate and the second moving plate extend to the upper part of the box body and are respectively and fixedly provided with clamping plates, and anti-skid rubber pads are fixedly adhered to the mutually close sides of the two clamping plates. The clamping device is reasonable in design and simple to operate, can be used for rapidly clamping and releasing the clamping of the semiconductor element, can be used for controlling the clamping force as required, and is convenient to use.

Description

Tin dispensing device for semiconductor element production
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a tin dotting device for semiconductor element production.
Background
Semiconductor refers to a material having a conductive property between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors.
Through the retrieval, chinese patent application No. 202020616717. X discloses a point tin device for semiconductor element production, including the operation panel, the equal fixedly connected with fixing base in front end and the rear end on operation panel surface, the surperficial threaded connection of fixing base has the threaded rod, the one end of threaded rod has the clamp splice through bearing swing joint, the spacing groove has all been seted up to the both sides on operation panel surface, the inner chamber fixedly connected with spacing slide bar of spacing groove, the equal sliding connection in both ends on spacing slide bar surface has spacing sliding sleeve. According to the utility model, the threaded rod is rotated to drive the clamping blocks to move, the two clamping blocks move towards the element so as to fasten the element, the clamping blocks drive the fixing blocks to move, and the fixing blocks drive the limiting sliding sleeves to slide on the surfaces of the limiting sliding rods so as to limit the clamping blocks, so that the problems of reduction of production efficiency and product quality of semiconductors due to lack of fixation of the limiting sliding sleeves during tin point production of semiconductor elements are solved. However, when some semiconductor elements which only need to be subjected to simple spot welding are operated, the fixing mode is complicated, and the working efficiency is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects of the prior art and provides a tin dotting device for producing a semiconductor element.
The technical purpose of the utility model is realized by the following technical scheme: a tin dispensing device for semiconductor element production comprises an operating table, a box body and supporting plates, wherein the box body is fixedly installed at the top of the operating table, the two supporting plates are fixedly installed on two sides of the bottom of the operating table, a bar-shaped opening is formed in the top of the box body, a first movable plate and a second movable plate are slidably installed in the bar-shaped opening, a bar-shaped plate is fixedly installed on one side, close to each other, of the first movable plate and the second movable plate, a toothed plate is fixedly installed on one side, close to each other, of the two bar-shaped plates, a clamping plate is fixedly installed on the top end of the first movable plate and the top end of the second movable plate, the clamping plates are respectively and fixedly installed on the top of the box body, anti-skidding rubber pads are fixedly adhered to one side, close to each other, a same rotating shaft of the clamping plates is rotatably installed on inner walls of the front side and the back side of the box body, gears and reels are fixedly installed on the outer side of the rotating shaft, and the two toothed plates are both meshed with the gears, the bottom fixed mounting of operation panel has the riser, the rectangle mouth has been seted up on the riser, slidable mounting has the sliding plate in the rectangle mouth, and the equal fixed mounting in both sides has the holding down plate around the sliding plate, one side fixed mounting who keeps away from movable plate one of movable plate two has the dead lever, threaded mounting has hollow lead screw on one side inner wall of box, the one end that the fixed disk was kept away from to hollow lead screw extends to outside the box and fixed cover is equipped with the hand wheel, and the dead lever keeps away from one end slidable mounting of movable plate two in hollow lead screw, the outside slidable mounting of dead lever has the fixed disk, and the fixed disk rotates with hollow lead screw to be connected.
Preferably, the same return spring is fixedly installed on one side, close to each other, of the fixed disc and the movable plate, and the return spring is movably sleeved on the outer side of the fixed rod.
Preferably, the same cross rod is fixedly installed on the inner walls of the two sides of the strip-shaped opening, sliding holes are formed in the first moving plate and the second moving plate, and the first moving plate and the second moving plate are connected with the cross rod in a sliding mode through the corresponding sliding holes.
Preferably, two limiting grooves are formed in the outer side of the fixing rod, a plurality of limiting blocks are fixedly mounted on the inner circumferential surface of the fixing disc, and the limiting blocks are respectively slidably mounted in the corresponding limiting grooves.
Preferably, a pulling rope is fixed on the reel and wound on the reel, and one end of the pulling rope, which is far away from the reel, extends to the lower part of the operating platform and is fixedly connected with the sliding plate.
Preferably, the same guide rod is fixedly installed on the inner wall of the top and the inner wall of the bottom of the rectangular opening, the sliding plate is provided with a through hole, and the sliding plate is slidably connected with the outer side of the guide rod through the through hole.
The utility model has the beneficial effects that: according to the utility model, by pressing the pressing plate downwards, the sliding plate can drive the rotating shaft through the pull rope and the reel to enable the gear to rotate along the anticlockwise direction, the two strip-shaped plates respectively drive the first moving plate and the first moving plate to move towards the direction in which the moving plates approach each other under the matching of the two toothed plates, so that the two clamping plates can be controlled to move towards the direction away from each other, a semiconductor element needing tin deposition is placed at the position between the two clamping plates, the pressing plate is loosened, the two clamping plates can be controlled to stably clamp the semiconductor element under the action of the reset spring, the hollow lead screw is rotated through the hand wheel, the hollow lead screw drives the fixed disc to extrude the reset spring leftwards or stretch the reset spring rightwards, the tensioning of the reset spring can be adjusted according to needs, and meanwhile, the strength for clamping the clamping plates to clamp the semiconductor element can be realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic perspective view of a tin dispensing device for semiconductor device production according to the present invention;
FIG. 2 is a schematic cross-sectional view of a tin dispensing device for semiconductor device manufacturing according to the present invention;
FIG. 3 is a schematic structural diagram of part A of a tin dispensing device for semiconductor device production according to the present invention;
fig. 4 is a schematic structural diagram of a portion B of a tin dispensing device for semiconductor device production according to the present invention.
In the figure: 1. an operation table; 2. a box body; 3. a strip-shaped opening; 4. a cross bar; 5. moving a first plate; 6. moving a second plate; 7. a strip plate; 8. a toothed plate; 9. a clamping plate; 10. a rotating shaft; 11. a gear; 12. a reel; 13. a vertical plate; 14. a rectangular opening; 15. a sliding plate; 16. a lower pressing plate; 17. fixing the rod; 18. a hollow lead screw; 19. fixing the disc; 20. a limiting groove; 21. a limiting block; 22. a return spring.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to specific embodiments. It is to be understood that the described embodiments are merely a few embodiments of the utility model, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without any inventive step, are within the scope of the present invention.
Referring to fig. 1-4, a tin dispensing device for semiconductor element production comprises an operating table 1, a box body 2 and supporting plates, wherein the box body 2 is fixedly installed at the top of the operating table 1, the two supporting plates are fixedly installed at two sides of the bottom of the operating table 1, the operating table 1 can be stably supported through the supporting plates, a strip-shaped opening 3 is formed in the top of the box body 2, a first moving plate 5 and a second moving plate 6 are slidably installed in the strip-shaped opening 3, strip-shaped plates 7 are fixedly installed at one sides, close to each other, of the first moving plate 5 and the second moving plate 6, toothed plates 8 are fixedly installed at one sides, close to each other, of the two strip-shaped plates 7, the top ends of the first moving plate 5 and the second moving plate 6 extend to the upper side of the box body 2 and are respectively and fixedly installed with clamping plates 9, anti-skid rubber pads are fixedly adhered to one sides, and can be prevented from sliding in the clamping process through the anti-skid rubber pads, meanwhile, the clamping stability can be improved, the same rotating shaft 10 of the pressing plates is rotatably mounted on the inner walls of the front side and the rear side of the box body 2, the gear 11 and the reel 12 are fixedly sleeved on the outer side of the rotating shaft 10, the two toothed plates 8 are both meshed with the gear 11, the bottom of the operating table 1 is fixedly provided with a vertical plate 13, the vertical plate 13 is provided with a rectangular opening 14, a sliding plate 15 is slidably mounted in the rectangular opening 14, the front side and the rear side of the sliding plate 15 are fixedly provided with lower pressing plates 16, one side of the moving plate II 6, which is far away from the moving plate I5, is fixedly provided with a fixed rod 17, the inner wall of one side of the box body 2 is provided with a hollow lead screw 18 in a threaded manner, one end of the hollow lead screw 18, which is far away from the fixed disk 19, extends to the outside of the box body 2 and is fixedly sleeved with a hand wheel, one end of the fixed rod 17, which is far away from the moving plate II 6, is slidably mounted in the hollow lead screw 18, and the fixed disk 19 is slidably mounted on the outer side of the fixed rod 17, and the fixed disc 19 is rotatably connected with the hollow screw rod 18.
In this embodiment, the same return spring 22 is fixedly installed on the side where the fixed disk 19 and the second moving plate 6 are close to each other, and the return spring 22 is movably sleeved on the outer side of the fixed rod 17, so that the second moving plate 6 can be pushed to slide leftwards to be reset through the return spring 22.
In this embodiment, the same cross bar 4 is fixedly installed on the inner walls of the two sides of the strip-shaped opening 3, the first moving plate 5 and the second moving plate 6 are both provided with sliding holes, the first moving plate 5 and the second moving plate 6 are respectively in sliding connection with the cross bar 4 through the corresponding sliding holes, and the first moving plate 5 and the second moving plate 6 can stably slide through the cross bar 4.
In this embodiment, two spacing grooves 20 have been seted up in the outside of dead lever 17, and fixed mounting has a plurality of stoppers 21 on the inner peripheral surface of fixed disk 19, and a plurality of stoppers 21 respectively slidable mounting are in corresponding spacing groove 20, can make fixed disk 19 keep stable slip along the outside of dead lever 17 through spacing groove 20 and stopper 21.
In this embodiment, a pulling rope is fixed and wound on the reel 12, one end of the pulling rope, which is far away from the reel 12, extends to the lower part of the operating platform 1 and is fixedly connected with the sliding plate 15, and the rotating shaft 10 can be driven to rotate anticlockwise when the sliding plate 15 moves downwards through the pulling rope.
In this embodiment, the same guide bar is fixedly mounted on the top inner wall and the bottom inner wall of the rectangular opening 14, the sliding plate 15 is provided with a through hole, the sliding plate 15 is slidably connected with the outer side of the guide bar through the through hole, and the sliding plate 15 can stably slide along the rectangular opening 14 through the guide bar.
The working principle is as follows: when the semiconductor component clamping device is used, the lower pressing plate 16 is stepped on downwards by feet, so that the sliding plate 15 drives the rotating shaft 10 to rotate in the anticlockwise direction through the matching of the pull rope and the reel 12, the first moving plate 5 and the second moving plate 6 are driven by the two strip-shaped plates 7 to slide in the mutually approaching direction through the gear 11 and the two toothed plates 8, the first moving plate 5 and the second moving plate 6 drive the two clamping plates 9 to move in the mutually departing direction under the action of the first moving plate 5 and the second moving plate 6, a semiconductor component to be welded is placed between the two clamping plates 9, the lower pressing plate 16 is loosened, the two clamping plates 9 move in the mutually approaching direction under the action of the reset spring 22, the semiconductor component can be stably clamped, and then point tin soldering can be carried out.
The utility model provides a tin dotting device for producing a semiconductor element. The principles and embodiments of the present invention are explained herein using specific examples, which are set forth only to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (6)

1. The utility model provides a point tin device is used in semiconductor element production, includes operation panel (1), box (2) and backup pad, its characterized in that, box (2) fixed mounting is at the top of operation panel (1), and two backup pad fixed mounting are in the bottom both sides of operation panel (1), bar mouth (3) have been seted up at the top of box (2), slidable mounting has movable plate one (5) and movable plate two (6) in bar mouth (3), the equal fixed mounting in one side that movable plate one (5) and movable plate two (6) are close to each other has bar board (7), and the equal fixed mounting in one side that two bar boards (7) are close to each other has pinion rack (8), the top of movable plate one (5) and two (6) all extends to the top of box (2) and fixed mounting respectively has grip block (9), and one side that two grip block (9) are close to each other all fixed pasting have anti-skidding rubber pad, the movable type automatic feeding device is characterized in that the box body (2) is connected with the inner walls of the two sides in the front and back direction and is provided with the same rotating shaft (10) for rotatably installing the pressing plates, a gear (11) and a reel (12) are fixedly sleeved on the outer side of the rotating shaft (10), the two toothed plates (8) are respectively meshed with the gear (11), a vertical plate (13) is fixedly installed at the bottom of the operating table (1), a rectangular opening (14) is formed in the vertical plate (13), a sliding plate (15) is slidably installed in the rectangular opening (14), lower pressing plates (16) are fixedly installed on the front side and the rear side of the sliding plate (15), a fixing rod (17) is fixedly installed on one side, away from the first moving plate (5), of the second moving plate (6), a hollow lead screw (18) is installed on the inner wall of one side of the box body (2) in a threaded manner, one end, away from the fixed plate (19), of the hollow lead screw (18), extends to the outer side of the box body (2) and is fixedly sleeved with a hand wheel, and one end of the fixed rod (17) far away from the second moving plate (6) is slidably mounted in the hollow screw rod (18), a fixed disk (19) is slidably mounted on the outer side of the fixed rod (17), and the fixed disk (19) is rotatably connected with the hollow screw rod (18).
2. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: one side, close to each other, of the fixed disc (19) and the second moving plate (6) is fixedly provided with the same return spring (22), and the return spring (22) is movably sleeved on the outer side of the fixed rod (17).
3. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: the movable plate is characterized in that the inner walls of two sides of the strip-shaped opening (3) are fixedly provided with the same cross rod (4), sliding holes are formed in the first movable plate (5) and the second movable plate (6), and the first movable plate (5) and the second movable plate (6) are respectively connected with the cross rod (4) in a sliding mode through the corresponding sliding holes.
4. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: two limiting grooves (20) are formed in the outer side of the fixing rod (17), a plurality of limiting blocks (21) are fixedly mounted on the inner circumferential surface of the fixing disc (19), and the limiting blocks (21) are respectively slidably mounted in the corresponding limiting grooves (20).
5. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: a pulling rope is fixed on the winding wheel (12) and wound, and one end of the pulling rope, which is far away from the winding wheel (12), extends to the lower part of the operating platform (1) and is fixedly connected with the sliding plate (15).
6. The tin spot welding device for producing the semiconductor element according to claim 1, wherein: the inner wall of the top of the rectangular opening (14) and the inner wall of the bottom are fixedly provided with the same guide rod, the sliding plate (15) is provided with a through hole, and the sliding plate (15) is connected with the outer side of the guide rod in a sliding mode through the through hole.
CN202122071188.7U 2021-08-31 2021-08-31 Tin dispensing device for semiconductor element production Active CN216096874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202122071188.7U CN216096874U (en) 2021-08-31 2021-08-31 Tin dispensing device for semiconductor element production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202122071188.7U CN216096874U (en) 2021-08-31 2021-08-31 Tin dispensing device for semiconductor element production

Publications (1)

Publication Number Publication Date
CN216096874U true CN216096874U (en) 2022-03-22

Family

ID=80729706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202122071188.7U Active CN216096874U (en) 2021-08-31 2021-08-31 Tin dispensing device for semiconductor element production

Country Status (1)

Country Link
CN (1) CN216096874U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20221114

Address after: 710000 No. 1, North Row, Panjiazhuang Village Industrial Park, Changyanbao Street, Yanta District, Xi'an, Shaanxi

Patentee after: Xi'an Changrui Electromechanical Technology Co.,Ltd.

Address before: 610000 No.109, 1st floor, no.230 xiehexia street, Huayang street, Tianfu New District, Chengdu, Sichuan

Patentee before: Yang Jie

TR01 Transfer of patent right