CN216027717U

CN216027717U - IC bending mechanism

Info

Publication number: CN216027717U
Application number: CN202122079284.6U
Authority: CN
Inventors: 苏巍
Original assignee: Wuhan Huahaina Technology Co ltd
Current assignee: Wuhan Huahaina Technology Co ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-03-15
Anticipated expiration: 2031-08-31

Abstract

The utility model discloses an IC bending mechanism which comprises a base, wherein a placing groove opening is formed in the base, a regulating plate is embedded in the placing groove opening, a plurality of positioning grooves are formed in the regulating plate, a plurality of positioning plates are arranged on the regulating plate, a plurality of containing cavities are formed in the placing groove opening above the base by the plurality of positioning plates, the regulating plate and the base, IC pieces are arranged in the containing cavities, and hydraulic columns are fixedly arranged on two sides above the base. According to the utility model, the adjusting plate is arranged in the placing notch, the placing notch is divided into the accommodating cavities by the positioning plates, and the positioning plates are movably connected with the adjusting plate, so that the accommodating cavities can be adjusted in area, therefore, the device is suitable for IC pieces of different specifications and sizes, the practicability of the device is improved, and the IC pieces are prevented from generating large fluctuation vibration in the process of pressing down pins through the arrangement of the springs in the buffer assembly.

Description

IC bending mechanism

Technical Field

The utility model relates to the technical field of bending, in particular to an IC bending mechanism.

Background

An IC is a generic term for semiconductor device products, and includes: in the field of automatic production, it is often necessary to bend the pins of an Integrated Circuit (IC) according to a specified shape.

The prior art has the following defects: in the existing bending work, the traditional method is to manually bend the IC by the aid of a jig, the production efficiency is low, the labor intensity is high, the IC bending effect is poor due to work fatigue, or the IC pin is bent at one time by a semi-automatic mechanism, but the problems of insufficient bending and the like exist.

Therefore, it is necessary to provide an IC bending mechanism.

SUMMERY OF THE UTILITY MODEL

In order to achieve the above purpose, the utility model provides the following technical scheme: an IC bending mechanism comprises a base, wherein a placing notch is formed in the base, a regulating plate is embedded in the placing notch, a plurality of positioning grooves are formed in the regulating plate, a plurality of positioning plates are arranged on the regulating plate, the positioning plates are movably embedded in the positioning grooves, the placing notch is divided into a plurality of accommodating cavities by the plurality of positioning plates, an IC piece is arranged in each accommodating cavity, a pressure-bearing strip block is fixedly connected to one side in the placing notch, a plurality of pins are arranged on one side of the IC piece, and one end of each pin extends to the outer side of the base;

the base top both sides all are fixed and are provided with the hydraulic pressure post, hydraulic pressure capital portion fixedly connected with fixed plate, fixed plate bottom one side fixedly connected with layering board, layering board one side is provided with buffer unit.

Preferably, regulating plate one side is connected with the regulating spindle through the bearing, regulating spindle one end runs through the base and extends to the base opposite side, regulating spindle and base threaded connection.

Preferably, a first camber angle is arranged on one side of the pressure-bearing strip block, a plurality of notches are formed in the pressure-bearing strip block, the pins are arranged inside the notches, and the pins are attached to the pressure-bearing strip block at the notches.

Preferably, the buffering component is arranged right above the IC piece and comprises a buffering plate, a plurality of springs are evenly arranged at the top of the buffering plate and are fixedly connected with a fixing plate, and the bottom of each spring is fixedly connected with the buffering plate.

Preferably, one side of the bottom of the buffer plate is fixedly connected with a buffer block, and the buffer block is arranged right above the pressure-bearing strip block.

Preferably, the batten plate is arranged on the outer side of the buffer component, and a second arc angle is arranged on one side of the batten plate.

Preferably, the pressure strip plate is arranged on the outer side of the base, and the pressure strip plate is arranged above the pressure strip block.

Preferably, the cross-sectional areas of a plurality of the accommodating cavities are equal, and the accommodating cavities are matched with the IC devices.

Preferably, the upper end face of the positioning plate, the upper end face of the IC part and the upper end face of the base are on the same horizontal line.

The utility model has the beneficial effects that:

1. the adjusting plate is arranged in the placing groove opening, the adjusting plate is provided with the plurality of positioning groove openings, the plurality of positioning plates are movably arranged on the adjusting plate through the positioning grooves, and therefore a plurality of containing cavities are formed;

2. according to the utility model, the adjusting shaft is arranged on one side of the adjusting plate, one end of the adjusting shaft penetrates through the base and extends to one side of the base, and the adjusting shaft is in threaded connection with the base, one end of the adjusting shaft is connected with the adjusting plate through the bearing, so that the adjusting plate can be pushed to transversely move in the placing groove opening by rotating the adjusting shaft, and further, the IC piece in the containing cavity can be transversely adjusted in position, namely, when the pin on the IC piece is short or long, the transverse displacement of the IC piece in the containing cavity is adjusted through the adjusting shaft, so that the bending work can be conveniently carried out on the proper length of the pin.

3. In the utility model, the bottom of the fixed plate is provided with a batten plate which is arranged outside the base, one side of the batten plate is provided with a buffer component, when the hydraulic column drives the fixing plate to move downwards, the fixing plate drives the pressure strip plate to move downwards, and the pins are jointed with the pressure strip blocks to form downward pressing and bending of the pins, in the process of moving the pressing strip downwards, the buffer assembly synchronously moves downwards, and the buffer plate and the buffer block in the buffer assembly respectively correspond to the IC piece and the pressure-bearing strip block, therefore, when the pressing strip plate presses and bends the pins downwards, the buffer plate and the buffer block are firstly contacted with the IC piece and the pressure-bearing strip block, through the arrangement of a plurality of springs in the buffer assembly, the IC component is prevented from generating large fluctuation vibration in the process of pressing down the pins, and then can avoid bending to the damage that the IC spare caused to a certain extent, improve the quality and the yield of IC spare and pin.

Drawings

FIG. 1 is a schematic diagram of an overall structure of an IC bending mechanism according to the present invention;

FIG. 2 is an exploded view of the IC bending mechanism provided by the present invention;

FIG. 3 is a schematic cross-sectional view of an IC bending mechanism according to the present invention;

FIG. 4 is a schematic structural view of a bearing bar block provided by the present invention;

in the figure: 1. a base; 2. placing the notch; 3. an adjusting plate; 4. positioning a groove; 5. positioning a plate; 6. an accommodating chamber; 7. an IC part; 8. a pressure-bearing bar block; 9. a pin; 10. a hydraulic column; 11. a fixing plate; 12. pressing a batten; 13. an adjustment shaft; 14. a first arc angle; 15. a notch; 16. a buffer plate; 17. a spring; 18. a buffer block; 19. a second arc angle.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.

Referring to the accompanying drawings 1-4, the IC bending mechanism provided by the utility model comprises a base 1, wherein a placing notch 2 is formed in the base 1, an adjusting plate 3 is embedded in the placing notch 2, a plurality of positioning grooves 4 are formed in the adjusting plate 3, a plurality of positioning plates 5 are arranged on the adjusting plate 3, the positioning plates 5 are movably embedded in the positioning grooves 4, the placing notch 2 is divided into a plurality of accommodating cavities 6 by the plurality of positioning plates 5, an IC piece 7 is arranged in each accommodating cavity 6, a pressure-bearing strip block 8 is fixedly connected to one side in the placing notch 2, a plurality of pins 9 are arranged on one side of each IC piece 7, and one end of each pin 9 extends to the outer side of the base 1;

both sides above the base 1 are fixedly provided with hydraulic columns 10, the top parts of the hydraulic columns 10 are fixedly connected with fixing plates 11, one side of the bottom of the fixed plate 11 is fixedly connected with a batten plate 12, one side of the batten plate 12 is provided with a buffer component, when the hydraulic column 10 drives the fixing plate 11 to move downwards, the fixing plate 11 drives the pressure strip plate 12 to move downwards, and the pins 9 are attached to the pressure strip blocks 8, so that the pins 9 are pressed and bent downwards, during the downward movement of the batten 12, the buffer assembly moves downward synchronously with the batten, and the buffer plate 16 and the buffer block 18 in the buffer assembly correspond to the IC device 7 and the pressure-bearing batten 8 respectively, so that when the bar presser 12 bends the pins 9 downward, the cushion plate 16 and the cushion block 18 are first brought into contact with the IC device 7 and the bar presser 8, by providing a plurality of springs 17 in the buffer assembly, a large fluctuation of the IC package 7 during the pressing down of the pins 9 is avoided.

Furthermore, one side of the adjusting plate 3 is connected with an adjusting shaft 13 through a bearing, one end of the adjusting shaft 13 penetrates through the base 1 and extends to the other side of the base 1, the adjusting shaft 13 is in threaded connection with the base 1, one end of the adjusting shaft 13 is connected with the adjusting plate 3 through a bearing by rotating the adjusting shaft 13 according to the length of the pin 9 on the IC piece 7, the body of the adjusting shaft 13 is in threaded connection with the base 1, and further the adjusting shaft 13 rotates, so that the adjusting plate 3 can be transversely displaced and adjusted inside the placing groove, a notch 15 corresponding to the pin 9 is formed in the pressure-bearing strip block 8 according to the position of the pin 9 on the IC piece 7, and then the position of the adjusting plate 3 is adjusted through the adjusting shaft 13;

further, a first camber angle 14 is arranged on one side of the pressure-bearing bar block 8, a plurality of notches 15 are formed in the pressure-bearing bar block 8, the pin 9 is arranged in the notch 15, the pin 9 is attached to the pressure-bearing bar block 8 at the notch 15, when the position of the adjusting plate 3 is adjusted, the pin 9 to be bent on the IC component 7 is placed at the notch 15 on the pressure-bearing bar block 8 until the pin 9 is attached to the pressure-bearing bar block 8 in the notch 15, when the pressure-bearing block is attached to the pin 9, the fixing plate 11 drives the pressure-bearing plate 12 to move downwards, so that the pin 9 is bent downwards, the pressure-bearing bar block 8 supports the pin 9, so that the pin 9 is bent downwards, the first camber angle 14 plays a role in guiding and buffering for the bending of the pin 9, and a large extrusion force between the stress point of the pin 9 and the pressure-bearing bar block 8 when the pin 9 is bent is avoided, causing the pin 9 to break;

further, the buffer assembly is arranged right above the IC element 7 and comprises a buffer plate 16, a plurality of springs 17 are arranged at the top of the buffer plate 16, the plurality of springs 17 are uniformly arranged, the top of each spring 17 is fixedly connected with the fixed plate 11, the bottom of each spring 17 is fixedly connected with the buffer plate 16, through the arrangement of the plurality of springs 17 in the buffer assembly, the IC element 7 is prevented from generating large fluctuation vibration in the process of pressing down the pins 9, namely when the fixed plate 11 moves downwards to perform bending work, the buffer plate 16 and the fixed plate 11 move synchronously, the buffer plate 16 and the IC element 7 are firstly contacted, the vibration generated by the IC element 7 during bending is transmitted to the springs 17 through the buffer plate 16, the springs 17 are used for unloading and buffering, and further damage to the IC element 7 caused by bending can be avoided to a certain extent;

furthermore, a buffer block 18 is fixedly connected to one side of the bottom of the buffer plate 16, the buffer block 18 is arranged right above the pressure-bearing strip block 8, the fixed plate 11 drives the buffer block 18 and the buffer plate 16 to move synchronously in the process that the fixed plate 11 presses down, the buffer block 18 is fixed to the bottom of the buffer plate 16, the buffer block 18 corresponds to the pressure-bearing strip block 8, and therefore when the pin 9 is pressed down and bent through the pressure strip plate 12, the pin 9 on the pressure-bearing strip block 8 is clamped and limited, and the pin 9 is prevented from being subjected to large elastic deformation in bending;

furthermore, the strip pressing plate 12 is arranged on the outer side of the buffer component, a second arc angle 19 is arranged on one side of the strip pressing plate 12, and the arrangement of the second arc angle 19 facilitates downward pressing and bending of the pins 9 to force the pins 9 to bend;

further, the batten plate 12 is arranged on the outer side of the base 1, and the batten plate 12 is arranged above the pressure bar block 8;

further, the cross-sectional areas of a plurality of the accommodating chambers 6 are equal, and the accommodating chambers 6 are matched with the IC parts 7;

further, the upper end surface of the positioning plate 5, the upper end surface of the IC component 7 and the upper end surface of the base 1 are on the same horizontal line.

The using process of the utility model is as follows: when the utility model is used, firstly, according to the size of the IC piece 7, a plurality of positioning plates 5 are further used, the positioning plates 5 are movably inserted into the positioning grooves 4 on the adjusting plate 3, so that a plurality of accommodating cavities 6 are formed by the positioning plates 5, the adjusting plate 3 and the base 1 in the accommodating groove opening 2 above the base 1 and are suitable for the IC piece 7 to use, then, according to the length of the pin 9 on the IC piece 7, an adjusting shaft 13 is rotated, one end of the adjusting shaft 13 is connected with the adjusting plate 3 through a bearing, the body of the adjusting shaft 13 is in threaded connection with the base 1, further, the adjusting shaft 13 is rotated, the adjusting plate 3 can be transversely displaced and adjusted in the accommodating groove, according to the position of the pin 9 on the IC piece 7, a notch 15 corresponding to the pin 9 is formed on the pressure-bearing strip block 8, then, the position of the adjusting plate 3 is adjusted through the adjusting shaft 13 until the position of the pin 9 on the IC piece 7 to be bent is placed at the notch 15 on the pressure-bearing strip block 8, the pin 9 is attached to the pressure-bearing strip block 8 in the notch 15, when the hydraulic column 10 drives the fixing plate 11 to move downwards, the fixing plate 11 drives the pressure strip plate 12 to move downwards, the pin 9 is attached to the pressure-bearing strip block 8, downward pressing and bending of the pin 9 are formed, the buffer assembly moves downwards synchronously with the pin 12 in the downward moving process, and the buffer plate 16 and the buffer block 18 in the buffer assembly correspond to the IC piece 7 and the pressure-bearing strip block 8 respectively, so that when the pin 9 is pressed and bent by the pressure strip plate 12, the buffer plate 16 and the buffer block 18 are firstly contacted with the IC piece 7 and the pressure-bearing strip block 8, and the large fluctuation vibration of the IC piece 7 in the downward pressing process of the pin 9 is avoided through the arrangement of the plurality of springs 17 in the buffer assembly.

The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made in accordance with the technical solution of the present invention are within the scope of the claims of the present invention.

Claims

1. The utility model provides a IC mechanism of bending, includes base (1), its characterized in that: the automatic positioning device is characterized in that a placing groove opening (2) is formed in the base (1), a regulating plate (3) is embedded in the placing groove opening (2), a plurality of positioning grooves (4) are formed in the regulating plate (3), a plurality of positioning plates (5) are arranged on the regulating plate (3), the positioning plates (5) are movably embedded in the positioning grooves (4), the placing groove opening (2) is divided into a plurality of accommodating cavities (6) by the plurality of positioning plates (5), an IC (integrated circuit) piece (7) is arranged in each accommodating cavity (6), a pressure-bearing strip block (8) is fixedly connected to one side in the placing groove opening (2), a plurality of pins (9) are arranged on one side of the IC piece (7), and one ends of the pins (9) extend to the outer side of the base (1);

the hydraulic support is characterized in that hydraulic columns (10) are fixedly arranged on two sides of the upper portion of the base (1), a fixing plate (11) is fixedly connected to the tops of the hydraulic columns (10), a pressing strip plate (12) is fixedly connected to one side of the bottom of the fixing plate (11), and a buffering assembly is arranged on one side of the pressing strip plate (12).

2. The IC bending mechanism according to claim 1, wherein: regulating plate (3) one side is connected with regulating spindle (13) through the bearing, regulating spindle (13) one end runs through base (1) and extends to base (1) opposite side, regulating spindle (13) and base (1) threaded connection.

3. The IC bending mechanism according to claim 1, wherein: pressure-bearing strip piece (8) one side is provided with first camber angle (14), a plurality of breachs (15) have been seted up on pressure-bearing strip piece (8), pin (9) set up inside breach (15), just pin (9) are in breach (15) department and pressure-bearing strip piece (8) laminating setting.

4. The IC bending mechanism according to claim 1, wherein: the buffer assembly is arranged right above the IC piece (7), the buffer assembly comprises a buffer plate (16), a plurality of springs (17) are arranged at the top of the buffer plate (16), the springs (17) are evenly arranged, the tops of the springs (17) are fixedly connected with a fixed plate (11), and the bottoms of the springs (17) are fixedly connected with the buffer plate (16).

5. The IC bending mechanism according to claim 4, wherein: one side of the bottom of the buffer plate (16) is fixedly connected with a buffer block (18), and the buffer block (18) is arranged right above the pressure-bearing strip block (8).

6. The IC bending mechanism according to claim 1, wherein: the batten plate (12) is arranged on the outer side of the buffer component, and a second arc angle (19) is arranged on one side of the batten plate (12).

7. The IC bending mechanism according to claim 1, wherein: the batten plate (12) is arranged on the outer side of the base (1), and the batten plate (12) is arranged above the pressure-bearing bar block (8).

8. The IC bending mechanism according to claim 1, wherein: the cross-sectional areas of the containing cavities (6) are equal, and the containing cavities (6) are matched with the IC parts (7).

9. The IC bending mechanism according to claim 1, wherein: the upper end face of the positioning plate (5), the upper end face of the IC piece (7) and the upper end face of the base (1) are positioned on the same horizontal line.