CN216015353U - Cold air circulating type cooling device for electronic chip - Google Patents

Abstract

The utility model relates to the technical field of chip cooling, in particular to a cold air circulating type cooling device for an electronic chip. The condenser comprises a shell and a plurality of condensing assemblies arranged at the bottom of the shell, wherein the shell comprises a transverse hollow pipeline, and each condensing assembly comprises a return pipe. According to the utility model, the flow speed difference is formed between the air in the transverse hollow pipeline and the air at the top of the transverse hollow pipeline, then the hot air emitted by the top electronic chip enters the transverse hollow pipeline through the longitudinal hollow pipeline to be converged with the cold air circulating in the transverse hollow pipeline, and then flows out through the filter screen, so that the temperature around the electronic chip is reduced, the circulation of the cold air is realized, the problem that the dust is blown to the surface of the electronic chip due to direct blowing to the electronic chip is solved, and the cooling effect is improved.

Description

Cold air circulating type cooling device for electronic chip

Technical Field

The utility model relates to the technical field of chip cooling, in particular to a cold air circulating type cooling device for an electronic chip.

Background

An electronic chip is formed by placing a large number of integrated circuits formed by microelectronic components (transistors, resistors, capacitors, and the like) on a plastic substrate to form a chip, which comprises a wafer chip and a packaged chip.

In the use, electronic chip can produce the heat, in order to guarantee its normal operating, often need cool down to it, and current technique is all through the flabellum direct blow to the chip, cool down to it, but makes the dust adhere to its surface very easily like this, and the gas that blows in moreover also can carry the dust.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a cooling device for an electronic chip with a circulating cold air to solve the problems in the background technology.

In order to achieve the above object, the present invention provides a cooling device for an electronic chip with a cold air circulation type, comprising a housing and a plurality of condensing assemblies arranged at the bottom of the housing, wherein the housing comprises a transverse hollow pipeline, the condensing assemblies comprise a return pipe, two ends of the return pipe are provided with connecting pipes, the connecting pipes are communicated with the transverse hollow pipeline, a condenser is arranged outside the return pipe, one side of the condenser is provided with a water pump, the housing further comprises a longitudinal hollow pipeline, the longitudinal hollow pipeline is arranged at the top of the transverse hollow pipeline, the transverse hollow pipeline and the longitudinal hollow pipeline are connected to form a T-shaped circulation cavity, the cavities inside the transverse hollow pipeline and the longitudinal hollow pipeline are in a communication state, one side of the transverse hollow pipeline is provided with a wind power assembly, the wind power assembly comprises a mounting plate and a fan, the mounting plate is fixedly connected with the transverse hollow pipeline, and the fan is arranged on the mounting plate, the other side of the transverse hollow pipeline is provided with a filter screen.

As a further improvement of the technical scheme, a filter plate is arranged at the top in the longitudinal hollow pipeline, and a plurality of through holes are formed in the filter plate.

As a further improvement of the technical scheme, a plurality of guide plates are arranged in the longitudinal hollow pipeline along the direction of wind power circulation in the transverse hollow pipeline, and the top end and the bottom end of each guide plate are narrower than the middle part.

As a further improvement of the technical scheme, the guide plate is of a hollow structure, and the hollow cavity is communicated with the cavities formed inside the transverse hollow pipeline and the longitudinal hollow pipeline.

As a further improvement of the technical scheme, one side of the transverse hollow pipeline, which is positioned on the filter screen, is provided with a flow guide pipe, and the flow guide pipe is bent upwards and is used for guiding the gas blown out of the transverse hollow pipeline.

As a further improvement of the technical scheme, a wind power assembly is arranged at the end part of the flow guide pipe.

As a further improvement of the technical scheme, a bent pipe is arranged between the return pipe and the connecting pipe.

Compared with the prior art, the utility model has the beneficial effects that:

in this circulating electron chip of cold wind cooling device for, form the velocity difference rather than the top air flow in the horizontal hollow pipeline, then make the steam that top electron chip gived off join rather than the inside cold air of circulating in the horizontal hollow pipeline through vertical hollow pipeline entering, flow through the filter screen again to reduce the temperature around the electron chip, realize the circulation of cold wind, solved and directly bloied to the electron chip and lead to the dust to be blown the problem on its surface, still improved the effect of cooling simultaneously.

Drawings

FIG. 1 is a schematic view of the overall structure of embodiment 1 of the present invention;

FIG. 2 is an exploded view of the entire structure of example 1 of the present invention;

FIG. 3 is a schematic view of a filter plate structure according to example 1 of the present invention;

fig. 4 is a schematic view of a first embodiment of a flow conduit structure according to the present invention;

fig. 5 is a schematic view of a second embodiment of the flow conduit structure of embodiment 1 of the present invention;

fig. 6 is a schematic view of a baffle structure of embodiment 2 of the present invention.

The various reference numbers in the figures mean:

100. a housing;

110. a transverse hollow conduit;

120. a longitudinal hollow conduit; 121. a filter plate; 1211. a through hole; 122. a baffle;

130. a wind power assembly; 131. mounting a plate; 132. a fan;

140. filtering with a screen;

150. a flow guide pipe;

200. a condensing assembly; 210. a return pipe; 220. a connecting pipe; 230. bending the tube; 240. a condenser; 250. and (4) a water pump.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Example 1

Referring to fig. 1-5, the present invention provides a cold air circulating cooling device for electronic chips, including a housing 100 and a plurality of condensing assemblies 200 disposed at the bottom of the housing 100, wherein the housing 100 includes a transverse hollow pipe 110, the condensing assemblies 200 include a return pipe 210, two ends of the return pipe 210 are provided with connecting pipes 220, the connecting pipes 220 are communicated with the transverse hollow pipe 110, the outside of the return pipe 210 is provided with a condenser 240, one side of the condenser 240 is provided with a water pump 250, the housing 100 further includes a longitudinal hollow pipe 120, and the cavities inside the transverse hollow pipe 110 and the longitudinal hollow pipe 120 are in a communication state, before use, the cavities of the transverse hollow pipe 110 and the longitudinal hollow pipe 120 are filled with water, the water is cooled circularly by the cooperation of the return pipe 210, the condenser 240 and the water pump 250, and at this time, the air passing through the transverse hollow pipe 110 is cooled to form cold air, the whole cooling device is arranged at the bottom of the electronic chip, so that the longitudinal hollow pipeline 120 is aligned with the electronic chip, the longitudinal hollow pipeline 120 is arranged at the top of the transverse hollow pipeline 110, the transverse hollow pipeline 110 is connected with the longitudinal hollow pipeline 120 to form a T-shaped circulation cavity, one side of the transverse hollow pipeline 110 is provided with a wind power assembly 130, the wind power assembly 130 comprises a mounting plate 131 and a fan 132, the mounting plate 131 is fixedly connected with the transverse hollow pipeline 110, the fan 132 is arranged on the mounting plate 131, when in use, the fan 132 drives the rotation of fan blades through a motor to generate airflow, so that the outside air enters the transverse hollow pipeline 110 to form cold air, at the moment, the cold air in the transverse hollow pipeline 110 transversely flows and flows out through a filter screen 140 at the other side of the transverse hollow pipeline 110, and dust around the electronic chip is absorbed through the wind power effect formed by the cold air flow, and the air is filtered by the filter screen 140, so that the flowing cold air does not carry dust, and further the air purification effect is achieved, a good working environment is provided for the electronic chip, in addition, the flowing speed of the cold air in the transverse hollow pipeline 110 is improved under the action of the fan 132, a flow speed difference is formed between the transverse hollow pipeline 110 and the air flowing at the top of the transverse hollow pipeline 110, then the hot air emitted by the top electronic chip enters the transverse hollow pipeline 110 through the longitudinal hollow pipeline 120 and is converged with the cold air circulating inside the transverse hollow pipeline 110, and then the hot air flows out through the filter screen 140, so that the temperature around the electronic chip is reduced, the circulation of cold air is realized, the problem that the dust is blown to the surface of the electronic chip due to direct blowing of the electronic chip is solved, and meanwhile, the cooling effect is also improved.

In this embodiment, the top of the longitudinal hollow pipe 120 is provided with a filter plate 121, and the filter plate 121 is provided with a plurality of through holes 1211, so as to filter particles entering the longitudinal hollow pipe 120 and having a radius larger than that of the through holes 1211, thereby preventing the longitudinal hollow pipe 120 from being blocked.

In addition, a flow guide pipe 150 is disposed on one side of the transverse hollow pipeline 110, which is located on the filter screen 140, and the flow guide pipe 150 is bent upward for guiding the air blown out from the transverse hollow pipeline 110, so that the flowing cold air is directly blown to the electronic chip, thereby improving the cooling efficiency.

In addition, the wind force assembly 130 is disposed at the end of the draft tube 150, and the wind force assembly 130 improves the flow guiding strength of the draft tube 150, accelerates the flow of the cool air, and further improves the cooling efficiency.

Further, a bent pipe 230 is provided between the return pipe 210 and the connection pipe 220. Thereby supporting the entire temperature reduction device by the portion of the bent tube 230 that protrudes.

Example 2

In order to make the hot air and the cold air fully converge, please refer to fig. 6, wherein a is a hot air inlet path, a plurality of flow deflectors 122 are arranged in the longitudinal hollow duct 120 along the direction of wind flow in the transverse hollow duct 110, and the top and bottom ends of the flow deflectors 122 are narrower than the middle part, so that the inlet hot air is uniformly distributed on the path of the fan blade blowing the cold air, thereby improving the convergence degree of the cold air and the hot air and ensuring repeated convergence.

Specifically, the baffle 122 is a hollow structure, and the hollow cavity is communicated with the cavities formed inside the transverse hollow pipe 110 and the longitudinal hollow pipe 120, so as to primarily cool the hot air through the baffle 122.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (7)

1. The utility model provides a circulating electron is heat sink for chip of cold wind, includes casing (100) and a plurality of condensing assembly (200) of setting in casing (100) bottom, casing (100) are including horizontal cavity pipeline (110), and condensing assembly (200) include back flow (210), and the both ends of back flow (210) are equipped with connecting pipe (220), and connecting pipe (220) and horizontal cavity pipeline (110) intercommunication, and the outside of back flow (210) is equipped with condenser (240), and one side of condenser (240) is equipped with water pump (250), its characterized in that: casing (100) still includes vertical hollow pipeline (120), vertical hollow pipeline (120) set up at horizontal hollow pipeline (110) top, and form "T" shape circulation cavity after horizontal hollow pipeline (110) and vertical hollow pipeline (120) are connected, and horizontal hollow pipeline (110) and the inside cavity of vertical hollow pipeline (120) are the feed through state, one side of horizontal hollow pipeline (110) is equipped with wind-force subassembly (130), wind-force subassembly (130) are including mounting panel (131) and fan (132), mounting panel (131) and horizontal hollow pipeline (110) fixed connection, fan (132) are installed on mounting panel (131), the opposite side of horizontal hollow pipeline (110) is equipped with filter screen (140).

2. The cooling device for an electronic chip of a cold air circulation type according to claim 1, wherein: the top in vertical cavity pipeline (120) is equipped with filter (121), has seted up a plurality of through-holes (1211) on filter (121).

3. The cooling device for an electronic chip of a cold air circulation type according to claim 1, wherein: be equipped with a plurality of guide plates (122) in vertical cavity pipeline (120) along the direction of wind-force circulation in horizontal cavity pipeline (110), the top and the bottom of guide plate (122) all are narrower than the mid portion.

4. The cooling device for an electronic chip of a cold air circulation type according to claim 3, wherein: the deflector (122) is of a hollow structure, and the hollow cavity is communicated with the cavities formed inside the transverse hollow pipe (110) and the longitudinal hollow pipe (120).

5. The cooling device for an electronic chip of a cold air circulation type according to claim 1, wherein: and a flow guide pipe (150) is arranged on one side, located on the filter screen (140), of the transverse hollow pipeline (110), and the flow guide pipe (150) is bent upwards and used for guiding gas blown out of the transverse hollow pipeline (110).

6. The cooling device for an electronic chip of a cold air circulation type according to claim 5, wherein: and a wind power assembly (130) is arranged at the end part of the draft tube (150).

7. The cooling device for an electronic chip of a cold air circulation type according to claim 1, wherein: a bent pipe (230) is arranged between the return pipe (210) and the connecting pipe (220).

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