CN215947396U - Temperature control device and vacuum assembly - Google Patents

Abstract

According to various embodiments, the temperature control device can have: a rack (102) having a fastening device (102b) for fastening a member to be temperature-regulated to one side (101a) of the rack (102); a heat transfer wall (104) facing the side (101a) for exchanging thermal energy with a component; a cavity (111) bordering the heat transfer wall (104); two fluidic connections (108a, 108b) which are fluidically coupled to one another by means of a cavity (111); a mechanical transducer (106) arranged to transmit force between the gantry (102) and the heat transfer wall (104) in response to a change in pressure experienced by the mechanical transducer (106).

Description

Temperature control device and vacuum assembly

Technical Field

Various embodiments relate to a temperature conditioning apparatus and a vacuum assembly.

Background

In general, the substrate may be treated, e.g., processed, coated, heated, etched, and/or structurally altered in a vacuum coating facility. One method for coating a substrate is so-called sputtering. One or more layers may be deposited on a substrate by sputtering, for example. For this purpose, the gases forming the plasma can be ionized by means of the cathode, wherein the material to be deposited (also referred to as coating material) of the cathode can be atomized by means of the plasma formed there. The atomized coating material is then directed toward a substrate upon which the coating material may be deposited and formed into a layer.

In order to dissipate the heat energy released there, the individual components of the vacuum coating installation can be water-cooled. If these components have to be maintained outside the vacuum coating installation, the water-cooled components are separated from the cooling circuit system according to the conventional need for a complicated assembly process without the cooling water entering the vacuum coating installation. This task is done, for example, manually, which makes a person a source of failure and time consuming. When coating a substrate, its surroundings can be parasitic, for example

Coating and thus conventionally using a cooled sacrificial plate (opererbhee) collecting excess coating material. If these consumable plates should be replaced, a cumbersome assembly process results.

SUMMERY OF THE UTILITY MODEL

It is clear from the different embodiments that: each fluid connection provided in the vacuum chamber, which is opened and reclosed during the assembly process, is a potential source of failure, even if it is very scientifically operated and meets the highest technical requirements. According to various embodiments, this source of failure is reduced to a minimum by means of the tempering device and the vacuum module, in which the assembly through which the fluid flows and the assembly to be cooled are separated from each other. This achieves that: the cooling circulation system remains closed when the components to be cooled are replaced.

The temperature control device and the vacuum assembly provided according to various embodiments thus simplify the maintenance complexity and shorten the maintenance time, for example in an efficient vacuum coating installation. This simplifies, for example, the automation of the assembly step (for example by means of a control device). This makes it possible to implement a fully automatic operation.

In an exemplary embodiment, the service part is inserted into a support system arranged in the vacuum chamber and is fastened thereto by means of a quick-action clamping system. The cooling body through which the fluid flows is integrated in the support system and is pressed against and/or released again from the service part by means of the expansion body.

Drawings

In the drawings:

fig. 1 to 8 each show different schematic views of a temperature control device according to different embodiments;

fig. 9 and 10 each show different schematic diagrams of a method for operating a temperature control device according to different embodiments;

fig. 11 shows a schematic side or cross-sectional view of a vacuum assembly according to various embodiments.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the utility model may be practiced. In this regard, directional terminology, such as "upper," "lower," "front," "rear," etc., is used with respect to the orientation of the figure(s) being described. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. Of course, other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It goes without saying that the features of the different exemplary embodiments described here can be combined with one another as long as they are not specifically described otherwise. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.

Within the scope of this specification, the terms "connected," "connected," and "coupled" are used to describe direct and indirect connections (e.g., ohmic and/or conductive, such as conductive), direct or indirect connections, and direct or indirect couplings. Wherever appropriate, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

The term "coupled" or "coupled" according to various embodiments may be understood as (e.g., mechanical, hydrostatic, thermal, and/or electrical), e.g., directly or indirectly connected and/or acting in an alternating manner. The elements can be coupled to one another, for example, along an alternating action chain, along which alternating actions can be exchanged, for example, for fluids (then also referred to as fluidically coupled). For example, two elements coupled to one another can interact with one another in an alternating manner, for example mechanically, hydrostatically, thermally and/or electrically. The interconnection of multiple vacuum components (e.g., valves, pumps, chambers, etc.) may include: these vacuum components are fluidically coupled to one another. According to various embodiments, "coupled" may be understood as mechanically (e.g., physically or physically) coupled, e.g., by direct physical contact. The coupling may be arranged to transmit mechanical alternating effects (e.g. force, torque, etc.).

The connection or coupling of the transfer fluid between the two elements can be realized: the two elements are capable of exchanging fluids with each other (that is to say, having or being constituted by liquid and/or gaseous materials). The fluid-carrying connection can optionally be sealed off from the outside so that fluid exchange takes place substantially without losses.

The different components (also referred to as components) absorb thermal power (also referred to as thermal power) during operation, for example, in that they convert electrical power into thermal power or in that they absorb thermal radiation. In this case, its temperature rises (also referred to as heating) until the heat losses naturally released into the surroundings are identical to the absorbed heat power (also referred to as input power). In this case, the temperature of the component is generated as a balance between the heat losses and the heat input.

In order to reduce the temperature, the heat dissipation power of the component can be increased, for example by remembering that so-called thermal contact walls extract thermal energy from the component (also called active cooling or just cooling for short). In the same way, thermal energy can likewise be supplied to the component (also referred to as active heating or just as heating). More generally, the components may be tempered (that is, cooled and/or heated). The thermal contact wall here explicitly provides a wall via which thermal energy is exchanged between the component to be cooled and a fluid as a heat transfer medium (also referred to as heating medium).

The thermal contact wall can be flowed through by a fluid or at least be bordered by a flowing fluid, which absorbs a portion of the extracted heat in a conductive manner and transports it away in a convective manner (that is to say by means of material transport), for example. The fluid may have a lower temperature than the thermal contact wall, thereby providing a continuous heat flow from the thermal contact wall to the fluid. Similarly, the thermal contact wall may have a lower temperature than the component to be temperature conditioned, thereby providing a continuous flow of heat from the component to the thermal contact wall. The fluid can absorb the thermal power of the component and be transported away in the flow direction. This endothermic process by means of the flowing fluid achieves: high power can be carried away in a small space.

In principle, heat transfer to or from the component to be tempered can take place. Tempering the component may include cooling and/or heating the component. In this case, the temperature control device is primarily concerned with the process of cooling the component by means of the temperature control device. The description of cooling can be applied analogously to a process in which a component is heated by means of a temperature control device, the heat transfer then taking place in the opposite direction.

According to various embodiments, the thermally conductive material may include or consist of a metal. However, as an alternative or in addition to metals, other thermally conductive materials can basically also be used. "thermally conductive" is understood herein to mean having a thermal conductivity of about 100 watts/meter and kelvin (W/m-K) or more, for example about 200W/m-K or more (also referred to as highly thermally conductive), for example about 300W/m-K or more, for example about 400W/m-K or more. Examples of the high thermal conductive metal include: copper, aluminum or alloys thereof.

According to various embodiments, the fluid (e.g., cooling fluid) may comprise or consist of a gas (e.g., cooling gas) and/or a liquid (e.g., cooling liquid). For example, the liquid may comprise or consist of water. For example, the liquid may comprise or consist of oil, such as synthetic and/or mineral oil. In general, it goes without saying that any suitable fluid medium (also called fluid) can be used as cooling fluid.

Fig. 1 shows a schematic side view or a cross-sectional view of a tempering device 100 according to various embodiments.

The temperature conditioning device 100 has a rack 102, a heat transfer wall 104 and a mechanical transducer 106 (also simply referred to as transducer).

The rack 102 has a fastening device 102b on a side 101a (also called assembly side or more intuitively called upper side) of the temperature regulating device 100, which is faced by the heat transfer wall 104. By means of the fastening device 102b, components (also referred to as components) to be temperature-controlled, for example maintenance components, can be fastened to the rack 102 on the assembly side 101 a.

The heat transfer wall 104 may be arranged to be movable 109 relative to the gantry 102, for example to be movable towards the mounting side 101a or away from the mounting side 109 (for example in the direction 105). For example, the heat transfer wall 104 as a whole may be slidably supported relative to the gantry 102, for example by means of a support device (e.g. having or consisting of linear bearings). Alternatively or additionally, the heat transfer wall 104 may be deformed such that at least a section of the heat transfer wall 104 is movable relative to the gantry 102.

The fastening device 102b can, for example, be provided to connect the component to the gantry in such a way that, when the component is connected to the gantry by means of the fastening device 102b, a movement of the component away from the gantry, for example in the direction of the mounting side 101a or away from the mounting side 101a, is prevented. The fastening device 102b may, for example, be arranged to establish a form-locking connection between the component and the gantry 102, for example when the fastening device 102b is operated.

To establish a form-locking connection, the fastening device 102b may, for example, have one or more shackles, one or more threads, one or more grooves, one or more hooks or the like. More generally, the fastening device 102b may have one or more form-locking profiles to establish the form-locking connection.

Examples of components of the fastening device include: locking elements such as quick-grip locking elements, linear locking elements and/or bayonet locking elements; a threaded member; a latch lug; a pulling member. Examples of establishing a connection with a fastening device have: relative movement between the rack and the component to be temperature-regulated; latching of the locking element; manual insertion of the pivot; screwing and/or hooking of fasteners. Examples of performing relative motion have: a slider moving in the U-shaped profile of the gantry 102; or an eccentric gripper that moves the slide.

The heat transfer wall 104 may, for example, have a thermally conductive material or consist of it at least on the installation side 101 a. For example, the thermally conductive material may be exposed on the mounting side 101 a.

Furthermore, the temperature control device 100 has a cavity 111 and two fluid connections 108a, 108b (e.g., cooling fluid connections) which are fluidically connected to one another by means of the cavity 111.

The or each fluid port 108a, 108b may, for example, have or be formed by a projecting tube end. The or each fluid connection 108a, 180b may, for example, have a seal or be formed by a seal, for example an annular seal. The or each fluid interface 108a, 108b may, for example, be threaded. The or each fluid interface 108a, 108b may, for example, have a snap-lock latch.

The cavity 111 may be bordered by the heat transfer wall 104, for example at least by its thermally conductive material. This achieves that: the fluid flowing through the cavity 111 is in physical contact with the heat transfer wall 104, e.g., with a thermally conductive material thereof.

The transducer 106 may generally be configured to transmit a force (also referred to as a compressive force) between the rack and the heat transfer wall 104 (and thus also referred to as a pressure-force-transducer 106) in response to a change in pressure experienced by the transducer 106. Transducer 106 may be generally configured to change in volume (also referred to as a volume change), shape, and/or expansion in response to a change in pressure. The transducer 106 may be coupled to the scaffold 102 and the heat transfer wall 104 such that a change in volume, shape, and/or expansion produces a compressive force that is transmitted between the scaffold 102 and the heat transfer wall 104.

The pressure variations may include, for example: the pressure experienced by the interior of the inflated body (also referred to as the internal pressure) changes and/or the pressure experienced by the exterior of the inflated body (also referred to as the external pressure) changes. For example, the pressure change may include: the difference between the external pressure and the internal pressure changes. For example, the pressure change may include: only the external pressure or only the internal pressure changes.

For example, the change in the compressive force may be a function of the change in pressure such that the compressive force increases as the pressure changes. The pressing force may be directed away from the gantry 102, for example, such that the heat transfer wall 104 or at least a section of the heat transfer wall moves away from the gantry 102 (also referred to as a pressing operation). If the pressure change is reversed, the pressing force can be reduced again until it is zero (also called release operation).

For example, the pressure-force transducer 106 may have an expansion body (also referred to as an expandable body, a pressure expansion body or simply a pressure body). The expansion body may be arranged to change its volume (also referred to as volume change) in response to a change in pressure. For example, the pressure-expandable body can have a hollow body. Examples of the inflation body include: a balloon; a lift cylinder; a hose; bellows (e.g., corrugated bellows); a closed cell foam material; a flexible container.

Less complex implementations include: the pressure-force transducer 106 has a flexible container which is assembled pressureless in the inflated state of the vacuum chamber 802 (see fig. 11) and therefore has atmospheric pressure inside. By evacuating the vacuum chamber 802, a pressure change can be caused, such that the pressure body expands and presses against the heat transfer wall 104. The pressure body can be made of rubber or silicone, for example.

The pressure variations may include, for example: the internal pressure enclosed by the expansion body changes relative to the external pressure acting on the expansion body from the outside. When the internal pressure rises relative to the external pressure, for example, the volume increases. And when the internal pressure is lowered relative to the external pressure, for example, the volume is decreased.

The pressing operation may include, for example: the external pressure of the mechanical transducer 106 is reduced, for example, by the volume of this transducer increasing (also referred to as volume increase or expansion). The release run may include, for example: the external pressure of the mechanical transducer 106 increases, for example, by decreasing the volume of the transducer (also referred to as volume increase or expansion).

The transducer 106, which is exemplary here, is primarily an expansion body. The description of the expansion body can be applied analogously to differently arranged transducers 106, which do not have to change their volume in order to generate the pressing force.

The gantry 102 can have, for example, a section 102a (also referred to as a gantry base 102 a). The transducer 106 may couple the gantry base 102a and the heat transfer wall 104 to one another. The compressive force may then be transmitted between the pedestal base 102a and the heat transfer wall 104.

This is an easily understood exemplary embodiment of a temperature control device 100, in which a converter 106 is arranged between the heat transfer wall 104 and the rack base 102 a. The description of this exemplary embodiment may be similarly applied to other embodiments of the temperature conditioning apparatus 10 in which the transducer 106, the heat transfer wall 104, and the pedestal base 102a are arranged differently.

Fig. 2 shows a schematic side view or a cross-sectional view of a temperature control device 100 according to various embodiments 200, in which the temperature control device 100 has a hollow body 204 (also referred to as temperature control body), that is to say a body with a cavity 111. The outer wall of the temperature-controlled body 204 can comprise or consist of the heat transfer wall 104.

The temperature control body 204 can be designed, for example, in the form of a fluid line having a flat outer surface. The temperature control processing body 204 may have or be constituted by a cooling body, for example.

The tempering treatment 204 and the converter 106 can thus be separate components. This allows for simpler processing and/or better tempering. For example, the materials of the temperature-controlled body 204 and the transducer 106 may be different from each other, so that the transducer 106 has a better pressure response, while the temperature-controlled body 204 has a better thermal conductivity.

For example, the temperature control body 204 can have or consist of a first material (also referred to as temperature control material) and the converter 106 can have or consist of a second material (also referred to as converter material).

For example, the temperature regulating material may have a greater thermal conductivity than the transducer material. For example, the temperature regulating material may have a larger elastic modulus than the transducer material. For example, the temperature regulating material may have a lower elastic limit than the transducer material.

For example, the temperature control material can have a thermally conductive material or consist thereof. For example, the transducer material may have or consist of an elastomer (e.g., neoprene) or spring steel. The elastomer may, for example, comprise or consist of rubber or silicone.

In this case, the entire tempering treatment body 204 is moved during the coupling and decoupling movements. To compensate for this movement, each fluid connection 108a, 108b of the temperature control device can have a flexible fluid line 208a, 208b which fluidically couples the fluid connection 108a, 108b to the cavity 111. This reduces the risk of breakage of the pipeline. The or each flexible fluid line 208a, 208b may, for example, have a hose or be formed from it. The or each flexible fluid line 208a, 208b may, for example, have an elastomer or be composed of it. The elastomer may, for example, comprise or consist of rubber or silicone.

Fig. 3 shows a schematic side view or cross-sectional view of a temperature-regulating device 100 according to various embodiments 300, in which the heat exchanger 106 has a cavity 111 and a heat transfer wall 104. In this case, the internal pressure may be the pressure of the fluid in the cavity 111. This configuration enables fewer components and thus reduces warehousing costs and the like.

For example, the transducer 106 may be composed of different materials. For example, the first section of the converter 106 can have a heat transfer wall 104 which has or consists of a temperature control material. For example, the second section of the transformer 106 may have a deformation wall 304 that has or is composed of the transformer material. While this configuration may be difficult to manufacture, it can be achieved: heat conduction through the heat transfer wall 104 is optimized.

The deformation wall 304 and the heat transfer wall 104 can likewise be of the same material or consist of the same, for example a converter material. Such an arrangement, although increasing the difficulty of heat conduction through the heat transfer wall 104, nevertheless achieves a higher reliability of the temperature conditioning device 100, notably due to less contact surface between the different materials. However, a lower heat transfer is also acceptable if the component to be tempered has to be cooled much less intensively and/or if the contact surface between the component to be tempered and the heat transfer wall 104 is sufficiently large.

As an alternative, each fluid connection 108a, 108b of the temperature control device 100 can have a flexible fluid line 208a, 208b which fluidically couples the fluid connection 108a, 108b to the cavity 111. This reduces the risk of breakage of the pipeline. The or each flexible fluid line 208a, 208b may, for example, have a hose or be formed from it. The or each flexible fluid line 208a, 208b may, for example, have an elastomer or be composed of it.

Fig. 4 shows a schematic side view or cross-sectional view of a temperature-regulating device 100 according to various embodiments 400, in which the cavity 111 is bounded by the stand 102. This configuration obviously enables cooling of the gantry 102 by means of a fluid.

For example, the gantry 102 may be trough-shaped, such that the gantry 102 has a recess 402 in which the cavity 111 is provided. For example, the heat transfer wall 104 may be disposed in the recessed portion 402. If the heat transfer wall 104 should be movable as a whole relative to the rack 102, the temperature conditioning device 100 can also have a seal 404 (e.g. a sealing ring) which seals the gap between the heat transfer wall 104 and the rack 102.

The following relates to more specific exemplary embodiments of the temperature control device 100, in which the temperature control device 100 has the converter 106 and, separately therefrom, the temperature control treatment body 204. The description of this exemplary embodiment can be applied analogously to the previously described embodiments of the tempering device 100, in which the converter 106 and the tempering treatment body 204 have, for example, common components.

Fig. 5 shows a schematic side view or a cross-sectional view of a temperature control device 100 according to various embodiments 500, in which the temperature control device 100 is coupled to a component 502 to be temperature-controlled. The component 502 to be tempered can have, for example, a sheet, for example, a reverse sputtering plane, as will be explained in more detail below. The temperature control device 100 can have a temperature control body 204 which is penetrated by the cavity 111.

The transducer 106 may have an expansion body 106e and, optionally, a pressure transmitter (Druckvermitler) 106 u. The pressure transmitter 106u can have a first contact surface that is in contact with the first temperature control body 204 and a second contact surface that is in contact with the expansion body 106e, wherein the first contact surface and the second contact surface can optionally be different from each other. This achieves that: the shape and size of the temperature-control treatment body 204 do not necessarily have to be adapted to the shape and size of the expansion body 106e, and thus greater design flexibility is achieved. For example, the first contact surface may be smaller than the second contact surface.

Expansion body 106e may, for example, have folds 606f, which improve the expansion capacity of the expansion body. This achieves, for example: the transducer material constituting the expansion body 106e does not necessarily have to have a high elastic limit forcibly.

The component to be tempered may alternatively have a projection 506 (e.g. a cross member (Balken)), the function of which will be explained in more detail later. The projection 506 may extend into the channel shaped skid 102.

If the pressure (e.g., internal pressure and/or external pressure) to which the expansion body 106e is subjected is changed, the pressure causes the pressure transmitter 106u to slide in the direction of the fitting side 101 a. This movement (also referred to as stroke) is transmitted to the temperature-controlled treatment body 204 by means of the pressure transmitter 106 u.

The expansion body 106e can provide a distance s which is greater than the distance that the temperature control treatment body 204 can move until it contacts the component 502 to be temperature controlled₁A distance s to the component 502 to be tempered, which distance is freely movable before its movement is prevented by means of the fastening device₂The sum of (a) and (b).

The pressure transmitter 106u has, for example, a plate 510 (e.g., a sheet) and a plurality of punches 512 (e.g., angle profiles) as separate assemblies. In order to transmit the pressing force to the temperature control body 204, the sheet 510 of the pressure transmitter 106u can extend over the entire contour of the expansion body 106 e. Punches 512 are attached to the plate members 510 of the pressure transmitter 106u, respectively. This arrangement allows for flexible behavior of the pressure transmitter 106 u.

The heat transfer wall 104 may optionally comprise or be constructed of copper strands. The copper strand improves the thermal contact and/or enables a height compensation.

Fig. 6 shows a perspective exploded view of a temperature conditioning device 100 according to a different embodiment 600. The rack 102 (also referred to simply as a carrier body) can be provided to receive the pressure transmitter and the temperature control treatment body 204 (for example together with the heat transfer wall 104), for example in its recess 402.

As shown, expansion body 106e may have or consist of a longitudinally extending hose. Inflation body 106e may optionally have a fluid interface. This achieves that: fluid is delivered to the inflation body 106e so that the internal pressure of the inflation body 106e can be varied. This achieves that: the pressing force transmitted to the heat transfer wall 104 can be adjusted better.

The fastening device 102b, for example, has one or more pivots 606 mounted on the gantry 102 that extend through the deep, concave portion of the trough-shaped gantry 102. By means of the or each pivot 606, the component 502 to be tempered can be connected in a form-fitting manner as explained in more detail below.

Fig. 7 shows a perspective cross-sectional view of a temperature regulating device 100 according to various embodiments 700. If a pressure transmitter 106u is used, it may have corresponding recesses into which the pivot 606 can already or will be arranged or through which the pivot 606 extends. This achieves that: the pressure transmitters 106u may be provided as bodies joined together, which homogenizes the spatial distribution of the pressing force.

Fig. 8 shows a perspective view of a temperature conditioning device 100 according to a different embodiment 800.

The inflation body 106e may optionally have a fluid port 822 (also referred to as an internal pressure port) that extends through a sidewall of the gantry 102. Fluid may be delivered to inflation body 106e via internal pressure interface 822, thereby enabling the internal pressure of inflation body 106e to be varied. This achieves that: the pressing force transmitted to the heat transfer wall 104 can be adjusted, for example by means of a control device. Clearly, the pressure differential and thus the compressive force can be fine-tuned by means of the internal pressure interface 822. This also simplifies the automated implementation of the tempering device.

Alternatively or additionally, the leak test can be performed by means of the internal pressure connection 822. The tightness test achieves improved reliability.

The gantry 102 is optionally slidably supported. To this end, the gantry 102 may have a carrying carriage 844 that is slidably supported on rollers (not shown) of the support apparatus. The gantry 102 can be slid by means of an operating device (not shown). The operating device may be operated manually or may have an electric drive device (for example with a motor, a gear or a reciprocating piston) for driving the sliding movement. The operating device can, for example, have a lever system or be formed by it. The gantry 102 may be provided as a slider, for example. This improves the slidable support of the gantry 102.

The channel shape of the gantry 102 achieves: the expansion of the expansion shoe 106 due to pressure variations is directed in the direction of the fitting side 101a and thus to the heat transfer wall 104. If the expansion body 106 is a separate hollow body, for example, a leak test can be carried out. The leak tightness test may include: the inflation body 106e is supplied with a detection gas (e.g., helium gas) for leak detection.

Fig. 9 shows different schematic views of a method for operating a temperature control device 100 according to different embodiments, namely a side view 901 and a cross-sectional view 903.

The method may include: in 900a, the temperature control device 100 and the component 502 to be temperature-controlled are combined. Combining together may include, for example: the component 502 to be temperature-conditioned is arranged on the assembly side 101a and/or is in physical contact with the rack 102. Combining together may include, for example: the projection 506 of the member 502 is placed into the recess of the stage 102. The projection 506 of the member 502 may, for example, have a void 506a (also referred to as a fastening void 506a) in which the pivot 606 of the fastening device 102b is received.

The fastening void 506a may extend into the projection 506 along a curved or angled path, for example. This achieves that: the projection 506 of the member 502 has a hook-like form-locking contour 506 h.

The unlocked position of the combination is shown clearly here. The beam 506 is fully inserted and located, for example, on the pivot 606, on an edge of the gantry 102, and on an optional support.

The method may include: in 900b the member 502 is fastened to the gantry 102, for example by operating a fastening device. The operation of the fastening device may include, for example: the pivot 606 is displaced relative to the projection 506 of the member 502 such that the pivot 606 comes behind the hook-like form-locking contour 506h (also referred to as fastening 900 b). The member 502 is accordingly released (specifically: unlocked) from the gantry 102 in the reverse order.

As a result of the member 502 being secured to the gantry 102, movement of the member 502 away from the gantry 102 (that is, they are secured to one another) is prevented. It goes without saying that such a form-locking mechanism can also be provided in other ways. Of course, the member 502 may be threaded with, suspended in, or otherwise fastened to the stand in place of or in addition to the pivot 606.

The translation of the pivot 606 relative to the projection 506 may include, for example: the gantry 102 (if the gantry is slidably supported) is made to slide, for example, along a direction 103 along which a deep part of the gantry 102 and/or the gantry 102 itself extends longitudinally.

The transfer of the gantry 102 may include, for example: the gantry 102 is moved in translation by means of a lever system. When the gantry 102 is translated, the heat transfer wall 104 (e.g., copper strands) can be spatially separated from the member 502 (e.g., the anti-sputtering plane) to achieve low resistance movement of the gantry 102.

Fig. 10 shows different schematic views, namely a side view 1001 and a cross-sectional view 1003, of a method for operating a temperature control device 100 according to different embodiments.

The method may include: in 1000a, the heat transfer wall 104 and the member 502 are combined together, for example, by bringing them into physical contact with each other. The method may optionally include pressing the heat transfer wall 104 against the member 502 in 1000 b.

The method may include: the pressure experienced by transducer 106 (also referred to as pressure change) is varied in 1000a and 1000 b. The pressure variations may include: the pressure inside the expansion body 106e (also referred to as internal pressure) increases. Alternatively or additionally, the pressure variation may comprise: the pressure outside the transducer 106 (also referred to as the external pressure) decreases.

For example, the temperature adjusting device 100 may be provided in a vacuum chamber 802 (see fig. 11) that is evacuated to reduce the external pressure. The internal pressure may then be atmospheric pressure, for example, at the beginning and decreases with expansion. The pressure change realizes that: the external pressure is less than the internal pressure. The expansion body 106e lifts the pressure transmitter 106u and/or the temperature control body 204 up, for example, until the heat transfer wall 104 comes into physical contact with and/or presses against the component 502.

1000b may cause the member 502 to move away from the gantry 102, for example, until the form-locking profile 506h is in physical contact with and/or pressed against a pivot. Movement of the member 502 away from the gantry 102 is significantly prevented by the form-locking profile 506 h.

According to various embodiments, the surface of the temperature-regulating treatment body 204 (e.g., the heat transfer wall 104 thereof) in contact with the member 502 (also referred to as a heat transfer contact surface) may be smaller than the surface of the expansion body 106e generating the force (also referred to as a pressing surface). This achieves that: the pressure with which the heat transfer contact surface is pressed against the component is as large as possible. For example, in the evacuated state of vacuum chamber 802, the pressure differential applied across expansion body 106e may be greater than about 1 kilopascal (e.g., greater than about 10 kilopascals) and/or up to about 100 kilopascals (kPa).

The pressing force is then derived from the product of this pressure difference and the pressing area. In a similar manner, the pressure on the heat transfer contact surface (also referred to as the pressing force) is derived from the quotient of the pressing force and the value of the heat transfer contact area. If the expansion 23 of the pressure surface is, for example, approximately 85mm (millimeters) and the expansion 24 of the heat transfer contact surface parallel thereto is, for example, approximately 40mm, then a pressing force of 223kPa is generated at a pressure difference of 100 kPa. Other pressure conversion ratios (pressing force/pressure difference) may be achieved in a similar manner, or other types of pressure transmitters may be used to achieve a pressure conversion ratio greater than 1.

The larger the pressure conversion ratio, the more diverse the possible range of applications. For example, the pressure conversion ratio achieves: there may be atmospheric pressure or less inside the expansion body 106e (e.g., a pressure hose), and thus a pump for generating a large internal pressure is not necessarily required. It goes without saying, however, that a pump can also be coupled to the expansion body 106e already or to be coupled (for example, to its internal pressure connection) in order to increase the internal pressure and/or to control the pressing force.

More generally, actuators may be manipulated to effect, control, and/or regulate pressure changes. For example, a first pump may be coupled as an actuator with the internal pressure interface 822. Alternatively or additionally, a second pump may be coupled as an actuator with the interior of the vacuum chamber 802.

According to various embodiments, by means of an expansion body 106e (e.g. a pressure hose) there is provided: a uniform pressing force is achieved over the entire longitudinal extension.

In the exemplary embodiment, the contact load can be introduced into the lower region of the temperature-control body 204 by means of a flexible expansion body 106e, for example a hose made of rubber or silicone. Inflation body 106e may be assembled in a non-pressurized state and form a discrete volume in the process environment. By evacuating the vacuum chamber 802, a pressure difference is created which presses the temperature-regulated processing body 204 against the member 502 (e.g., a locked shielding sheet).

Fig. 11 shows a schematic side or cross-sectional view of a vacuum assembly 1100 according to various embodiments.

The vacuum assembly 1100 may have a vacuum chamber 802 and a temperature conditioning device 100. The temperature-regulating device 100 can be arranged at least partially, for example at least its heat transfer wall 104, its rack and/or its changer 106, in the vacuum chamber 802.

The vacuum assembly 1100 may have a heat source 1102 (e.g., a coating apparatus) that releases thermal energy, such as thermal radiation, during operation. The mounting side 101a may face the heat source 1102. The coating apparatus is referred to herein as an exemplary heat source 1102. The coating device can be configured to provide a coating material for coating a substrate and can release thermal power when the coating material is provided. It goes without saying that the description of the coating device 1102 is similarly applicable to any other heat source, which does not necessarily have to provide a coating material.

The coating device 1102 may, for example, be arranged for physical vapour deposition, for example by means of plasma. The coating material can be atomized, also referred to as sputtered, for example by means of plasma. The plasma can release thermal radiation.

The assembly side 101a may face the coating apparatus 1102. For example, the coating device 1102 can be configured to spray the coating material in the direction of the temperature control device 100 and to spray a thermal power (also referred to as thermal power) with the coating material.

If a substrate (not shown) should be transported in vacuum chamber 802, vacuum assembly 1100 can also have a transport apparatus with a plurality of transport rollers 812. The transport device can be configured to transport the substrate to be coated along the transport path 1111, for example, past the coating device 1102 and/or in the vacuum chamber 802. The transport path 1111 may extend, for example, between the temperature conditioning device 100 and the coating device 1102.

The transport device can have, for example, a plurality of transport rollers 812, which are provided for transporting the plate-shaped substrate. For example, the plate-shaped substrate can be transported in a manner lying on transport rollers 812 and/or inserted into a substrate holder (not shown). The plate-shaped substrate can have, for example, a wafer or other semiconductor substrate.

Alternatively, the transport apparatus may have an unwinding roller and a winding roller that are provided to wind the band-shaped substrate along the transport path 1111 from the unwinding roller to the winding roller. Alternatively, the transport apparatus may have a plurality of guide rollers arranged to divert the transport path 1111 one or more times so that the substrate is transported past the coating apparatus 1102. The web-shaped substrate (web-shaped substrate) may comprise or consist of a film, a nonwoven, a tape and/or a fabric.

The temperature conditioned member 502 may be physically and/or thermally coupled to the heat transfer wall 104. The component 502 to be temperature-controlled can, for example, have or consist of a shielding device 502, which provides a so-called anti-sputtering plane. Reference is made primarily herein to a shielding device as an exemplary member 502. It goes without saying that the description of the shielding device can analogously be applied to any other component 502 that is to be tempered but does not necessarily need to provide a shielding function.

The shielding device may for example already be or be arranged between the transport path 1111 and the temperature conditioning device 100.

The shielding 502 may have or be constituted by one or more plates and/or one or more sheets. Furthermore, the shielding device may have an additional fastening device (also referred to as a mating fastening device) which corresponds to (may be coupled with) the fastening device of the temperature-regulating device 100. The mating fastening device may have, for example, a beam 506 with a plurality of hooks or other hook-like form-locking contours 506 h.

The temperature-regulating device 100 and/or the shielding device 502 can be arranged between two transport rollers 812 of the transport device. This achieves that: the spaces between the transport rollers 812 are protected from the coating material as it accumulates on the shielding 502.

Alternatively or additionally, the shielding device 502 may have one or more through-holes through which a transport roller 812 of the transport device extends (not shown). This achieves that: the transport equipment is protected from the coating material as it accumulates on the shielding 502.

The temperature control device 100 thus achieves cooling of the shielding device 502 by drawing thermal energy out of the shielding device 502 by means of the fluid of the temperature control device 100. If the shielding device 502 is heavily contaminated with coating material, it can be disconnected from the tempering device 100, so that the shielding device 502 as a whole can be replaced.

The vacuum assembly 1100 can, for example, have a fluid supply 1804 disposed at least partially outside the vacuum chamber 802. The fluid supply 1804 may be coupled with both fluid interfaces 108a, 108 b. The fluid supply 1804 may, for example, have a pump for driving a fluid through the cavity 111 via the two fluid connections 108a, 108 b. The fluid supply 1804, for example, can have a fluid reservoir in which the fluid is disposed. The fluid supply 1804 may, for example, have a compensation container in which the fluid is disposed.

According to various embodiments, the vacuum assembly 1100 may have a pump system 804 (with at least one vacuum pump, e.g., a high vacuum pump such as a turbomolecular pump). The vacuum chamber 802 may be coupled to a pump system 804 (e.g., a gas delivery ground) for providing a negative pressure or vacuum and is securely positioned such that it withstands the force of air pressure in the evacuated state. The vacuum chamber 802 may already be provided or provided in the closed state, for example, air-tight, dust-tight and/or vacuum-tight. The pump system 804 enables: a portion of the gas is pumped out of the process chamber interior and thus reduces the external pressure on the transducer 106.

According to various embodiments, the vacuum assembly 1100 may have a gas delivery system 1716 (e.g., having one or more gas passages into the vacuum chamber). Vacuum chamber 801 can be supplied with a process gas by means of gas supply system 1716 to establish a process gas pressure in vacuum chamber 802. The external pressure acting on the transducer 106 can be generated by the equilibrium of the process gas, which is delivered by means of the gas delivery system 1716 and pumped out by means of the pumping system 804.

According to various embodiments, the vacuum chamber 802 may be configured to provide a pressure therein (e.g., external pressure) in a range of about 10mbar to about 1mbar (i.e., low vacuum) or less, such as about 1mbar to about 10mbar^-3A pressure in the range of mbar (in other words: moderate vacuum) or less, for example about 10^-3mbar to about 10^-7A pressure in the range of mbar (in other words: high vacuum) or less, e.g. a pressure less than high vacuum, e.g. less than about 10^-7mbar。

The following description refers to different examples of the preceding description and what are shown in the drawings.

Example 1 is a temperature conditioning apparatus having: a stage having a fastening device for fastening a member to be temperature-regulated on one side of the stage; a (e.g. thermally conductive) heat transfer wall facing the side for exchanging thermal energy with the component; a cavity bordering the heat transfer wall; two fluidic connections (e.g., cooling fluidic connections) that are fluidically coupled to one another by means of a cavity; a mechanical transducer arranged to transmit a force between the platform and the heat transfer wall in response to a change in pressure experienced by the mechanical transducer (e.g. by a change in volume of the transducer), for example to push the heat transfer wall away from the platform and/or to squeeze it out of the platform.

Example 1 is a temperature conditioning apparatus having: a trough-shaped rack having a fastening device for fastening a component to be temperature-conditioned on an open side of the rack; a (e.g. thermally conductive) heat transfer wall facing the side for exchanging thermal energy with the component, the heat transfer wall being provided in the rack; a cavity bordering the heat transfer wall; two fluidic interfaces (e.g., cooling fluidic interfaces) that are fluidically coupled to one another by the cavity; a mechanical transducer arranged to extrude the heat transfer wall from the bed in response to pressure changes experienced by the mechanical transducer (e.g. by volume changes of the transducer).

Example 2 is a temperature control device according to example 1 or 1, wherein the heat transfer wall has or consists of a thermally conductive material, for example a metal.

Example 3 is the temperature adjustment apparatus according to one of examples 1 to 2, wherein the rack has a section opposite to the side, wherein the mechanical transducer is disposed between the section and the heat transfer wall, and/or wherein the mechanical transducer couples the section and the heat transfer wall to each other.

Example 4 is the temperature adjustment apparatus according to one of examples 1 to 3, wherein the inverter is configured to force the heat transfer wall out of the rack by means of power.

Example 5 is the temperature regulating apparatus according to one of examples 1 to 4, wherein the mechanical transducer is arranged to transmit a force between the rack and the heat transfer wall or to press the heat transfer wall in response to a change in fluid pressure experienced by the mechanical transducer.

Example 6 is the temperature adjusting apparatus according to one of examples 1 to 5, wherein the rack is trough-shaped (e.g., has a recessed portion in which the heat transfer wall is provided). For example, the transducer can be arranged to force the heat transfer wall out of the channel-shaped rack.

Example 7 is a temperature conditioning apparatus according to one of examples 1 to 6, further having two flexible fluid lines (e.g., hoses), wherein each fluid line fluidly couples a cooling fluid interface of the two fluid interfaces with the cavity.

Example 8 is a temperature control device according to one of examples 1 to 7, which further has a hollow body which has a cavity and is separated, for example, from the interior of the mechanical converter.

Example 9 is the temperature adjustment device according to one of examples 1 to 8, wherein the heat transfer wall is movably supported relative to the rack such that a force transmitted by means of the mechanical transducer urges the heat transfer wall to move relative to the rack, e.g. towards the side or away from the side.

Example 10 is the temperature control device according to one of examples 1 to 9, wherein the mechanical transducer has a hollow body, which provides, for example, an expansion body.

Example 11 is a temperature adjustment apparatus according to one of examples 1 to 10, further having: an internal pressure connection which is fluidically coupled to the interior of the mechanical converter (for example, the hollow body thereof).

Example 12 is the temperature adjustment apparatus according to one of examples 1 to 11, further having: an actuator is provided, which is configured to effect a pressure change experienced by the mechanical transducer in response to actuation of the actuator (e.g., having one or more pumps), for example, by delivering fluid to and/or withdrawing fluid from the interior of the mechanical transducer.

Example 13 is the temperature adjustment apparatus according to example 12, further having: a control device arranged to operate the actuator, e.g. based on a characteristic value representing said force.

Example 14 is the temperature control device according to one of examples 1 to 13, wherein the mechanical transducer has or consists of an elastomer.

Example 15 is the temperature adjustment device according to one of examples 1 to 14, wherein the mechanical transducer (e.g. its hollow body) is arranged such that the pressure change causes a volume change of the mechanical transducer.

Example 16 is the temperature adjustment device according to one of examples 1 to 15, wherein the fastening device and/or the stand are movably supported (e.g. by means of a supporting device) (e.g. opposite the heat transfer wall), e.g. between the first state and the second state.

Example 17 is the temperature adjustment device according to one of examples 1 to 16, wherein the fastening device is provided as: from the first state into the second state, which establishes a coupling of the member with the gantry; and from the second state into the first state, which decouples (also referred to as uncoupling) the member from the carriage.

Example 18 is the temperature adjustment device according to one of examples 1 to 17, further having an operating device which is arranged to bring the fastening device from the first state into the second state and from the second state into the first state, for example, by displacing the stand, for example, by means of the operating device.

Example 19 is a temperature regulating device according to one of examples 1 to 18, wherein the fastening device has a slide and/or form-locking profiles for fastening the component.

Example 20 is a vacuum assembly having: a vacuum chamber; a temperature control device according to one of examples 1 to 19, a heat transfer wall of which is disposed in the vacuum chamber; an optional coating device, which is provided to spray coating material onto the heat transfer wall or at least into the coating area that the heat transfer wall faces; optionally a transport device configured to transport the substrate past the heat transfer wall and/or past the coating device and/or in the coating area; optionally a fluid supply member arranged to supply fluid to and/or withdraw fluid from the cavity of the temperature conditioning apparatus (e.g. to provide a fluid circulation system).

Example 21 is a vacuum assembly according to example 20, further having a processing assembly (e.g., with a coating apparatus and/or a transport apparatus) for processing a substrate in a vacuum chamber, the processing assembly having, for example, a component to be temperature conditioned; wherein the processing assembly is, for example, configured to deliver thermal energy to the component while processing the substrate; the components to be tempered are, for example, components of a coating installation; the components to be tempered are, for example, components of the transport system.

Example 22 is a vacuum assembly according to example 21, having a shielding device having a member to be temperature-regulated (e.g., a shielding wall) and disposed at the side in the vacuum chamber, wherein the shielding device is disposed, for example, between the coating device and the heat transfer wall; wherein the shielding device is for example arranged between the coating area and the heat transfer wall; wherein the shielding device is for example in physical contact with the heat transfer wall.

Example 23 is the vacuum assembly of example 22, wherein the shielding apparatus has an additional stage that holds a component to be temperature conditioned; and/or the component to be temperature-controlled has or consists of a shielding wall; and/or the shielding device or at least the component to be temperature-conditioned can be moved relative to the temperature-conditioning device, for example when the heat transfer wall is arranged in a stationary manner in the vacuum chamber.

Claims (10)

1. Tempering device (100), characterized in that: the temperature adjustment device has:

a stand (102) having a fastening device (102b) for fastening a component to be temperature-controlled to one side (101a) of the stand (102);

a heat transfer wall (104) facing the side (101a) for exchanging thermal energy with the component;

-a cavity (111) bordering the heat transfer wall (104);

two fluid connections (108a, 108b) which are fluidically connected to one another by means of the cavity (111);

-a mechanical transducer (106) arranged to transmit force between the gantry (102) and the heat transfer wall (104) in response to a change in pressure experienced by the mechanical transducer (106).

2. Tempering device (100) according to claim 1, characterized in that: the heat transfer wall (104) is made of a thermally conductive material.

3. Tempering device (100) according to claim 1 or 2, characterized in that: the gantry (102) has a section (102a) which is opposite the side (101a), wherein the mechanical converter (106) couples the section (102a) and the heat transfer wall (104) to one another.

4. Tempering device (100) according to claim 1 or 2, characterized in that: the gantry (102) is trough-shaped, wherein the transducer (106) is arranged to press the heat transfer wall (104) out of the trough-shaped gantry (102) by means of the force.

5. Tempering device (100) according to claim 1 or 2, characterized in that: the temperature control device further comprises: two flexible fluid lines, wherein each fluid line fluidically couples a cooling fluid connection of the two fluid connections (108a, 108b) to the cavity (111).

6. Tempering device (100) according to claim 1 or 2, characterized in that: the heat transfer wall (104) is mounted so as to be movable relative to the gantry (102) such that a movement of the heat transfer wall (104) relative to the gantry (102) is achieved by means of the force transmitted by the mechanical transducer (106).

7. Tempering device (100) according to claim 1 or 2, characterized in that: the temperature control device also has an internal pressure connection which is fluidically coupled to an interior of the mechanical converter (106).

8. Tempering device (100) according to claim 1 or 2, characterized in that: the mechanical transducer (106) has or consists of an elastomer.

9. Tempering device (100) according to claim 1 or 2, characterized in that: the mechanical transducer (106) is arranged such that the pressure change causes a volume change of the mechanical transducer (106).

10. A vacuum assembly (1100), characterized by: the vacuum assembly has:

a vacuum chamber (802), and

-a temperature conditioning device (100) according to claim 1 or 2, the heat transfer wall (104) of which is arranged in the vacuum chamber (802).

Images