CN215911413U

CN215911413U - Installation chip with heat dissipation uses

Info

Publication number: CN215911413U
Application number: CN202122102185.5U
Authority: CN
Inventors: 孙纯霞
Original assignee: Shenzhen Jinggong Electronic Technology Co ltd
Current assignee: Shenzhen Jinggong Electronic Technology Co ltd
Priority date: 2021-09-01
Filing date: 2021-09-01
Publication date: 2022-02-25
Anticipated expiration: 2031-09-01

Abstract

The utility model belongs to the field of chips, and particularly relates to an installation chip with heat dissipation function, which comprises a chip main body, wherein a shell is arranged on the outer side of the chip main body, and installation mechanisms are arranged on two sides of the shell; through heat dissipation mechanism, the hinge, the protection casing, the sealing strip, the louvre, the structural design of dust screen and radiator fan, realized carrying out an effective radiating function to this installation chip, the unable heat dissipation of long-time work can lead to installing the chip because of the high condition that causes short-circuit fault of temperature has been solved, consequently, the work efficiency of installation chip has been influenced, still can influence the condition of installation chip life simultaneously, thereby the problem of the practicality of this installation chip has been reduced, when the during operation chip produces the temperature, at first the heat can be through the condition that the louvre oozed, when the great unable louvre that looses through the louvre of inside heat, it blows off the cooling to launch radiator fan to inside heat, thereby provide better guarantee for the heat dissipation of this chip.

Description

Installation chip with heat dissipation uses

Technical Field

The utility model relates to the field of chips, in particular to an installation chip with a heat dissipation function.

Background

An integrated circuit in which a circuit is formed on a surface of a semiconductor chip is also called a thin film integrated circuit, and another thick film integrated circuit is a miniaturized circuit formed by integrating a separate semiconductor device and a passive component into a substrate or a wiring board.

Integrated circuits, microcircuits/chips, are one way in electronics to miniaturize circuits and are often fabricated on the surface of a semiconductor wafer.

However, most of the currently used mounting chips have poor heat dissipation effects, and the situation of short circuit fault caused by overhigh temperature can be caused due to the fact that the mounting chips cannot dissipate heat after long-time working, so that the working efficiency of the mounting chips is influenced, and meanwhile, the situation of the service life of the mounting chips can be influenced, so that the practicability of the mounting chips is reduced, and therefore, the mounting chips with the heat dissipation function are provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

In order to make up for the defects of the prior art and solve the problem that most of heat dissipation effects are poor, the utility model provides a mounting chip with a heat dissipation function.

The technical scheme adopted by the utility model for solving the technical problems is as follows: the mounting chip with the heat dissipation function comprises a chip main body, wherein a shell is arranged on the outer side of the chip main body, mounting mechanisms are arranged on two sides of the shell and comprise mounting pieces, fixing bolts are fixed on one sides of the mounting pieces, mounting holes are formed in the inner sides of the mounting pieces, and rubber pads are arranged on the surfaces below the mounting pieces.

One side of shell is provided with heat dissipation mechanism, heat dissipation mechanism includes the hinge, the opposite side fixedly connected with protection casing of hinge, the inboard of protection casing is provided with the sealing strip, the louvre has been seted up to the inboard of protection casing, the dust screen is installed to the inboard of protection casing, radiator fan is installed to the inboard of protection casing.

Preferably, the clamping groove is formed in the inner side of the shell, the clamping groove and the shell are of a penetrating structure, and the size of the clamping groove is matched with that of the chip main body.

Preferably, the mounting piece passes through fixing bolt and shell threaded connection, and the mounting hole is equidistant distribution on the mounting piece, and the rubber pad closely laminates with the mounting piece.

Preferably, the shield is movably connected with the housing by hinges, and the hinges are arranged with a vertical central axis symmetry axis of the shield.

Preferably, the sealing strip is tightly attached to the protective cover, and the size of the protective cover is matched with that of the sealing strip.

Preferably, the heat dissipation holes and the protective cover are in a penetrating structure, and the heat dissipation holes are distributed on the protective cover at equal intervals.

Preferably, the dust screen is movably connected with the protective cover through a fixing piece, and the size of the dust screen is matched with that of the protective cover.

Preferably, the heat dissipation fan is movably connected with the protective cover through a screw, and the size of the heat dissipation fan is smaller than that of the protective cover.

The utility model has the advantages that:

1. according to the utility model, through the structural design of the heat dissipation mechanism, the hinge, the protective cover, the sealing strip, the heat dissipation holes, the dustproof net and the heat dissipation fan, an effective heat dissipation function for the installed chip is realized, and the problem that the short circuit fault of the installed chip caused by overhigh temperature can be caused due to the fact that the heat cannot be dissipated after long-time work is solved, so that the working efficiency of the installed chip is influenced, and the service life of the installed chip can be influenced, thereby reducing the practicability of the installed chip;

2. according to the chip mounting structure, through the structural design of the mounting sheet, the fixing bolt, the mounting hole and the rubber pad, the chip is provided with a function of bad fixed mounting, the problem that the working efficiency of the chip is affected due to looseness during working caused by the fact that the chip cannot be effectively mounted is solved, meanwhile, the problem that the mounting surface is damaged due to long-term fixing is solved, when the chip mounting structure is mounted, the fixing piece is screwed into the inner side of the mounting hole through the mounting sheet in a penetrating mode to carry out mounting and fixing, meanwhile, the rubber pad is arranged on one side of the mounting sheet, the mounting sheet and the mounting surface are effectively isolated and protected, and therefore better guarantee is provided for mounting and fixing of the chip.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic structural diagram of an embodiment in a front view;

FIG. 2 is a schematic structural view of a mounting mechanism according to an embodiment;

FIG. 3 is a schematic structural diagram of a heat dissipation mechanism according to an embodiment;

FIG. 4 is a schematic structural view of a chucking groove of the embodiment;

FIG. 5 is an enlarged view of the structure at A in FIG. 1 according to the present invention.

In the figure: 1. a chip body; 2. a housing; 3. a clamping groove; 4. an installation mechanism; 401. mounting a sheet; 402. fixing the bolt; 403. mounting holes; 404. a rubber pad; 5. a heat dissipation mechanism; 501. a hinge; 502. a protective cover; 503. a sealing strip; 504. heat dissipation holes; 505. a dust screen; 506. a heat dissipation fan.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, a mounting chip with heat dissipation function includes a chip main body 1, a housing 2 is disposed outside the chip main body 1, mounting mechanisms 4 are disposed on both sides of the housing 2, each mounting mechanism 4 includes a mounting plate 401, a fixing bolt 402 is fixed on one side of the mounting plate 401, a mounting hole 403 is formed on the inner side of the mounting plate 401, and a rubber pad 404 is disposed on the lower surface of the mounting plate 401.

One side of shell 2 is provided with heat dissipation mechanism 5, and heat dissipation mechanism 5 includes hinge 501, and hinge 501's opposite side fixedly connected with protection casing 502, protection casing 502's inboard are provided with sealing strip 503, and louvre 504 has been seted up to protection casing 502's inboard, and dust screen 505 is installed to protection casing 502's inboard, and radiator fan 506 is installed to protection casing 502's inboard.

In this embodiment, chucking groove 3 has been seted up to the inboard of shell 2, and chucking groove 3 and shell 2 are for running through the structure, and the size in chucking groove 3 is identical with chip main part 1's size, through the setting in chucking groove 3, can carry out a chucking anti-drop's effect for chip main part 1.

In this embodiment, mounting plate 401 passes through fixing bolt 402 and shell 2 threaded connection, and mounting hole 403 is equidistant distribution on mounting plate 401, and rubber pad 404 and mounting plate 401 closely laminate, and the during operation runs through the mounting plate 401 with the mounting and screws into the mounting hole 403 inboard and install fixedly, and one side of mounting plate 401 is provided with rubber pad 404 simultaneously, and the effectual purpose of carrying out an isolation protection with mounting plate 401 and installation face.

In this embodiment, the protective cover 502 is movably connected with the housing 2 through the hinge 501, and the hinge 501 is arranged along a vertical central axis symmetry axis of the protective cover 502, so that the protective cover 502 can be rotationally closed through the hinge 501 during operation, thereby effectively performing an isolation protection function on the chip main body 1 on the inner side of the housing 2.

In this embodiment, the sealing strip 503 is tightly attached to the shield cap 502, and the size of the shield cap 502 is matched with the size of the sealing strip 503, so that the sealing strip 503 can be arranged to provide a sealing purpose for the inner side of the shield cap 502 after the shield cap 502 is rotated to be closed.

In this embodiment, the heat dissipation holes 504 and the shield 502 are through structures, and the heat dissipation holes 504 are distributed on the shield 502 at equal intervals, so that the heat generated during operation can be dissipated through the heat dissipation holes 504.

In this embodiment, the dust screen 505 is movably connected to the shield 502 by a fixing piece, and the size of the dust screen 505 is identical to that of the shield 502, so that the dust can be prevented from penetrating into the shield 502 through the heat dissipation holes 504 to damage the chip body 1 due to the dust.

In this embodiment, the heat dissipation fan 506 is movably connected to the shield 502 via a screw, and the size of the heat dissipation fan 506 is smaller than that of the shield 502, so that the heat dissipation fan 506 can blow away the internal heat quickly for cooling.

The electrical components presented in the document are all electrically connected with an external master controller and 220V mains, and the master controller can be a conventional known device controlled by a computer or the like.

The during operation, at first connect external power source, secondly place suitable position with shell 2, run through the mounting piece 401 and twist into mounting hole 403 inboard and install fixedly, fixed back, with protection casing 502 through the rotatory opening of hinge 501, put into the inboard installation chucking in chucking groove 3 with chip main part 1 after opening, after the chucking, close protection casing 502 through the rotation of hinge 501, when the during operation chip produces the temperature, at first the heat can be through the condition that louvre 504 oozes, when the great untimely through louvre 504 effluvium of inside heat, it blows off the cooling to send out radiator fan 506 to inside heat, wherein, radiator fan 506's model is MH902R, this is exactly this installation chip theory of operation that has the heat dissipation and uses.

In summary, the mounting chip with heat dissipation function has the advantages that through the structural design of the heat dissipation mechanism 5, the hinge 501, the protective cover 502, the sealing strip 503, the heat dissipation hole 504, the dust screen 505 and the heat dissipation fan 506, the function of effective heat dissipation is achieved for the mounting chip, the problem that short-circuit fault caused by overhigh temperature of the mounting chip due to heat dissipation failure in long-time working is solved, the working efficiency of the mounting chip is affected, meanwhile, the service life of the mounting chip is affected, the practicability of the mounting chip is reduced, when the chip generates temperature in working, firstly, heat can seep out through the heat dissipation hole 504, when the internal heat is large and cannot be dissipated through the heat dissipation hole 504 in time, the heat dissipation fan 506 is started to blow away and cool the internal heat, so that better guarantee is provided for heat dissipation of the chip, and the mounting chip can be mounted through the mounting pieces 401, Fixing bolt 402, the structural design of mounting hole 403 and rubber pad 404, realized providing the function with a bad fixed mounting to this chip, the condition of the unable during operation not hard up work efficiency who influences the chip of effectual installation leads to this chip has been solved, the impaired problem of installation face has been solved because of long-term fixed the leading to of having solved simultaneously, during the installation, run through the mounting piece 401 with the mounting and twist into mounting hole 403 inboard and install fixedly, one side of mounting piece 401 is provided with rubber pad 404 simultaneously, the effectual purpose of carrying out an isolation protection with mounting piece 401 and installation face, thereby the installation of this chip is fixed and is provided better guarantee.

In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed.

Claims

1. A kind of installation chip with heat dissipating uses, characterized by that: the chip comprises a chip main body (1), wherein a shell (2) is arranged on the outer side of the chip main body (1), mounting mechanisms (4) are arranged on two sides of the shell (2), each mounting mechanism (4) comprises a mounting sheet (401), a fixing bolt (402) is fixed on one side of each mounting sheet (401), a mounting hole (403) is formed in the inner side of each mounting sheet (401), and a rubber pad (404) is arranged on the surface below each mounting sheet (401);

one side of shell (2) is provided with heat dissipation mechanism (5), heat dissipation mechanism (5) are including hinge (501), opposite side fixedly connected with protection casing (502) of hinge (501), the inboard of protection casing (502) is provided with sealing strip (503), louvre (504) have been seted up to the inboard of protection casing (502), dust screen (505) are installed to the inboard of protection casing (502), radiator fan (506) are installed to the inboard of protection casing (502).

2. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the clamping groove (3) is formed in the inner side of the shell (2), the clamping groove (3) and the shell (2) are of a penetrating structure, and the size of the clamping groove (3) is identical to that of the chip main body (1).

3. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the mounting piece (401) is in threaded connection with the shell (2) through the fixing bolt (402), the mounting holes (403) are distributed on the mounting piece (401) at equal intervals, and the rubber pad (404) is tightly attached to the mounting piece (401).

4. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the protective cover (502) is movably connected with the shell (2) through a hinge (501), and the hinge (501) is arranged on a vertical middle axis symmetry axis of the protective cover (502).

5. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the sealing strip (503) is tightly attached to the protective cover (502), and the size of the protective cover (502) is matched with that of the sealing strip (503).

6. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the heat dissipation holes (504) and the protective cover (502) are in a penetrating structure, and the heat dissipation holes (504) are distributed on the protective cover (502) at equal intervals.

7. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the dustproof net (505) is movably connected with the protective cover (502) through a fixing piece, and the size of the dustproof net (505) is matched with that of the protective cover (502).

8. A mounted chip with heat dissipating use as claimed in claim 1, wherein: the heat radiation fan (506) is movably connected with the protective cover (502) through a screw rod, and the size of the heat radiation fan (506) is smaller than that of the protective cover (502).