CN215879292U

CN215879292U - Quick heat radiation structure of wire drawing die set

Info

Publication number: CN215879292U
Application number: CN202122269011.8U
Authority: CN
Inventors: 朱宏治
Original assignee: Jiangsu Honghu Precision Mould Co ltd
Current assignee: Jiangsu Honghu Precision Mould Co ltd
Priority date: 2021-09-18
Filing date: 2021-09-18
Publication date: 2022-02-22
Anticipated expiration: 2031-09-18

Abstract

The utility model discloses a quick heat dissipation structure of a wire drawing die device, which relates to the technical field of wire drawing dies and comprises a liquid collection box, wherein a filtering mechanism is arranged at the inner side of the liquid collection box, the filtering mechanism consists of a support plate, a micro-filtration membrane and a non-woven fabric filter cotton layer, a U-shaped plate is fixedly connected at one side of the liquid collection box, a guide plate is fixedly connected with the inner wall of the U-shaped plate, a guide groove is arranged on the upper surface of the guide plate, a water pump is arranged at the other side of the liquid collection box, a first connecting pipe is arranged at the output end of the water pump, a conical atomizing nozzle is arranged at one side of the first connecting pipe and corresponds to the guide groove, the cold surface of a semiconductor refrigerating sheet is attached to the outer wall of the liquid collection box, the temperature reduction treatment in the liquid collection box can be effectively carried out, the wire drawing die is sprayed and water is recycled, so that the quick heat dissipation treatment can be carried out on the wire drawing die, not only the radiating effect is good, has improved radiating efficiency moreover greatly.

Description

Quick heat radiation structure of wire drawing die set

Technical Field

The utility model relates to the technical field of wire drawing dies, in particular to a quick heat dissipation structure of a wire drawing die device.

Background

The wire drawing die is characterized in that a metal wire passes through a die to be gradually reduced to reach the size required by people, the special die is the wire drawing die, a die core of the wire drawing die is made of natural diamonds, artificial diamonds (the artificial diamonds comprise GE, PCD, synthetic materials and the like), a copper wire drawing die belongs to a flexible wire drawing die, a hard wire drawing die is made of tungsten wires and the like, the angle of a compression area of the tungsten wire drawing die is smaller and is generally 12-14 degrees, and the wire drawing die comprises a diamond wire drawing die, a hard alloy wire drawing die, a plastic wire drawing die and the like.

The heat dissipation structure of the existing wire drawing die device mainly has the following defects: the heat radiation structure of the existing wire drawing die is mainly characterized in that a heat radiation fin is arranged on the wire drawing die, and heat exchange is carried out between the heat radiation fin and the outside to achieve the heat radiation effect, so that the heat radiation efficiency is low, the heat radiation effect is not good, and the quick heat radiation of the die cannot be achieved.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the technical scheme provides a quick heat dissipation structure of a wire drawing die device, and the problem is solved.

In order to achieve the above purposes, the technical scheme adopted by the utility model is as follows:

the utility model provides a quick heat radiation structure of wire drawing die set, includes collection liquid box, collection liquid box installs filter mechanism in the inboard, filter mechanism comprises support plate, micro-filtration membrane and non-woven fabrics filter cotton layer, collection liquid box one side fixedly connected with U template, U template inner wall fixedly connected with guide plate, the guiding gutter has been seted up to the guide plate upper surface, the water pump is installed to collection liquid box opposite side, first connecting pipe is installed to the output of water pump, first connecting pipe one side is equipped with the toper atomizer, and the toper atomizer is corresponding with the guiding gutter, it all installs the semiconductor refrigeration piece to collect liquid box both sides outer wall.

As a preferable technical scheme of the utility model, the bottom of the liquid collection box is provided with a bottom plate, the edges of the upper surface of the bottom plate are symmetrically provided with screws, and the screws penetrate through the bottom plate.

As a preferred technical scheme of the utility model, the support plate is arranged in a hollow structure, the joint of the outer wall of the support plate and the inner wall of the liquid collection box is provided with the sealant, the microfiltration membrane is compounded on the upper surface of the support plate, the non-woven fabric filter cotton layer is compounded and connected with the microfiltration membrane, and the thickness of the non-woven fabric filter cotton layer is set to be 0.2-0.5 mm.

According to the preferable technical scheme, rib plates are symmetrically welded on the outer wall of the U-shaped plate, reinforcing ribs are welded at the joint of the lower surface of the guide plate and the inner wall of the U-shaped plate, and a plurality of reinforcing ribs are arranged at equal intervals.

As a preferable technical scheme of the utility model, the input end of the water pump is in conduction connection with the inner cavity of the liquid collecting box, the top end of the first connecting pipe is provided with a two-way joint, the tail end of the two-way joint is provided with a second connecting pipe, and the second connecting pipe is in conduction connection with the conical atomizing nozzle.

As a preferred technical scheme of the utility model, the semiconductor refrigeration pieces are provided with a plurality of semiconductor refrigeration pieces, the semiconductor refrigeration pieces are arranged at equal intervals, one side of each semiconductor refrigeration piece is provided with a fan set, and the air outlet end of each fan set is provided with a dustproof mesh enclosure.

Compared with the prior art, the utility model has the beneficial effects that: the guide plate is arranged under the wire drawing die, a proper amount of water is injected into the inner side of the liquid collecting box, the water pump is powered on, the water inside the liquid collecting box is pumped out through the work of the water pump and then is transmitted into the conical atomizing nozzle through the first connecting pipe, under the action of pressure, the water is sprayed onto the surface of the wire drawing die in a mist form to achieve the effect of cooling, the excessive water mist is collected in the guide groove formed in the upper surface of the guide plate under the effect of the blocking of the U-shaped plate and then flows into the liquid collecting box under the effect of gravity, impurities in the water are filtered through the filtering mechanism in the liquid collecting box, meanwhile, the cold surface of the semiconductor refrigerating sheet is attached to the outer wall of the liquid collecting box, the temperature reduction treatment in the liquid collecting box can be effectively carried out, the circulation is carried out, the rapid heat dissipation treatment can be carried out on the wire drawing die, and the heat dissipation effect is good, and the heat dissipation efficiency is greatly improved.

Drawings

FIG. 1 is a schematic perspective view of the present invention;

FIG. 2 is a schematic side view of the present invention;

FIG. 3 is a schematic view of the filter mechanism of the present invention;

FIG. 4 is a schematic diagram of the structure of the new version of the U of the present invention;

fig. 5 is a schematic view of a baffle configuration of the present invention.

The reference numbers in the figures are:

1. a base plate; 101. a screw;

2. a liquid collecting box;

3. a filtering mechanism; 301. a carrier plate; 302. a microfiltration membrane; 303. a non-woven fabric filter cotton layer;

4. a U-shaped plate; 401. a rib plate; 402. a baffle; 403. a diversion trench; 404. reinforcing ribs;

5. a water pump; 501. a first connecting pipe; 502. a two-way joint; 503. a second connecting pipe; 504. a conical atomizer;

6. a semiconductor refrigeration sheet;

7. a fan set.

Detailed Description

The following description is presented to disclose the utility model so as to enable any person skilled in the art to practice the utility model. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.

Referring to fig. 1-5, a quick heat dissipation structure of a wire drawing die device comprises a liquid collection box 2, a filtering mechanism 3 is installed on the inner side of the liquid collection box 2, the filtering mechanism 3 is composed of a support plate 301, a microfiltration membrane 302 and a non-woven fabric filter cotton layer 303, a U-shaped plate 4 is fixedly connected to one side of the liquid collection box 2, a guide plate 402 is fixedly connected to the inner wall of the U-shaped plate 4, a guide groove 403 is formed in the upper surface of the guide plate 402, a water pump 5 is installed on the other side of the liquid collection box 2, a first connecting pipe 501 is installed at the output end of the water pump 5, a conical atomizing nozzle 504 is arranged on one side of the first connecting pipe 501 and corresponds to the guide groove 403, and semiconductor refrigerating sheets 6 are installed on the outer walls of the two sides of the liquid collection box 2; the guide plate 402 is arranged right below the wire drawing die, a proper amount of water is injected into the inner side of the liquid collecting box 2, then the water pump 5 is powered on, the water in the inner side of the liquid collecting box 2 is pumped out through the work of the water pump 5 and is then transmitted into the conical atomizing spray nozzle 504 through the first connecting pipe 501, under the action of pressure, the water can be sprayed onto the surface of the wire drawing die in a fog form to achieve the effect of cooling, the excessive water fog can be collected in the guide groove 403 arranged on the upper surface of the guide plate 402 under the effect of the blocking of the U-shaped plate 4 and then flows into the liquid collecting box 2 under the action of gravity, impurities in the water are filtered through the filtering mechanism 3 in the liquid collecting box 2, meanwhile, the cold surface of the semiconductor refrigerating sheet 6 is attached to the outer wall of the liquid collecting box 2, the cooling treatment in the liquid collecting box 6 can be effectively carried out, and the circulation is carried out, so that the rapid heat dissipation treatment can be carried out on the wire drawing die, not only the radiating effect is good, has improved radiating efficiency moreover greatly.

Specifically, bottom plate 1 is installed to 2 bottoms of collection liquid box, screw 101 is installed to 1 upper surface edge symmetries of bottom plate, and screw 101 runs through bottom plate 1, and through a plurality of screws of 1 edge installation at the bottom plate, it is convenient fixed to the device installation.

Specifically, the carrier plate 301 is a hollow structure, a sealant is arranged at the joint of the outer wall of the carrier plate 301 and the inner wall of the liquid collecting box 2, the microfiltration membrane 302 is compounded on the upper surface of the carrier plate 301, the non-woven fabric filter cotton layer 303 is compounded with the microfiltration membrane 302 and connected with the same, the thickness of the non-woven fabric filter cotton layer 303 is set to be 0.3-0.5mm, the non-woven fabric filter cotton layer 303 is arranged on the uppermost layer of the filter mechanism 3, the non-woven fabric filter cotton fiber tissue is loose, the high porosity increases the impurity receiving capacity, the composite interception mode is adopted, solid and soft particles can be effectively eliminated, larger particle impurities are intercepted on the fiber surface, and fine particles are caught in the deep layer of the filter material, so that the filter plate has higher filtering efficiency, can filter some large particle impurities in water, and then filter the fine particle impurities in water through the microfiltration membrane 302, thereby effectively filtering the impurities in water, so that the water can be recycled.

Specifically, ribbed slab 401 has been welded to the symmetry of U type plate 4 outer wall, the welding of guide plate 402 lower surface and U type plate 4 inner wall junction has strengthening rib 404, and strengthening rib 404 equidistance is equipped with a plurality ofly, can improve the bonding strength of U type plate 4 and bottom plate 1 junction through setting up ribbed slab 401, can strengthen the intensity and rigidity and the torsional resistance of guide plate 402 through setting up strengthening rib 404, can overcome the askew distortion of goods that guide plate 402 caused because of the stress inequality that the wall thickness difference brought to increase the intensity of guide plate 402 and U type plate 4 inner wall faying face.

Specifically, the input of

water pump

5 and 2 inner chambers of collection liquid box conducting connection, two-way joint 502 is installed on first connecting pipe 501 top, second connecting pipe 503 is installed to two-way joint 502 end, and second connecting pipe 503 and toper atomizer 504 conducting connection, can take out the water after the cooling in the collection liquid box 2, sprays to mould department to reach radiating effect.

Specifically, semiconductor refrigeration piece 6 is equipped with a plurality ofly, and is a plurality of equidistance is arranged between semiconductor refrigeration piece 6, fan group 7 is installed to 6 one side of semiconductor refrigeration piece, and the air-out end of fan group 7 installs dustproof screen panel, and the air current that blows off through fan group 7 passes through the hot face of semiconductor refrigeration piece 6 to accelerate the flow of the near air of 6 hot faces of semiconductor refrigeration piece, prevent the heat gathering.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the utility model, but that various changes and modifications may be made without departing from the spirit and scope of the utility model, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a quick heat radiation structure of wire drawing die set which characterized in that: including collecting liquid box (2), filtering mechanism (3) are installed to collection liquid box (2) inboard, filtering mechanism (3) comprise support plate (301), micro-filtration membrane (302) and non-woven fabrics filter cotton layer (303), collect liquid box (2) one side fixedly connected with U template (4), U template (4) inner wall fixedly connected with guide plate (402), guiding gutter (403) have been seted up to guide plate (402) upper surface, collect liquid box (2) opposite side and install water pump (5), first connecting pipe (501) are installed to the output of water pump (5), first connecting pipe (501) one side is equipped with toper atomizer (504), and toper atomizer (504) and guiding gutter (403) are corresponding, semiconductor refrigeration piece (6) are all installed to collection liquid box (2) both sides outer wall.

2. The rapid heat dissipation structure of a wire drawing die device according to claim 1, characterized in that: bottom plate (1) is installed to collection liquid box (2) bottom, screw (101) are installed to bottom plate (1) upper surface edge symmetry, and screw (101) run through bottom plate (1).

3. The rapid heat dissipation structure of a wire drawing die device according to claim 1, characterized in that: support plate (301) are hollow out construction setting, support plate (301) outer wall is equipped with sealed glue with album liquid box (2) inner wall linking department, microfiltration membrane (302) are compound at support plate (301) upper surface, cotton layer of non-woven fabrics (303) and microfiltration membrane (302) are compound continuous, cotton layer of non-woven fabrics (303) thickness setting is at 0.3-0.5 mm.

4. The rapid heat dissipation structure of a wire drawing die device according to claim 1, characterized in that: ribbed slab (401) have been welded to U template (4) outer wall symmetry, guide plate (402) lower surface and the welding of U template (4) inner wall linking department have strengthening rib (404), and strengthening rib (404) equidistance is equipped with a plurality ofly.

5. The rapid heat dissipation structure of a wire drawing die device according to claim 1, characterized in that: the input end of water pump (5) and album liquid box (2) inner chamber turn-on connection, two-way joint (502) are installed on first connecting pipe (501) top, second connecting pipe (503) are installed to two-way joint (502) end, and second connecting pipe (503) and toper atomizer (504) turn-on connection.

6. The rapid heat dissipation structure of a wire drawing die device according to claim 1, characterized in that: semiconductor refrigeration piece (6) are equipped with a plurality ofly, and are a plurality of equidistance is arranged between semiconductor refrigeration piece (6), fan group (7) are installed to semiconductor refrigeration piece (6) one side, and the air-out end of fan group (7) installs dustproof screen panel.