CN215874913U - Treatment head assembly, treatment head device and fat-reducing treatment instrument - Google Patents

Abstract

The utility model provides a treatment head component, a treatment head device and a fat-reducing treatment instrument, wherein the treatment head component comprises: the refrigeration unit, the heat exchange unit and the circuit board; the refrigeration unit is provided with a heat dissipation surface; the heat exchange unit is respectively connected with the radiating surface and the circuit board and used for respectively radiating heat of the radiating surface and the circuit board. So set up, utilize the heat exchange unit to provide and dispel the heat to the circuit board, saved the radiating spare part of circuit board exclusive, and then saved the quantity of spare part, it has simplified the process of heat transfer, has improved the radiating effect.

Description

Treatment head assembly, treatment head device and fat-reducing treatment instrument

Technical Field

The utility model relates to the technical field of medical instruments, in particular to a treatment head assembly, a treatment head device and a fat-reducing treatment instrument.

Background

With the improvement of living standard of people, the problem of obesity has become a big problem which puzzles people in modern society. Obesity can cause health problems such as hypertension, heart disease, diabetes, etc. The traditional fat reducing method mainly adopts operations, such as abdominal plasty, liposuction and the like, which have wounds to reduce fat. Despite the obvious effects of these procedures, the fear of surgery has largely limited the implementation of traditional fat reduction procedures, and more people prefer to choose non-invasive fat reduction. The non-invasive fat-reducing method mainly comprises the following steps: low energy laser therapy (LLLT), radiofrequency therapy (RF), high energy focused ultrasound therapy (HIFU), cryolipolysis. The method for freezing and dissolving fat utilizes that adipose tissues are more sensitive to low temperature, fat cells generate crystal necrosis at the temperature lower than 10 ℃, inflammatory reaction is induced, and finally the fat cells are phagocytized and metabolized by macrophages so as to achieve the effect of reducing fat. Clinical data show that after the frozen fat dissolving method is adopted for treatment, the treatment effect is good, and the customer satisfaction is good. The fat reducing therapeutic apparatus adopts a frozen fat dissolving mode to carry out fat reducing treatment on a patient.

The treatment head assembly of the fat reduction treatment apparatus comprises a circuit board, preferably a Printed Circuit Board (PCB), the heat dissipation of which is crucial to the normal operation of the circuit board. At present, for the heat dissipation of the circuit board, a single part for assisting the heat dissipation is arranged, and the circuit board is subjected to heat dissipation by virtue of the part, however, the arrangement increases the number of the parts of the treatment head assembly, the heat transfer process is more, the heat dissipation effect is poor, and the heat dissipation mode structure of the circuit board is single.

Therefore, it is an urgent need to solve the problem for manufacturers of therapeutic head assemblies and lipid-reducing therapeutic apparatuses to develop a therapeutic head assembly that can dissipate heat from a circuit board without increasing the number of components, and has a good heat dissipation effect and a variety of heat dissipation structures.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a treatment head component, a treatment head device and a fat-reducing treatment instrument, and aims to solve the problems that in the existing treatment head component, a special heat dissipation device needs to be added when a circuit board dissipates heat, so that the number of parts is increased, and the heat dissipation effect is poor.

In order to solve the above technical problem, the present invention provides a treatment head assembly, including: the refrigeration unit, the heat exchange unit and the circuit board; the refrigeration unit is provided with a heat dissipation surface; the heat exchange unit is respectively connected with the radiating surface and the circuit board and used for respectively radiating heat of the radiating surface and the circuit board.

Optionally, the heat exchange unit includes a heat exchange flow passage, and the heat exchange flow passage is used for circulating a refrigerant.

Optionally, the heat exchange unit includes a heat exchange body portion and a heat exchange extension portion connected to each other, and the heat exchange body portion is at least in heat conduction connection with the heat dissipation surface.

Optionally, the circuit board is in heat conduction connection with the heat exchange extension portion.

Optionally, the heat exchange body part is further connected with the circuit board in a heat conducting manner.

Optionally, the circuit board and the heat dissipation surface are arranged at an angle.

Optionally, two sides of the heat exchange unit are respectively connected with the circuit board and the refrigeration unit

Optionally, the heat exchange unit has a circuit board heat dissipation surface, and the shape of the circuit board heat dissipation surface is matched with the shape of the circuit board.

In order to solve the above technical problem, the present invention provides a therapy head device, including: the treatment head assembly and the treatment head as described above; the refrigerating unit of the treatment head component is provided with a refrigerating surface, and the refrigerating surface is connected with the treatment head and used for providing refrigerating capacity.

In order to solve the above technical problems, the present invention provides a fat-reducing therapeutic apparatus, comprising: a therapy head apparatus as described above.

In a treatment head assembly, a treatment head device and a fat reduction treatment apparatus provided by the present invention, the treatment head assembly includes: the refrigeration unit, the heat exchange unit and the circuit board; the refrigeration unit is provided with a heat dissipation surface; the heat exchange unit is respectively connected with the radiating surface and the circuit board and used for respectively radiating heat of the radiating surface and the circuit board. So set up, utilize the heat exchange unit to dispel the heat to the circuit board, saved the radiating spare part of circuit board exclusive, and then saved the quantity of spare part, it has simplified the process of heat transfer, has improved the radiating effect.

Drawings

It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the utility model and do not constitute any limitation to the scope of the utility model. Wherein:

fig. 1 is a schematic view of a heat exchange unit and a circuit board of a treatment head assembly according to a first embodiment of the utility model.

Fig. 2 is a cross-sectional view of a left side view of the heat exchange unit and the circuit board shown in fig. 1.

Fig. 3 is a cross-sectional view of a treatment head assembly according to a first embodiment of the utility model.

Fig. 4 is a schematic view of a treatment head assembly according to a second embodiment of the utility model.

Figure 5 is a cross-sectional view of the treatment head assembly shown in figure 4.

Fig. 6 is a schematic view of a treatment head assembly according to a third embodiment of the present invention.

Figure 7 is a cross-sectional view of the treatment head assembly shown in figure 6.

In the drawings:

surface of A-heat exchange flow passage

10-treatment head, 11-treatment opening;

100-a refrigeration unit;

200-heat exchange unit, 210-circuit board heat sink, 220-heat exchange flow channel, 230-refrigerant inlet, 240-refrigerant outlet, 250-heat exchange body part, 260-heat exchange extension;

300-circuit board.

Detailed Description

To further clarify the objects, advantages and features of the present invention, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.

As used in this specification, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. As used in this specification, the term "or" is generally employed in its sense including "and/or" unless the content clearly dictates otherwise. The terms "a number of" are generally used in a sense including "at least one," the terms "at least two" are generally used in a sense including "two or more," furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, and the terms "mounted", "connected" and "connected" are to be construed broadly and may for example be fixedly connected, detachably connected, or integral; either directly or indirectly through intervening media, either internally or in any other relationship. The "distal end" refers to the end distal to the caregiver's operation and the "proximal end" refers to the end proximal to the caregiver's operation. Furthermore, as used in the present invention, the disposition of an element with another element generally only means that there is a connection, coupling, fit or driving relationship between the two elements, and the connection, coupling, fit or driving relationship between the two elements may be direct or indirect through intermediate elements, and cannot be understood as indicating or implying any spatial positional relationship between the two elements, i.e., an element may be in any orientation inside, outside, above, below or to one side of another element, unless the content clearly indicates otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations. Furthermore, in the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the utility model.

The embodiment of the utility model provides a treatment head component, a treatment head device and a fat-reducing treatment instrument, wherein the treatment head component comprises: the refrigeration unit, the heat exchange unit and the circuit board; the refrigeration unit is provided with a heat dissipation surface; the heat exchange unit is respectively connected with the radiating surface and the circuit board and is used for respectively radiating heat of the radiating surface and the circuit board. So set up, utilize the heat exchange unit to provide and dispel the heat to the circuit board, saved the radiating spare part of circuit board exclusive, and then saved the quantity of spare part, it has simplified the process of heat transfer, has improved the radiating effect.

The following description refers to the accompanying drawings.

[ EXAMPLES one ]

FIG. 1 is a schematic view of a heat exchange unit and a circuit board of a treatment head assembly according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view of a left side view of the heat exchange unit and circuit board shown in FIG. 1; FIG. 3 is a cross-sectional view of a treatment head assembly according to a first embodiment of the present invention; fig. 4 is a schematic view of a treatment head assembly according to a second embodiment of the utility model.

Referring to fig. 1 to 3, the present embodiment provides a treatment head assembly and a treatment head device.

Referring to fig. 3, the therapy head device includes: a treatment head assembly and a treatment head 10.

As shown in fig. 3, the therapy head 10 is, for example, a therapy head for fat reduction therapy, and is used for being adsorbed to a part of a human body where fat reduction is required. The treatment head 10 is preferably of a grooved construction, for example. The treatment head 10 is provided with a treatment opening 11, and when in use, the treatment opening 11 is used for facing the human tissue, so that the treatment head 10 can adsorb the human tissue at the part. As shown in fig. 4, a therapeutic head assembly is arranged on the outer side wall of the therapeutic head 10, the therapeutic head assembly includes a refrigeration unit 100, the refrigeration unit 100 has a refrigeration surface, and the refrigeration surface is connected with the therapeutic head 10 and used for providing refrigeration for the therapeutic head 10, so that the human tissue inside the therapeutic head 10 can be subjected to cryotherapy, and further the effect of reducing fat is achieved. Preferably, the circuit board 300 of the therapeutic head assembly is parallel to the surface of the therapeutic opening 11, so that the circuit board 300 can be regularly arranged on the therapeutic head assembly, and the circuit board 300 is prevented from being damaged due to the disordered arrangement.

The treatment head assembly comprises: a refrigeration unit 100, a heat exchange unit 200, and a circuit board 300.

The refrigeration unit 100 has two sides, a cooling side and a heat dissipating side. The refrigerating surface of the refrigerating unit 100 faces the therapy head 10 to provide cold for the therapy head 10; the heat radiating surface of the refrigeration unit 100 is used to release heat generated by refrigeration.

The heat exchange unit 200 is connected to the heat dissipation surface and the circuit board 300, respectively, and is configured to dissipate heat from the heat dissipation surface and the circuit board 300, respectively. The heat exchange unit 200 is connected to the heat dissipating surface of the refrigeration unit 100, and is configured to take away heat of the heat dissipating surface, thereby achieving heat dissipation of the refrigeration unit 100. The heat exchange unit 200 is connected to the circuit board 300, and is configured to take away heat of the circuit board 300, so as to achieve heat dissipation of the circuit board. The circuit board 300 may be a rigid circuit board or a flexible circuit board, and the flexible circuit board may have a curved surface. Preferably, the circuit board 300 is a PCB board, for example. The structure of the heat exchange unit 200 for attaching the circuit board 300 may be configured according to the structure of the circuit board 300, for example, the circuit board 300 has a plate-shaped or curved surface, and the heat exchange unit 200 also has a plate-shaped or curved surface for placing the circuit board 300. The heat exchange unit 200 is preferably a circuit board heat dissipation surface 210, for example, and the circuit board 300 is attached to the circuit board heat dissipation surface 210. More preferably, the shape of the circuit board heat dissipation surface 210 matches the shape of the circuit board 300, for example, the circuit board is a flat plate structure, and the heat exchange unit 200 has a surface for mounting and connecting the flat plate structure, so that the circuit board 300 can better be closely attached to and connected with the heat exchange unit 200, thereby increasing the heat exchange capacity between the two, and further improving the heat dissipation effect of the circuit board. In the treatment head assembly of the first embodiment, the heat exchange unit 200 is connected to the circuit board 300 while being connected to the refrigeration unit 100, and the heat exchange unit 200 can dissipate heat of the circuit board 300 synchronously when the heat dissipation surface of the refrigeration unit 100 dissipates heat, so that dedicated heat dissipation parts of the circuit board 300 are saved, and further the number of the parts is saved, so that the treatment head assembly simplifies the heat transfer process compared with the case of arranging too many parts without increasing the number of the parts, and further improves the heat dissipation effect of the treatment head assembly. In addition, the circuit board 300 can be disposed at any position of the heat exchange unit 200, and the heat exchange unit 200 can also be designed to have a structure matched with the circuit board 300, so that the structure of the heat dissipation mode of the circuit board 300 is diversified, and the heat dissipation effect of the therapeutic head assembly is increased. In practice, the circuit board 300 may be connected to the heat exchange unit 200 entirely, or a part of the circuit board may be connected to the heat exchange unit 200. Part of the circuit board may be a part mainly requiring heat dissipation, and the heat exchange unit 200 can primarily dissipate the heat of the part mainly requiring heat dissipation. In the present embodiment, a part of the circuit board is disposed on the heat exchange unit 200.

Further, as shown in fig. 1 and fig. 2, the heat exchange unit 200 performs cooling and heat dissipation by using a refrigerant, for example, and the heat exchange unit 200 includes a heat exchange flow passage 220, where the heat exchange flow passage 220 is used for flowing the refrigerant. Specifically, the heat exchange unit 200 further includes a refrigerant inlet 230 and a refrigerant outlet 240, the refrigerant flows in and out through the refrigerant inlet 230 and the refrigerant outlet 240, and the refrigerant takes heat in the process of flowing in and out. Preferably, because the metal material has a strong heat conduction/cold conduction capability, the cold energy brought by the refrigerant can be diffused to the whole heat exchange unit 200 through the metal material, and the heat exchange unit 200 is made of the metal material, so that the circuit board 300 can be disposed at any position of the heat exchange unit 200. Those skilled in the art can set the relative position between the circuit board 300 and the heat exchange unit 200 according to the actual positional relationship.

Preferably, the heat exchange unit 200 includes a heat exchange body part 250 and a heat exchange extension part 260 which are connected. The heat exchange body portion 250 is at least in thermal conductive connection with the heat dissipation surface. More preferably, the circuit board 300 is thermally coupled to the heat exchanging extension 260. In the first exemplary embodiment, the heat exchanging body 250 is, for example, a portion provided with the heat exchanging channel 220, and the heat exchanging extension 260 is, for example, a metal connecting plate, and is used for exchanging heat between the heat exchanging body 250 and the circuit board 300. Of course, in other embodiments, the heat exchanging extension 260 may also be other structures and components for transferring heat, etc.

Preferably, as shown in fig. 2, the circuit board 300 is disposed at an angle to the heat dissipation surface. In the first exemplary embodiment, the heat exchange body portion 250 of the heat exchange unit 200 is connected to a heat dissipation surface. The heat dissipating surface is disposed in parallel to a surface a of the heat exchange flow path of the heat exchange body portion 250, thereby improving a heat dissipating effect of the heat dissipating surface. The circuit board 300 forms a certain angle with a surface a of the path of the heat exchange flow channel and is connected with the heat exchange extension part 260, and the heat exchange extension part 260 is matched with the structure of the circuit board. Preferably, the circuit board 300 and the heat dissipation surface are disposed at 90 °, so that the heat exchange extension portion 260 and the heat exchange body portion 250 are also disposed at 90 °, and in other embodiments, the circuit board 300 and the heat exchange body portion are disposed at 30 °, 60 ° or other angles according to actual requirements.

The treatment head device provided by the embodiment has the beneficial effects brought by the treatment head assembly, and the details are not repeated herein. The structure and principle of other components of the therapy head device can be referred to the prior art, and the description is not repeated herein.

This embodiment still provides a fat reduction therapeutic instrument, fat reduction therapeutic instrument includes: the treatment head device is as described above. The fat-reducing therapeutic apparatus has the beneficial effects brought by the therapeutic head device, and the details are not repeated here. The structure and principle of other components of the fat reduction treatment apparatus can be referred to the prior art, and the description is not repeated herein.

[ example two ]

FIG. 1 is a schematic view of a heat exchange unit and a circuit board of a treatment head assembly according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view of a left side view of the heat exchange unit and circuit board shown in FIG. 1; FIG. 3 is a cross-sectional view of a treatment head assembly according to a first embodiment of the present invention; FIG. 4 is a schematic view of a treatment head assembly according to a second embodiment of the present invention; figure 5 is a cross-sectional view of the treatment head assembly shown in figure 4.

The same parts of the treatment head assembly of the second embodiment and the first embodiment are not repeated, and only different points are described below.

Preferably, as shown in fig. 2, 4 and 5, the heat exchange unit 200 includes a heat exchange body portion 250, and the heat exchange body portion 250 is connected to a heat dissipation surface and is further connected to the circuit board 300 in a heat conduction manner. The circuit board 300 is directly connected to the heat exchange body part 250, improving the heat dissipation efficiency of the circuit board 300.

Preferably, as shown in fig. 4, both sides of the heat exchange unit 200 are respectively connected to the circuit board 300 and the refrigeration unit 100. In the second embodiment, as shown in fig. 2, for example, when the refrigeration unit 100 is disposed parallel to the surface a where the path of the heat exchange flow channel is located, the circuit board 300 connected to the other side of the heat exchange unit 200 is also disposed parallel to the surface a where the path of the heat exchange flow channel is located, so that the contact area between the circuit board 300 and the heat exchange flow channel is larger, the heat exchange unit 200 can take away more heat of the circuit board 300, the area of the heat exchange unit 200 is fully utilized, and the heat dissipation efficiency of the circuit board is improved. Of course, in other embodiments, two sides of the heat exchange unit 200 are respectively connected to the circuit board and the refrigeration unit 100, and the relationship between the circuit board 300 and the surface a where the path of the heat exchange flow channel is located is not limited.

Preferably, the treatment head assembly may include one, two or more heat exchange units 200, and one, two or more circuit boards 300 may be connected to each heat exchange unit 200. In the second exemplary embodiment, as shown in fig. 4, the treatment head assembly includes two heat exchange units 200 and two circuit boards 300, and each of the circuit boards 300 is connected to one of the heat exchange units 200, so that the circuit board 300 can be sufficiently contacted with the heat exchange unit 200.

Preferably, as shown in fig. 4 and 5, in the treatment head device provided in this embodiment, each of the treatment head assemblies is disposed at an angle to the plane where the treatment opening 11 is located. In the second embodiment, the plane where the treatment head assembly and the treatment opening 11 are located is 90 degrees, so that the components of the treatment head assembly are regularly arranged. Preferably, the two treatment head assemblies can be symmetrically arranged on the treatment head device, so that the uniform heat dissipation of the treatment head device is ensured. Of course, in other embodiments, a worker in this field may position the treatment head assembly as needed for actual heat dissipation.

[ EXAMPLE III ]

FIG. 6 is a schematic view of a treatment head assembly according to a third embodiment of the present invention; figure 7 is a cross-sectional view of the treatment head assembly shown in figure 6.

The same parts of the treatment head assembly of the third embodiment as those of the first and second embodiments are not described again, and different points are described below.

As shown in fig. 6 and 7, each of the treatment head assemblies is disposed at an angle to the plane of the treatment opening 11. In the third embodiment, the surface where the treatment head assembly is located and the surface where the treatment opening 11 is located are arranged at 60 degrees, so that the components of the treatment head assembly are ensured to be regularly arranged. Furthermore, the two treatment head assemblies can be symmetrically arranged on the treatment head device, so that the uniform heat dissipation of the treatment head device is ensured.

In summary, in the treatment head assembly, the treatment head device and the fat reduction treatment apparatus provided by the present invention, the treatment head assembly includes: the refrigeration unit, the heat exchange unit and the circuit board; the refrigeration unit is provided with a heat dissipation surface; the heat exchange unit is respectively connected with the radiating surface and the circuit board and used for respectively radiating heat of the radiating surface and the circuit board. So set up, utilize the heat exchange unit to dispel the heat to the circuit board, saved the radiating spare part of circuit board exclusive, and then saved the quantity of spare part, it has simplified the process of heat transfer, has improved the radiating effect.

It should be noted that the important point in each embodiment in this specification is that the embodiment is different from other embodiments, and the same and similar parts in each embodiment may be referred to each other.

It should be understood, however, that the intention is not to limit the utility model to the particular embodiments described. It will be apparent to those skilled in the art from this disclosure that many changes and modifications can be made, or equivalents modified, in the embodiments of the utility model without departing from the scope of the utility model. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention are still within the protection scope of the technical solution of the present invention, unless the content of the technical solution of the present invention is departed from.

Claims (10)

1. A treatment head assembly, comprising: the refrigeration unit, the heat exchange unit and the circuit board;

the refrigeration unit is provided with a heat dissipation surface;

the heat exchange unit is respectively connected with the radiating surface and the circuit board and used for respectively radiating heat of the radiating surface and the circuit board.

2. The treatment head assembly of claim 1, wherein the heat exchange unit includes heat exchange channels for passage of a refrigerant.

3. The treatment head assembly of claim 1, wherein the heat exchange unit includes a heat exchange body portion and a heat exchange extension portion that are connected, the heat exchange body portion being in thermally conductive connection with at least the heat dissipation surface.

4. The treatment head assembly of claim 3, wherein the circuit board is thermally conductively coupled to the heat exchange extension.

5. The treatment head assembly of claim 3, wherein the heat exchange body portion is further in thermally conductive connection with the circuit board.

6. The treatment head assembly of claim 1, wherein the circuit board is angled with respect to the heat sink.

7. The treatment head assembly of claim 1, wherein two sides of the heat exchange unit are connected to the circuit board and the refrigeration unit, respectively.

8. The treatment head assembly of claim 1, wherein the heat exchange unit has a circuit board heat dissipation surface having a shape that matches a shape of the circuit board.

9. A therapy head device, comprising: treatment head assembly according to any one of claims 1-8 and a treatment head;

the refrigerating unit of the treatment head component is provided with a refrigerating surface, and the refrigerating surface is connected with the treatment head and used for providing refrigerating capacity.

10. A fat-reducing therapeutic apparatus, comprising: the applicator device according to claim 9.

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