CN215867723U - Computer case with independent heat dissipation air duct - Google Patents
Computer case with independent heat dissipation air duct Download PDFInfo
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- CN215867723U CN215867723U CN202122369261.9U CN202122369261U CN215867723U CN 215867723 U CN215867723 U CN 215867723U CN 202122369261 U CN202122369261 U CN 202122369261U CN 215867723 U CN215867723 U CN 215867723U
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Abstract
The utility model discloses a computer case with an independent radiating air channel, which comprises a case body and a radiating assembly, wherein the case body comprises a case body and a cover body, the surface of the cover body is provided with an air inlet and an air outlet, the bottom of the inner side of the case body is provided with a main board, a CPU board is positioned on the surface of the main board, the radiating assembly comprises a first cover body, the bottom of the first cover body is provided with a radiating copper sheet, the surface of the radiating copper sheet is provided with radiating fins, the bottom of the radiating copper sheet is mutually attached to the surface of the CPU board, the distance between the radiating copper sheet and the CPU board is shortened, the heat transfer time between the CPU board and the radiating copper sheet is shortened, the radiating speed of the device is accelerated, the radiating effect of the device is further enhanced, the two opposite sides of the first cover body are respectively provided with a second cover body and a third cover body, the first cover body, the second cover body and the third cover body are mutually matched to form an independent air channel, and cold air outside the case body is not contacted with components inside the case body after entering, a very good dust-proof effect can be achieved.
Description
Technical Field
The utility model belongs to the technical field of computer cases, and particularly relates to a computer case with an independent heat dissipation air duct.
Background
Along with the ever-increasing economic level, the income per capita is continuously improved, the purchasing power of people is continuously improved, almost all households have computers, and the computers mainly comprise computer cases, display screens, keyboards and other parts, wherein the computer cases are particularly important in the computer parts, and the computer cases are used as one part of computer accessories and play a main role in placing and fixing the computer accessories to play a role in supporting and protecting.
The existing computer case is provided with a plurality of air inlet and air outlet holes for heat dissipation, dust outside the case can enter the case along with flowing air, and the dust is accumulated on a circuit board near a heat radiator, so that the working stability of electronic elements on the circuit board is endangered, and even the electronic elements are damaged. However, if the chassis is made into a totally enclosed type, the heat dissipation performance will be affected, so how to improve the dustproof effect of the main chassis and ensure the heat dissipation performance is a problem that needs to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model adopts the following technical scheme:
a computer case with independent heat dissipation air channels comprises,
the case comprises a case body, wherein the case body comprises a case body, a cover body is arranged at the top of the case body, an air inlet is formed in one side of the surface of the cover body, an air outlet is formed in the other side of the surface of the cover body, a main board is arranged at the bottom of the inner side of the case body, and a CPU board is positioned on one side of the surface of the main board;
the heat dissipation assembly comprises a first cover body, a heat dissipation copper sheet is arranged at the bottom of the first cover body, the surface of the radiating copper sheet is provided with radiating fins which are uniformly distributed, the bottom of the radiating copper sheet is provided with a mounting piece, the mounting piece is used for fixing the position of the heat dissipation copper sheet so that the bottom of the heat dissipation copper sheet is mutually attached to the surface of the CPU board, a second cover body and a third cover body are respectively arranged at two opposite sides of the first cover body, the interior of the second cover body and the interior of the third cover body are both communicated with the interior of the first cover body, the tops of the second cover body and the third cover body are both attached to the cover body, the interior of the second cover body is communicated with the air inlet, the interior of the third cover body is communicated with the air outlet, and a fan is arranged on one side, close to the first cover body, of the interior of the second cover body.
Preferably, the second cover body and the third cover body are both matched with the first cover body in size and shape to form an independent heat dissipation air duct.
Preferably, the joints of the second cover body and the third cover body with the first cover body are provided with sealing rings.
Preferably, the joints of the second cover body and the third cover body with the cover body are provided with elastic gaskets, and the height of the plane where the tops of the elastic gaskets are located is higher than that of the plane where the tops of the first cover body are located.
Preferably, the cross-sectional shape of the heat dissipation copper sheet is a T-shape.
Preferably, the surface of the motherboard is provided with first mounting holes, and the first mounting holes are uniformly distributed on the periphery of the CPU board.
Preferably, the mounting part comprises a first support and a second support, the first support and the second support are connected with the heat dissipation copper sheet through screws, first limiting holes are formed in two ends of the first support, the positions of the first limiting holes correspond to those of the first mounting holes, bolts sequentially pass through the first limiting holes and the first mounting holes and are used for fixing the positions between the first support and the mainboard, the shapes and sizes of the second support and the first support are consistent, and the second support and the first support are symmetrically arranged along the central axis of the heat dissipation copper sheet.
Preferably, the first and second brackets are both [ shaped ].
Preferably, the surface of the bolt is surrounded by a spring.
The utility model has the beneficial effects that: the heat dissipation copper sheet arranged in the device is mutually attached to the surface of the CPU board through the mounting piece, the distance between the heat dissipation copper sheet and the CPU board is shortened, the heat transfer time can be effectively shortened, the fan is started, the external cold air of the case body sequentially passes through the second cover body, the heat dissipation fins and the third cover body through the air inlet, the heat of the heat dissipation fins is taken out through the air outlet, the heat dissipation speed of the device is accelerated, and further the heat dissipation effect of the device is enhanced.
Drawings
Fig. 1 is a schematic structural diagram of a computer case with an independent heat dissipation air duct according to an embodiment of the present invention;
FIG. 2 is an exploded view of a computer case with an independent heat dissipation duct according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the interior of the box body according to the embodiment of the present invention;
fig. 4 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present invention;
fig. 5 is a front cross-sectional view of a heat dissipation assembly according to an embodiment of the present invention.
In the figure: 1-a cabinet body; 101-a box body; 102-a cover body; 103-air inlet; 104-air outlet; 105-a main board; 106-CPU board; 107-first mounting hole; 2-a first mounting hole; 201-heat dissipation copper sheet; 202-a mount; 2020-first support; 2021-a second scaffold; 2022-a first limit hole; 2023-bolt; 2024-spring; 203-radiating fins; 204-a second cover; 205-a fan; 206-a third shell; 207-resilient pads; 208-first cover.
Detailed Description
Examples
As shown in fig. 1-5, a computer case with independent heat dissipation air ducts comprises,
the case comprises a case body 1, wherein the case body 1 comprises a case body 101, a cover body 102 is arranged at the top of the case body 101, an air inlet 103 is formed in one side of the surface of the cover body 102, an air outlet 104 is formed in the other side of the surface of the cover body 102, a main board 105 is arranged at the bottom of the inner side of the case body 101, and a CPU board 106 is positioned on one side of the surface of the main board 105;
the heat dissipation assembly 2 comprises a first cover body 208, a heat dissipation copper sheet 201 is arranged at the bottom of the first cover body 208, heat dissipation fins 203 which are uniformly distributed are arranged on the surface of the heat dissipation copper sheet 201, an installation piece 202 is arranged at the bottom of the heat dissipation copper sheet 201, the installation piece 202 is used for fixing the position of the heat dissipation copper sheet 201 to enable the bottom of the heat dissipation copper sheet 201 to be mutually attached to the surface of the CPU board 106, a second cover body 204 and a third cover body 206 are respectively arranged on two opposite sides of the first cover body 208, the inside of the second cover body 204 and the inside of the third cover body 206 are communicated with the inside of the first cover body 208, the tops of the second cover body 204 and the third cover body 206 are respectively attached to the cover body 102, the inside of the second cover body 204 is communicated with the air inlet 103, the inside of the third cover body 206 is communicated with the air outlet 104, and a fan 205 is arranged on one side, close to the first cover body 208, of the inside of the second cover body 204;
specifically, the cover 102 is connected with the box 101 by screws, the heat dissipation fins 203 are sheet-shaped, the heat dissipation fins 203 are made of copper, the surfaces of the heat dissipation copper sheets 201 and the CPU board 106 are mutually attached to shorten the distance between the heat dissipation copper sheets 201 and the CPU board 106, which can effectively shorten the heat transfer time, and the fan 205 is used to accelerate the heat dissipation speed of the heat dissipation fins 203, so that the heat of the heat dissipation fins 203 is rapidly taken out of the air channel, thereby accelerating the heat dissipation speed and enhancing the heat dissipation effect.
As shown in fig. 2 to 5, in this embodiment, the second cover 204 and the third cover 206 are both adapted to the first cover 208 in size and shape to form an independent heat dissipation air duct, and sealing rings are disposed at joints between the second cover 204 and the first cover 208 and between the third cover 206 and the first cover 208;
specifically, the first cover body 208, the second cover body 204 and the third cover body 206 are mutually matched to form an independent heat dissipation air duct, and sealing rings are arranged at the joints of the second cover body 204 and the third cover body 206 and the first cover body 208, so that air passing through the heat dissipation air duct cannot enter the case body 1, the dust outside the case body 1 is prevented from entering the case body 1 through the heat dissipation air duct and contacting with components inside the case body 1, and the dustproof device has a better dustproof effect.
As shown in fig. 3, in this embodiment, elastic gaskets 207 are disposed at the joints of the second cover 204 and the third cover 206 and the cover 102, and the height of the plane where the tops of the elastic gaskets 207 are located is higher than the height of the plane where the tops of the first cover 208 are located;
specifically, the elastic gasket 207 is made of a rubber material, the elastic gasket 207 can be used for sealing the connection between the second cover 204 and the cover 102 and the connection between the third cover 206 and the cover 102, so that dust outside the case body 1 is prevented from entering the case body 1 through the connection between the second cover 204 and the cover 102 and contacting components inside the case body 1, and the elastic gasket 207 can also play a role in buffering by utilizing elasticity of the elastic gasket, and when the cover 102 receives acting force from top to bottom, the elastic gasket 207 can provide a role in buffering for the heat dissipation assembly 2.
As shown in fig. 5, in the present embodiment, the cross-sectional shape of the heat-dissipating copper sheet 201 is a T-shape;
specifically, the cross-sectional shape of the heat dissipation copper sheet 201 is T-shaped, that is, a protrusion is disposed at the middle position of the bottom of the heat dissipation copper sheet 201, two sides of the heat dissipation copper sheet 201 are used for mounting the mounting member 202, and the protrusion of the heat dissipation copper sheet 201 is used for contacting with the surface of the CPU board 106.
As shown in fig. 4, in this embodiment, the surface of the motherboard 105 is provided with first mounting holes 107, the first mounting holes 107 are uniformly distributed on the periphery of the CPU board 106, the mounting component 202 includes a first bracket 2020 and a second bracket 2021, the first bracket 2020 and the second bracket 2021 are both connected to the heat-dissipating copper sheet 201 through screws, both ends of the first bracket 2020 are provided with first limiting holes 2022, the positions of the first limiting holes 2022 correspond to the positions of the first mounting holes 107, the first limiting holes 2022 and the first mounting holes 107 can be passed through by bolts 2023, the bolts 2023 sequentially pass through the first limiting holes 2022 and the first mounting holes 107 to fix the positions between the first bracket 2020 and the motherboard 105, and the shapes and sizes of the second bracket 2021 and the first bracket 2020 are all the same, the second bracket 2021 and the first bracket 2020 are arranged in mirror symmetry along the central axis of the heat dissipation copper sheet 201, and both the first bracket 2020 and the second bracket 2021 are in a shape of a [ shape;
specifically, both ends of the first bracket 2020 and the second bracket 2021 extend to the outside of the heat dissipation copper sheet 201, the number of the first mounting holes 107 and the number of the bolts 2023 are four, both ends of the first bracket 2020 and the second bracket 2021 are respectively provided with a first limiting hole 2022, and the first bracket 2020, the second bracket 2021, the first mounting hole 107, the first limiting hole 2022 and the bolts 2023 are mutually matched for fixing the position between the CPU board 106 and the heat dissipation copper sheet 201, so that the bottom of the heat dissipation copper sheet 201 is mutually attached to the surface of the CPU board 106.
In this embodiment, the surface of the bolt 2023 is surrounded by a spring 2024;
specifically, the elasticity of the spring 2024 itself can play a fastening role, and the bolt 2023 is prevented from loosening in the later stage.
Specifically, the working principle of the computer case with the independent heat dissipation air duct is as follows: when the device is used, heat generated by the CPU board 106 in the working process is transferred to the radiating fins 203 through the radiating copper sheet 201, the bottom of the radiating copper sheet 201 is attached to the surface of the CPU board 106, the distance between the radiating copper sheet 201 and the CPU board 106 is shortened, the heat transfer time between the CPU board 106 and the radiating copper sheet 201 is shortened, the fan 205 is started, cold air outside the case body 1 is accelerated to sequentially pass through the second cover body 204, the radiating fins 203 and the third cover body 206 through the air inlet 103, the heat of the radiating fins 203 is taken out through the air outlet 104, the radiating speed of the device is accelerated, the radiating effect of the device is further enhanced, meanwhile, the first cover body 208, the second cover body 204 and the third cover body 206 are mutually matched to form an independent air channel, the cold air outside the case body 1 is not contacted with components inside the case body 1 after entering the air channel, and a good dustproof effect can be achieved, the utility model has better heat dissipation effect and better dustproof effect.
Finally, it should be noted that: the specific model specifications of the motherboard 105, the CPU board 106, and the fan 205 need to be determined by model selection according to the actual specification of the device, and the specific model selection calculation method adopts the prior art, so detailed description is omitted.
The power supply of the motherboard 105, the CPU board 106 and the fan 205 and the principle thereof will be clear to those skilled in the art and will not be described in detail here.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A computer case with independent heat dissipation air duct is characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the case body (1), the case body (1) comprises a case body (101), a cover body (102) is arranged at the top of the case body (101), an air inlet (103) is formed in one side of the surface of the cover body (102), an air outlet (104) is formed in the other side of the surface of the cover body (102), a main board (105) is arranged at the bottom of the inner side of the case body (101), and a CPU board (106) is located on one side of the surface of the main board (105);
the heat dissipation assembly (2) comprises a first cover body (208), a heat dissipation copper sheet (201) is arranged at the bottom of the first cover body (208), heat dissipation fins (203) which are uniformly distributed are arranged on the surface of the heat dissipation copper sheet (201), a mounting piece (202) is arranged at the bottom of the heat dissipation copper sheet (201), the mounting piece (202) is used for fixing the position of the heat dissipation copper sheet (201) to enable the bottom of the heat dissipation copper sheet (201) to be mutually attached to the surface of the CPU board (106), a second cover body (204) and a third cover body (206) are respectively arranged on two opposite sides of the first cover body (208), the interior of the second cover body (204) and the interior of the third cover body (206) are both communicated with the interior of the first cover body (208), and the tops of the second cover body (204) and the third cover body (206) are both attached to the cover body (102), the inside of the second cover body (204) is communicated with the air inlet (103), the inside of the third cover body (206) is communicated with the air outlet (104), and a fan (205) is arranged on one side, close to the first cover body (208), of the inside of the second cover body (204).
2. The computer case with independent cooling air ducts of claim 1, wherein: the second cover (204) and the third cover (206) are both matched with the first cover (208) in size and shape to form independent heat dissipation air channels.
3. The computer case with independent cooling air ducts of claim 1, wherein: sealing rings are arranged at the joints of the second cover body (204) and the third cover body (206) and the first cover body (208).
4. The computer case with independent cooling air ducts of claim 1, wherein: elastic gaskets (207) are arranged at the joints of the second cover body (204) and the third cover body (206) and the cover body (102), and the height of the plane where the tops of the elastic gaskets (207) are located is higher than that of the plane where the tops of the first cover body (208) are located.
5. The computer case with independent cooling air ducts of claim 1, wherein: the cross section of the heat dissipation copper sheet (201) is T-shaped.
6. The computer case with independent cooling air ducts of claim 5, wherein: first mounting holes (107) are formed in the surface of the main board (105), and the first mounting holes (107) are uniformly distributed on the periphery of the CPU board (106).
7. The computer case with independent cooling air ducts of claim 6, wherein: the mounting piece (202) comprises a first support (2020) and a second support (2021), the first support (2020) and the second support (2021) are connected with the heat dissipation copper sheet (201) through screws, first limiting holes (2022) are formed in two ends of the first support (2020), the positions of the first limiting holes (2022) correspond to the positions of the first mounting holes (107), bolts (2023) are used for fixing the positions between the first support (2020) and the mainboard (105) through the first limiting holes (2022) and the first mounting holes (107) in sequence, the second support (2021) and the first support (2020) are identical in shape and size, and the second support (2021) and the first support (2020) are arranged in mirror symmetry along the central axis of the heat dissipation copper sheet (201).
8. The computer case with independent cooling air ducts of claim 7, wherein: the first bracket (2020) and the second bracket (2021) are both [ shaped ].
9. The computer case with independent cooling air ducts of claim 7, wherein: the surface of the bolt (2023) is surrounded by a spring (2024).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122369261.9U CN215867723U (en) | 2021-09-28 | 2021-09-28 | Computer case with independent heat dissipation air duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122369261.9U CN215867723U (en) | 2021-09-28 | 2021-09-28 | Computer case with independent heat dissipation air duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215867723U true CN215867723U (en) | 2022-02-18 |
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ID=80261808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122369261.9U Active CN215867723U (en) | 2021-09-28 | 2021-09-28 | Computer case with independent heat dissipation air duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215867723U (en) |
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2021
- 2021-09-28 CN CN202122369261.9U patent/CN215867723U/en active Active
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