CN215846361U - Positioning mechanism and laser marking device - Google Patents

Positioning mechanism and laser marking device Download PDF

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Publication number
CN215846361U
CN215846361U CN202121619464.2U CN202121619464U CN215846361U CN 215846361 U CN215846361 U CN 215846361U CN 202121619464 U CN202121619464 U CN 202121619464U CN 215846361 U CN215846361 U CN 215846361U
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China
Prior art keywords
positioning
chip frame
rail
track
positioning mechanism
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CN202121619464.2U
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Chinese (zh)
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李文强
杨建新
朱霆
周学慧
张凯
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Shenzhen Tete Semiconductor Equipment Co ltd
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Shenzhen Tete Semiconductor Equipment Co ltd
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Abstract

The utility model provides a positioning mechanism and a laser marking device comprising the same, wherein the positioning mechanism is used for positioning a chip frame, the chip frame is provided with a positioning hole, the chip frame comprises a conveying rail, a pressure plate and a driving piece, the conveying rail is used for conveying the chip frame, a sliding groove is formed in the conveying rail, the side edge of the chip frame extends into the sliding groove, a marking station is arranged on the conveying rail, and a positioning groove is formed in the conveying rail corresponding to the marking station; the material pressing plate is arranged above the marking station and provided with a positioning needle, and the positioning needle corresponds to the positioning groove; the driving piece comprises a first driving piece and a second driving piece, the first driving piece is used for driving the chip frame to move along the conveying track, when the chip frame moves to the marking station, the second driving material pressing plate moves downwards, and the positioning needle penetrates through the positioning groove and then stretches into the positioning hole. The utility model solves the problem of insufficient positioning precision of the laser marking device in the prior art.

Description

Positioning mechanism and laser marking device
Technical Field
The utility model relates to the technical field of laser marking, in particular to a positioning mechanism and a laser marking device comprising the same.
Background
In the prior art, when a chip on a chip frame is marked, the chip needs to be conveyed to a preset marking station to mark. In order to ensure the accuracy of marking, when the chip frame is transported to the marking station, a positioning mechanism is required to fix the chip frame. However, in the conventional laser marking device, the positioning mechanism often cannot position the chip frame well, so that the marking accuracy is insufficient. In particular, the laser marking device in the prior art has the problem of being difficult to position.
SUMMERY OF THE UTILITY MODEL
The utility model provides a positioning mechanism and a laser marking device comprising the same, and aims to solve the problem that the laser marking device in the prior art is difficult to position.
The utility model provides a positioning mechanism which is used for positioning a chip frame, wherein the chip frame is provided with a positioning hole and comprises a conveying rail, a pressure plate and a driving piece, the conveying rail is used for conveying the chip frame, the side edge of the chip frame extends into a sliding groove, a marking station is arranged on the conveying rail, and a positioning groove is arranged on the conveying rail corresponding to the marking station; the material pressing plate is arranged above the marking station and provided with a positioning needle, and the positioning needle is arranged corresponding to the positioning groove; the driving piece comprises a first driving piece and a second driving piece, the first driving piece is used for driving the chip frame to move along the conveying track, when the chip frame moves to the marking station, the second driving piece presses the material plate to move downwards, and the positioning needle penetrates through the positioning groove and then extends into the positioning hole.
In an optional embodiment, the conveying track includes a first track and a second track, the first track and the second track are respectively provided with a first chute and a second chute, two opposite sides of the chip frame respectively extend into the first chute and the second chute, and the positioning grooves are formed in the first track and the second track.
In an optional embodiment, the pressure plates include a first pressure plate and a second pressure plate, and the first pressure plate and the second pressure plate are respectively disposed corresponding to the first rail and the second rail.
In an optional embodiment, the first rail and the second rail are both provided with a plurality of positioning grooves.
In an optional embodiment, the locating pin is detachably arranged on the pressure plate.
In an optional embodiment, the positioning mechanism includes a fixed portion and a movable portion, the first rail is disposed on the fixed portion, the second rail is disposed on the movable portion, and the driving member includes a third driving member, the third driving member drives the movable portion to approach and be away from the fixed portion, so as to adjust a distance between the first rail and the second rail.
In an alternative embodiment, an inductive sensor is further disposed on the transfer track.
In an alternative embodiment, the drive member comprises a cylinder or an electric motor.
In an alternative embodiment, the drive member includes a cross roller ramp.
The utility model also provides a laser marking device, which comprises the positioning mechanism and a laser marking mechanism, wherein the laser marking mechanism is arranged above the marking station.
The positioning mechanism and the laser marking device comprising the positioning mechanism are provided. Specifically, positioning mechanism includes the pressure flitch, the pressure flitch be provided with pilot pin and constant head tank on the transfer orbit respectively, work as when chip frame moves to beating the mark station, the pressure flitch downstream, the pilot pin passes behind the constant head tank, stretches into in the locating hole of chip frame, in order to realize the location chip frame's effect. So set up the problem that laser marking device among the prior art exists and be difficult to the location.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a laser marking apparatus according to the present invention;
FIG. 2 is a schematic view of a portion of the structure of FIG. 1;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 is a schematic view of the positioning mechanism of FIG. 1;
fig. 5 is an enlarged view at B in fig. 4.
The reference numbers illustrate:
reference numerals Name (R) Reference numerals Name (R)
100 Laser marking device 200 Chip frame
111 First rail 112 Second rail
11a Locating slot 121 First pressure plate
122 Second pressure plate 12a Positioning needle
20 Laser marking mechanism 30 Dust removal mechanism
40 Feeding mechanism 50 Blanking mechanism
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if appearing throughout the text, "and/or" is meant to include three juxtaposed aspects, taking "A and/or B" as an example, including either the A aspect, or the B aspect, or both A and B satisfied aspects. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
In the prior art, when a chip on a chip frame is marked, the chip needs to be conveyed to a preset marking station to mark. In order to ensure the accuracy of marking, when the chip frame is transported to the marking station, a positioning mechanism is required to fix the chip frame. However, in the conventional laser marking device, the positioning mechanism often cannot position the chip frame well, so that the marking accuracy is insufficient. In particular, the laser marking device in the prior art has the problem of being difficult to position.
Referring to fig. 1, 2 and 4, the present invention provides a positioning mechanism 10 for positioning a chip frame, wherein the chip frame has a positioning hole, the positioning mechanism 10 includes a conveying rail, a pressure plate and a driving member, the conveying rail is used for conveying the chip frame, a side edge of the chip frame extends into the chute, a marking station is arranged on the conveying rail, and a positioning groove 11a is arranged on the conveying rail corresponding to the marking station; the material pressing plate is arranged above the marking station and provided with a positioning needle 12a, and the positioning needle 12a corresponds to the positioning groove 11 a; the driving piece includes first driving piece and second driving piece, first driving piece is used for the drive the chip frame is followed conveying orbital motion, works as the chip frame moves extremely when beating the mark station, the second drive the pressure flitch downstream, just pilot pin 12a passes behind the constant head tank 11a, stretch into in the locating hole.
When the chip frame moves to the marking station, namely, is positioned below the pressure plate, the positioning hole on the chip frame aligns with the positioning groove 11a and the positioning needle 12 a. At this time, the second driving member drives the positioning pin 12a to move downward, and after passing through the positioning slot 11a, the pin is inserted into the positioning hole on the chip frame, so as to position the chip frame. Optionally, the positioning groove 11a is opened on a conveying track between the positioning pin 12a and the chip frame, so as to avoid the positioning pin 12 a. In an embodiment, the positioning slot 11a may be formed in the middle of the track, or may be formed by an edge of the track being recessed inwards.
At this time, the position of the chip frame is relatively fixed, and displacement is not easy to occur, so that the positioning precision is not influenced. Furthermore, a CCD camera and a laser marking mechanism are further arranged above the marking station. After the positioning mechanism 10 finishes positioning the chip frame, the CCD photographs the chip frame, and the laser marking mechanism performs laser marking on the chip frame. Thereby realizing the positioning process and the marking process of the chip frame. In an optional embodiment, the preset position of the pressure plate and the preset stroke of the pressure plate can be set according to the actual requirement in the production process.
Referring to fig. 2 and 4, in an alternative embodiment, the conveying track includes a first track 111 and a second track 112, the first track 111 and the second track 112 are respectively provided with a first sliding slot and a second sliding slot, two opposite sides of the chip frame respectively extend into the first sliding slot and the second sliding slot, and the first track 111 and the second track 112 are both provided with the positioning slot 11 a. So that no interference is generated in the movement between the transfer rail and the nip plate. The first rail 111 and the second rail 112 are respectively disposed corresponding to two opposite sides of the chip frame. In particular, the two sides are two sides of the chip frame parallel to the moving direction. And the marking station is disposed between the first rail 111 and the second rail 112. In an optional embodiment, a lifting plate is further disposed between the first rail 111 and the second rail 112, and when the chip frame moves to the marking station, the lifting plate lifts the chip frame to be separated from the conveying rail, and after the conveying rail is pre-positioned, the positioning pin 12a and the positioning hole are matched and positioned. The arrangement of the first sliding chute and the second sliding chute can reduce the influence of the conveying track on the movement of the jacking plate.
Referring to fig. 4, in an optional embodiment, the pressure plates include a first pressure plate 121 and a second pressure plate 122, and the first pressure plate 121 and the second pressure plate 122 are respectively disposed corresponding to the first rail 111 and the second rail 112. Optionally, a plurality of rows of positioning holes are formed in the chip frame. In this regard, the positioning mechanism 10 is correspondingly provided with the first pressure plate 121 and the second pressure plate 122, so that the position of the fixed chip frame is more stable, and the marking result is more accurate.
Referring to fig. 4, in an alternative embodiment, the first rail 111 and the second rail 112 are both provided with a plurality of positioning slots 11 a. Correspondingly, the material pressing plate is provided with a plurality of positioning pins 12 a. With this arrangement, the positioning mechanism 10 can be applied to a chip frame having a plurality of positioning holes.
Referring to fig. 3 and 5, in an alternative embodiment, the positioning pin 12a is detachably disposed on the pressing plate. In this way, the positioning pins 12a can be detached or mounted for different types of chip frames according to the requirements or the arrangement positions of the positioning holes. Specifically, the chip frame can be positioned on the premise of not damaging the chip frame. Meanwhile, the positioning mechanism 10 can adapt to chip frames of different models.
Referring to fig. 1 and 4, in an alternative embodiment, the positioning mechanism 10 includes a fixed portion and a movable portion, the first rail 111 is disposed on the fixed portion, the second rail 112 is disposed on the movable portion, and the driving member includes a third driving member, the third driving member drives the movable portion to approach and separate from the fixed portion, so as to adjust a distance between the first rail 111 and the second rail 112. The width of the chip frame is correspondingly changed for different models of chip frames. In order to adapt to chip frames with different widths, the distance between the first rail 111 and the second rail 112 is adjustable. There are many possible ways to adjust the distance between the first rail 111 and the second rail 112. In another alternative embodiment, the positioning mechanism 10 may also include two movable portions, and the distance between 2 movable portions may also be controlled to accommodate different types of chip frames. Optionally, for chip frames of different models, the preset position and the movement stroke of the pressure plate are correspondingly changed.
Referring to fig. 2, in an alternative embodiment, an inductive sensor is further disposed on the transmission track. Further, the laser marking device also comprises a control mechanism. The control mechanism is connected with the induction sensor. And the first driving piece and the second driving piece are connected with the control mechanism. As such, the inductive sensor is used to sense the position of the chip frame. When the chip frame moves to the marking station, the control mechanism is used for receiving information transmitted by the induction sensor and controlling the first driving piece and the second driving piece to move. So as to complete the positioning of the chip frame and improve the marking precision.
Referring to fig. 4, in an alternative embodiment, the driving member includes a cylinder or a motor. That is, the first driving member, the second driving member, and the third driving member may be driven by an air cylinder or a motor. Furthermore, the cylinder is good at reciprocating linear motion, can reliably work under severe conditions, is simple to operate and can basically realize maintenance-free operation. The motor has the advantages of being fast in response time and capable of accurately controlling speed, position and torque through a feedback system.
Referring to fig. 4-5, in an alternative embodiment, the driving member includes a cross roller slide. The cylinder tends to occupy a larger volume than the motor. Namely, the motor has a compact structure and a small volume, and the motor is used as a driving part, which is more beneficial to reducing the volume of the positioning mechanism 10. In order to further reduce the volume of the driving member, the driving member of the positioning mechanism 10 also adopts a cross roller sliding table. The crossed roller sliding table is used as a transmission part of the motor. In one embodiment, the positioning mechanism 10 has a jacking member, and the motor is connected to the jacking member or the pressure plate sequentially through a coupler and a cross roller sliding table. The cross roller slide may also be a cross roller slide or a pulley assembly. Specifically, the crossed roller sliding table is a relatively common transmission part, and the crossed roller sliding table comprises a roller base, a roller sliding table and two pairs of crossed roller guide rails, namely the crossed roller sliding table is formed by arranging the two pairs of crossed roller guide rails between the roller base and the roller sliding table. The crossed roller guide rail comprises a first guide rail, a second guide rail, rollers and a roller holding plate, wherein the roller holding plate is positioned between the first guide rail and the second guide rail, a plurality of rollers are arranged on the roller holding plate, and the guide rail is provided with a V-shaped raceway so that the rollers can roll in the raceway. Further, the drive member further includes a cam assembly. The arrangement of the cam assembly can more accurately control the movement stroke of the workpiece connected with the driving piece.
Referring to fig. 1, the present invention further provides a laser marking device 100, where the laser marking device 100 includes the positioning mechanism 10, the laser marking device 100 further includes a laser marking mechanism 20, and the laser marking mechanism 20 is disposed above the marking station. After the positioning mechanism 10 finishes positioning the chip frame 200, the CCD camera arranged above the marking station photographs the chip frame 200, and the laser marking mechanism 20 performs laser marking on the chip frame 200. Further, the laser marking device 100 further includes a feeding mechanism 40 and a discharging mechanism 50. The feeding mechanism 40 and the discharging mechanism 50 are respectively arranged at two ends of the conveying track. To complete the loading and unloading of the chip frame 200. In an optional embodiment, the laser marking device further includes a dust removing mechanism 30, and the dust removing mechanism 30 is disposed between the pressure plate and the chip frame 200, and plays a role in removing dust from the chip frame 200. To avoid dust affecting the accuracy of laser marking.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. A positioning mechanism for positioning a chip frame, the chip frame having a positioning hole, comprising:
the conveying track is used for conveying a chip frame, a sliding groove is formed in the conveying track, the side edge of the chip frame extends into the sliding groove, a marking station is arranged on the conveying track, and a positioning groove is formed in the conveying track corresponding to the marking station;
the material pressing plate is arranged above the marking station and provided with a positioning needle, and the positioning needle is arranged corresponding to the positioning groove;
the driving piece comprises a first driving piece and a second driving piece, the first driving piece is used for driving the chip frame to move along the conveying track, when the chip frame moves to the marking station, the second driving piece downwards moves the pressure plate, and the positioning needle penetrates through the positioning groove and then stretches into the positioning hole.
2. The positioning mechanism according to claim 1, wherein the conveying track includes a first track and a second track, the first track and the second track are respectively provided with a first sliding chute and a second sliding chute, two opposite sides of the chip frame respectively extend into the first sliding chute and the second sliding chute, and the positioning grooves are respectively formed on the first track and the second track.
3. The positioning mechanism of claim 2, wherein the nip plate comprises a first nip plate and a second nip plate, and the first nip plate and the second nip plate are respectively arranged corresponding to the first rail and the second rail.
4. The positioning mechanism according to claim 3, wherein a plurality of positioning grooves are provided on each of the first rail and the second rail.
5. The positioning mechanism of claim 1, wherein the positioning pin is detachably disposed on the material pressing plate.
6. The positioning mechanism as set forth in claim 2, wherein said positioning mechanism includes a fixed portion and a movable portion, said first rail being disposed on said fixed portion, said second rail being disposed on said movable portion, said driving member including a third driving member, said third driving member driving said movable portion toward and away from said fixed portion to adjust a distance between said first rail and said second rail.
7. The positioning mechanism according to claim 4, wherein an inductive sensor is further provided on the transfer rail.
8. The positioning mechanism of claim 1, wherein the drive member comprises a pneumatic cylinder or an electric motor.
9. The positioning mechanism of claim 1, wherein the drive member includes cross roller ramps.
10. A laser marking device, characterized in that, the laser marking device includes the positioning mechanism of any one of claims 1 to 9, the laser marking device further includes a laser marking mechanism, the laser marking mechanism is arranged above the marking station.
CN202121619464.2U 2021-07-16 2021-07-16 Positioning mechanism and laser marking device Active CN215846361U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121619464.2U CN215846361U (en) 2021-07-16 2021-07-16 Positioning mechanism and laser marking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121619464.2U CN215846361U (en) 2021-07-16 2021-07-16 Positioning mechanism and laser marking device

Publications (1)

Publication Number Publication Date
CN215846361U true CN215846361U (en) 2022-02-18

Family

ID=80334348

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121619464.2U Active CN215846361U (en) 2021-07-16 2021-07-16 Positioning mechanism and laser marking device

Country Status (1)

Country Link
CN (1) CN215846361U (en)

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