CN215817959U - Variable frequency power supply device capable of automatically radiating heat - Google Patents
Variable frequency power supply device capable of automatically radiating heat Download PDFInfo
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- CN215817959U CN215817959U CN202122423582.2U CN202122423582U CN215817959U CN 215817959 U CN215817959 U CN 215817959U CN 202122423582 U CN202122423582 U CN 202122423582U CN 215817959 U CN215817959 U CN 215817959U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 69
- 238000001816 cooling Methods 0.000 claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 239000000498 cooling water Substances 0.000 claims abstract description 16
- 238000002347 injection Methods 0.000 claims abstract description 7
- 239000007924 injection Substances 0.000 claims abstract description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a variable-frequency power supply device capable of automatically radiating heat, which comprises a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, an injection fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (micro control unit) controller, wherein the box body is provided with a heat radiating pipe; the variable frequency power supply device is characterized in that a semiconductor refrigerating sheet and a jet fan are arranged in a box body, so that convection circulation cold air is formed in the box body, and heat generated by a variable frequency power supply can be conducted and dissipated to the outside along with the convection circulation cold air; in addition, a water-cooling pipe is arranged in the box body, and the water-cooling pipe can take away heat generated by the variable frequency power supply through cooling water flowing in the water-cooling pipe; therefore, the variable frequency power supply device carries out double heat dissipation on the variable frequency power supply device through two active heat dissipation modes, namely air cooling and water cooling, so that the heat dissipation efficiency of the variable frequency power supply device can be improved, and heat is prevented from accumulating inside the variable frequency power supply device.
Description
Technical Field
The utility model relates to the technical field of variable frequency power supply equipment, in particular to a variable frequency power supply device capable of automatically radiating heat.
Background
The variable frequency power supply device is a power supply conversion device for converting commercial power so as to output direct current. The variable frequency power supply device can generate a large amount of heat in the working process, if the heat is not conducted and dissipated in time, the heat can be accumulated inside the variable frequency power supply device, so that the normal work of the variable frequency power supply device is influenced, and even the condition that an electronic element inside the variable frequency power supply device is fused can be caused. Therefore, it is important to perform timely and rapid heat dissipation on the variable frequency power supply device.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model provides a variable-frequency power supply device capable of automatically radiating heat, which comprises a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, a jet fan, a temperature sensor, a water-cooling pipe, a water pump and an MCU (microprogrammed control Unit) controller, wherein the box body is provided with a heat radiating pipe; the variable frequency power supply device is characterized in that a semiconductor refrigerating sheet and a jet fan are arranged in a box body, so that convection circulation cold air is formed in the box body, and heat generated by a variable frequency power supply can be conducted and dissipated to the outside along with the convection circulation cold air; in addition, a water-cooling pipe is arranged in the box body, and the water-cooling pipe can take away heat generated by the variable frequency power supply through cooling water flowing in the water-cooling pipe; therefore, the variable frequency power supply device carries out double heat dissipation on the variable frequency power supply device through two active heat dissipation modes, namely air cooling and water cooling, so that the heat dissipation efficiency of the variable frequency power supply device can be improved, and heat is prevented from accumulating inside the variable frequency power supply device.
The utility model provides a variable-frequency power supply device capable of automatically radiating heat, which is characterized by comprising a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, an injection fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (micro control unit) controller, wherein the box body is provided with a heat radiating pipe; wherein,
the box body is in a cuboid shape, and the variable frequency power supply is arranged inside the box body;
semiconductor refrigerating sheets are respectively arranged on six inner wall surfaces of the box body;
the jet fan is arranged at the bottom end of the interior of the box body and is used for conveying jet air flow to the interior of the box body;
the temperature sensor is arranged on the variable frequency power supply and is used for detecting the temperature of the variable frequency power supply;
the water-cooling pipe is arranged inside the box body, the water pump is arranged on the water-cooling pipe, and the water pump is used for conveying cooling water to the inside of the water-cooling pipe;
the MCU controller is respectively connected with the temperature sensor, the jet fan and the water pump and is used for controlling the speed of the jet fan for conveying jet air flow or controlling the speed of the water pump for conveying cooling water;
furthermore, square heat dissipation holes are uniformly formed in the peripheral side wall of the box body, and each square heat dissipation hole is covered with a dust screen;
the box body is made of aluminum alloy;
furthermore, a supporting panel is arranged inside the box body;
the supporting panel comprises a panel main body and side plates which are respectively arranged at two sides of the panel main body;
the panel main body and the two side plates are integrally formed;
each side plate is provided with a plurality of side plate screw holes;
inner wall surface screw holes are formed in the two opposite inner wall surfaces in the box body at positions corresponding to the side plate screw holes one by one;
each side plate screw hole is sequentially connected with the corresponding inner wall surface screw hole through a screw, so that the supporting panel can be fixedly arranged in the box body;
further, a plurality of hollow holes are uniformly formed in the surface of the panel main body;
the panel main body and the side plates are both made of aluminum alloy;
further, the variable frequency power supply is fixed above the supporting panel through heat-conducting silica gel in a bonding mode;
further, the length of the semiconductor refrigeration piece is 5cm-8cm, and the width of the semiconductor refrigeration piece is 3cm-4 cm;
further, the temperature sensor is a thermal resistance type temperature sensor or a thermocouple type temperature sensor;
further, the water cooling pipe comprises a main pipe body, and a water inlet and a water outlet which are respectively arranged at two ends of the main pipe body;
the main pipe body is positioned in the box body, and the pipe diameter of the main pipe body is 1cm-2 cm;
the water pump is arranged at the water inlet;
further, the main pipe body is a plastic pipe body;
further, the water pump is a variable frequency water pump.
Compared with the prior art, the variable-frequency power supply device capable of automatically radiating heat comprises a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, an injection fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (microprogrammed control Unit) controller; the variable frequency power supply device is characterized in that a semiconductor refrigerating sheet and a jet fan are arranged in a box body, so that convection circulation cold air is formed in the box body, and heat generated by a variable frequency power supply can be conducted and dissipated to the outside along with the convection circulation cold air; in addition, a water-cooling pipe is arranged in the box body, and the water-cooling pipe can take away heat generated by the variable frequency power supply through cooling water flowing in the water-cooling pipe; therefore, the variable frequency power supply device carries out double heat dissipation on the variable frequency power supply device through two active heat dissipation modes, namely air cooling and water cooling, so that the heat dissipation efficiency of the variable frequency power supply device can be improved, and heat is prevented from accumulating inside the variable frequency power supply device.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a variable frequency power supply device capable of automatically dissipating heat according to the present invention.
Reference numerals: 1. a box body; 2. a variable frequency power supply; 3. a semiconductor refrigeration sheet; 4. a jet fan; 5. a temperature sensor; 6. a water-cooled tube; 7. a water pump; 8. an MCU controller; 9. a support panel; 10. a panel main body; 11. side plates.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a variable frequency power supply device capable of automatically dissipating heat according to an embodiment of the present invention. The variable-frequency power supply device capable of automatically radiating heat comprises a box body 1, a variable-frequency power supply 2, a semiconductor refrigerating sheet 3, an injection fan 4, a temperature sensor 5, a water cooling pipe 6, a water pump 7 and an MCU (microprogrammed control Unit) controller 8; wherein,
the box body 1 is in a cuboid shape, and the variable frequency power supply 2 is arranged inside the box body 1;
six inner wall surfaces of the box body 1 are respectively provided with a semiconductor refrigeration sheet 3;
the jet fan 4 is arranged at the bottom end of the interior of the box body 1, and the jet fan 4 is used for conveying jet air flow to the interior of the box body 1;
the temperature sensor 5 is arranged on the variable frequency power supply 2, and the temperature sensor 5 is used for detecting the temperature of the variable frequency power supply 2;
the water-cooling pipe 6 is arranged inside the box body 1, the water pump 7 is arranged on the water-cooling pipe 6, and the water pump 7 is used for conveying cooling water to the inside of the water-cooling pipe 6;
the MCU controller 8 is respectively connected with the temperature sensor 5, the jet fan 4 and the water pump 7, and the MCU controller 8 is used for controlling the speed of the jet fan 4 for conveying jet air flow or controlling the speed of the water pump 7 for conveying cooling water.
The beneficial effects of the above technical scheme are: the variable-frequency power supply device capable of automatically radiating heat comprises a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, a jet fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (micro control unit) controller; the variable frequency power supply device is characterized in that a semiconductor refrigerating sheet and a jet fan are arranged in a box body, so that convection circulation cold air is formed in the box body, and heat generated by a variable frequency power supply can be conducted and dissipated to the outside along with the convection circulation cold air; in addition, a water-cooling pipe is arranged in the box body, and the water-cooling pipe can take away heat generated by the variable frequency power supply through cooling water flowing in the water-cooling pipe; therefore, the variable frequency power supply device carries out double heat dissipation on the variable frequency power supply device through two active heat dissipation modes, namely air cooling and water cooling, so that the heat dissipation efficiency of the variable frequency power supply device can be improved, and heat is prevented from accumulating inside the variable frequency power supply device.
In addition, the MCU controller is respectively connected with the temperature sensor, the jet fan and the water pump, and can control the speed of the jet fan for conveying jet air flow or the speed of the water pump for conveying cooling water according to the temperature of the variable frequency power supply detected by the temperature sensor; for example, when the MCU controller determines that the temperature of the variable frequency power supply detected by the temperature sensor exceeds a preset temperature threshold, the MCU controller may instruct the jet fan to increase the speed of delivering the jet air flow or instruct the water pump to increase the speed of delivering the cooling water; when the MCU controller determines that the temperature of the variable frequency power supply detected by the temperature sensor does not exceed a preset temperature threshold value, the MCU controller can instruct the jet fan to reduce the speed of conveying jet air flow or instruct the water pump to reduce the speed of conveying cooling water. The variable frequency power supply can be, but is not limited to, a single-phase three-phase variable frequency variable voltage power supply.
Preferably, square heat dissipation holes are uniformly formed in the peripheral side wall of the box body 1, and each square heat dissipation hole is covered with a dust screen;
the box body 1 is made of aluminum alloy.
The beneficial effects of the above technical scheme are: set up square louvre on the lateral wall all around of this box, can improve when the injection fan sprays the air current to the inside transport of box, should spray the exchange efficiency of air current and external air environment to the heat that makes this variable frequency power supply ware produce can disperse in the external environment by express delivery.
Preferably, the inside of the box 1 is provided with a support panel 9;
the support panel 9 includes a panel main body 10 and side plates 11 respectively disposed at both sides of the panel main body 10;
the panel body 10 is integrally formed with two side plates 11;
each side plate 11 is provided with a plurality of side plate screw holes;
inner wall surface screw holes are arranged on two opposite inner wall surfaces in the box body 1 and in one-to-one correspondence with the side plate screw holes;
each side plate screw hole is connected with the corresponding screw hole on the inner wall surface in sequence through a screw, so that the supporting panel 9 can be fixedly arranged inside the box body 1.
The beneficial effects of the above technical scheme are: can set up this variable frequency power supply ware unsettled ground in the inside of this box through this supporting panel, can provide firm support and avoid this variable frequency power supply ware to receive external vibration's interference like this to this variable frequency power supply ware.
Preferably, a plurality of hollow holes are uniformly formed on the surface of the panel body 10;
the panel main body 10 and the side plate 11 are made of aluminum alloy.
The beneficial effects of the above technical scheme are: evenly set up a plurality of fretwork holes on the surface of this panel main part, this weight that not only can reduce the panel main part to can also make the heat that this variable frequency power supply ware produced disperse through the fretwork hole rapidly.
Preferably, the variable frequency power supply 2 is fixed above the supporting panel 9 by bonding with heat conductive silicone.
The beneficial effects of the above technical scheme are: utilize heat conduction silica gel to bond this variable frequency power supply ware and fix in this supporting panel top, can improve this variable frequency power supply ware's installation steadiness like this.
Preferably, the semiconductor refrigerating sheet 3 has a length of 5cm-8cm and a width of 3cm-4 cm.
The beneficial effects of the above technical scheme are: the length of the semiconductor refrigerating sheet 3 is set to be 5cm-8cm, and the width is set to be 3cm-4cm, so that the refrigerating area of the semiconductor refrigerating sheet can be increased to the maximum extent.
Preferably, the temperature sensor 5 is a thermistor type temperature sensor or a thermocouple type temperature sensor.
The beneficial effects of the above technical scheme are: the accuracy of the temperature sensor for detecting the temperature of the variable frequency power supply directly determines the accuracy of the MCU controller for controlling the running states of the injection fan and the water pump. By using the temperature sensor as the thermistor type temperature sensor 5 or the thermocouple type temperature sensor, the temperature detection accuracy of the temperature sensor can be improved to the maximum.
Preferably, the water cooling pipe 6 comprises a main pipe body, and a water inlet and a water outlet which are respectively arranged at two ends of the main pipe body;
the main pipe body is positioned in the box body 1, and the pipe diameter of the main pipe body is 1cm-2 cm;
the water pump 7 is arranged at the water inlet.
The beneficial effects of the above technical scheme are: the water pump is arranged at the water inlet of the main pipe body, so that the flow speed of cooling water inside the main pipe body can be controlled through the water pump, and the water cooling efficiency of the water cooling pipe is improved.
Preferably, the main pipe body is a plastic pipe body.
The beneficial effects of the above technical scheme are: the main pipe body is designed into the plastic pipe body, so that the flexibility of the main pipe body can be improved, and the water-cooling heat dissipation length of the main pipe body in the box body can be controlled conveniently.
Preferably, the water pump 7 is a variable frequency water pump.
The beneficial effects of the above technical scheme are: the water pump is set as a variable frequency water pump, so that the stability of conveying cooling water to the water cooling pipe by the water pump can be improved, and the working electricity consumption of the water pump can be saved.
According to the content of the embodiment, the variable frequency power supply device capable of automatically radiating heat comprises a box body, a variable frequency power supply, a semiconductor refrigerating sheet, a jet fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (micro control unit) controller; the variable frequency power supply device is characterized in that a semiconductor refrigerating sheet and a jet fan are arranged in a box body, so that convection circulation cold air is formed in the box body, and heat generated by a variable frequency power supply can be conducted and dissipated to the outside along with the convection circulation cold air; in addition, a water-cooling pipe is arranged in the box body, and the water-cooling pipe can take away heat generated by the variable frequency power supply through cooling water flowing in the water-cooling pipe; therefore, the variable frequency power supply device carries out double heat dissipation on the variable frequency power supply device through two active heat dissipation modes, namely air cooling and water cooling, so that the heat dissipation efficiency of the variable frequency power supply device can be improved, and heat is prevented from accumulating inside the variable frequency power supply device.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the utility model. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The variable-frequency power supply device capable of automatically radiating heat is characterized by comprising a box body, a variable-frequency power supply, a semiconductor refrigerating sheet, an injection fan, a temperature sensor, a water cooling pipe, a water pump and an MCU (microprogrammed control Unit) controller;
wherein,
the box body is in a cuboid shape, and the variable frequency power supply is arranged inside the box body;
semiconductor refrigerating sheets are respectively arranged on six inner wall surfaces of the box body;
the jet fan is arranged at the bottom end of the interior of the box body and is used for conveying jet air flow to the interior of the box body;
the temperature sensor is arranged on the variable frequency power supply and is used for detecting the temperature of the variable frequency power supply;
the water-cooling pipe is arranged inside the box body, the water pump is arranged on the water-cooling pipe, and the water pump is used for conveying cooling water to the inside of the water-cooling pipe;
the MCU controller is respectively connected with the temperature sensor, the jet fan and the water pump and is used for controlling the speed of the jet fan for conveying jet air flow or controlling the speed of the water pump for conveying cooling water.
2. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
square heat dissipation holes are uniformly formed in the peripheral side wall of the box body, and a dustproof net covers each square heat dissipation hole;
the box body is made of aluminum alloy.
3. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
a supporting panel is arranged inside the box body;
the supporting panel comprises a panel main body and side plates which are respectively arranged at two sides of the panel main body;
the panel main body and the two side plates are integrally formed;
each side plate is provided with a plurality of side plate screw holes;
inner wall surface screw holes are formed in the two opposite inner wall surfaces in the box body at positions corresponding to the side plate screw holes one by one;
each side plate screw hole is sequentially connected with the corresponding inner wall surface screw hole through screws, so that the supporting panel can be fixedly arranged inside the box body.
4. The variable frequency power supply device capable of automatically dissipating heat according to claim 3, wherein:
a plurality of hollow holes are uniformly formed in the surface of the panel main body;
the panel main body and the side plates are made of aluminum alloy.
5. The variable frequency power supply device capable of automatically dissipating heat according to claim 3, wherein:
the variable frequency power supply is fixed above the supporting panel through heat-conducting silica gel in a bonding mode.
6. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
the length of the semiconductor refrigerating sheet is 5cm-8cm, and the width of the semiconductor refrigerating sheet is 3cm-4 cm.
7. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
the temperature sensor is a thermal resistance type temperature sensor or a thermocouple type temperature sensor.
8. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
the water cooling pipe comprises a main pipe body, and a water inlet and a water outlet which are respectively arranged at two ends of the main pipe body;
the main pipe body is positioned in the box body, and the pipe diameter of the main pipe body is 1cm-2 cm;
the water pump is arranged at the water inlet.
9. The variable frequency power supply device capable of automatically dissipating heat according to claim 8, wherein:
the main pipe body is a plastic pipe body.
10. The variable frequency power supply device capable of automatically dissipating heat according to claim 1, wherein:
the water pump is a variable frequency water pump.
Priority Applications (1)
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CN202122423582.2U CN215817959U (en) | 2021-10-09 | 2021-10-09 | Variable frequency power supply device capable of automatically radiating heat |
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CN202122423582.2U CN215817959U (en) | 2021-10-09 | 2021-10-09 | Variable frequency power supply device capable of automatically radiating heat |
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CN202122423582.2U Active CN215817959U (en) | 2021-10-09 | 2021-10-09 | Variable frequency power supply device capable of automatically radiating heat |
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2021
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