CN215771079U - Cooling structure of etching disc - Google Patents
Cooling structure of etching disc Download PDFInfo
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- CN215771079U CN215771079U CN202122187837.XU CN202122187837U CN215771079U CN 215771079 U CN215771079 U CN 215771079U CN 202122187837 U CN202122187837 U CN 202122187837U CN 215771079 U CN215771079 U CN 215771079U
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- cooling
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- outer ring
- ring cooling
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Abstract
The utility model discloses an etching disc cooling structure, which comprises a front surface sheet for placing a wafer and a back surface sheet for introducing inert gas to cool an etching disc, wherein a group of air holes leading to the front surface sheet are formed in the back surface sheet; the outer ring cooling concave ring is provided with a group of outer ring cooling sub concave rings, the outer ring cooling sub concave rings are tangent to and communicated with the inner ring cooling concave rings, an outer ring cooling groove is arranged at the tangent position, and the outer ring cooling groove extends to the other end of the outer ring cooling sub concave rings along the diameter direction. According to the utility model, through the adjustment of the back sheet structure, the temperature uniformity of the etching disc is ensured, and the etching uniformity of the wafer is further improved. Can be widely applied to the field of wafer etching processing.
Description
Technical Field
The utility model relates to the field of substrate processing equipment, in particular to an etching disc cooling structure.
Background
The etching disc is used for containing the wafer in the etching process of the wafer, then is placed in an etching cavity of the etching machine for etching, and etching gas acts on the wafer from the upper part to etch the wafer during etching. Meanwhile, inert gas needs to be introduced below the etching disc to cool the etching disc, so that the over-high temperature of the etching disc is avoided. The bottom of the existing etching disc is of a smooth surface structure, so that the cooling speed of each part is consistent, but in the actual use process, the temperature of the outer ring of the etching disc is higher than that of the middle area, which is caused by the environment of the etching cavity, so that the etching rates of the outer ring and the inner ring of the etching disc are inconsistent, and the etching quality of a product is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide an etching disk cooling structure, which solves the problem that the etching uniformity of a wafer is influenced due to inconsistent temperature of the existing etching disk.
The technical scheme adopted by the utility model for solving the technical problems is as follows: an etching disc cooling structure comprises a front surface sheet for placing a wafer and a back surface sheet for introducing inert gas to cool an etching disc, wherein a group of air holes leading to the front surface sheet are formed in the back surface sheet, an inner ring cooling concave ring and an outer ring cooling concave ring which are concentric with the etching disc are arranged on the back surface sheet, a group of inner ring cooling grooves arranged along the radius direction of the etching disc are connected and arranged on the inner ring cooling concave ring, and the inner ring cooling grooves are converged at the circle center of the etching disc; the outer ring cooling concave ring is provided with a group of outer ring cooling sub concave rings, the outer ring cooling sub concave rings are tangent to and communicated with the inner ring cooling concave rings, an outer ring cooling groove is arranged at the tangent position, and the outer ring cooling groove extends to the other end of the outer ring cooling sub concave rings along the diameter direction.
Furthermore, at least one ring of cooling circular arcs is arranged on the outer ring cooling concave ring and in each outer ring cooling sub-concave ring, and the cooling circular arcs are intersected with the outer ring cooling groove.
Preferably, the inner ring cooling grooves are uniformly provided with 3 cooling grooves along the inner ring cooling concave ring, and the intersection of each inner ring cooling groove and the inner ring cooling concave ring is provided with an air inlet.
Further, at least one inner ring cooling concave ring is concentrically arranged in the inner ring cooling concave ring.
Preferably, the inner ring cooling concave ring and the outer ring cooling concave ring have the same width, and the width of the inner ring sub cooling concave ring is smaller than that of the outer ring sub cooling concave ring.
The utility model has the beneficial effects that: according to the utility model, through design adjustment of the cooling lines of the back surface piece of the etching disc, the contact area between the outer ring of the etching disc and the inert gas and the amount of the inert gas are increased, so that the heat dissipation speed of the outer ring is improved, the integral temperature of the etching disc is kept consistent, and the problem of inconsistent etching speed caused by the fact that the temperature of the outer ring of the etching disc is higher than that of the inner ring due to the etching cavity structure of the outer ring is solved.
The utility model will be explained in more detail below with reference to the drawings and examples.
Drawings
FIG. 1 is a schematic view of a front sheet of the present invention.
Figure 2 is a schematic view of a back sheet of the present invention.
Detailed Description
In an embodiment, as shown in fig. 1 and fig. 2, an etching disk cooling structure includes a front surface sheet 1 for placing wafers and a back surface sheet 2 for introducing an inert gas to cool an etching disk, where a group of wafer placing regions 12 and an isolation cooling region 13 disposed between the wafer placing regions 12 are disposed on the front surface sheet 1. The back piece 2 is provided with a group of air holes 3 leading to the front piece 1, the air holes 3 are arranged in the wafer placing area 12 and the isolation cooling area 13 of the front piece 1, and the air holes 3 in the wafer placing area 12 directly cool the wafer. And a circle of air holes 3 in the wafer placing area 12 are arranged along the circumferential direction. The back sheet 2 is provided with an inner ring cooling concave ring 4 and an outer ring cooling concave ring 5 which are concentric with the etching disc, the inner ring cooling concave ring 4 is connected with a group of inner ring cooling grooves 6 which are arranged along the radius direction of the etching disc, and the inner ring cooling grooves 6 converge at the center of the etching disc. The outer ring cooling concave ring 5 is provided with a group of outer ring cooling sub concave rings 7, the outer ring cooling sub concave rings 7 are tangent to and communicated with the inner ring cooling concave ring 4, outer ring cooling grooves 8 are arranged at tangent positions, and the outer ring cooling grooves 8 extend to the other end of the outer ring cooling sub concave rings 7 along the diameter direction.
And at least one cooling arc 9 is also arranged on the outer ring cooling concave ring 5 and in each outer ring cooling sub-concave ring 7, and the cooling arcs 9 are intersected with the outer ring cooling groove 8, so that the contact area of cooling gas is increased. At least one inner ring cooling concave ring 11 is concentrically arranged in the inner ring cooling concave ring 4. The inner ring cooling concave ring 4 and the outer ring cooling concave ring 5 have the same width, and the width of the inner ring cooling concave ring 11 is smaller than that of the outer ring cooling concave ring 7, so that the inert gas in the inner ring cooling concave ring 11 is less than that of the outer ring cooling concave ring 7, and the heat dissipation speed of the inner ring is lower than that of the outer ring. In order to facilitate the inert gas to quickly fill the whole back surface piece 2, the inner ring cooling grooves 6 are uniformly provided with 3 strips along the inner ring cooling concave ring 4, and the intersection of the inner ring cooling grooves 6 and the inner ring cooling concave ring 4 is respectively provided with an air inlet 10.
The utility model is described above with reference to the accompanying drawings. It is to be understood that the specific implementations of the utility model are not limited in this respect. Various insubstantial improvements are made by adopting the method conception and the technical scheme of the utility model; the present invention is not limited to the above embodiments, and can be modified in various ways.
Claims (5)
1. The utility model provides an sculpture dish cooling structure, carries out refrigerated back piece (2) including positive dough sheet (1) that is used for placing the wafer and is used for letting in inert gas to the sculpture dish, be provided with a set of bleeder vent (3) that lead to positive dough sheet (1) on back piece (2), its characterized in that: an inner ring cooling concave ring (4) and an outer ring cooling concave ring (5) which are concentric with the etching disc are arranged on the back sheet (2), a group of inner ring cooling grooves (6) which are arranged along the radius direction of the etching disc are connected and arranged on the inner ring cooling concave ring (4), and the inner ring cooling grooves (6) are converged at the circle center of the etching disc; the outer ring cooling concave ring (5) is provided with a group of outer ring cooling sub concave rings (7), the outer ring cooling sub concave rings (7) are tangent to the inner ring cooling concave ring (4) and communicated with the inner ring cooling concave ring, an outer ring cooling groove (8) is arranged at the tangent position, and the outer ring cooling groove (8) extends to the other end of the outer ring cooling sub concave ring (7) along the diameter direction.
2. The etching disk cooling structure according to claim 1, wherein: and the outer ring cooling concave ring (5) is also at least provided with a ring of cooling circular arcs (9) in each outer ring cooling sub-concave ring (7), and the cooling circular arcs (9) are intersected with the outer ring cooling groove (8).
3. The etching disk cooling structure according to claim 1, wherein: the inner ring cooling groove (6) is uniformly provided with 3 cooling grooves along the inner ring cooling concave ring (4), and the intersection of the inner ring cooling groove (6) and the inner ring cooling concave ring (4) is provided with an air inlet (10).
4. The etching disk cooling structure according to claim 1, wherein: at least one inner ring cooling concave ring (11) is further concentrically arranged in the inner ring cooling concave ring (4).
5. The etching disk cooling structure according to claim 4, wherein: the inner ring cooling concave ring (4) and the outer ring cooling concave ring (5) are the same in width, and the width of the inner ring cooling concave ring (11) is smaller than that of the outer ring cooling concave ring (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122187837.XU CN215771079U (en) | 2021-09-10 | 2021-09-10 | Cooling structure of etching disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122187837.XU CN215771079U (en) | 2021-09-10 | 2021-09-10 | Cooling structure of etching disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215771079U true CN215771079U (en) | 2022-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122187837.XU Active CN215771079U (en) | 2021-09-10 | 2021-09-10 | Cooling structure of etching disc |
Country Status (1)
| Country | Link |
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| CN (1) | CN215771079U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117423599A (en) * | 2023-11-03 | 2024-01-19 | 扬州中科半导体照明有限公司 | Etching disc structure capable of improving etching consistency |
-
2021
- 2021-09-10 CN CN202122187837.XU patent/CN215771079U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117423599A (en) * | 2023-11-03 | 2024-01-19 | 扬州中科半导体照明有限公司 | Etching disc structure capable of improving etching consistency |
| CN117423599B (en) * | 2023-11-03 | 2024-03-22 | 扬州中科半导体照明有限公司 | Etching disc structure capable of improving etching consistency |
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