CN215769602U

CN215769602U - Micro-service infrastructure system

Info

Publication number: CN215769602U
Application number: CN202122077439.2U
Authority: CN
Inventors: 代强; 王娟; 刘勇
Original assignee: Chengdu Zhonglan Information Technology Co ltd
Current assignee: Chengdu Zhonglan Information Technology Co ltd
Priority date: 2021-08-31
Filing date: 2021-08-31
Publication date: 2022-02-08
Anticipated expiration: 2031-08-31

Abstract

The utility model discloses a micro-service infrastructure system, which comprises a mechanism box, wherein a micro-service infrastructure system unit is fixedly installed on the inner wall of the mechanism box, a baffle is fixedly connected to the inner wall of the mechanism box, a shell is fixedly connected to the left side surface of the mechanism box, a partition is fixedly connected to the inner wall of the shell, the right side surface of the partition is fixedly connected with the left side surface of the mechanism box, a fixed shell is fixedly connected to the left side surface of the shell, a semiconductor refrigeration sheet is fixedly connected to the inner side wall of the fixed shell, the cold end of the semiconductor refrigeration sheet penetrates through the shell and extends to the inside of the shell, a liquid pump is fixedly connected to the inner bottom wall of the shell, and the input end of the liquid pump penetrates through the partition and extends to the upper part of the partition. The micro-service infrastructure system improves the cooling effect of the micro-service infrastructure system unit, solves the problem that the running speed is influenced by overhigh temperature, and enables the micro-service infrastructure system unit to better perform micro-service work.

Description

Micro-service infrastructure system

Technical Field

The utility model belongs to the technical field of internet, and particularly relates to a micro-service infrastructure system.

Background

The internet refers to the result of mutually linking two computers or more than two computer terminals, clients and servers by means of computer information technology, people can send mails to friends far away from thousands of miles to finish a work and a common entertainment, with the development of mobile internet and the popularization of application cloud, micro services become the most popular design concept of application service architecture, are simply fine-grained independent services, are independently deployed in the micro service architecture, are independently developed, tested and changed, have own data, are the micro service architecture, however, a micro service infrastructure system unit can generate larger heat in the long-time running process, but the cooling effect of the current micro service infrastructure system unit is poor, therefore, the running speed of the micro-service infrastructure system unit can be influenced by overhigh temperature, and therefore, the micro-service infrastructure system is provided for solving the problems.

Disclosure of Invention

The utility model provides a micro-service infrastructure system unit, which aims to solve the problems that the micro-service infrastructure system unit generates larger heat in the long-time operation process, but the cooling effect of the existing micro-service infrastructure system unit is poor, so that the operation speed of the micro-service infrastructure system unit is influenced by overhigh temperature.

The micro-service infrastructure system comprises a mechanism box, wherein a micro-service infrastructure system unit is fixedly arranged on the inner wall of the mechanism box, the inner wall of the mechanism box is fixedly connected with a baffle plate, the left side surface of the mechanism box is fixedly connected with a shell, the inner wall of the shell is fixedly connected with a clapboard, the right side surface of the clapboard is fixedly connected with the left side surface of the mechanism box, the left side surface of the shell is fixedly connected with a fixed shell, the inner side wall of the fixed shell is fixedly connected with a semiconductor refrigeration piece, the cold end of the semiconductor refrigerating sheet penetrates through the shell and extends into the shell, the inner bottom wall of the shell is fixedly connected with a liquid pump, the input end of the liquid pump penetrates through the partition plate and extends to the upper side of the partition plate, the output end of the liquid pump is fixedly communicated with a conveying pipe, and the bottom surface of the mechanism box is fixedly connected with a supporting box.

The one end that the drawing liquid pump was kept away from to the conveyer pipe runs through casing, support case and mechanism case in proper order and extends to the inside of mechanism case, the fixed intercommunication of one end that the drawing liquid pump was kept away from to the conveyer pipe has the refrigeration pipe, the one end that the conveyer pipe was kept away from to the refrigeration pipe runs through baffle and mechanism case in proper order and extends to the inside of casing.

The mechanism box is characterized in that a fan is fixedly embedded in the upper surface of the mechanism box, symmetrical supporting blocks are fixedly connected to the upper surface of the supporting box, clamping holes are formed in one side face, close to each other, of the supporting blocks, and dust filtering cotton plates are clamped on the inner walls of the clamping holes together.

Two air inlets are formed in the bottom surface of the supporting box, the two air inlets are located below the air inlet fan, heat dissipation holes are formed in the right side surface of the mechanism box, and grids are fixedly connected to the inner walls of the heat dissipation holes.

The inner bottom wall of the mechanism box is fixedly connected with symmetrical supporting plates, the upper surfaces of the two supporting plates are fixedly connected with the bottom surface of the baffle, and one side surface, far away from the supporting plates, of the two supporting plates is provided with ventilation openings which are arranged equidistantly.

The upper surface of casing has seted up the water injection hole, the inner wall threaded connection of water injection hole has the sealing plug, the ventilation hole has been seted up to the bottom surface of set casing, the bottom surface fixedly connected with symmetrical supporting seat of supporting box.

Compared with the prior art, the utility model has the beneficial effects that: the cooling water can be stored through the arranged shell, the liquid pump can be installed at the same time, the effect of cooling treatment on the cooling water is achieved through the arranged semiconductor refrigeration piece, the cooling water can circulate in the refrigeration pipe through the liquid pump and the conveying pipe, heat generated by the interior of the shell and the micro-service infrastructure system unit can be driven, the shell and the micro-service infrastructure system unit can be cooled rapidly, external air can be sucked through the arranged air inlet fan and matched with the cooling water in the conveying pipe, cold air can be formed by refrigerating the air, the formed cold air is utilized, the effect of blowing the working area of the micro-service infrastructure system unit for cooling is achieved, the cooling effect of the micro-service infrastructure system unit is improved, and the problem that the operating speed is influenced by overhigh temperature of the micro-service infrastructure system unit is avoided, the microservice infrastructure system set will be better microservice worked.

Drawings

FIG. 1 is a schematic perspective view of a mechanism box according to the present invention;

FIG. 2 is a cross-sectional view of a front view of the mechanism housing of the present invention;

FIG. 3 is a cross-sectional view of a front view of the support box of the present invention.

In the figure: 1. a mechanism box; 2. a micro-service infrastructure system unit; 3. a housing; 4. a partition plate; 5. a semiconductor refrigeration sheet; 6. a stationary case; 7. a liquid pump; 8. a delivery pipe; 9. a support box; 10. a refrigeration pipe; 11. a fan inlet; 12. a support block; 13. a clamping hole; 14. a dust filtration cotton plate; 15. an air inlet hole; 16. heat dissipation holes; 17. a grid; 18. a support plate; 19. a vent; 20. a baffle plate; 21. a water injection hole; 22. a sealing plug; 23. a vent hole; 24. and (4) supporting the base.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

Referring to fig. 1-3, a micro-service infrastructure system includes a mechanism box 1, a micro-service infrastructure system unit 2 is fixedly mounted on an inner wall of the mechanism box 1, a baffle 20 is fixedly connected to an inner wall of the mechanism box 1, a housing 3 is fixedly connected to a left side surface of the mechanism box 1, a partition 4 is fixedly connected to an inner wall of the housing 3, a right side surface of the partition 4 is fixedly connected to a left side surface of the mechanism box 1, a fixing housing 6 is fixedly connected to a left side surface of the housing 3, a semiconductor refrigeration sheet 5 is fixedly connected to an inner side wall of the fixing housing 6, a cold end of the semiconductor refrigeration sheet 5 penetrates through the housing 3 and extends to the inside of the housing 3, a liquid pump 7 is fixedly connected to an inner bottom wall of the housing 3, an input end of the liquid pump 7 penetrates through the partition 4 and extends to the upper side of the partition 4, an output end of the liquid pump 7 is fixedly communicated with a delivery pipe 8, and a support box 9 is fixedly connected to a bottom surface of the mechanism box 1.

In the utility model, one end of a conveying pipe 8, which is far away from a liquid pump 7, sequentially penetrates through a shell 3, a supporting box 9 and a mechanism box 1 and extends to the inside of the mechanism box 1, one end of the conveying pipe 8, which is far away from the liquid pump 7, is fixedly communicated with a refrigerating pipe 10, one end of the refrigerating pipe 10, which is far away from the conveying pipe 8, sequentially penetrates through a baffle 20 and the mechanism box 1 and extends to the inside of the shell 3, so that refrigerated cooling water can be better conveyed, meanwhile, the cooling water can be circulated, a fan 11 is fixedly embedded on the upper surface of the cooling mechanism box 1, which is better for a micro-service basic framework system unit 2, symmetrical supporting blocks 12 are fixedly connected to the upper surface of the supporting box 9, clamping holes 13 are respectively formed in one side surface, which is close to each other, dust-filtering cotton plates 14 are clamped together on the inner walls of the two clamping holes 13, so as to play a role in dual cooling of the micro-service basic framework system unit 2, the dust filtering cotton plate 14 can filter dust of the sucked gas, so that the effect of effective dust removal is achieved.

The bottom surface of the supporting box 9 is provided with two air inlet holes 15, the two air inlet holes 15 are both positioned below the air inlet fan 11, the right side surface of the mechanism box 1 is provided with a heat dissipation hole 16, the inner wall of the heat dissipation hole 16 is fixedly connected with a grid 17 which can better ventilate the mechanism box 1, the heat inside the mechanism box 1 can be quickly dissipated through the heat dissipation hole 16, the inner bottom wall of the mechanism box 1 is fixedly connected with symmetrical supporting plates 18, the upper surfaces of the two supporting plates 18 are fixedly connected with the bottom surface of a baffle plate 20, one side surface of the two supporting plates 18 which are far away from each other is provided with ventilation openings 19 which are arranged at equal intervals, the refrigeration pipe 10 and the micro-service infrastructure system unit 2 can be preliminarily blocked, the problem that the micro-service infrastructure system unit 2 is affected with damp due to leaked water stains is avoided, the upper surface of the shell 3 is provided with a water injection hole 21, the inner wall of the water injection hole 21 is connected with a sealing plug 22 through threads, vent 23 has been seted up to the bottom surface of set casing 6, and the symmetrical supporting seat 24 of bottom surface fixedly connected with of supporting box 9 makes the cooling water pour into fast through water injection hole 21, has strengthened the stability of mechanism case 1 bottom through supporting seat 24.

The working principle of the utility model is as follows: when the micro-service infrastructure system unit 2 is cooled, the semiconductor refrigerating sheet 5, the liquid pump 7 and the air inlet fan 11 are firstly communicated with a power supply, then the sealing plug 22 is taken down, cooling water is injected through the water injection hole 21, then the semiconductor refrigerating sheet 5 is started to work, the cooling water in the shell 3 can be refrigerated, after the cooling water is refrigerated, the liquid pump 7 is started to operate, the cooling water can be pumped in and can be conveyed and circulated through the conveying pipe 8 and the refrigerating pipe 10, therefore, the temperature of the inside of the mechanism box 1 and the operation area of the micro-service infrastructure system unit 2 can be effectively reduced by utilizing the circulation of the cooling water in the refrigerating pipe 10, meanwhile, the air outside can be sucked by utilizing the work of the air inlet fan 11, and when the air circulates on the surface of the conveying pipe 8, the air can be refrigerated to form cold air by utilizing the cooling water in the conveying pipe 8, therefore, the cold air can blow the micro-service infrastructure system unit 2 again, and the effect of quickly cooling the micro-service infrastructure system unit 2 is achieved.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. Microservice infrastructure system, including mechanism case (1), its characterized in that: the mechanism comprises a mechanism box (1), a micro-service basic framework system unit (2) is fixedly mounted on the inner wall of the mechanism box (1), a baffle (20) is fixedly connected to the inner wall of the mechanism box (1), a shell (3) is fixedly connected to the left side face of the mechanism box (1), a partition (4) is fixedly connected to the inner wall of the shell (3), the right side face of the partition (4) is fixedly connected to the left side face of the mechanism box (1), a fixing shell (6) is fixedly connected to the left side face of the shell (3), a semiconductor refrigerating sheet (5) is fixedly connected to the inner side wall of the fixing shell (6), the cold end of the semiconductor refrigerating sheet (5) penetrates through the shell (3) and extends to the inside of the shell (3), an extraction pump (7) is fixedly connected to the inner bottom wall of the shell (3), and the input end of the extraction pump (7) penetrates through the partition (4) and extends to the upper side of the partition (4), the output end of the liquid pump (7) is fixedly communicated with a conveying pipe (8), and the bottom surface of the mechanism box (1) is fixedly connected with a supporting box (9).

2. The microservice infrastructure system of claim 1, wherein: casing (3), support box (9) and mechanism case (1) are run through in proper order to the one end that drawing liquid pump (7) were kept away from in conveyer pipe (8) and the inside of extending to mechanism case (1), the fixed intercommunication of one end that drawing liquid pump (7) were kept away from in conveyer pipe (8) has refrigeration pipe (10), the one end that conveyer pipe (8) were kept away from in proper order in refrigeration pipe (10) runs through baffle (20) and mechanism case (1) and extends to the inside of casing (3).

3. The microservice infrastructure system of claim 1, wherein: the upper surface of mechanism case (1) is fixed to be inlayed and is had into fan (11), the upper surface fixed connection of supporting box (9) has symmetrical supporting shoe (12), two card hole (13) have all been seted up to a side that supporting shoe (12) are close to each other, two the common joint of inner wall in card hole (13) has strain dirt cotton board (14).

4. Microservice infrastructure system according to claims 1 and 3, characterized in that: two air inlet holes (15) have been seted up to the bottom surface of supporting box (9), two air inlet holes (15) all are located the below of fan (11), louvre (16) have been seted up to the right flank of mechanism case (1), the inner wall fixedly connected with grid (17) of louvre (16).

5. The microservice infrastructure system of claim 1, wherein: the inner bottom wall of the mechanism box (1) is fixedly connected with symmetrical support plates (18), the upper surfaces of the two support plates (18) are fixedly connected with the bottom surface of a baffle (20), and one side surface, far away from each other, of the two support plates (18) is provided with ventilation openings (19) which are arranged equidistantly.

6. The microservice infrastructure system of claim 1, wherein: water injection hole (21) have been seted up to the upper surface of casing (3), the inner wall threaded connection of water injection hole (21) has sealing plug (22), ventilation hole (23) have been seted up to the bottom surface of set casing (6), the bottom surface fixedly connected with symmetrical supporting seat (24) of supporting box (9).