CN215760209U

CN215760209U - Heating floor

Info

Publication number: CN215760209U
Application number: CN202121770795.6U
Authority: CN
Inventors: 李永武; 杨敏
Original assignee: Guangzhi Technology Beijing Co ltd
Current assignee: Guangzhi Technology Beijing Co ltd
Priority date: 2021-07-30
Filing date: 2021-07-30
Publication date: 2022-02-08
Anticipated expiration: 2031-07-30

Abstract

The embodiment of the utility model provides a heating wood floor. The heating wood floor comprises a base material, a heating chip and a surface layer, wherein the heating chip is arranged on the base material and comprises an electric-heat conversion material and a first substrate, the electric-heat conversion material is covered on the first substrate through vacuum coating to form a conductive layer, and the first substrate is packaged to form the heating chip; the surface layer covers the heating chip; wherein the bottom layer and/or the surface layer comprise wood resource materials subjected to carbonization treatment. According to the heating wood floor, the heating chip generates heat after being electrified to achieve the heating effect, and the base material and/or the surface layer are/is carbonized, so that deformation of the base material and/or the surface layer caused by heating of the heating chip is effectively reduced.

Description

Heating floor

Technical Field

The utility model relates to the technical field of household building materials, in particular to a heating floor.

Background

At present, the south is cold and moist in winter, and no effective heating measures are available except for using an air conditioner in the south. Therefore, most southern areas use air conditioners for heating without floor heating. But compare with warm up, the air conditioner heats according to from the top down mode, can cause the heat to produce inhomogeneous, can produce the body to the people moreover and feel uncomfortable, and the scope of being heated of air conditioner receives the restriction moreover, and heat utilization rate is low, can produce the noise in the air conditioner operation moreover. Meanwhile, heating elements are directly placed below the wood floor in partial areas to reach the effect of floor heating, but the wood floor is simply heated, so that the wood floor is greatly deformed, and the damage which cannot be compensated is caused.

SUMMERY OF THE UTILITY MODEL

Embodiments of the present invention provide a heating floor to solve one or more technical problems in the prior art.

In a first aspect, an embodiment of the present invention provides a heating floor, including:

a bottom layer;

the heating chip is arranged on the bottom layer and comprises an electrothermal conversion material and a first substrate, the electrothermal conversion material covers the first substrate through vacuum coating to form a conducting layer, the first substrate is packaged to form the heating chip, and the heating chip is used for generating heat after being electrified;

the surface layer covers the heating chip; wherein the bottom layer and/or the surface layer comprise a wood resource material subjected to carbonization treatment.

In a second aspect, an embodiment of the present invention provides a heating floor, including:

a bottom layer;

the surface layer covers the heating chip; wherein the thickness of the bottom layer is the same as that of the surface layer.

In a preferred embodiment, the thickness range of the conductive layer includes 10nm to 1000nm, and the thickness range of the heat-generating chip includes 200um to 1000 um.

In a preferred embodiment, the heating floor further comprises a balance layer, the balance layer is arranged below the bottom layer, and the balance layer comprises a wood resource material subjected to carbonization treatment.

In a preferred embodiment, the wood resource material includes wood, bamboo, vines, roots and stems of shrubs, various crop stalks, reinforced wood, composite solid wood, cork, and wood-plastic materials.

In a preferred embodiment, the thickness of the surface layer ranges from 0.6mm to 5mm, and the thickness of the heating floor ranges from 8mm to 22 mm.

In a preferred embodiment, the heating floor further comprises a second substrate disposed between the bottom layer and the balancing layer, and the first substrate and the second substrate are the same in thickness and material.

In a preferred embodiment, the first and second substrates comprise PET material.

In a preferred embodiment, the heating floor further comprises a first protective layer covering the exposed surface of the top layer and a second protective layer covering the exposed surface of the balancing layer.

In a preferred embodiment, the first and second protective layers comprise thermosetting resin impregnated paper.

One of the above technical solutions has the following advantages or beneficial effects: the heating wood floor can generate heat after the heating chip is electrified to achieve the heating effect, and the bottom layer and/or the surface layer are/is carbonized, so that the deformation of the bottom layer and/or the surface layer caused by the heating of the heating chip is effectively reduced.

The foregoing summary is provided for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and following detailed description.

Drawings

In the drawings, like reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily to scale. It is appreciated that these drawings depict only some embodiments in accordance with the disclosure and are therefore not to be considered limiting of its scope.

Fig. 1 shows a schematic cross-sectional view of a heating floor according to an embodiment of the utility model.

Fig. 2 shows another cross-sectional view of a heating floor according to an embodiment of the present invention.

Reference numerals:

110. a surface layer; 120. A heat generating chip; 130. A bottom layer;

140. a balancing layer; 150. A second substrate; 160. A first protective layer;

170. and a second protective layer.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In a first aspect, referring to fig. 1, an embodiment of the present invention provides a heating floor, which includes a bottom layer 130, a heat-generating chip 120, and a surface layer 110.

The heating chip 120 is disposed on the bottom layer 130, the heating chip 120 includes an electrothermal conversion material and a first substrate, the electrothermal conversion material is covered on the first substrate by vacuum coating to form a conductive layer, the first substrate is packaged to form the heating chip 120, and the heating chip 120 is configured to generate heat after being powered on.

The surface layer 110 covers the heat generating chip 120; wherein the bottom layer 130 and/or the surface layer 110 comprise a wood resource material subjected to carbonization treatment.

In the heating wood floor in this embodiment, the heating chip 120 is powered on to generate heat to achieve a heating effect, and the bottom layer 130 and/or the surface layer 110 are carbonized, so that deformation of the bottom layer 130 and/or the surface layer 110 caused by temperature rise of the heating chip 10 is effectively reduced.

In a second aspect, referring to fig. 1, an embodiment of the present invention provides a heating floor, which includes a bottom layer 130, a heat generating chip 120, and a surface layer 110.

In the heating wood floor in this embodiment, the heating chip 120 is powered on to generate heat to achieve a heating effect, and the thicknesses of the bottom layer 130 and/or the surface layer 110 are the same, so that the generated stresses are consistent, thereby effectively reducing the deformation of the bottom layer 130 and/or the surface layer 110 caused by the temperature rise of the heating chip 10.

In a specific embodiment, the thickness range of conducting layer includes 10nm ~ 1000nm, the thickness range of the chip 120 that generates heat includes 200um ~ 1000um, and the conducting layer that this embodiment adopted vacuum sputtering to make can reach the nanometer, is the totally different technique with the resistance heating among the prior art, can reach more effectively thinner, and direct veneer can not influence floor thickness in the floor at all moreover.

In a specific embodiment, referring to fig. 2, the heating floor further includes a balance layer 140, the balance layer 140 is disposed under the bottom layer 130, and the balance layer 140 includes a wood resource material that is carbonized, so that the balance layer 140 is not deformed by heating.

In one embodiment, the wood resource material includes wood, bamboo, vines, roots and stems of shrubs, various crop stalks, reinforced wood, composite solid wood, cork, and wood-plastic materials.

In a specific embodiment, the thickness of the surface layer 110 ranges from 0.6mm to 5mm, and the thickness of the heating floor ranges from 8mm to 22 mm.

In a specific embodiment, referring to fig. 2, the heating floor further comprises a second substrate 150, the second substrate 150 is disposed between the bottom layer 130 and the balance layer 140, and the thickness and the material of the first substrate and the second substrate 150 are the same.

In a particular embodiment, the first and second substrates 150 comprise a PET material.

In a specific embodiment, referring to fig. 2, the heating floor further includes a first protective layer 160 and a second protective layer 170, wherein the first protective layer 160 covers the exposed surface of the top layer 110, and the second protective layer 170 covers the exposed surface of the balance layer 140.

In a particular embodiment, the first protective layer 160 and the second protective layer 170 comprise thermosetting resin impregnated paper.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive various changes or substitutions within the technical scope of the present invention, and these should be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims

1. A heating floor, comprising:

a bottom layer;

2. A heating floor, comprising:

a bottom layer;

3. The heating floor as claimed in claim 1 or 2, wherein the thickness range of the conductive layer includes 10nm to 1000nm, and the thickness range of the heat generating chip includes 200um to 1000 um.

4. The heating floor as in claim 1 or 2, further comprising a balancing layer disposed below the bottom layer, the balancing layer comprising a carbonized wood resource material.

5. The heating floor as claimed in claim 4, wherein the wood resource material includes wood, bamboo, vine, rhizomes of shrubs, various crop stalks, reinforced wood, composite solid wood, cork and wood-plastic material.

6. The heating floor of claim 4, wherein the surface layer has a thickness ranging from 0.6mm to 5mm, and the heating floor has a thickness ranging from 8mm to 22 mm.

7. The heating floor of claim 4, further comprising a second substrate disposed between the base layer and the balancing layer, wherein the first substrate and the second substrate are the same thickness and material.

8. The heating floor of claim 7, wherein the first substrate and the second substrate comprise a PET material.

9. The heating floor of claim 4, further comprising a first protective layer overlying the exposed surface of the face layer and a second protective layer overlying the exposed surface of the balancing layer.

10. The heating floor as in claim 9, wherein the first protective layer and the second protective layer comprise thermosetting resin impregnated paper.