CN215750096U - Cutting mechanism and cutting equipment - Google Patents
Cutting mechanism and cutting equipment Download PDFInfo
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- CN215750096U CN215750096U CN202121723256.7U CN202121723256U CN215750096U CN 215750096 U CN215750096 U CN 215750096U CN 202121723256 U CN202121723256 U CN 202121723256U CN 215750096 U CN215750096 U CN 215750096U
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Abstract
The utility model relates to a cutting mechanism and cutting equipment, wherein the cutting mechanism comprises a cutting rack and a cutting operation assembly arranged on the cutting rack; the cutting operation assembly comprises two cutting units and a cutting driving unit, the cutting units comprise cutting lines, the cutting lines of the two cutting units are arranged side by side, the distance between the cutting lines of the two cutting units is a preset value, and the cutting driving unit is arranged along the width direction of the silicon material and used for driving the cutting lines to cut the silicon material into strips along the length direction of the silicon material. Different from the prior art, the cutting driving unit can be arranged along the width direction of the silicon material, and the cutting driving unit can be arranged between two cutting lines, so that the structure of the cutting mechanism is more compact, the space is saved, and the arrangement of the cutting mechanism is convenient.
Description
Technical Field
The utility model relates to the field of silicon ingot cutting, in particular to a cutting mechanism and cutting equipment.
Background
In the conventional silicon wafer manufacturing process, taking a polysilicon product as an example, generally, the general operation procedures may include: firstly, using a silicon ingot squarer to perform squaring operation on a primary silicon ingot (large-size silicon ingot) so as to form a secondary silicon ingot (small-size silicon ingot); after the squaring is finished, cutting off the secondary silicon ingot by using a silicon ingot cutting machine to form a polycrystalline silicon rod; then, corresponding grinding operations (such as surface grinding, chamfering, barreling and the like) are carried out on each polycrystalline silicon rod, so that the surface shaping of the polycrystalline silicon rods can meet the requirements of corresponding flatness and dimensional tolerance; and subsequently, slicing the polycrystalline silicon rod by using a slicing machine to obtain the polycrystalline silicon slice.
In the process of implementing the utility model, the inventor finds that the following problems exist in the prior art:
when the cutting mechanism of the silicon ingot squarer in the prior art adopts double-line cutting, a driving unit is not reasonably arranged, so that the cutting mechanism occupies a large space and is not beneficial to the arrangement of the cutting mechanism.
SUMMERY OF THE UTILITY MODEL
Therefore, a cutting mechanism and a cutting device are needed to be provided, and the technical problems that the floor space of the cutting mechanism is large and the arrangement of the cutting mechanism is not facilitated due to the fact that a driving unit is not reasonably arranged in the prior art are solved.
In order to achieve the above object, the inventor provides a cutting mechanism, which comprises a cutter frame and a cutting operation assembly arranged on the cutter frame;
the cutting operation assembly comprises two cutting units and a cutting driving unit, the cutting units comprise cutting lines, the cutting lines of the two cutting units are arranged side by side, the distance between the cutting lines of the two cutting units is a preset value, and the cutting driving unit is arranged along the width direction of the silicon material and used for driving the cutting lines to cut the silicon material into strips along the length direction of the silicon material.
Be different from prior art, the technical scheme of this application sets up side by side through the line of cut of two cutting units, and the interval between the line of cut of two cutting units is the default, can realize the simultaneous cutting of double-line. The cutting driving unit is arranged along the width direction of the silicon material and is used for driving the cutting line to cut the silicon material into long strips along the length direction of the silicon material; so, can set up cutting drive unit along the width direction of silicon material, cutting drive unit can set up between two line of cut, makes cutting mechanism's structure compacter, saves space, makes things convenient for cutting mechanism's arrangement.
As an embodiment of the present invention, the cutting operation assembly includes a cutting panel and two cutting driving units, the two cutting driving units are disposed on the cutting panel in a staggered manner, output shafts of the two cutting driving units face opposite directions, and the two cutting driving units drive one cutting line respectively.
As an embodiment of the present invention, the cutting panel includes a bottom plate, the bottom plate is provided with a mounting hole, the two cutting driving units are a first cutting driving unit and a second cutting driving unit, the first cutting driving unit is mounted on an upper surface of the bottom plate, and the second cutting driving unit is mounted on the mounting hole.
As an embodiment of the present invention, the two cutting units respectively include a main driving wheel, a sub driving wheel and a tensioning member, the main driving wheel, the sub driving wheel and the tensioning member are respectively disposed on the cutting panel, the cutting lines are respectively looped around the main driving wheel, the sub driving wheel and the tensioning member, and the first cutting driving unit and the second cutting driving unit respectively drive the main driving wheel of the cutting unit to rotate through a synchronous belt, so as to drive the cutting lines to move around the loop.
As an embodiment of the present invention, two cutting units are respectively located at both sides of the cutting panel.
As an embodiment of the present invention, the cutting mechanism further includes a cutting feed mechanism disposed on the cutting frame, the cutting frame is provided with a cutting track, and the cutting feed mechanism is configured to drive the cutting running assembly to relatively slide along an extending direction of the cutting track.
As an embodiment of the present invention, the cutting mechanism includes more than two cutting operation assemblies and more than two cutting feeding mechanisms, and the cutting frame is provided with more than two cutting tracks;
the cutting operation components are arranged on the cutting machine frame through the cutting tracks respectively, and each cutting operation component is provided with one cutting feeding mechanism independently.
As an embodiment of the present invention, the distance between the cutting lines of the adjacent cutting travel assemblies is also a preset value.
As an embodiment of the present invention, the cutting running assembly is disposed on the cutting track through a sliding seat, the cutting feed mechanism includes a cutting motor, and the cutting feed mechanism is used for driving the cutting running assembly to relatively slide along the extending direction of the cutting track through the cooperation of the cutting motor and the sliding seat and the lead screw.
To achieve the above object, the inventors also provide a cutting apparatus, such as the cutting mechanism of any one of the above-mentioned inventors.
Be different from prior art, the cutting equipment of the technical scheme of this application sets up side by side through the line of cut of two cutting units, and the interval between the line of cut of two cutting units is the default, can realize the double-line and cut simultaneously. The cutting driving unit is arranged along the width direction of the silicon material and is used for driving the cutting line to cut the silicon material into long strips along the length direction of the silicon material; so, can set up cutting drive unit along the width direction of silicon material, cutting drive unit can set up between two line of cut, makes cutting mechanism's structure compacter, saves space, makes things convenient for cutting mechanism's arrangement.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present application, and it is obvious for a person skilled in the art to obtain other drawings based on the drawings without any creative effort.
FIG. 1 is a perspective view of a cutting apparatus according to one embodiment of the present application;
FIG. 2 is a front view of a cutting apparatus according to one embodiment of the present application;
FIG. 3 is a schematic structural view of a cutting operation assembly according to one embodiment of the present application;
FIG. 4 is a schematic structural view of a cutting feed mechanism according to an embodiment of the present application;
fig. 5 is a perspective view of a silicon material table positioning mechanism according to an embodiment of the present application.
Description of reference numerals:
11. a main driving wheel which is used for driving the main driving wheel,
12. the tension component is arranged on the base plate,
13. a cutting driving unit for driving the cutting blade,
15. from the position of the drive wheel(s),
16. the cutting of the panel is carried out by cutting the panel,
161. a bottom plate, a plurality of first connecting plates,
162. a mounting hole is formed in the base plate,
17. the cutting line is provided with a cutting line,
18. the cutting mechanism is used for cutting the workpiece,
181. the cutting machine frame is provided with a cutting machine frame,
1811. the track is cut out and the cutting is carried out,
182. the cutting operation component is used for cutting the workpiece,
1821. a sliding seat is arranged on the sliding seat,
183. a cutting and feeding mechanism is arranged on the cutting and feeding mechanism,
1831. a cutting motor is arranged on the cutting machine,
1832. a screw rod is arranged on the screw rod,
19. a silicon material table positioning mechanism is arranged on the silicon material table,
191. a movable clamping component which is arranged on the base,
192. the clamping component is fixed and the clamping component is fixed,
194. and positioning the frame.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
In the description of the present application, unless explicitly stated or limited otherwise, the terms "first", "second", and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless specified or indicated otherwise; the terms "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, integrally connected, or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present embodiment can be understood by those of ordinary skill in the art according to specific situations.
In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described with reference to the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element via an intermediate element.
The direction indicated by the arrow x in the figure is the width direction of the silicon material, the direction indicated by the arrow y in the figure is the length direction of the silicon material, and the direction indicated by the arrow z in the figure is the thickness direction of the silicon material.
When the cutting mechanism of the silicon ingot squarer in the prior art adopts double-line cutting, a driving unit is not reasonably arranged, so that the cutting mechanism occupies a large space and is not beneficial to the arrangement of the cutting mechanism.
Therefore, an embodiment of the present invention provides a technical solution, please refer to fig. 1 to 5, and the embodiment relates to a cutting apparatus, which includes a silicon material table positioning mechanism 19 and a cutting mechanism 18, wherein the silicon material table positioning mechanism 19 is configured to position and clamp a silicon material along a length direction of the silicon material (a direction indicated by an arrow y in the figure), and the cutting mechanism 18 is configured to cut the silicon material into long strips along the length direction of the silicon material (the direction indicated by the arrow y in the figure).
The silicon material table positioning mechanism 19 comprises a positioning rack 194, and a fixed clamping component 192 and a movable clamping component 191 which are arranged on the positioning rack 194, wherein the fixed clamping component 192 is arranged at one end of the positioning rack 194, the movable clamping component 191 is arranged at the other end of the positioning rack 194, more than two fixed clamping components 192 and more than two movable clamping components 191 are arranged along the width direction of the silicon material, and the movable clamping components 191 and the fixed clamping components 192 are correspondingly matched with each other one by one to clamp the silicon material; even cutting line 17 cuts the silicon material through, rectangular silicon material still is by activity centre gripping subassembly and the centre gripping of fixed centre gripping subassembly, can effectively reduce the vibration of silicon material, reduces the broken string that collapses the limit and rock and arouse.
In the present embodiment, referring to fig. 1 to fig. 3, the cutting mechanism 18 includes a cutter frame 181 and a cutting operation assembly 182 disposed on the cutter frame 181; the cutting operation assembly 182 includes two cutting units and a cutting driving unit 13, the cutting units include cutting lines 17, the cutting lines 17 of the two cutting units are arranged side by side, and the distance between the cutting lines 17 of the two cutting units is a preset value, in this embodiment, the preset value is 158mm, the cutting driving unit 13 is arranged along the width direction of the silicon material (as indicated by arrow x in the figure), and is used for driving the cutting lines 17 to cut the silicon material into long strips along the length direction of the silicon material (as indicated by arrow y in the figure);
different from the prior art, the technical scheme of this application sets up side by side through the line of cut 17 of two cutting units, and the interval between the line of cut 17 of two cutting units is the default, can realize the double-line and cut simultaneously. The cutting driving unit 13 is arranged along the width direction (the direction indicated by an arrow x in the figure) of the silicon material and is used for driving the cutting line 17 to cut the silicon material into long strips along the length direction (the direction indicated by an arrow y in the figure) of the silicon material, and the length of the cutting driving unit 13 is smaller than a preset value; therefore, the cutting driving unit 13 can be arranged along the width direction of the silicon material (as indicated by an arrow x in the figure), and the cutting driving unit 13 can be arranged between the two cutting lines 17, so that the structure of the cutting mechanism 18 is more compact, the space is saved, and the arrangement of the cutting mechanism 18 is convenient.
Specifically, the length of the cutting driving unit 13 is smaller than a preset value, so that the cutting driving unit 13 does not interfere with adjacent parts. It is within the scope of the present embodiment to use one cutting driving unit 13 to drive two cutting lines 17 simultaneously, or to use two cutting driving units 13 to drive two cutting lines 17 separately. The total length of the cutting driving unit 13 may be greater than a preset value, and as long as the adjacent components are not interfered, the total length of the cutting driving unit 13 may also be smaller than the preset value, so as to avoid interference, which is within the protection scope of the present embodiment. Even if the total length of the cutting driving unit 13 may be greater than a preset value, an escape space may be made between adjacent cutting operation assemblies, and normal operation may be possible.
In some embodiments, as shown in fig. 1, the cutting mechanism 18 further includes a cutting feed mechanism 183 disposed on the cutter frame 181, the cutter frame 181 is provided with a cutting track 1811, and the cutting feed mechanism 183 is configured to drive the cutting running assembly 182 to slide relatively along the extending direction of the cutting track 1811. In this embodiment, the cutting track 1811 is disposed along the length of the silicon material (as indicated by the arrow y in the figure).
In this way, the cutting operation assembly 182 can be driven by the cutting feed mechanism 183 to cut the silicon material along the length direction of the silicon material (the direction indicated by the arrow y in the figure).
In some embodiments, the cutting mechanism 18 includes more than two cutting travel assemblies 182 and more than two cutting feed mechanisms 183, and the cutting frame 181 is provided with more than two cutting tracks 1811; the cutting operation units 182 are respectively disposed on the cutter frame 181 via a cutting rail 1811, and each cutting operation unit 182 is individually provided with a cutting feed mechanism 183.
In this way, by arranging the cutting operation assemblies 182 on the cutter frame 181 through one cutting rail 1811, each cutting operation assembly 182 is separately provided with one cutting feed mechanism 183, each cutting feed mechanism 183 can separately drive one cutting operation assembly 182, and the cutting operation assemblies 182 are independent of each other and can feed independently without interfering with each other.
In some embodiments, the spacing between the cutting lines 17 of adjacent cutting travel assemblies 182 is also a preset value. Thus, the distance between the cutting lines 17 passing through the adjacent cutting operation assemblies 182 is also a preset value, in this embodiment, the preset value is 158mm, and when more than two cutting operation assemblies 182 cut simultaneously, the widths of the cut strip silicon materials are the same, so that the sizes of the strip silicon materials can be unified, and the subsequent production is facilitated.
In some embodiments, as shown in fig. 3, the cutting operation assembly 182 includes a cutting panel 16 and two cutting driving units 13, the two cutting driving units 13 are disposed on the cutting panel 16 in a staggered manner, the output shafts of the two cutting driving units 13 face in opposite directions respectively, and face in two directions indicated by an arrow x respectively, and the two cutting driving units 13 drive one cutting line 17 respectively.
Thus, the two cutting lines 17 are driven respectively, power can be provided for the cutting lines 17 respectively, the problem that one cutting driving unit 13 drives the two cutting lines 17 simultaneously and the power is insufficient is solved, and the maintenance and the repair of the single cutting line 17 are facilitated.
In some embodiments, the cutting panel 16 includes a bottom plate 161, the bottom plate 161 is provided with a mounting hole 162, the two cutting driving units 13 are a first cutting driving unit 13 and a second cutting driving unit 13, the first cutting driving unit 13 is mounted on the upper surface of the bottom plate 161, and the second cutting driving unit 13 is mounted on the mounting hole 162.
Thus, the first cutting driving unit 13 is mounted on the upper surface of the bottom plate 161, the second cutting driving unit 13 is mounted on the mounting hole 162, and the first cutting driving unit 13 and the second cutting driving unit 13 are arranged in a staggered mode, so that the first cutting driving unit 13 and the second cutting driving unit 13 can be conveniently mounted, and the space is saved.
In some embodiments, the two cutting units respectively comprise a main driving wheel 11, a driven driving wheel 15 and a tensioning part 12, the main driving wheel 11, the driven driving wheel 15 and the tensioning part 12 are respectively arranged on the cutting panel 16, the cutting line 17 is respectively in a ring shape around the main driving wheel 11, the driven driving wheel 15 and the tensioning part 12, and the first cutting driving unit 13 and the second cutting driving unit 13 respectively drive the main driving wheel 11 of the cutting unit to rotate through a synchronous belt, so that the cutting line 17 is driven to move around the ring shape.
In this way, by the cutting units respectively comprising the main driving wheel 11, the auxiliary driving wheel 15 and the tensioning member 12, the cutting of the silicon material by the cutting lines 17 can be achieved. The cutting panel 16 is provided with an opening for allowing the silicon material to pass through, so that the silicon material can be cut by the cutting line 17 along the vertical direction (such as the direction indicated by an arrow z in the figure), and the cut silicon material is accommodated in the cutting panel 16, so that the silicon material can be conveniently cut by the cutting line 17.
In some embodiments, two cutting units are located on either side of the cutting panel 16. Thus, the arrangement of the cutting units is facilitated by the fact that the two cutting units are respectively located at both sides of the cutting panel 16.
In some embodiments, as shown in fig. 3 and 4, the cutting operation assembly 182 is disposed on the cutting track 1811 through a sliding seat 1821, the cutting feed mechanism 183 includes a cutting motor 1831, and the cutting feed mechanism 183 is configured to drive the cutting operation assembly 182 to slide relatively along the extending direction of the cutting track 1811 through the cooperation of the cutting motor 1831 and the lead screw 1832 with the sliding seat 1821. In this manner, the feeding speed and the feeding position of the cutting feed mechanism 183 can be precisely controlled by the cooperation of the motor and the lead screw 1832.
In the using process, firstly, the polysilicon ingot is conveyed to the silicon material platform positioning mechanism 19, which can be manual or automatic mechanical arm. One vertical end face of the polysilicon ingot is leaned against the edge of the movable clamping block of the movable clamping assembly 191 as much as possible. The movable clamping driving unit acts to push the polycrystalline silicon ingot through the movable clamping block, so that the polycrystalline silicon ingot is clamped. At this time, the movable clamping assemblies 191 and the fixed clamping assemblies 192 which are arranged in one-to-one opposite mode are provided, so that clamping of the polycrystalline silicon strip block can be always kept after cutting is completed, and broken lines caused by edge breakage and shaking are reduced.
The cutting mechanism 18 is operated to cut the strip, the driving mode of the cutting operation assembly 182 is different from the previous one, the size of the cut polysilicon block is generally 158mm × 158mm, so the cutting operation assembly is limited by space, and the cutting feeding mechanism 183 adopts a synchronous belt for conveying. The cutting operation assemblies 182 are provided with a plurality of cutting operation assemblies 182, each cutting operation assembly 182 is provided with an independent cutting feeding mechanism 183, 2 sets of cutting units are arranged on the cutting operation assemblies 182, the distance between the cutting units is 158mm, therefore, in the action, the polycrystalline silicon ingot is cut into a plurality of strips with the thickness of 158mm, and the leather materials on the other four surfaces of the strips are kept in the original state.
After the cutting mechanism 18 finishes cutting, 2 pieces of leather on the outermost side are manually collected, and then the cutting mechanism 18 retracts to the initial position.
It should be noted that, although the above embodiments have been described herein, the utility model is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present patent.
Claims (10)
1. A cutting mechanism is characterized by comprising a cutter frame and a cutting operation assembly arranged on the cutter frame;
the cutting operation assembly comprises two cutting units and a cutting driving unit, the cutting units comprise cutting lines, the cutting lines of the two cutting units are arranged side by side, the distance between the cutting lines of the two cutting units is a preset value, and the cutting driving unit is arranged along the width direction of the silicon material and used for driving the cutting lines to cut the silicon material into strips along the length direction of the silicon material.
2. The cutting mechanism of claim 1, wherein the cutting operation assembly comprises a cutting panel and two cutting driving units, the two cutting driving units are arranged on the cutting panel in a staggered mode, output shafts of the two cutting driving units face to opposite directions respectively, and the two cutting driving units drive one cutting line respectively and independently.
3. The cutting mechanism as claimed in claim 2, wherein the cutting panel includes a base plate, a mounting hole is provided on the base plate, and the two cutting driving units are a first cutting driving unit and a second cutting driving unit, the first cutting driving unit is mounted on an upper surface of the base plate, and the second cutting driving unit is mounted on the mounting hole.
4. The cutting mechanism as claimed in claim 3, wherein the two cutting units respectively include a main driving wheel, a sub driving wheel and a tensioning member, the main driving wheel, the sub driving wheel and the tensioning member are respectively disposed on the cutting panel, the cutting lines are respectively looped around the main driving wheel, the sub driving wheel and the tensioning member, and the first cutting driving unit and the second cutting driving unit respectively drive the main driving wheel of the cutting unit to rotate through a timing belt, thereby driving the cutting lines to move around the loop.
5. The cutting mechanism of claim 2, wherein two cutting units are located on either side of the cutting panel.
6. The cutting mechanism according to claim 1, further comprising a cutting feed mechanism disposed on the cutter frame, wherein the cutter frame is provided with a cutting track, and the cutting feed mechanism is configured to drive the cutting running assembly to slide relatively along an extending direction of the cutting track.
7. The cutting mechanism according to claim 6, wherein the cutting mechanism comprises more than two cutting operation assemblies and more than two cutting feeding mechanisms, and more than two cutting tracks are arranged on the cutting machine frame;
the cutting operation components are arranged on the cutting machine frame through the cutting tracks respectively, and each cutting operation component is provided with one cutting feeding mechanism independently.
8. The cutting mechanism of claim 7, wherein the spacing between the cutting lines of adjacent cutting travel assemblies is also a preset value.
9. The cutting mechanism according to claim 6, wherein the cutting running assembly is disposed on the cutting track through a sliding seat, the cutting feeding mechanism comprises a cutting motor, and the cutting feeding mechanism is used for driving the cutting running assembly to relatively slide along the extending direction of the cutting track through the cooperation of the cutting motor and a lead screw with the sliding seat.
10. A cutting apparatus, characterized by a cutting mechanism as claimed in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121723256.7U CN215750096U (en) | 2021-07-27 | 2021-07-27 | Cutting mechanism and cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121723256.7U CN215750096U (en) | 2021-07-27 | 2021-07-27 | Cutting mechanism and cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215750096U true CN215750096U (en) | 2022-02-08 |
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ID=80107631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121723256.7U Active CN215750096U (en) | 2021-07-27 | 2021-07-27 | Cutting mechanism and cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215750096U (en) |
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2021
- 2021-07-27 CN CN202121723256.7U patent/CN215750096U/en active Active
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