CN215734758U - Noise reduction Bluetooth headset - Google Patents
Noise reduction Bluetooth headset Download PDFInfo
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- CN215734758U CN215734758U CN202121262544.7U CN202121262544U CN215734758U CN 215734758 U CN215734758 U CN 215734758U CN 202121262544 U CN202121262544 U CN 202121262544U CN 215734758 U CN215734758 U CN 215734758U
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- microphone
- loudspeaker
- bluetooth headset
- kink
- noise reduction
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Abstract
The utility model provides a noise reduction Bluetooth headset which comprises a shell, a loudspeaker, a microphone and an FPC (flexible printed circuit), wherein the microphone is positioned on the front side of the loudspeaker, the FPC comprises a main board, a first bending part and a second bending part, the first bending part and the second bending part are connected to two ends of the main board, the main board is fixed at the bottom of the loudspeaker, the microphone is connected to one end of the first bending part, the first bending part is positioned on one side of the loudspeaker, one end of the second bending part is connected with a connector, and a plurality of positioning holes are formed in the bottom of the microphone. According to the noise reduction Bluetooth headset, the FPC is used for replacing a conventional circuit board and a conventional wire, the noise is low, the wire does not need to be welded, the processing efficiency is high, and the assembly difficulty is low.
Description
Technical Field
The utility model relates to the field of earphones, in particular to a noise reduction Bluetooth earphone.
Background
The Bluetooth earphone applies the Bluetooth technology to the hands-free earphone, so that users can avoid annoying wiring stumbling and can easily talk in various ways. Since the advent of bluetooth headsets, it has been a good tool for the mobile commerce industry to increase efficiency. Bluetooth headsets are commonly used as accessories for mobile terminals for voice listening of the mobile terminals. Because the wireless communication is adopted, an earphone connecting wire is not needed, the mobile terminal is convenient to use, and the wireless communication system is widely applied. The bluetooth headset of prior art adopts a plurality of wires to connect loudspeaker and microphone usually, and many pencil settings are inboard at the headset, produce great noise easily, influence the tone quality of headset.
SUMMERY OF THE UTILITY MODEL
Aiming at the problems, the noise reduction Bluetooth headset provided by the utility model uses the FPC to replace the conventional circuit board and the conventional lead, has less noise, does not need to weld the lead, and has high processing efficiency and low assembly difficulty.
In order to achieve the purpose, the utility model is solved by the following technical scheme:
the utility model provides a bluetooth headset of making an uproar falls, includes shell, loudspeaker, microphone, FPC, the microphone is located the loudspeaker front side, FPC includes the mainboard, connects first kink, the second kink at mainboard both ends, the mainboard is fixed loudspeaker bottom, the microphone is connected first kink one end, first kink is located loudspeaker one side, second kink one end is connected with the joint, the microphone bottom is equipped with a plurality of locating holes.
Specifically, the inner side of the shell is provided with a groove for accommodating the microphone, and the edge of the groove is provided with a plurality of first positioning posts matched with the positioning holes.
Specifically, loudspeaker include the support, be located the inboard U iron of support, be located the inboard permanent magnet of U iron, china department, voice coil loudspeaker voice coil, connection are in the diaphragm of voice coil loudspeaker voice coil one end, fix the protecgulum of support front end, be equipped with first conducting strip, second conducting strip on the support, two wirings of voice coil loudspeaker voice coil respectively with first conducting strip, second conducting strip welding, first conducting strip lower extreme is connected with first weld part, second conducting strip lower extreme is connected with the second weld part, first weld part, second weld part lower extreme all with the mainboard welding.
Specifically, a backing plate is fixed on the front cover, and a plurality of second positioning columns matched with the positioning holes are arranged on the backing plate.
Specifically, the backing plate is also provided with a through hole.
Specifically, the microphone is a silicon microphone.
The utility model has the beneficial effects that:
1. according to the noise reduction Bluetooth headset, the FPC is used for replacing a conventional circuit board and a conventional wire, the noise is low, the wire does not need to be welded, the processing efficiency is high, and the assembly difficulty is low;
2. the microphone module has the advantages that the backing plate is additionally arranged on the front cover of the loudspeaker, the microphone is fixed on the backing plate, the loudspeaker, the microphone and the FPC can be assembled to serve as a module before assembly, the whole module is installed into the inner side of the shell, the microphone alignment assembly step is omitted, the assembly difficulty is reduced, and the processing efficiency is improved.
Drawings
Fig. 1 is a front view of a noise-reducing bluetooth headset of embodiment 1.
Fig. 2 is a cross-sectional view taken along the plane a-a in fig. 1.
Fig. 3 is an exploded view of the noise reduction bluetooth headset according to embodiment 1.
Fig. 4 is a schematic structural view of the speaker, the microphone, and the FPC in embodiment 1.
Fig. 5 is a schematic structural view of the speaker, the microphone, the FPC, and the pad in embodiment 2.
Fig. 6 is an exploded view of the horn of example 2.
The reference signs are: the microphone comprises a shell 1, a groove 11, a first positioning column 12, a loudspeaker 2, a support 21, a U-shaped iron 22, a permanent magnet 23, a washer 24, a voice coil 25, a diaphragm 26, a front cover 27, a first conductive sheet 28, a first welding portion 281, a second conductive sheet 29, a second welding portion 291, a microphone 3, a positioning hole 31, an FPC4, a main board 41, a first bent portion 42, a second bent portion 43, a connector 5, a backing plate 6, a second positioning column 61 and a through hole 62.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the embodiments of the present invention are not limited thereto.
Example 1
As shown in fig. 1-4:
the utility model provides a bluetooth headset of making an uproar falls, including shell 1, loudspeaker 2, microphone 3, FPC4, microphone 3 is located loudspeaker 2 front side, FPC4 includes mainboard 41, connect first kink 42 at mainboard 41 both ends, second kink 43, mainboard 41 is fixed in loudspeaker 2 bottom, microphone 3 is connected in first kink 42 one end, first kink 42 is located loudspeaker 2 one side, second kink 43 one end is connected with and connects 5, 3 bottoms of microphone are equipped with a plurality of locating holes 31.
Preferably, the inner side of the housing 1 is provided with a groove 11 for accommodating the microphone 3, the edge of the groove 11 is provided with a plurality of first positioning posts 12 matched with the positioning holes 31, and when the microphone 3 is assembled, the microphone 3 needs to be firstly installed in the groove, and then the loudspeaker 2 is assembled.
Preferably, the horn 2 includes a support 21, a U-shaped iron 22 located inside the support 21, a permanent magnet 23 located inside the U-shaped iron 22, a washer 24, a voice coil 25, a diaphragm 26 connected to one end of the voice coil 25, and a front cover 27 fixed to the front end of the support 21, wherein the support 21 is provided with a first conductive sheet 28 and a second conductive sheet 29, two wires of the voice coil 25 are respectively welded to the first conductive sheet 28 and the second conductive sheet 29, the lower end of the first conductive sheet 28 is connected to a first welding portion 281, the lower end of the second conductive sheet 29 is connected to a second welding portion 291, the lower ends of the first welding portion 281 and the second welding portion 291 are welded to the main board 41.
Preferably, the microphone 3 is a silicon microphone, which is also called an MEMS microphone, and is a microphone manufactured based on the MEMS technology, and is composed of an MEMS boost sensor chip, an ASIC chip, a sound cavity, and an RF suppression circuit, where the MEMS sound pressure sensor is a micro capacitor composed of a silicon diaphragm and a silicon back plate, and can convert sound pressure change into capacitance change, and then convert the capacitance change of the ASIC chip into an electrical signal, thereby realizing "sound-sound" conversion. The silicon microphone has the characteristics of high temperature resistance, clear voice, easy identification, strong stability, noise reduction, RF interference resistance, small volume and low power consumption.
Example 2
As shown in fig. 5-6:
the utility model provides a bluetooth headset of making an uproar falls, including shell 1, loudspeaker 2, microphone 3, FPC4, microphone 3 is located loudspeaker 2 front side, FPC4 includes mainboard 41, connect first kink 42 at mainboard 41 both ends, second kink 43, mainboard 41 is fixed in loudspeaker 2 bottom, microphone 3 is connected in first kink 42 one end, first kink 42 is located loudspeaker 2 one side, second kink 43 one end is connected with and connects 5, 3 bottoms of microphone are equipped with a plurality of locating holes 31.
Preferably, the horn 2 includes a support 21, a U-shaped iron 22 located inside the support 21, a permanent magnet 23 located inside the U-shaped iron 22, a washer 24, a voice coil 25, a diaphragm 26 connected to one end of the voice coil 25, and a front cover 27 fixed to the front end of the support 21, wherein the support 21 is provided with a first conductive sheet 28 and a second conductive sheet 29, two wires of the voice coil 25 are respectively welded to the first conductive sheet 28 and the second conductive sheet 29, the lower end of the first conductive sheet 28 is connected to a first welding portion 281, the lower end of the second conductive sheet 29 is connected to a second welding portion 291, the lower ends of the first welding portion 281 and the second welding portion 291 are welded to the main board 41.
Preferably, the backing plate 6 is fixed on the front cover 27, the backing plate 6 is provided with a plurality of second positioning columns 61 matched with the positioning holes 31, during assembly, the microphone 3 is fixed on the backing plate 6, so that the loudspeaker 2, the microphone 3 and the FPC4 are integrated, and then the microphone 3 is installed in the shell 1, the microphone 3 does not need to be installed in the support 21 in an aligned mode in advance, and assembly difficulty is reduced.
Preferably, the pad 6 is further provided with a through hole 62, the through hole 62 is located below the microphone 3, and the sound source can be transmitted to the microphone 3 through the through hole 62.
Preferably, the microphone 3 is a silicon microphone, which is also called an MEMS microphone, and is a microphone manufactured based on the MEMS technology, and is composed of an MEMS boost sensor chip, an ASIC chip, a sound cavity, and an RF suppression circuit, where the MEMS sound pressure sensor is a micro capacitor composed of a silicon diaphragm and a silicon back plate, and can convert sound pressure change into capacitance change, and then convert the capacitance change of the ASIC chip into an electrical signal, thereby realizing "sound-sound" conversion. The silicon microphone has the characteristics of high temperature resistance, clear voice, easy identification, strong stability, noise reduction, RF interference resistance, small volume and low power consumption.
The above examples only show 2 embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. The utility model provides a bluetooth headset of making an uproar falls, its characterized in that, includes shell (1), loudspeaker (2), microphone (3), FPC (4), microphone (3) are located loudspeaker (2) front side, FPC (4) include mainboard (41), connect first kink (42), second kink (43) at mainboard (41) both ends, mainboard (41) are fixed loudspeaker (2) bottom, microphone (3) are connected first kink (42) one end, first kink (42) are located loudspeaker (2) one side, second kink (43) one end is connected with joint (5), microphone (3) bottom is equipped with a plurality of locating holes (31).
2. A noise reduction bluetooth headset according to claim 1, wherein the inside of the housing (1) is provided with a groove (11) for accommodating the microphone (3), and the edge of the groove (11) is provided with a plurality of first positioning posts (12) matching with the positioning holes (31).
3. The noise reduction Bluetooth headset of claim 1, wherein the speaker (2) comprises a bracket (21), a U-shaped iron (22) located inside the bracket (21), a permanent magnet (23) located inside the U-shaped iron (22), a washer (24), a voice coil (25), a diaphragm (26) connected to one end of the voice coil (25), and a front cover (27) fixed to the front end of the bracket (21), a first conducting strip (28) and a second conducting strip (29) are arranged on the bracket (21), two connecting wires of the voice coil (25) are respectively welded with the first conducting strip (28) and the second conducting strip (29), the lower end of the first conductive sheet (28) is connected with a first welding part (281), the lower end of the second conductive sheet (29) is connected with a second welding part (291), the lower ends of the first welding part (281) and the second welding part (291) are welded with the main plate (41).
4. A noise reduction bluetooth headset according to claim 3, wherein a backing plate (6) is fixed on the front cover (27), and a plurality of second positioning posts (61) matching with the positioning holes (31) are disposed on the backing plate (6).
5. A noise reducing Bluetooth headset according to claim 3, characterized in that the pad (6) is further provided with a through hole (62).
6. A noise reducing bluetooth headset according to claim 1, characterized in that the microphone (3) is a silicon microphone.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121262544.7U CN215734758U (en) | 2021-06-07 | 2021-06-07 | Noise reduction Bluetooth headset |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121262544.7U CN215734758U (en) | 2021-06-07 | 2021-06-07 | Noise reduction Bluetooth headset |
Publications (1)
Publication Number | Publication Date |
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CN215734758U true CN215734758U (en) | 2022-02-01 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202121262544.7U Active CN215734758U (en) | 2021-06-07 | 2021-06-07 | Noise reduction Bluetooth headset |
Country Status (1)
Country | Link |
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CN (1) | CN215734758U (en) |
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2021
- 2021-06-07 CN CN202121262544.7U patent/CN215734758U/en active Active
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