CN215729697U - Sensor module and electronic equipment - Google Patents

Abstract

The application discloses sensor module and electronic equipment, sensor module include circuit board, flexible line way board and at least one capacitive sensor, and the circuit board includes the circuit base plate and sets up in at least one pressure sensor of circuit base plate, and capacitive sensor and the circuit board that has pressure sensor all set up in the flexible line way board, are convenient for install the sensor module in electronic equipment. The flexible circuit board can be bent to be suitable for electronic equipment in different shapes, so that the application scene of the sensor module is enlarged. When the sensor module is applied to the electronic equipment, if a user touches the electronic equipment, the sensor module can simultaneously sense capacitance and pressure, and functions of the electronic equipment are enriched.

Description

Sensor module and electronic equipment

Technical Field

The utility model belongs to the technical field of sensor application, and particularly relates to a sensor module and electronic equipment.

Background

With the continuous development of technologies of electronic devices such as wearable devices, electronic devices such as wearable devices are increasingly popular. The wearable device can be suitable for various application scenes, and great convenience is brought to a user.

The pressure sensor and the capacitance sensor have wide application scenes on wearable equipment, and can realize functions such as key pressing, touch control and the like. And the wearable device can further realize richer functions by combining the pressure sensor and the capacitance sensor. However, wearable equipment has different shapes and sizes, and the sensor module of current structure receives the restriction of space and shape, can't satisfy and realize electric capacity sensing and pressure sensing simultaneously in crooked shell department, has restricted the further promotion of wearable electronic equipment function.

SUMMERY OF THE UTILITY MODEL

In view of the above, embodiments of the present application provide a sensor module and an electronic device to solve the above problems.

In a first aspect, an embodiment of the present application provides a sensor module, which includes:

the flexible circuit board is provided with at least one capacitive sensor;

the circuit board comprises a circuit substrate and at least one pressure sensor arranged on the circuit substrate;

the circuit board is arranged on the flexible circuit board and is electrically connected with the flexible circuit board.

In a second aspect, an embodiment of the present application provides an electronic device, which includes a housing and the sensor module described in the first aspect, where the sensor module is disposed in the housing.

The sensor module provided by the utility model comprises a circuit board, a flexible circuit board and at least one capacitance sensor, wherein the circuit board comprises a circuit substrate and at least one pressure sensor arranged on the circuit substrate, and the capacitance sensor and the circuit board with the pressure sensor are both arranged on the flexible circuit board, so that the sensor module can be conveniently installed on electronic equipment. Because the flexible line way board can be crooked and be applicable to the electronic equipment of different shapes, enlarged the application scene of sensor module, when the sensor module was applied to electronic equipment, if the user touched and pressed electronic equipment, can carry out capacitance sensing and pressure sensing simultaneously through this sensor module, richened electronic equipment's function.

These and other aspects of the embodiments of the present application will be more readily apparent from the following description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments, not all embodiments, of the present application. All other embodiments and drawings obtained by a person skilled in the art based on the embodiments of the present application without any inventive step are within the scope of the present invention.

For a person skilled in the art, without inventive effort, further figures can be derived from these figures.

Fig. 1 illustrates an exploded view of a pressure sensor module according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a pressure sensor module according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a pressure sensor module according to another embodiment of the present application;

fig. 4 is a schematic structural diagram of a pressure sensor module according to another embodiment of the present application;

fig. 5 is a schematic structural diagram of a pressure sensor module according to yet another embodiment of the present application;

fig. 6 is a schematic structural diagram of a pressure sensor module according to still another embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a pressure sensor module according to yet another embodiment of the present application;

fig. 8 is a schematic structural diagram of a pressure sensor module according to yet another embodiment of the present application;

fig. 9 is a schematic structural diagram illustrating a third surface of a circuit board in a pressure sensor module according to yet another embodiment of the present application;

fig. 10 is a schematic structural diagram illustrating a second surface of a flexible printed circuit board in a pressure sensor module according to yet another embodiment of the present application;

fig. 11 is a schematic structural diagram of a pressure sensor module according to yet another embodiment of the present application;

fig. 12 is a schematic structural diagram illustrating a third surface of a circuit board in a pressure sensor module according to yet another embodiment of the present application;

fig. 13 is a schematic structural diagram of a pressure sensor module according to yet another embodiment of the present application;

fig. 14 is a schematic structural diagram of a flexible printed circuit board in a pressure sensor module according to yet another embodiment of the present application;

fig. 15 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 16 shows a schematic structural diagram of an electronic device according to another embodiment of the present application.

Detailed Description

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The sensor module and the electronic device provided by the embodiments of the present application will be described in detail through specific embodiments.

Referring to fig. 1 and fig. 2 together, an embodiment of the present invention provides a pressure sensor module 100, which includes a circuit board 110, a flexible circuit board 120, and at least one capacitive sensor 130. The circuit board 110 includes a circuit substrate 111 and at least one pressure sensor 112 disposed on the circuit substrate 111.

In the embodiment shown in fig. 2, the circuit board 110 is disposed on the flexible wiring board 120 and electrically connected to the flexible wiring board 120. Specifically, the circuit board 110 with the pressure sensor module 100 may be stacked on the flexible wiring board 120. Since the capacitive sensor 130 is also disposed on the flexible wiring board 120, when the flexible wiring board 120 is assembled to the electronic device, the electronic device can have both capacitive sensing and pressure sensing functions. When the sensor module 100 is disposed on an electronic device, the flexible printed circuit 120 can be bent to adapt to electronic devices of different shapes, and when a user touches the flexible printed circuit, the sensor module 100 can perform capacitance sensing and pressure sensing simultaneously.

In the present embodiment, the circuit board 110 includes a wiring substrate 111 and at least one pressure sensor 112 disposed on the wiring substrate 111. The circuit board 111 is stacked on the flexible wiring board 120. The flexible wiring board 120 has a first surface 121 and a second surface 122 facing away from each other. The wiring substrate 111 has a third surface 1111 and a fourth surface 1112 facing away from each other. The third surface 1111 of the circuit substrate 111 is stacked on the second surface 122 of the flexible circuit board 120, that is, the third surface 1111 is a surface close to the flexible circuit board 120, and the fourth surface 1112 is a surface away from the flexible circuit board 120.

The circuit substrate 111 may carry the pressure sensor 112, and the circuit substrate 111 can support the pressure sensor 112 when the pressure sensor 112 is pressed. The circuit substrate 111 may be a rigid printed circuit board 110, and the rigid printed circuit board 110 is used to support the pressure sensor 112, so that the cost of the sensor module 100 can be reduced compared to the case of additionally using a reinforcing plate as a support.

In some embodiments, the pressure sensor 112 can be disposed on the third surface 1111 of the circuit substrate 111. As shown in fig. 2, in the circuit board 110 of the sensor module 100 exemplarily shown in fig. 2, the pressure sensor 112 is disposed on the third surface 1111 of the circuit substrate 111.

In some other embodiments, the pressure sensor 112 may be disposed on the fourth surface 1112 of the circuit substrate 111. As shown in fig. 3, in the circuit board 210 of the sensor module 200 exemplarily shown in fig. 3, the pressure sensor 112 is disposed on the fourth surface 1112 of the circuit substrate 111.

In the embodiment shown in fig. 2 and 3, the number of pressure sensors 112 is one. In some other embodiments, as shown in fig. 4, the circuit board 310 may further include a plurality of pressure sensors 112, and all of the plurality of pressure sensors 112 may be disposed on one surface of the circuit substrate 111. In the sensor module 300 exemplarily shown in fig. 4, the circuit board 310 includes two pressure sensors 112, and the two pressure sensors 112 are all disposed on the fourth surface 1112 of the circuit substrate 111. In some other embodiments, as shown in fig. 5, the circuit board 410 further includes a plurality of pressure sensors 112, and the plurality of pressure sensors 112 are disposed on different surfaces of the circuit substrate 111. Some of the pressure sensors 112 are disposed on the third surface 1111 in the plurality of pressure sensors 112. The remaining pressure sensors 112 of the plurality of pressure sensors 112 are disposed on the fourth surface 1112. In the sensor module 400 exemplarily shown in fig. 5, the circuit board 410 includes two pressure sensors 112a and 112b, the pressure sensor 112a is disposed on the third surface 1111 of the circuit substrate 111, and the pressure sensor 112b is disposed on the fourth surface 1112 of the circuit substrate 111.

In some embodiments, when the plurality of pressure sensors 112 are disposed on different surfaces of the circuit substrate 111, the pressure sensors 112 disposed on the third surface 1111 and the pressure sensors 112 disposed on the fourth surface 1112 are disposed in a one-to-one manner. In the sensor module 400 exemplarily shown in fig. 5, the circuit board 410 includes two pressure sensors 112a, 112 b. The pressure sensor 112a is disposed on the third surface 1111, and the pressure sensor 112b is disposed on the fourth surface 1112. And the pressure sensor 112a disposed on the third surface 1111 is disposed opposite to the pressure sensor 112b disposed on the fourth surface 1112.

In some embodiments, when the plurality of pressure sensors 112 are disposed on different surfaces of the circuit substrate 111, the pressure sensor 112 disposed on the third surface 1111 is offset from the pressure sensor 112 disposed on the fourth surface 1112. As shown in fig. 6, in the sensor module 500 exemplarily shown in fig. 6, the circuit board 510 includes two pressure sensors 112c and 112 d. The pressure sensor 112c is disposed on the third surface 1111, the pressure sensor 112d is disposed on the fourth surface 1112, and the pressure sensor 112c disposed on the third surface 1111 and the pressure sensor 112d disposed on the fourth surface 1112 are staggered.

In some embodiments, when a plurality of pressure sensors 112 are disposed on different surfaces of the circuit substrate 111, at least one pressure sensor 112 disposed on the third surface is disposed opposite to a pressure sensor disposed on the fourth surface 1112. At least one pressure sensor 112 disposed on the third surface is offset from a pressure sensor disposed on the fourth surface 1112. As shown in fig. 7, in the sensor module 600 exemplarily shown in fig. 7, the circuit board 610 includes four pressure sensors 112e, 112f, 112g, and 112 h. Wherein, the pressure sensor 112e and the pressure sensor 112f are disposed on the third surface 1111, and the pressure sensor 112g and the pressure sensor 112h are disposed on the fourth surface 1112. The pressure sensor 112e disposed on the third surface 1111 is disposed opposite to the pressure sensor 112g disposed on the fourth surface 1112. The pressure sensor 112f disposed on the third surface 1111 is staggered from the pressure sensors 112h and 112g disposed on the fourth surface 1112.

It is to be understood that the embodiment of the present application does not limit the manner in which the pressure sensor 112 is disposed on the circuit substrate 111, as long as the pressure sensor 112 can be fixed to the circuit substrate 111. Alternatively, the pressure sensor 112 may be adhesively fixed to the surface of the wiring substrate 111. Alternatively, the pressure sensor 112 may be fixed to the surface of the circuit substrate 111 by soldering.

The pressure sensor 112 is electrically connected to the flexible wiring board 120, and the pressure sensor 112 generates an electrical signal when deformed by being pressed. In the present embodiment, the pressure sensor 112 may be a thin film resistive type, a MEMS (micro electro Mechanical Systems) chip type, or the like.

It can be understood that the circuit substrate 111 may be integrated with a plurality of circuit elements, for example, the circuit substrate 111 may be integrated with a main control chip, the pressure sensor 112 is electrically connected to the main control chip, an electrical signal generated by the pressure sensor 112 is transmitted to the main control chip of the circuit substrate 111 through a circuit of the circuit substrate 111, and the main control chip processes and feeds back the signal and generates a corresponding instruction to implement a corresponding operation.

In the above embodiment, the circuit substrate 111 may not be provided with a main control chip, the pressure sensor 112 is electrically connected to the flexible printed circuit 120, and the electrical signal generated by the pressure sensor 112 is transmitted to the flexible printed circuit 120.

In the above embodiment, the circuit substrate 111 may be electrically connected to the flexible wiring board 120 by soldering. It is understood that the circuit board 710 may include one or more first pads 113, as shown in fig. 8. The first solder joint 113 is disposed on the third surface 1111 of the circuit substrate 111, and the first solder joint 113 is used to electrically connect the pressure sensor 112 and the flexible circuit board 120. Wherein the first solder 113 is electrically connected to the pressure sensor 112, and the first solder 113 is electrically connected to the flexible circuit board 120.

In some embodiments, the first solder 113 and the pressure sensor 112 are disposed on the same surface of the circuit substrate 111. As shown in fig. 8, in the sensor module 700 exemplarily shown in fig. 8, the first pads 113 of the circuit board 710 and the pressure sensor 112 are disposed on the third surface 1111 of the circuit substrate 111. As shown in fig. 9, in the sensor module 700 exemplarily shown in fig. 9, the circuit board 710 includes four first pads 113. The first pad 113 is electrically connected to the pressure sensor 112. The four first pads 113 are electrically connected to the four connection terminals of the pressure sensor 112, respectively. And the first pad 113 is electrically connected to the flexible wiring board 120. The four connection terminals of the pressure sensor 112 may include two output terminals and two power supply terminals.

In the above embodiment, the flexible wiring board 120 may further include one or more second pads 123. The second solder joint 123 is disposed on the second surface 122 of the flexible circuit board 120, and the second solder joint 123 is electrically connected to the first solder joint 113. Referring to fig. 8 and 10, the flexible printed circuit 120 includes four second pads 123, each of the second pads 123 is disposed opposite to the first pad 113, and each of the second pads 123 is electrically connected to the first pad 113.

In some embodiments, the first solder joint 113 and the pressure sensor 112 may be disposed on different surfaces of the circuit substrate 111. As shown in fig. 11, in the sensor module 800 exemplarily shown in fig. 11, the first pads 113 of the circuit board 810 are disposed on the third surface 1111 of the circuit substrate 111, and the pressure sensor 112 is disposed on the fourth surface 1112 of the circuit substrate 111. As shown in fig. 12, the exemplary circuit board 810 of fig. 12 includes four first solder bumps 113. The first pad 113 is electrically connected to the pressure sensor 112. It is understood that the first bonding pad 113 can be electrically connected to the pressure sensor 112 through a circuit disposed on the circuit substrate 111, and the first bonding pad 113 can also be electrically connected to the pressure sensor 112 through a plated hole. The first pad 113 is electrically connected to the flexible wiring board 120.

In the above embodiment, the area of the circuit board 111 is smaller than the area of the flexible wiring board 120. The circuit substrate 111 is disposed on the flexible printed circuit 120 to assist the sensor module 100 in adapting to various scenes. The pressure sensor 112 of the circuit substrate 111 can perform the pressure sensing function of the sensor module 100. When the sensor module 100 is applied to an electronic device with a small space, part of the circuit of the flexible printed circuit 120 may be transferred to the circuit board 111, thereby reducing the overall size of the sensor module 100.

Referring to fig. 2, in the present embodiment, the flexible circuit board 120 has a first surface 121 and a second surface 122 facing away from each other. The first surface 121 of the flexible wiring board 120 is provided with a capacitive sensor 130, and the circuit board 110 is stacked on the second surface 122 of the flexible wiring board 120. The first surface 121 of the flexible printed circuit 120 is used for being attached to the inner wall of the housing 200 of the electronic device, and the flexible printed circuit 120 can be bent to be suitable for electronic devices with different shapes. If the user touches the electronic device, the flexible printed circuit 120 deforms to transmit the force generated by the user's pressing to the pressure sensor 112.

It is understood that the flexible wiring board 120 may be integrated with a plurality of circuit elements, for example, the flexible wiring board 120 may be integrated with a main control chip. The flexible wiring board 120 is electrically connected to the pressure sensor 112 of the circuit board 110, and the flexible wiring board 120 is also electrically connected to the capacitance sensor 130. When the pressure sensing module is pressed, the pressure sensor 112 transmits the detected signal to the main control chip of the flexible printed circuit board 120, and the capacitance sensor 130 transmits the detected signal to the main control chip of the flexible printed circuit board 120 for processing, so as to respond to the pressing operation of the user, thereby realizing simultaneous pressure sensing and capacitance sensing.

It is understood that, in the above embodiment, the flexible circuit board 120 may not be provided with a main control chip, and the signal detected by the capacitive sensor 130 may be transmitted to the circuit board 110 through the flexible circuit board 120, processed by a circuit on the circuit board 110, or processed by an external circuit electrically connected to the circuit board 110.

In the above embodiment, the flexible wiring board 120 may completely cover the circuit board 110 in order to transmit the force of the user's pressing to the pressure sensor 112 when the user presses. When the user presses, the force of the user pressing the housing 200 of the electronic device deforms the flexible wiring board 120, thereby acting on the pressure sensor 112. The pressure sensor 112 is deformed to generate a deformation corresponding to the user's pressing.

Referring to fig. 2, the capacitance sensor 130 is disposed on the flexible circuit board 120. The capacitive sensor 130 may sense the position of the user touch. When a user presses, if a touch position of the user is opposite to a position of the capacitive sensor 130, an electrical signal generated by the capacitive sensor 130 is transmitted to the flexible printed circuit 120, so as to implement a corresponding operation.

In the above embodiments, the sensor module 100 may include one or more capacitive sensors 130. When the capacitive sensor 130 includes a plurality of capacitive sensors 130, the positions of the plurality of capacitive sensors 130 may be set according to actual needs. For example, the plurality of capacitive sensors 130 may be arranged at equal intervals, may be arranged in a specific shape, and may be arranged in sequence in the same direction. In some embodiments, multiple capacitive sensors 130 may also be used to enable a sliding operation. When a user touches, if the touch position of the user is opposite to the position of the capacitive sensor 130, the capacitive sensor 130 generates an electrical signal and transmits the electrical signal to the flexible printed circuit board 120. The touch position of the user is determined by recognizing the electrical signals of the capacitive sensor 130, and the touch trajectory of the user is determined by recognizing the sequence of the electrical signals generated by the capacitive sensor 130, so that the sliding operation of the user is recognized. The functions of the electronic device can be enriched by providing a plurality of capacitive sensors 130, for example, functions such as "next", "volume up", "volume down", etc. can be implemented when the user slides in the first direction. Referring to fig. 13 and 14, the sensor module 900 includes three capacitive sensors 130, and the three capacitive sensors 130 are disposed at equal intervals along the direction a in fig. 14.

The sensor module 100 provided by the utility model comprises a circuit board 110, a flexible circuit board 120 and at least one capacitance sensor 130, wherein the circuit board 110 comprises a circuit substrate 111 and at least one pressure sensor 112 arranged on the circuit substrate 111, and the capacitance sensor 130 and the circuit board with the pressure sensor 112 are both arranged on the flexible circuit board 120, so that the sensor module 100 is conveniently mounted on electronic equipment. The flexible printed circuit 120 can be bent to adapt to electronic devices of different shapes, so that the application range of the sensor module 100 is expanded. When the sensor module 100 is applied to the electronic device, if the user touches the electronic device, the sensor module 100 can simultaneously perform capacitance sensing and pressure sensing, thereby enriching the functions of the electronic device.

Referring to fig. 15, an electronic device according to an embodiment of the present application further includes a pressure sensor module 100 and a housing 1000, wherein the pressure sensor module 100 is disposed in the housing 1000, and the sensor module 100 is disposed on an inner surface of the housing 1000 and is used for sensing a touch action of a user. When a user touches, the sensor module 100 can perform capacitance sensing and pressure sensing simultaneously.

As an embodiment, the flexible printed circuit board in the sensor module 100 may be attached to the inner wall of the housing 1000, and in order to enhance the sensitivity of the capacitance detection, the capacitance sensor may be directed toward the inner wall of the housing 1000.

In some embodiments, as shown in fig. 15, the inner surface of the housing 1000 exemplarily illustrated in fig. 15, on which the sensor module 100 is mounted, may be a plane, and the sensor module 100 is directly tiled on the inner surface of the housing 1000.

In other embodiments, as shown in fig. 16, the inner surface of the casing 1100, on which the sensor module 100 is mounted, may be a curved surface as shown in fig. 16. The flexible wiring board 120 may be bent to fit the inner surface of the housing 1100.

In the above embodiment, the outer wall of the housing 1000 may further be provided with a pressing portion (not shown), the pressing portion may correspond to a position of the sensor module 100, and the pressing portion may be a pressing mark for guiding a user to press the corresponding position of the housing 1000. The pressing portion may act as a "key" of the electronic device, which when pressed, triggers the capacitive sensor 130 and the pressure sensor 112. The user controls the electronic equipment to execute the corresponding key operation function by triggering the key. Through setting up the splenium and replacing traditional mechanical button, the user can carry out the touch operation through the mode of touch to make electronic equipment carry out corresponding operating function. For example, the pressing portion may be used as a "power key" or a "play/pause key", or other function keys, and is not particularly limited herein.

In the foregoing embodiment, the electronic device may further include a wireless communication module, where the wireless communication module is configured to establish wireless communication with the mobile terminal, and the wireless communication module may be a bluetooth module, a Wi-Fi module, or a ZIGbee module.

Optionally, the electronic device may be an earphone, an electronic cigarette, a recording pen, a smart watch, a bracelet, or the like, which is not limited in this application.

The electronic device provided by the utility model comprises a shell 1000 and a sensor module 100, wherein the sensor module 100 comprises a circuit board 110, a flexible circuit board 120 and at least one capacitive sensor 130, the circuit board 110 comprises a circuit substrate 111 and at least one pressure sensor 112 arranged on the circuit substrate 111, and the capacitive sensor 130 and the circuit board 110 with the pressure sensor 112 are both arranged on the flexible circuit board 120, so that the sensor module 100 is convenient to mount on the electronic device. The flexible printed circuit 120 can be bent to adapt to electronic devices of different shapes, so that the application range of the sensor module 100 is expanded. If the user touches the electronic device, the sensor module 100 can perform capacitance sensing and pressure sensing simultaneously, thereby enriching the functions of the electronic device.

Optionally, the embodiments of the present application have been described above with reference to the drawings, but the present application is not limited to the above-mentioned embodiments, which are only illustrative and not restrictive, and those skilled in the art can make many forms without departing from the spirit and scope of the present application.

Claims (12)

1. A sensor module, comprising:

the flexible circuit board is provided with at least one capacitive sensor;

the circuit board comprises a circuit substrate and at least one pressure sensor arranged on the circuit substrate;

the circuit board is arranged on the flexible circuit board and is electrically connected with the flexible circuit board.

2. The sensor module of claim 1, wherein the flexible circuit board has a first surface and a second surface facing away from each other, the capacitive sensor being disposed on the first surface;

the circuit board is arranged on the second surface.

3. The sensor module of claim 2, wherein the circuit substrate has a third surface and a fourth surface facing away from each other, the second surface is opposite to the third surface, and the third surface is stacked on the second surface;

the pressure sensor is arranged on the third surface; or

The pressure sensor is arranged on the fourth surface.

4. The sensor module of claim 1, wherein the circuit board comprises a first solder joint, the first solder joint is disposed on the circuit substrate, and the first solder joint is electrically connected to the pressure sensor and the flexible circuit board.

5. The sensor module of claim 4, wherein the first solder joint and the pressure sensor are disposed on a same surface of the circuit substrate.

6. The sensor module of claim 4, wherein the first solder joint and the pressure sensor are disposed on different surfaces of the circuit substrate.

7. The sensor module of claim 6, wherein the flexible circuit board includes a second solder joint, the second solder joint being electrically connected to the first solder joint.

8. A sensor module according to any one of claims 1 to 7, characterised in that the circuit substrate is a rigid printed circuit board.

9. The sensor module according to any one of claims 1 to 7, wherein the board area of the circuit substrate is smaller than the board area of the flexible wiring board, and the flexible wiring board completely covers the circuit board.

10. The sensor module of claim 1, wherein the number of the capacitive sensors is plural, and the plural capacitive sensors are arranged at equal intervals along the same direction.

11. An electronic device, comprising a housing and the sensor module of any one of claims 1-10, wherein the sensor module is disposed within the housing.

12. The electronic device of claim 11, wherein the flexible circuit board is attached to an inner wall of the housing, and the capacitive sensor faces the inner wall of the housing.

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