CN215728336U - Test head assembly and test device - Google Patents

Abstract

The utility model relates to a test head assembly and a test device. The test head assembly comprises a test head main body and a first heat-conducting medium structure, wherein a bulge is arranged on one side, facing the electronic element to be tested, of the test head main body, the first heat-conducting medium structure covers the bulge, the first heat-conducting medium structure is used for being matched with the electronic element to be tested, and the heat conductivity of the first heat-conducting medium structure is larger than that of air; the test head assembly further comprises a clamping jaw, wherein the clamping jaw is arranged on the test head main body and can be arranged around the electronic element to be tested to prevent the electronic element to be tested from moving. The test head assembly has better use effect.

Description

Test head assembly and test device

Technical Field

The utility model relates to the field of test equipment, in particular to a test head assembly and a test device.

Background

With the rapid development of integrated circuit technology, most electronic devices are used in different temperature environments. In order to simulate the performance of the electronic device in high and low temperature environments, the electronic device needs to be placed in a corresponding temperature environment for performance testing to distinguish defective products. In addition, as electronic technology develops, the self heat flux density of electronic devices also increases rapidly. In order to improve the temperature control effect and efficiency of the electronic element test area, the heat conduction resistance of the test device needs to be reduced, and the heat conduction performance needs to be enhanced.

Generally, a thermal resistance between an action surface of a test head and an electronic component and the electronic component to be tested is large due to poor contact, and the electronic component is likely to be displaced when the test head sucks or presses the electronic component.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a test head assembly and a test apparatus to solve the problems of low heat conduction efficiency between the test head and the electronic component and easy displacement of the electronic component.

The utility model provides a test head assembly which comprises a test head main body and a first heat-conducting medium structure, wherein a bulge is arranged on one side, facing an electronic element to be tested, of the test head main body, the first heat-conducting medium structure covers the bulge, the first heat-conducting medium structure is used for being matched with the electronic element to be tested, and the heat conductivity of the first heat-conducting medium structure is greater than that of air;

the test head assembly further comprises a clamping jaw, wherein the clamping jaw is arranged on the test head main body and can be arranged around the electronic element to be tested to prevent the electronic element to be tested from moving.

So set up, set up the arch in the test head main part to for first heat-conducting medium structure provides the mounted position, and first heat-conducting medium structure is used for cooperating with the electronic component that awaits measuring, thereby realizes filling the clearance between protruding and the electronic component that awaits measuring with first heat-conducting medium structure, because the heat conductivity of first heat-conducting medium structure is greater than the heat conductivity of air, consequently can reduce the thermal resistance, in order to promote heat-conduction efficiency. The contact area can be increased through the deformation of the first heat-conducting medium structure, so that the heat conduction efficiency is improved; and the clamping jaws can surround the periphery of the electronic element to be tested in the adsorption or pressing process, so that reliable positioning is realized, the movement or rotation of the electronic element to be tested is ensured, the matching reliability can be further ensured, and the testing accuracy is further ensured.

In one embodiment, the test head assembly further comprises a flow channel structure and a second heat-conducting medium structure, the flow channel structure is fixedly connected with the test head main body, a flow channel for a refrigerant to pass through is arranged on the flow channel structure, a groove is arranged on the test head main body, an opening of the groove faces the flow channel structure, the depth of the groove is smaller than or equal to the thickness of the second heat-conducting medium structure, so that the second heat-conducting medium structure fills a gap between the test head main body and the flow channel structure on the heat-conducting path, and the heat conductivity of the second heat-conducting medium structure is larger than that of air.

So set up, the test head subassembly is through setting up the recess in the test head main part, and pack the second heat-conducting medium structure in the recess, and the degree of depth of recess is less than the thickness of second heat-conducting medium structure, second heat-conducting medium structure self can be deformed in order to fill the gap between runner structure and the test head main part when making runner structure and test head main part cooperation, thereby prevent to have the air between the two and lead to the thermal resistance increase on the heat conduction path, and because in the second heat-conducting medium structure embedding recess, consequently can not influence the height between runner structure and the test head main part. The runner structure and the test head main body are connected through threads, and a macroscopic air layer can exist. By adding a recess (also referred to as a notch) in the thermal path of the test head body in which the second thermal medium structure is placed. The depth of the groove is slightly smaller than the thickness of the second heat-conducting medium structure, and the macroscopic air layer between the flow channel structure and the test head main body is filled through the deformation of the second heat-conducting medium structure, so that the heat conductivity is increased.

In one embodiment, a protrusion is disposed on a side of the test head main body facing the electronic component to be tested, the test head assembly further includes a first heat conducting medium structure, the first heat conducting medium structure covers the protrusion, and a heat conductivity of the first heat conducting medium structure is greater than a heat conductivity of air.

So set up, can promote the area of contact with the electronic component that awaits measuring to increase heat conduction efficiency.

In one embodiment, the first heat-conducting medium structure includes a flat plate portion and a bent portion, the flat plate portion is matched with the surface of the protrusion facing the electronic component to be tested, and the bent portion is bonded to the sidewall of the protrusion through a bonding adhesive layer.

By the arrangement, the problem that the thickness of the bonding glue between the test head main body and the electronic element is difficult to control to generate an air layer to increase heat resistance can be prevented.

In one embodiment, the cross-sectional area of the protrusion gradually increases along a direction gradually away from the electronic component to be tested.

So set up, can increase area of contact, promote heat conduction efficiency.

In one embodiment, a mounting hole is formed in the test head main body, the test head assembly further comprises a heating structure, the heating structure penetrates through the mounting hole of the test head main body, and the heating structure is arranged around the periphery of the heat conduction path of the test head main body so as to prevent a gap from being formed in the heat conduction path of the test head main body.

With this arrangement, an air layer can be prevented from being generated on the heat conduction path, thereby avoiding an increase in thermal resistance.

In one embodiment, a third heat conducting medium structure is filled between the hole wall of the mounting hole and the heating structure to prevent a gap from being formed between the hole wall of the mounting hole and the heating structure.

So set up, can prevent to produce the air bed between heating structure and the test head main part, promote heat transfer efficiency.

In one embodiment, the thermal conductivity of the flow channel structure and/or the test head body is greater than or equal to the thermal conductivity of copper.

So set up, can promote the heat transfer efficiency of runner structure and test head main part.

In one embodiment, the surface of the flow channel structure is covered with a first thermal conductivity enhancement coating, and the thermal conductivity of the thermal conductivity enhancement coating is greater than or equal to the first thermal conductivity of the flow channel structure.

So set up, can further promote the heat conduction efficiency of runner structure.

In one embodiment, the surface of the test head body is covered with a second thermal conductivity enhancement coating having a thermal conductivity greater than or equal to the thermal conductivity of the test head body.

So set up, can promote the heat conduction efficiency of test head main part.

According to another aspect of the present application, there is provided a test apparatus comprising the above-described test head assembly.

So set up, can promote the sensitivity of test, and temperature control's efficiency.

Drawings

FIG. 1 is a first perspective view of a test head assembly according to an embodiment of the present invention;

FIG. 2 is a perspective view of a second perspective view of a test head assembly according to an embodiment of the present invention;

FIG. 3 is a schematic top view of a test head assembly according to an embodiment of the present invention;

fig. 4 is a perspective view of a third perspective view of a test head assembly with jaws according to an embodiment of the present invention.

Description of reference numerals:

10. a test head body; 11. a second heat-conducting medium structure; 12. a groove; 13. a protrusion; 20. a flow channel structure; 40. a first heat-conducting medium structure; 41. a bending part; 50. a heating structure; 60. an electronic component to be tested; 70. a claw is provided.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

It will be understood that when an element is referred to as being "mounted on" another element, it can be directly mounted on the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. When an element is referred to as being "secured to" another element, it can be directly secured to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, the present embodiment provides a test head assembly, which includes a test head main body 10 and a first heat conducting medium structure 40, wherein a protrusion 13 is disposed on a side of the test head main body 10 facing an electronic device 60 to be tested, the first heat conducting medium structure 40 covers the protrusion 13, the first heat conducting medium structure 40 is used for matching with the electronic device 60 to be tested, and a heat conductivity of the first heat conducting medium structure 40 is greater than a heat conductivity of air.

Set up arch 13 on this test head main part 10 to for first heat-conducting medium structure 40 provides the mounted position, and first heat-conducting medium structure 40 is used for cooperating with the electronic component 60 that awaits measuring to the realization fills the clearance between arch 13 and the electronic component 60 that awaits measuring with first heat-conducting medium structure 40, because the thermal conductivity of first heat-conducting medium structure 40 is greater than the thermal conductivity of air, consequently can reduce the thermal resistance, in order to promote heat conduction efficiency. And the contact area can be increased by the deformation of the first heat transfer medium structure 40, thereby improving the heat transfer efficiency.

Optionally, the first heat conducting medium structure 40 includes a flat plate portion and a bent portion 41, the flat plate portion is matched with the surface of the protrusion 13 facing the electronic component 60 to be tested, and the bent portion 41 is bonded to the sidewall of the protrusion 13 through an adhesive layer.

The structure of the bulge 13 is arranged on the test head main body 10, and the first heat-conducting medium structure 40 is bent and cut into a structure with the bent part 41, so that the four folded edges (namely the bent part 41) are adhered with the adhesive substance to form an adhesive layer and are adhered to the four walls of the bulge 13. Therefore, the contact area between the action surface of the test head main body 10 and the electronic element 60 to be tested can be increased, the heat conduction efficiency is improved, and the problem of a new air layer caused by too thick bonding substances can be solved well.

In the present embodiment, the cross-sectional area of the protrusion 13 gradually increases in a direction gradually away from the electronic component 60 to be tested.

Thus, according to the heat transfer formula q ═ λ a (dt/dx), where λ is the thermal conductivity, a is the heat transfer area, t is the temperature, and x is the coordinate on the heat transfer surface. q is the heat flow density delivered in the x-direction and dt/dx is the rate of change of the temperature of the object along the x-direction (proportional to the temperature difference and inversely proportional to the length), it can be seen that the rate of heat transfer is inversely proportional to the length of the delivered object, the cross-sectional area is proportional to the temperature difference. Based on this, the projections 13 are configured as described above, so that the cross-sectional area of the heat conduction path is increased, and the heat conduction capability is improved.

The first heat conducting medium structure 40 may be a high heat conducting medium, which may be the same as or different from the second heat conducting medium structure 11, and the specific material thereof may be determined as required as long as the requirement of heat conductivity can be met, for example, it may be red copper.

Optionally, the test head assembly further includes a flow channel structure 20 and a second heat conducting medium structure 11, the flow channel structure 20 is fixedly connected to the test head main body 10, a flow channel for passing a refrigerant is provided on the flow channel structure 20, a groove 12 is provided on the test head main body 10, an opening of the groove 12 faces the flow channel structure 20, a depth of the groove 12 is smaller than a thickness of the second heat conducting medium structure 11, so that the second heat conducting medium structure 11 fills a gap between the test head main body 10 and the flow channel structure 20 on the heat conducting path, and a heat conductivity of the second heat conducting medium structure 11 is greater than a heat conductivity of air.

This test head subassembly is through setting up recess 12 on test head main part 10, and pack second heat-conducting medium structure 11 in recess 12, and the degree of depth of recess 12 is less than the thickness of second heat-conducting medium structure 11, second heat-conducting medium structure 11 self can be out of shape when making runner structure 20 and test head main part 10 cooperate in order to fill the gap between runner structure 20 and the test head main part 10, thereby prevent to have the air between the two and lead to the thermal resistance increase on the heat conduction path, and because second heat-conducting medium structure 11 imbeds in recess 12, consequently can not influence the height between runner structure 20 and the test head main part 10.

A macroscopic layer of air may exist between the flow channel structure 20 and the test head body 10 by the screw connection. By adding a recess 12 (also referred to as a notch) in the thermal conduction path of the test head body 10 in which the second thermal conduction medium structure 11 is placed. The depth of the groove 12 is slightly smaller than the thickness of the second heat conductive medium structure 11, and the macroscopic air layer between the flow channel structure 20 and the test head main body 10 is filled by the deformation of the second heat conductive medium structure 11 itself, thereby increasing the heat conductivity.

In this embodiment, the second heat conducting medium structure 11 may be a high heat conducting medium to improve the heat conductivity. Since the second heat-conducting medium structure 11 added between the flow channel structure 20 and the test head main body 10 is placed in the groove 12, the height dimension of the whole structure is not affected.

The second heat conducting medium structure and the first heat conducting medium structure may be made of the same or different materials, for example: indium flakes, graphite flakes, or highly thermally conductive alloy materials, and the like.

Optionally, a mounting hole is formed in the test head main body 10, and the test head assembly further includes a heating structure 50, the heating structure 50 is disposed in the mounting hole of the test head main body 10 in a penetrating manner, and the heating structure 50 is disposed around the periphery of the heat conducting path of the test head main body 10 to prevent a gap from being formed on the heat conducting path of the test head main body 10.

Heating structure 50 can be the heating rod, heating structure 50 is installed and is belonged to clearance fit in test head main part 10, can adopt heating structure 50 to run through test head main part 10 setting at the horizontal direction, in order to avoid there being little air bed between heating structure 50 and the test head main part 10, thereby prevent to increase heat conduction thermal resistance, arrange heating structure 50 along heat conduction path border all around (it still runs through test head main part 10 on both sides about, through the rational arrangement heating rod position, thereby guarantee that the last thermal resistance of the electronic component heat conduction path that awaits measuring is less.

In this embodiment, the area enclosed by the heating structure 50 is a heat conducting path on the test head body 10.

Optionally, a third heat conducting medium structure is filled between the hole wall of the mounting hole and the heating structure 50 to prevent a gap from being formed between the hole wall of the mounting hole and the heating structure 50. Therefore, the third heat-conducting medium structure can be arranged to avoid the increase of heat-conducting resistance due to the gap.

In this embodiment, the third heat-conducting medium structure may be a heat-conducting silicone grease. The gap between the heating structure 50 and the test head main body 10 is filled by smearing heat-conducting silicone grease in the process of installing the heating structure 50, so that the air filled in the gap can be reduced, and the heat conductivity is improved. However, it is difficult to ensure that there is no gap at all, and therefore, air is prevented from being present on the heat conduction path by disposing the heating structure 50 at the outer periphery of the heat conduction path as described above, so as to ensure that the thermal resistance of the heat conduction path can be reduced.

Optionally, the thermal conductivity of the flow channel structure 20 and/or the test head body 10 is greater than or equal to the thermal conductivity of copper. For example, the flow channel structure 20 and the test head body 10 are made of red copper, so that good thermal conductivity can be obtained.

Optionally, to further enhance the thermal conductivity, the surface of the flow channel structure 20 is covered with a first thermal conductivity enhancement coating having a thermal conductivity greater than or equal to the first thermal conductivity of the flow channel structure 20. For example, when the flow channel structure 20 is processed, especially surface treated, a soft material with high thermal conductivity (e.g., nickel) is coated on the surface, which can reduce thermal conductivity and thermal resistance, thereby further improving thermal conductivity.

Optionally, the surface of the test head body 10 is covered with a second thermally conductive enhanced coating having a thermal conductivity greater than or equal to the thermal conductivity of the test head body 10.

The second heat conduction reinforcing coating and the first heat conduction reinforcing coating can be made of the same material or different materials. In this embodiment, in order to improve the thermal conductivity and reduce the processing cost, a soft material with high thermal conductivity (e.g. nickel) is coated to reduce the thermal resistance and improve the thermal conductivity when the test head body 10 is subjected to surface treatment.

In addition, the flatness, roughness and surface cleanliness of the interface of the flow channel structure 20 and the test head structure can be restrained during processing, so that an air gap formed when the flow channel structure 20 and the test head main body 10 are connected is as small as possible, and the thermal conductivity and resistance are reduced.

As shown in fig. 4, the test head assembly further includes a jaw 70, and the jaw 70 is disposed on the test head body 10 and surrounds the electronic component 60 to be tested. The jaw 40 is arranged to limit the further movement or rotation of the electronic element 60 to be tested in the adsorption or pressing process so as to limit the electronic element 60 to be tested, thereby ensuring the testing accuracy.

In this embodiment, a plurality of claws 70 are distributed on the test head main body 10, and the claws 70 are arranged at intervals along the circumferential direction of the electronic element 60 to be tested, so as to reliably limit the electronic element 60 to be tested in the circumferential direction.

As shown in fig. 4, the jaw 70 includes a transverse section and a vertical section, and the transverse section is connected to the test head body 10, and the connection may be a direct connection or an indirect connection. The vertical section is intended to cooperate with the electronic component 60 to be tested in order to clamp it.

According to another aspect of the present application, there is provided a test apparatus, characterized in that the test apparatus comprises the above-described test head assembly. The testing device adopting the testing head assembly has the advantages that the air gap between the flow channel structure 20 and the testing head main body 10 is filled by the second heat-conducting medium structure 11, so that the problem of heat-conducting resistance increase caused by the formation of the air gap between the flow channel structure and the testing head main body is avoided. And because the second heat-conducting medium structure 11 is arranged in the groove 12 of the test head main body 10, the problem that the overall structure size is affected due to the increase of the distance between the flow channel structure 20 and the test head main body 10, which may be caused by the arrangement of the second heat-conducting medium structure 11, is avoided.

By arranging the protrusion 13 on the side of the test head main body 10 facing the electronic element 60 to be tested and arranging the first heat-conducting medium structure 40 to be a structure with folded edges, the problem that an air layer is formed due to poor thickness control when an adhesive is smeared between the test head main body 10 and the electronic element 60 to be tested is avoided. In addition, the heat transfer rate is improved by increasing the cross-sectional area on the heat transfer path by providing the protrusions 13.

By reasonably distributing the heating structures 50 on the test head body 10 (i.e., the heat sources on the heat conduction path), the heat conduction path is free of an air layer as much as possible, thereby effectively reducing the thermal resistance on the heat conduction path.

The flow channel structure 20 and the test head main body 10 are both made of materials (such as red copper) with good heat conductivity, the flatness, the roughness and the surface cleanliness of the interface of the flow channel structure 20 and the test head main body 10 are restrained, the thickness of an air layer formed by connecting the flow channel structure 20 and the test head main body 10 is reduced or avoided, and an air gap formed when the flow channel structure 20 and the test head main body 10 are connected is as small as possible, so that the heat conduction resistance is reduced. In addition, the surfaces of the flow channel structure 20 and the test head body 10 may be coated with a softer, high thermal conductivity material (e.g., nickel) to reduce thermal conductivity and resistance.

This test head subassembly can be applied to electronic component's testing arrangement, because the thermal resistance of the heat conduction path of test head main part 10 is low, consequently can make heat transfer efficiency higher, thereby make the heat control to test head main part 10 and electronic component more timely, sensitive, make to heat change more sensitive, make the electronic component who is surveyed heat faster and cool down, improve the effect and the efficiency of test zone accuse temperature, can satisfy the demand of high low temperature test from this, be particularly useful for calorific capacity great electronic component's test.

The features of the above-described embodiments may be arbitrarily combined, and for the sake of brevity, all possible combinations of the features in the above-described embodiments are not described, but should be construed as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the features.

It should be understood by those skilled in the art that the above embodiments are only for illustrating the present invention and are not to be used as a limitation of the present invention, and that suitable changes and modifications of the above embodiments are within the scope of the claimed invention as long as they are within the spirit and scope of the present invention.

Claims (10)

1. A test head assembly is characterized by comprising a test head main body and a first heat-conducting medium structure, wherein a bulge is arranged on one side, facing an electronic element to be tested, of the test head main body, the first heat-conducting medium structure covers the bulge, the first heat-conducting medium structure is used for being matched with the electronic element to be tested, and the heat conductivity of the first heat-conducting medium structure is larger than that of air;

the test head assembly further comprises a clamping jaw, wherein the clamping jaw is arranged on the test head main body and can be arranged around the electronic element to be tested to prevent the electronic element to be tested from moving.

2. The test head assembly of claim 1, further comprising a flow channel structure and a second heat conducting medium structure, wherein the flow channel structure is fixedly connected with the test head body, a flow channel for refrigerant to pass through is arranged on the flow channel structure, a groove is arranged on the test head body, an opening of the groove faces the flow channel structure, and a depth of the groove is smaller than or equal to a thickness of the second heat conducting medium structure, so that the second heat conducting medium structure fills a gap between the test head body and the flow channel structure on a heat conducting path, and a heat conductivity of the second heat conducting medium structure is greater than a heat conductivity of air.

3. The test head assembly of claim 2, wherein the first thermal medium structure includes a flat plate portion and a bent portion, the flat plate portion is engaged with a surface of the protrusion facing the electronic component to be tested, and the bent portion is bonded to a sidewall of the protrusion through a bonding adhesive layer.

4. A test head assembly according to claim 2 or 3 wherein the projections have a cross-sectional area which increases progressively in a direction progressively away from the electronic component to be tested.

5. The test head assembly of claim 1, wherein the test head body has a mounting hole therein, the test head assembly further comprising a heating structure disposed through the mounting hole of the test head body and surrounding a periphery of the thermal path of the test head body to prevent formation of a void in the thermal path of the test head body.

6. The test head assembly of claim 5 wherein a third heat transfer medium structure is filled between the walls of the mounting holes and the heating structure to prevent voids from forming between the walls of the mounting holes and the heating structure.

7. The test head assembly of claim 2 wherein the thermal conductivity of the flow channel structure and/or the test head body is greater than or equal to the thermal conductivity of copper.

8. The test head assembly of claim 2 wherein a surface of the flow channel structure is covered with a first thermal conductivity enhancement coating having a thermal conductivity greater than or equal to the first thermal conductivity of the flow channel structure.

9. The test head assembly of claim 1 or 8 wherein a surface of the test head body is covered with a second thermal conductivity enhancement coating having a thermal conductivity greater than or equal to a thermal conductivity of the test head body.

10. A test apparatus, characterized in that it comprises a test head assembly according to any one of claims 1-9.

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