CN215713475U - Horizontal high aspect ratio circuit board micropore copper plating device - Google Patents
Horizontal high aspect ratio circuit board micropore copper plating device Download PDFInfo
- Publication number
- CN215713475U CN215713475U CN202122437064.6U CN202122437064U CN215713475U CN 215713475 U CN215713475 U CN 215713475U CN 202122437064 U CN202122437064 U CN 202122437064U CN 215713475 U CN215713475 U CN 215713475U
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- CN
- China
- Prior art keywords
- circuit board
- filter frame
- copper plating
- electroplating
- aspect ratio
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Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 28
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 238000007747 plating Methods 0.000 title claims abstract description 28
- 238000009713 electroplating Methods 0.000 claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 13
- 239000007787 solid Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a horizontal type high aspect ratio circuit board micropore copper plating device, which relates to the technical field of circuit board processing and comprises an electroplating box, wherein connecting blocks are arranged on two sides of a filter frame, a slide rod is arranged at the upper end of each connecting block, a fastening bolt is arranged on one side of the slide rod, an operator pulls the slide rod upwards after copper plating treatment so as to drive the connecting blocks and the filter frame to move upwards, when the upper surface of each connecting block moves to be in contact with the inner wall of a side groove, the fastening bolt is rotated at the moment so as to fix the slide rod, namely, the filter frame can be fixed, suspended matters in electroplating solution can stay above the filter frame in the lifting process of the filter frame, the filtered electroplating solution is positioned below the filter frame and can be discharged through a liquid outlet pipe, at the moment, a scraper plate, the side groove and the filter frame are positioned on the same horizontal line, and the operator pushes the scraper plate to move by using a switch, thereby can get rid of the suspended solid on filter frame surface, the operation is comparatively simple, and the practicality is strong.
Description
Technical Field
The utility model relates to the technical field of circuit board processing, in particular to a horizontal type high-aspect-ratio circuit board micropore copper plating device.
Background
The circuit board can be called as a printed circuit board or a printed circuit board, the English name is FPC circuit board (FPC circuit board is also called as a flexible circuit board), the flexible circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance, and micro-pore copper plating treatment is required to be carried out on the flexible printed circuit board in the processing process of the circuit board.
The existing micropore copper plating device is generally used for placing a circuit board in an electroplating box for copper plating treatment in the using process, but floating objects are easy to generate in electroplating solution in the treatment process, the electroplating solution cannot be filtered and cannot be reused, the generated floating objects are inconvenient to remove, and the using effect is poor.
Aiming at the problems, the utility model provides a horizontal type high-aspect-ratio circuit board micropore copper plating device.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a horizontal type high-aspect-ratio circuit board micropore copper plating device, after copper plating treatment, an operator pulls a slide rod upwards to drive a connecting block and a filter frame to move upwards, when the upper surface of the connecting block moves to be in contact with the inner wall of a side groove, a fastening bolt is rotated at the moment, so that the slide rod can be fixed, the filter frame can be fixed, suspended matters in electroplating solution can stay above the filter frame in the ascending process of the filter frame, the filtered electroplating solution is positioned below the filter frame and can be discharged through a liquid outlet pipe, at the moment, a scraper plate, the side groove and the filter frame are positioned on the same horizontal line, the operator pushes the scraper plate to move by using a switch, so that the suspended matters on the surface of the filter frame can be removed, the operation is simple, the practicability is strong, and the problems in the background technology are solved.
In order to achieve the purpose, the utility model provides the following technical scheme: a horizontal type high-aspect-ratio circuit board micropore copper plating device comprises an electroplating box, wherein an upper frame plate is fixedly mounted at the upper end of the electroplating box, the upper frame plate is of an L-shaped structure, a clamping structure is arranged at the lower end of the upper frame plate, a filter frame is arranged in the electroplating box, and a material pushing part is arranged on one side of the electroplating box;
the both sides of straining the frame are provided with the connecting block, and the upper end of connecting block is provided with the slide bar, and one side of slide bar is provided with fastening bolt, and connecting block, slide bar and fastening bolt all are provided with two sets ofly.
Preferably, the lower extreme fixed mounting of electroplating case has the base, and one side of electroplating case is provided with control switch, is provided with the swash plate in the inner chamber of electroplating case, and one side of swash plate is provided with the guide slot, and the guide slot is the tilt state.
Preferably, one side of electroplating box is provided with the drain pipe, and the drain pipe is linked together with the guide slot, and the upper end fixed mounting of electroplating box has the lantern ring, and the upper end of slide bar runs through the lantern ring, and the inner wall of electroplating box is provided with the side groove, and connecting block and side groove phase-match.
Preferably, the outer wall of the liquid outlet pipe is provided with a valve.
Preferably, the clamping structure comprises a channel arranged on one side of the upper frame plate and a positive and negative screw rod arranged inside the channel, the positive and negative screw rod is externally connected with an output end of a motor, and a thread block is arranged on the outer side of the positive and negative screw rod.
Preferably, the lower end of the thread block is fixedly provided with an electric push rod, and the other end of the electric push rod is connected with the clamping plate.
Preferably, the thread block, the electric push rod and the clamping plate are arranged in two groups, the thread block, the electric push rod and the clamping plate are symmetrically arranged about the central line of the positive and negative screw rod, and the thread block is in threaded fit connection with the positive and negative screw rod.
Preferably, the pushing piece comprises a side opening formed in the surface of the electroplating box and an air cylinder arranged on the side wall of the side opening, and the other end of the air cylinder is connected with the scraper.
Compared with the prior art, the utility model has the following beneficial effects:
1. the utility model provides a horizontal type high-aspect-ratio circuit board micropore copper plating device, wherein two groups of thread blocks, electric push rods and clamping plates are arranged, the two groups of thread blocks, electric push rods and clamping plates are symmetrically arranged about the central line of a positive and negative screw rod, the thread blocks are in threaded fit connection with the positive and negative screw rod, before the device is used, an operator places a horizontal type high-aspect-ratio circuit board between the two groups of clamping plates, starts a motor to work to drive the positive and negative screw rod to rotate and to be matched with the thread blocks for use, so that the thread blocks drive the electric push rods and the clamping plates to approach each other and clamp the horizontal type high-aspect-ratio circuit board, and meanwhile, the electric push rods are used for pushing the clamping plates and the circuit board to move downwards by using a switch until the clamping plates and the circuit board enter an electroplating box for subsequent copper plating treatment, and the device is convenient to use.
2. The utility model provides a horizontal type high-aspect-ratio circuit board micropore copper plating device, wherein connecting blocks are arranged on two sides of a filter frame, a sliding rod is arranged at the upper end of each connecting block and penetrates through a lantern ring, the sliding rods and the lantern rings are fixed by fastening bolts, during copper plating treatment, the connecting blocks and the filter frame are positioned at the lowest end of an electroplating box, after copper plating treatment, an operator pulls the sliding rods upwards to drive the connecting blocks and the filter frame to move upwards, when the upper surface of each connecting block moves to be in contact with the inner wall of a side groove, the fastening bolts are rotated at the moment to fix the sliding rods, so that the filter frame can be fixed, during the lifting process of the filter frame, suspended matters in electroplating solution can stay above the filter frame, the filtered electroplating solution is positioned below the filter frame and can be discharged through a liquid outlet pipe, and at the moment, a scraper blade, the side groove and the filter frame are positioned on the same horizontal line, operating personnel utilizes the switch to make the cylinder promote the scraper blade and remove to can get rid of the suspended solid on filter frame surface, the operation is comparatively simple, and the practicality is strong.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of the electroplating tank of the present invention;
FIG. 3 is an enlarged view taken at A of FIG. 2 in accordance with the present invention;
FIG. 4 is a bottom view of the clamping structure of the present invention;
fig. 5 is an enlarged view of the utility model at B in fig. 2.
In the figure: 1. electroplating box; 11. a base; 12. a control switch; 13. a sloping plate; 14. a guide groove; 15. a liquid outlet pipe; 151. a valve; 16. a collar; 17. a side groove; 2. an upper frame plate; 3. a clamping structure; 31. a channel; 32. a screw rod with positive and negative teeth; 33. a thread block; 34. an electric push rod; 35. a clamping plate; 4. a filter frame; 41. connecting blocks; 42. a slide bar; 43. fastening a bolt; 5. pushing the material piece; 51. a side port; 52. a cylinder; 53. a scraper.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the technical problems that the electroplating solution can not be filtered and reused, the generated floating objects can not be removed conveniently, and the using effect is not good, as shown in figures 1-5, the following preferable technical proposal is provided:
the utility model provides a horizontal high aspect ratio circuit board micropore copper plating device, includes electroplating box 1, and electroplating box 1's upper end fixed mounting has upper ledge plate 2, and upper ledge plate 2 is L shape structure, and upper ledge plate 2's lower extreme is provided with clamping structure 3, and electroplating box 1's inside is provided with filter frame 4, and one side of electroplating box 1 is provided with pushes away material spare 5.
The two sides of the filter frame 4 are provided with connecting blocks 41, the upper end of the connecting block 41 is provided with a slide bar 42, one side of the slide bar 42 is provided with a fastening bolt 43, and the connecting block 41, the slide bar 42 and the fastening bolt 43 are all provided with two groups.
The lower end of the electroplating box 1 is fixedly provided with a base 11, one side of the electroplating box 1 is provided with a control switch 12, an inclined plate 13 is arranged in the inner cavity of the electroplating box 1, one side of the inclined plate 13 is provided with a guide groove 14, and the guide groove 14 is in an inclined state.
One side of electroplating box 1 is provided with drain pipe 15, and drain pipe 15 is linked together with guide slot 14, and the upper end fixed mounting of electroplating box 1 has lantern ring 16, and the upper end of slide bar 42 runs through lantern ring 16, and the inner wall of electroplating box 1 is provided with side groove 17, and connecting block 41 and side groove 17 phase-match.
The outer wall of the liquid outlet pipe 15 is provided with a valve 151.
The clamping structure 3 comprises a channel 31 arranged on one side of the upper frame plate 2 and a positive and negative screw rod 32 arranged inside the channel 31, the positive and negative screw rod 32 is externally connected with a motor output end, and a thread block 33 is arranged on the outer side of the positive and negative screw rod 32.
An electric push rod 34 is fixedly installed at the lower end of the thread block 33, and the other end of the electric push rod 34 is connected with a clamping plate 35.
The thread block 33, the electric push rod 34 and the clamping plate 35 are provided with two sets, and two sets of the thread block 33, the electric push rod 34 and the clamping plate 35 are symmetrically installed about the central line of the positive and negative thread lead screw 32, and the thread block 33 is in threaded fit connection with the positive and negative thread lead screw 32, before the use, an operator places the horizontal high-aspect-ratio circuit board between the two sets of the clamping plates 35, and starts a motor to work, so that the positive and negative thread lead screw 32 rotates and is used in cooperation with the thread block 33, so that the thread block 33 drives the electric push rod 34 and the clamping plate 35 to be close to each other, and clamps the horizontal high-aspect-ratio circuit board, and meanwhile, the switch is utilized to enable the electric push rod 34 to push the clamping plate 35 and the circuit board to move downwards until the electric push rod enters the electroplating box 1, so as to carry out copper plating treatment later, and is convenient to use.
The material pushing member 5 comprises a side port 51 arranged on the surface of the electroplating box 1 and an air cylinder 52 arranged on the side wall of the side port 51, and the other end of the air cylinder 52 is connected with a scraper 53.
Specifically, during the copper plating process, the connecting block 41 and the filter frame 4 are located at the lowest end of the electroplating box 1, after the copper plating process, an operator pulls the sliding rod 42 upwards, thereby driving the connecting block 41 and the filter frame 4 to move upward, and when the upper surface of the connecting block 41 moves to contact with the inner wall of the side groove 17, the fastening bolt 43 is rotated, thereby fixing the slide bar 42, the filter frame 4 can be fixed, the suspended matters in the electroplating solution can stay above the filter frame 4 in the process of rising the filter frame 4, the filtered electroplating solution is positioned below the filter frame 4, and can be discharged through the liquid outlet pipe 15, at this time, the scraper 53 is on the same horizontal line with the side groove 17 and the filter frame 4, the operator uses the switch to make the cylinder 52 push the scraper 53 to move, thereby can get rid of the suspended solid on filter frame 4 surface, the operation is comparatively simple, and the practicality is strong.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a horizontal high aspect ratio circuit board micropore copper plating device, includes electroplating case (1), its characterized in that: an upper frame plate (2) is fixedly mounted at the upper end of the electroplating box (1), the upper frame plate (2) is of an L-shaped structure, a clamping structure (3) is arranged at the lower end of the upper frame plate (2), a filter frame (4) is arranged inside the electroplating box (1), and a material pushing part (5) is arranged on one side of the electroplating box (1);
the filter is characterized in that connecting blocks (41) are arranged on two sides of the filter frame (4), a sliding rod (42) is arranged at the upper end of each connecting block (41), a fastening bolt (43) is arranged on one side of each sliding rod (42), and two groups of connecting blocks (41), two groups of sliding rods (42) and two groups of fastening bolts (43) are arranged.
2. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 1, wherein: the lower end of the electroplating box (1) is fixedly provided with a base (11), one side of the electroplating box (1) is provided with a control switch (12), an inclined plate (13) is arranged in an inner cavity of the electroplating box (1), one side of the inclined plate (13) is provided with a guide groove (14), and the guide groove (14) is in an inclined state.
3. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 2, wherein: one side of electroplating case (1) is provided with drain pipe (15), and drain pipe (15) are linked together with guide slot (14), and the upper end fixed mounting of electroplating case (1) has lantern ring (16), and the upper end of slide bar (42) runs through lantern ring (16), and the inner wall of electroplating case (1) is provided with side groove (17), and connecting block (41) and side groove (17) phase-match.
4. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 3, wherein: and a valve (151) is arranged on the outer wall of the liquid outlet pipe (15).
5. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 1, wherein: clamping structure (3) are including setting up channel (31) and setting up positive and negative tooth lead screw (32) in channel (31) inside at last frame plate (2) one side, and external motor output of positive and negative tooth lead screw (32), and the outside of positive and negative tooth lead screw (32) is provided with screw block (33).
6. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 5, wherein: the lower end of the thread block (33) is fixedly provided with an electric push rod (34), and the other end of the electric push rod (34) is connected with the clamping plate (35).
7. The apparatus of claim 6, wherein: the thread block (33), the electric push rod (34) and the clamping plate (35) are provided with two groups, the thread block (33), the electric push rod (34) and the clamping plate (35) are symmetrically installed about the center line of the positive and negative thread screw rod (32), and the thread block (33) is in threaded fit connection with the positive and negative thread screw rod (32).
8. A horizontal high aspect ratio circuit board micro-via copper plating apparatus of claim 1, wherein: the material pushing part (5) comprises a side opening (51) arranged on the surface of the electroplating box (1) and an air cylinder (52) arranged on the side wall of the side opening (51), and the other end of the air cylinder (52) is connected with the scraper (53).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122437064.6U CN215713475U (en) | 2021-10-11 | 2021-10-11 | Horizontal high aspect ratio circuit board micropore copper plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122437064.6U CN215713475U (en) | 2021-10-11 | 2021-10-11 | Horizontal high aspect ratio circuit board micropore copper plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215713475U true CN215713475U (en) | 2022-02-01 |
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ID=80027598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122437064.6U Expired - Fee Related CN215713475U (en) | 2021-10-11 | 2021-10-11 | Horizontal high aspect ratio circuit board micropore copper plating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215713475U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
-
2021
- 2021-10-11 CN CN202122437064.6U patent/CN215713475U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114622255A (en) * | 2022-03-12 | 2022-06-14 | 张荣光 | Electroplating equipment for open-circuit short-circuit test board of chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220201 |