CN215703036U - Wafer ring cutting device - Google Patents
Wafer ring cutting device Download PDFInfo
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- CN215703036U CN215703036U CN202121939016.0U CN202121939016U CN215703036U CN 215703036 U CN215703036 U CN 215703036U CN 202121939016 U CN202121939016 U CN 202121939016U CN 215703036 U CN215703036 U CN 215703036U
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- fixedly connected
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- cutting
- wafer ring
- cutting device
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Abstract
The utility model discloses a wafer ring cutting device, which relates to the field of cutting devices and comprises an installation panel body, wherein a round through hole is formed in the top side of the installation panel body, a rotary installation cylinder is rotatably installed in the round through hole, the bottom end of the rotary installation cylinder is fixedly connected with a rotary large gear, the bottom side of the installation panel body is fixedly connected with a connection installation plate, and one side of the connection installation plate is fixedly connected with a connection transverse plate. This equipment is installed on the wafer ring cutting assembly line, material loading of wafer ring is carried out through the material feeding unit of wafer ring, at first start step drive motor, it rotates to drive the cutting dish through step drive motor, manual rotation control panel, the control panel drives and drives the lead screw and rotate, it drives driven connecting plate and moves forward to drive the lead screw, it removes along spacing slide rail to drive spacing sliding block through driven connecting plate, spacing sliding block drives step drive motor and cutting piece and removes, and then realize cutting a incision, through the manual regulation cutting depth, can have the shallower line of cut of cutting earlier, progressively deepen at the back, thereby guarantee cutting accuracy.
Description
Technical Field
The utility model relates to the field of cutting devices, in particular to a wafer ring cutting device.
Background
The wafer paster refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape of the wafer paster is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide.
In the prior art, the cutting process of the wafer paster cannot be automated, and continuous clamping and positioning are needed, so that time and labor are wasted when the precision cannot be guaranteed, the wafer ring cutting device is provided, the feeding device is matched, automatic annular track cutting can be achieved, meanwhile, the cutting feed amount can be manually adjusted, and the whole design structure is simple and strong in practicability.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a wafer ring cutting apparatus, so as to solve the problems of the related art.
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a crystal ring cutting device, includes the installation panel body, circular through-hole has been seted up to the top side of installation panel body, the installation section of thick bamboo is installed in the rotation of circular through-hole, the bottom fixedly connected with who rotates the installation section of thick bamboo rotates the gear wheel, the bottom side fixedly connected with of installation panel body links up the mounting panel, the one side fixedly connected with who links up the mounting panel connects the diaphragm, the top side fixedly mounted who connects the diaphragm has servo installation motor, servo installation motor's output shaft has the rotation pinion, it has brilliant ring to run through in the installation section of thick bamboo to rotate, two support ejector pins of top fixedly connected with of rotating the installation section of thick bamboo, two same square rings of top fixedly connected with that support the ejector pin, one side fixedly connected with of square ring supports the mounting bracket, the top side fixedly mounted who supports the mounting bracket has the riser.
Preferably, a circular through hole is formed in the vertical plate, a driving screw rod is installed in the circular through hole in a rotating mode, a control disc is fixedly connected to one end of the driving screw rod, and a limiting block is fixedly connected to the other end of the driving screw rod.
Preferably, one side fixed mounting that supports the mounting bracket has spacing slide rail, sliding sleeve has spacing sliding block on the spacing slide rail.
Preferably, the bottom side of the limiting sliding block is fixedly connected with a stepping drive motor, and an output shaft of the stepping drive motor is fixedly sleeved with a cutting disc.
Preferably, the limiting sliding block is sleeved on the limiting sliding rail in a sliding mode, and four supporting legs are fixedly connected to the bottom side of the mounting panel body.
Preferably, the top side of the limiting sliding block is fixedly connected with a driven connecting plate, a threaded through hole is formed in the driven connecting plate, and the screw rod is driven to penetrate through the threaded through hole.
The utility model has the technical effects and advantages that:
this practical theory of operation:
1. this equipment is installed on the wafer ring cutting assembly line, material loading of wafer ring is carried out through the material feeding unit of wafer ring, at first start step drive motor, it rotates to drive the cutting dish through step drive motor, manual rotation control panel, the control panel drives and drives the lead screw and rotate, it drives driven connecting plate and moves forward to drive the lead screw, it removes along spacing slide rail to drive spacing sliding block through driven connecting plate, spacing sliding block drives step drive motor and cutting piece and removes, and then realize cutting a incision, through the manual regulation cutting depth, can have the shallower line of cut of cutting earlier, progressively deepen at the back, thereby guarantee cutting accuracy.
2. Through servo installation motor's design, start servo installation motor this moment, servo installation motor drives and rotates pinion rotation, rotates the pinion and drives and rotate the gear wheel rotation, rotates the gear wheel and drives and rotate an installation section of thick bamboo and rotate, and then realizes driving the subassembly motion of fixing on supporting ejector pin and the square ring, and the cutting orbit is just in time circular to the cutting of realization to the brilliant ring, whole design simple structure, the practicality is strong.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic perspective view of another embodiment of the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 4 is a schematic top view of the present invention.
In the figure: 1. installing a panel body; 2. rotating the mounting cylinder; 3. rotating the bull gear; 4. connecting the mounting plates; 5. connecting the transverse plates; 6. a motor is installed in a servo mode; 7. rotating the pinion gear; 8. a crystal ring; 9. supporting the ejector rod; 10. a square ring; 11. supporting the mounting frame; 12. driving the screw rod; 13. a limiting slide rail; 14. a limiting sliding block; 15. a driven connecting plate; 16. a control panel; 17. a step-by-step drive motor; 18. and (5) cutting the disc.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The utility model provides a wafer ring cutting device as shown in figures 1-4, which comprises a mounting panel body 1, wherein a round through hole is formed in the top side of the mounting panel body 1, a rotary mounting cylinder 2 is rotatably mounted in the round through hole, a rotary large gear 3 is fixedly connected to the bottom end of the rotary mounting cylinder 2, a connecting mounting plate 4 is fixedly connected to the bottom side of the mounting panel body 1, a connecting transverse plate 5 is fixedly connected to one side of the connecting mounting plate 4, a servo mounting motor 6 is fixedly mounted on the top side of the connecting transverse plate 5, a rotary small gear 7 is connected to an output shaft of the servo mounting motor 6, a wafer ring 8 penetrates through the rotary mounting cylinder 2, two supporting ejector rods 9 are fixedly connected to the top end of the rotary mounting cylinder 2, the top ends of the two supporting ejector rods 9 are fixedly connected with a same square ring 10, a supporting mounting frame 11 is fixedly connected to one side of the square ring 10, the top side fixed mounting who supports mounting bracket 11 has the riser, drives cutting disc 18 through step drive motor 17 and rotates, and manual rotation control panel 16, control panel 16 drive and drive lead screw 12 and rotate, drive lead screw 12 and drive driven connecting plate 15 and move forward, drive limit sliding block 14 through driven connecting plate 15 and move along spacing slide rail 13, and limit sliding block 14 drives step drive motor 17 and cutting piece 18 and removes, and then realizes cutting a incision.
Further, in the above scheme, a circular through hole is formed in the vertical plate, a driving screw rod 12 is rotatably installed in the circular through hole, one end of the driving screw rod 12 is fixedly connected with a control panel 16, and the other end of the driving screw rod 12 is fixedly connected with a limiting block.
Further, in the above scheme, one side fixed mounting that supports mounting bracket 11 has spacing slide rail 13, sliding sleeve has spacing sliding block 14 on spacing slide rail 13, through spacing sliding block 14's design, has improved the effect of the precision of slip in-process.
Further, in the above scheme, the bottom side of the limiting sliding block 14 is fixedly connected with a step driving motor 17, the output shaft of the step driving motor 17 is fixedly sleeved with a cutting disc 18, the servo installation motor 6 is started at the moment, the servo installation motor 6 drives a rotation pinion 7 to rotate, the rotation pinion 7 drives a rotation gearwheel 3 to rotate, the rotation gearwheel 3 drives a rotation installation cylinder 2 to rotate, further, the fixed components on the supporting ejector rod 9 and the square ring 10 are driven to move, the cutting track is just circular at the moment, and therefore the cutting of the wafer ring is achieved.
Further, in above-mentioned scheme, sliding sleeve has spacing sliding block 14 on spacing slide rail 13, and four supporting legs of bottom side fixedly connected with of installation panel body 1 have realized spacing and the function of direction through spacing slide rail 13's design.
Further, in the above scheme, the top side of the limit sliding block 14 is fixedly connected with a driven connecting plate 15, a threaded through hole is formed in the driven connecting plate 15, the lead screw 12 is driven to penetrate through the threaded through hole, and the transmission of mechanical energy is realized through the design of the lead screw 12.
This practical theory of operation: the equipment is installed on a wafer ring cutting production line, the wafer ring is fed through a feeding device of the wafer ring, firstly, a stepping driving motor 17 is started, a cutting disc 18 is driven to rotate through the stepping driving motor 17, a control disc 16 is manually rotated, the control disc 16 drives a lead screw 12 to rotate, the lead screw 12 is driven to drive a driven connecting plate 15 to move forwards, a limit sliding block 14 is driven to move along a limit sliding rail 13 through the driven connecting plate 15, the limit sliding block 14 drives the stepping driving motor 17 and a cutting disc 18 to move, further, a notch is cut, at the moment, a servo installation motor 6 is started, the servo installation motor 6 drives a rotating pinion 7 to rotate, the rotating pinion 7 drives a rotating big gear 3 to rotate, the rotating big gear 3 drives a rotating installation cylinder 2 to rotate, further, the components fixed on a supporting ejector rod 9 and a square ring 10 are driven to move, at the moment, the cutting track is just circular, therefore, the wafer ring can be cut, the whole design structure is simple, and the practicability is high.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.
Claims (7)
1. The utility model provides a wafer ring cutting device, includes installation panel body (1), its characterized in that: the top side of the installation panel body (1) is provided with a circular through hole, a rotary installation cylinder (2) is rotatably installed in the circular through hole, the bottom end of the rotary installation cylinder (2) is fixedly connected with a rotary large gear (3), the bottom side of the installation panel body (1) is fixedly connected with a linking installation plate (4), one side of the linking installation plate (4) is fixedly connected with a connecting transverse plate (5), the top side of the connecting transverse plate (5) is fixedly installed with a servo installation motor (6), an output shaft of the servo installation motor (6) is connected with a rotary small gear (7), a crystal ring (8) penetrates through the rotary installation cylinder (2), the top end of the rotary installation cylinder (2) is fixedly connected with two support ejector rods (9), the top ends of the two support ejector rods (9) are fixedly connected with a same square ring (10), one side of the square ring (10) is fixedly connected with a support installation frame (11), a vertical plate is fixedly arranged on the top side of the support mounting frame (11).
2. The wafer ring cutting device according to claim 1, wherein: the vertical plate is provided with a circular through hole, a driving screw rod (12) is rotatably installed in the circular through hole, one end of the driving screw rod (12) is fixedly connected with a control panel (16), and the other end of the driving screw rod (12) is fixedly connected with a limiting block.
3. The wafer ring cutting device according to claim 1, wherein: one side fixed mounting that supports mounting bracket (11) has spacing slide rail (13), sliding sleeve has spacing sliding block (14) on spacing slide rail (13).
4. The wafer ring cutting device according to claim 3, wherein: the bottom side of the limiting sliding block (14) is fixedly connected with a stepping driving motor (17), and a cutting disc (18) is fixedly sleeved on an output shaft of the stepping driving motor (17).
5. The wafer ring cutting device according to claim 3, wherein: spacing sliding block (14) have been cup jointed in the slip on spacing slide rail (13), four supporting legs of bottom side fixedly connected with of installation panel body (1).
6. The wafer ring cutting device according to claim 3, wherein: the top side of the limiting sliding block (14) is fixedly connected with a driven connecting plate (15), a threaded through hole is formed in the driven connecting plate (15), and a screw rod (12) is driven to penetrate through the threaded through hole.
7. The wafer ring cutting device according to claim 1, wherein: the rotating small gear (7) is meshed with the rotating large gear (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121939016.0U CN215703036U (en) | 2021-08-18 | 2021-08-18 | Wafer ring cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121939016.0U CN215703036U (en) | 2021-08-18 | 2021-08-18 | Wafer ring cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215703036U true CN215703036U (en) | 2022-02-01 |
Family
ID=79997886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121939016.0U Active CN215703036U (en) | 2021-08-18 | 2021-08-18 | Wafer ring cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215703036U (en) |
-
2021
- 2021-08-18 CN CN202121939016.0U patent/CN215703036U/en active Active
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