CN215647814U - Integrated circuit design simulation device - Google Patents
Integrated circuit design simulation device Download PDFInfo
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- CN215647814U CN215647814U CN202122291497.5U CN202122291497U CN215647814U CN 215647814 U CN215647814 U CN 215647814U CN 202122291497 U CN202122291497 U CN 202122291497U CN 215647814 U CN215647814 U CN 215647814U
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Abstract
The utility model discloses an integrated circuit design simulation device which comprises a simulation box body and a simulation box cover, wherein the rear end of the top of the simulation box body is rotatably connected with the simulation box cover, two sides of the front end of the simulation box body are respectively and fixedly connected with a voltmeter and an ammeter, the bottom of the outer wall of one side of the simulation box body is fixedly connected with a communication interface, the outer surface of the top of the simulation box cover is fixedly connected with a plurality of load devices, and the bottom of the front end of the simulation box cover is fixedly connected with a lock. The cold air is generated by the refrigerating fan, and the hot air is generated by the heating fan, so that the low-temperature environment and the high-temperature environment of the integrated circuit during working can be conveniently simulated; the two box cover partition plates and the box body partition plate are mutually clamped, so that the working environment temperature of the integrated circuit can be conveniently changed, and the box cover partition plate and the box body partition plate which are made of rock wool plates have a good heat preservation effect; the two pressing cylinders drive the pressing plate to press downwards, so that the pins of the integrated circuit are connected with the connecting columns more tightly.
Description
Technical Field
The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit design simulation device.
Background
Integrated circuit design involves modeling of electronic devices, inter-device interconnect lines. The most commonly used substrate material for integrated circuit designs is silicon. Integrated circuit designs can be broadly divided into two broad categories, digital integrated circuit designs and analog integrated circuit designs; however, it is also possible that the actual integrated circuit is a mixed signal integrated circuit, so that not only the design of the circuit is used for both processes.
After the integrated circuit is designed, the working environment of the integrated circuit needs to be simulated and tested, so that the working states of the integrated circuit in different environments are obtained, and the conventional simulation device has the following defects: first, the existing simulation devices are difficult to simulate a variety of different temperature environments; secondly, the integrated circuit is easy to be damaged in the simulation process; therefore, it is desirable to provide an integrated circuit design simulation apparatus to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that the existing simulation device is difficult to simulate various different temperature environments; integrated circuits are susceptible to damage during simulation.
In order to solve the technical problems, the utility model adopts a technical scheme that: the integrated circuit design simulation device comprises a simulation box body and a simulation box cover, wherein the rear end of the top of the simulation box body is rotatably connected with the simulation box cover, two sides of the front end of the simulation box body are respectively and fixedly connected with a voltmeter and an ammeter, the bottom of the outer wall of one side of the simulation box body is fixedly connected with a communication interface, the outer surface of the top of the simulation box cover is fixedly connected with a plurality of load devices, and the bottom of the front end of the simulation box cover is fixedly connected with a lock;
two sides of the inner surface of the top of the simulated box cover are fixedly connected with box cover clapboards, the center of the inner surface of the top of the simulated box cover is fixedly connected with two compression cylinders, and the bottoms of piston rods of the two compression cylinders are fixedly connected with compression plates;
the simulation box body comprises a simulation box body bottom, a box body baffle plate, a communication control plate, a communication data line, a placing plate, a connecting column, a refrigerating fan, a cold air pipe, a heating fan, a box cover baffle plate, a communication interface, a connecting column, a communication control plate, a placing plate, a cold air pipe, a heating fan, a cooling fan, a heating fan, a power supply device and a power supply device, wherein the box body baffle plate corresponds to the box cover baffle plate and is fixedly connected with two sides of the inner surface of the simulation box body bottom, the communication control plate is fixedly connected with the communication interface, the communication data line is fixedly connected with the communication data line on one side close to the communication interface, the communication data line is fixedly connected with the communication interface, the placing plate is fixedly connected with the center on the inner side of the two box body baffle plates, the top of the placing plate is provided with the limiting groove, the bottom of the limiting groove is provided with a plurality of pipe leg holes, the leg holes are fixedly connected with the connecting column bottoms, the connecting column bottoms are fixedly connected with the communication control plate, the inner wall top on one side close to the communication interface, the simulation box body is fixedly connected with the cooling fan, the heating fan on one side close to the inner wall top of the simulation box body, the simulation box body close to the simulation box body, the cooling fan, the inner wall top is fixedly connected with the cooling fan, the inner wall top is fixedly connected with the cooling fan, and the air outlet of the heating fan is fixedly connected with a hot air pipe.
Preferably, the simulation box body and the simulation box cover are connected in a rotating mode through hinges, the simulation box body is opened through rotating the simulation box cover, the integrated circuit is placed into the simulation box body, then the simulation box cover is rotated reversely, the simulation box body is closed, and the integrated circuit is located in a sealed environment.
Preferably, two the pressure strip bottom all is provided with the memory foam-rubber cushion, descends through two air cylinder piston rods that compress tightly and drives two pressure strips and descend, makes pressure strip bottom and integrated circuit contact, slows down the holding down pressure of pressure strip through the memory foam-rubber cushion, avoids integrated circuit to damage.
Preferably, two case lid baffle and box baffle are rock wool board material and make, and the heat preservation effect of rock wool board is better, can effectively keep integrated circuit's ambient temperature, and two case lid baffle bottom fixedly connected with card strip, two the draw-in groove corresponding with the card strip is seted up at box baffle top, through the cooperation of card strip and draw-in groove, increases the gas tightness of integrated circuit place environment.
Preferably, a plurality of support columns of communication control panel bottom fixedly connected with, it is a plurality of support column bottom and simulation bottom of the case internal surface fixed connection play the supporting role to communication control panel through a plurality of support columns, avoid communication control panel bottom direct and simulation bottom of the case internal surface to contact.
Preferably, place the board and make for ceramic material, ceramic material has better insulating nature, and it is downthehole that integrated circuit's pin is inserted a plurality of pins, then with the spliced pole electric connection of pin hole bottom, it is a plurality of the spliced pole is the copper product and makes.
Preferably, two the box baffle is seted up respectively with cold-blast main and the corresponding through-hole of hot-blast main, just cold-blast main and hot-blast main keep away from simulation box one end and all run through the through-hole and extend to placing the board direction, produce cold wind through the refrigeration fan, analog integrated circuit works under low temperature environment, produces hot-blastly through the heating fan, analog integrated circuit works under high temperature environment.
The utility model has the following beneficial effects:
1. the refrigeration fan generates cold air, so that the low-temperature environment of the integrated circuit during working can be conveniently simulated; the heating fan generates hot air, so that the high-temperature environment of the integrated circuit during working can be conveniently simulated;
2. according to the utility model, the two box cover partition plates and the box body partition plate are mutually clamped, so that the integrated circuit is in a closed space, the working environment temperature of the integrated circuit is convenient to change, and the box cover partition plate and the box body partition plate which are made of rock wool plates have a good heat preservation effect and reduce temperature loss;
3. the two compressing cylinders drive the compressing plate to press downwards, so that the pins of the integrated circuit are connected with the connecting columns more tightly, and the memory foam-rubber cushion is arranged at the bottom of the compressing plate, so that the integrated circuit is prevented from being damaged by pressure.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a cross-sectional view of a simulated case lid of the present invention;
FIG. 3 is a cross-sectional view of a simulation pod of the present invention;
fig. 4 is a schematic view of the placement board of the present invention.
In the figure: 1. simulating a box body; 2. simulating a box cover; 3. connecting a lockset; 4. a load device; 5. a communication interface; 6. a voltmeter; 7. an ammeter; 8. a box cover clapboard; 9. a pressing cylinder; 10. a compression plate; 11. a box body clapboard; 12. a communication control panel; 13. placing the plate; 14. a communication data line; 15. a refrigeration fan; 16. a cold air pipe; 17. a heating fan; 18. a hot air pipe; 19. connecting columns; 20. a limiting groove; 21. and (4) pin holes.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.
Referring to fig. 1, an integrated circuit design simulation apparatus comprises a simulation box body 1 and a simulation box cover 2, wherein the simulation box cover 2 is rotatably connected to the rear end of the top of the simulation box body 1, the simulation box body 1 and the simulation box cover 2 are rotatably connected through a hinge, a voltmeter 6 and an ammeter 7 are respectively and fixedly connected to two sides of the front end of the simulation box body 1, the voltage value and the current value of the integrated circuit are measured by a voltmeter 6 and an ammeter 7, the bottom of the outer wall at one side of the simulation box body 1 is fixedly connected with a communication interface 5, is connected with a computer through a communication interface 5, a plurality of loading devices 4 are fixedly connected with the outer surface of the top of the simulation case cover 2, the loading devices 4 are electrically connected with an integrated circuit and a communication control panel 12, the integrated circuit drives the load device 4 to work, the bottom of the front end of the simulation box cover 2 is fixedly connected with a connecting lock 3, and the simulation box cover 2 and the simulation box body 1 are locked by connecting the lock 3.
Referring to fig. 2, 2 top internal surface both sides fixedly connected with case lid baffles 8 of simulation case lid, two case lid baffles 8 are rock wool board material and make, two 8 bottom fixedly connected with card strips of case lid baffle, 2 top internal surface center fixedly connected with two pressure cylinder 9 of simulation case lid, two equal fixedly connected with pressure strip 10 in pressure cylinder 9 piston rod bottom, drive pressure strip 10 through pressure cylinder 9 and descend, thereby compress tightly integrated circuit, two pressure strip 10 bottoms all are provided with the memory foam-rubber cushion, provide the buffering through the memory foam-rubber cushion, avoid pressure strip 10 to damage integrated circuit at the in-process of pushing down.
Referring to fig. 3 and 4, two sides of the inner surface of the bottom of the simulation box body 1 are fixedly connected with box body partition plates 11 corresponding to the box cover partition plate 8, the two box body partition plates 11 are made of rock wool board, the tops of the two box body partition plates 11 are provided with clamping grooves corresponding to the clamping strips, a closed space is formed by matching the box cover partition plate 8 and the box body partition plates 11, so that a certain temperature can be kept for a long time, the center of the inner surface of the bottom of the simulation box body 1 is fixedly connected with a communication control board 12, the bottom of the communication control board 12 is fixedly connected with a plurality of supporting columns, one side of the communication control board 12 close to the communication interface 5 is fixedly connected with a communication data line 14, one end of the communication data line 14 far away from the communication control board 12 is fixedly connected with the communication interface 5, parameters of the communication control board 12 are controlled by a computer, a placing plate 13 is fixedly connected with the center of the inner sides of the two box body partition plates 11, and the placing plate 13 is made of ceramic material, the top of the placing plate 13 is provided with a limiting groove 20, the integrated circuit is placed in the limiting groove 20, the bottom of the limiting groove 20 is provided with a plurality of pin holes 21, pins of the integrated circuit are inserted into the pin holes 21, the bottoms of the pin holes 21 are fixedly connected with connecting columns 19, the bottoms of the connecting columns 19 are fixedly connected with a communication control panel 12, the integrated circuit and the communication control panel 12 are connected through the connecting columns 19, the top of the inner wall of one side of the simulation box body 1 close to the communication interface 5 is fixedly connected with a refrigerating fan 15, an air outlet of the refrigerating fan 15 is fixedly connected with a cold air pipe 16, a box body partition plate 11 close to one side of the refrigerating fan 15 is provided with a through hole corresponding to the cold air pipe 16, one end of the cold air pipe 16, far away from the simulation box body 1, penetrates through the through hole and extends towards the direction of the placing plate 13, cold air is generated through the refrigerating fan 15, and then is sent into a closed space of the integrated circuit through the cold air pipe 16, thereby simulation integrated circuit works under low temperature environment, simulation box 1 keeps away from 15 one side inner wall top fixed connection heating fan 17 of refrigeration fan, heating fan 17 air outlet fixedly connected with hot-blast main 18, the box baffle 11 that is close to heating fan 17 one side has seted up the through-hole corresponding with hot-blast main 18, and hot-blast main 18 keeps away from simulation box 1 one end and all runs through the through-hole and extend to placing board 13 direction, it is hot-blast to produce through heating fan 17, then in sending hot-blast to integrated circuit's airtight space through hot-blast main 18, thereby simulation integrated circuit works under high temperature environment.
When the device is used, the simulation box cover 2 is rotated, the simulation box body 1 is opened, the integrated circuit is placed in the limiting groove 20, pins of the integrated circuit are inserted into the pin holes 21, the simulation box cover 2 is rotated reversely, the simulation box body 1 is closed, locking is carried out through the connection lockset 3, and then the two pressing cylinders 9 drive the pressing plate 10 to press down, so that the integrated circuit is pressed; cold air is sent into the closed space of the integrated circuit through a refrigerating fan 15 and a cold air pipe 16, so that the low-temperature working environment of the integrated circuit is simulated; the hot air is sent to the closed space of the integrated circuit through the heating fan 17 and the hot air pipe 18, so that the high-temperature working environment of the integrated circuit is simulated.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. The utility model provides an integrated circuit design analogue means, includes simulation box (1) and simulation case lid (2), its characterized in that: the simulation box comprises a simulation box body (1), a simulation box cover (2) and a communication interface (5), wherein the simulation box cover (2) is rotatably connected to the rear end of the top of the simulation box body (1), a voltmeter (6) and an ammeter (7) are fixedly connected to two sides of the front end of the simulation box body (1) respectively, the communication interface (5) is fixedly connected to the bottom of the outer wall of one side of the simulation box body (1), a plurality of load devices (4) are fixedly connected to the outer surface of the top of the simulation box cover (2), and a lock (3) is fixedly connected to the bottom of the front end of the simulation box cover (2);
two sides of the inner surface of the top of the simulation box cover (2) are fixedly connected with box cover partition plates (8), the center of the inner surface of the top of the simulation box cover (2) is fixedly connected with two pressing cylinders (9), and the bottoms of piston rods of the two pressing cylinders (9) are fixedly connected with pressing plates (10);
the simulation box comprises a simulation box body (1), box body partition plates (11) corresponding to box cover partition plates (8) are fixedly connected to two sides of the inner surface of the bottom of the simulation box body (1), a communication control panel (12) is fixedly connected to the center of the inner surface of the bottom of the simulation box body (1), a communication data line (14) is fixedly connected to one side, close to a communication interface (5), of the communication control panel (12), one end, far away from the communication control panel (12), of the communication data line (14) is fixedly connected with the communication interface (5), a placing plate (13) is fixedly connected to the center of the inner side of the two box body partition plates (11), a limiting groove (20) is formed in the top of the placing plate (13), a plurality of pin holes (21) are formed in the bottom of the limiting groove (20), connecting columns (19) are fixedly connected to the bottoms of the pin holes (21), and the bottoms of the connecting columns (19) are fixedly connected with the communication control panel (12), simulation box (1) is close to communication interface (5) one side inner wall top fixedly connected with refrigeration fan (15), refrigeration fan (15) air outlet fixedly connected with cold air pipe (16), refrigeration fan (15) one side inner wall top fixedly connected with heating fan (17) are kept away from in simulation box (1), heating fan (17) air outlet fixedly connected with hot-blast main (18).
2. The integrated circuit design simulation apparatus of claim 1, wherein: the simulation box body (1) and the simulation box cover (2) are rotatably connected through a hinge.
3. The integrated circuit design simulation apparatus of claim 1, wherein: the bottoms of the two pressing plates (10) are provided with memory foam cushions.
4. The integrated circuit design simulation apparatus of claim 1, wherein: two case lid baffle (8) and box baffle (11) are rock wool board material and make, and two fixedly connected with card strip in case lid baffle (8) bottom, two the draw-in groove corresponding with the card strip is seted up at box baffle (11) top.
5. The integrated circuit design simulation apparatus of claim 1, wherein: the bottom of the communication control panel (12) is fixedly connected with a plurality of supporting columns.
6. The integrated circuit design simulation apparatus of claim 1, wherein: the placing plate (13) is made of ceramic materials.
7. The integrated circuit design simulation apparatus of claim 1, wherein: two box baffle (11) are seted up respectively with cold blast pipe (16) and corresponding through-hole of hot-blast main (18), just cold blast pipe (16) and hot-blast main (18) are kept away from simulation box (1) one end and all are run through the through-hole and extend to placing board (13) direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122291497.5U CN215647814U (en) | 2021-09-22 | 2021-09-22 | Integrated circuit design simulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122291497.5U CN215647814U (en) | 2021-09-22 | 2021-09-22 | Integrated circuit design simulation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215647814U true CN215647814U (en) | 2022-01-25 |
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ID=79918373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122291497.5U Active CN215647814U (en) | 2021-09-22 | 2021-09-22 | Integrated circuit design simulation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215647814U (en) |
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2021
- 2021-09-22 CN CN202122291497.5U patent/CN215647814U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230727 Address after: M224, Floor 2-3, Building F and G, Wuhan Living Room, No. 8, Hongtu Road, Jiangjun Road Street, Dongxihu District, Wuhan City, 430000, Hubei Province Patentee after: Hubei Ruitong Technology Co.,Ltd. Address before: 510000 803, 76 Xingdong Road, xihuicheng garden, Fangcun Avenue, Liwan District, Guangzhou City, Guangdong Province Patentee before: Chen Xiaoli |
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| TR01 | Transfer of patent right |