CN215644485U - Liquid cooling heat exchange device for chip and vehicle - Google Patents
Liquid cooling heat exchange device for chip and vehicle Download PDFInfo
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- CN215644485U CN215644485U CN202122068750.0U CN202122068750U CN215644485U CN 215644485 U CN215644485 U CN 215644485U CN 202122068750 U CN202122068750 U CN 202122068750U CN 215644485 U CN215644485 U CN 215644485U
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Abstract
The utility model discloses a liquid cooling heat exchange device for a chip and a vehicle, wherein the liquid cooling heat exchange device for the chip comprises: liquid inlet portion, liquid outlet portion and heat transfer portion. The heat exchanging part is communicated between the liquid inlet part and the liquid outlet part, a liquid flowing space is arranged in the heat exchanging part, flow guide heat exchange fins are arranged in the liquid flowing space, the heat exchanging part is provided with a high-power chip heat exchanging area and a low-power chip heat exchanging area, and the setting density of the flow guide heat exchange fins corresponding to the high-power chip heat exchanging area is greater than that of the flow guide heat exchange fins corresponding to the low-power chip heat exchanging area. This liquid cooling heat transfer device can carry out the heat transfer to motor chip and generator chip simultaneously to realize that a heat transfer structure can carry out the heat transfer to the chip of difference, not only can make the structure simpler, be more convenient for arrange, but also can further promote the heat transfer effect to different chips.
Description
Technical Field
The utility model relates to the technical field of vehicles, in particular to a liquid cooling heat exchange device for a chip and a vehicle.
Background
In the prior art, the generator chip with lower heating temperature generally adopts air cooling to run, the motor chip with higher heating temperature generally adopts a liquid cooling device to cool to run, or the generator chip and the motor chip adopt two mutually independent liquid cooling devices to cool respectively, the two modes all result in poor cooling and heat exchange effects to the chip, influence the normal operation of the chip and the vehicle, and the integral structure of the latter is more complicated, the occupied arrangement space is larger, and the improvement space exists.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention is directed to a liquid cooling heat exchanging device for chips, which can exchange heat for a motor chip and a generator chip simultaneously, so as to realize that one heat exchanging structure can exchange heat for different chips, thereby not only simplifying the structure and facilitating the arrangement, but also further improving the heat exchanging effect for different chips.
In order to achieve the purpose, the technical scheme of the utility model is realized as follows:
a liquid-cooled heat exchange device for a chip, comprising: a liquid inlet part and a liquid outlet part; the heat exchange part is communicated between the liquid inlet part and the liquid outlet part, a liquid flowing space is arranged in the heat exchange part, flow guide heat exchange fins are arranged in the liquid flowing space, the heat exchange part is provided with a high-power chip heat exchange area and a low-power chip heat exchange area, and the setting density of the flow guide heat exchange fins corresponding to the high-power chip heat exchange area is greater than that of the flow guide heat exchange fins corresponding to the low-power chip heat exchange area.
Further, the low power chip heat exchanging region is located upstream of the high power chip heat exchanging region.
Further, the flow guide heat exchange fins are configured as wave-shaped fins extending along the flowing direction of the liquid in the heat exchange part.
Further, the undulation degree of the wavy fins corresponding to the high-power chip heat exchange area is greater than the undulation degree of the wavy fins corresponding to the low-power chip heat exchange area.
Furthermore, the high-power chip heat exchange area is correspondingly provided with three groups of wavy fin groups distributed along the liquid flowing direction, and a first buffer gap is formed between every two adjacent groups of wavy fin groups.
Furthermore, the low-power chip heat exchange area is correspondingly provided with three groups of wavy fin groups distributed along the liquid flowing direction, and a second buffer gap is formed between every two adjacent groups of wavy fin groups.
Further, the undulation degree of the wavy fins in the wavy fin group at the upstream is smaller than the undulation degree of the wavy fins in the wavy fin group at the downstream.
Further, the liquid inlet portion includes: feed liquor pipe and first transition communicating structure, first transition communicating structure intercommunication be in the feed liquor pipe with between the feed liquor end of heat transfer portion, first transition communicating structure with the open area of the first end of feed liquor pipe intercommunication is less than first transition communicating structure with the open area of the second end of heat transfer portion intercommunication, it includes to go out liquid portion: the liquid outlet pipe and the second transition communicating structure are communicated between the liquid outlet pipe and the liquid outlet end of the heat exchanging part, and the opening area of the third end of the second transition communicating structure communicated with the liquid outlet pipe is smaller than that of the fourth end of the second transition communicating structure communicated with the heat exchanging part.
Further, the first transition communicating structure gradually increases in width and gradually decreases in thickness from the first end to the second end, and the second transition communicating structure gradually increases in width and gradually decreases in thickness from the third end to the fourth end.
Compared with the prior art, the liquid cooling heat exchange device for the chip has the following advantages:
the liquid cooling heat exchange device for the chip can exchange heat for the motor chip and the generator chip simultaneously, so that one heat exchange structure can exchange heat for different chips, the structure is simpler, the arrangement is more convenient, and the heat exchange effect for different chips can be further improved.
Another object of the present invention is to provide a vehicle, which includes the above liquid-cooled heat exchange device for a chip, and the chip of the vehicle can be cooled better, so that the safety of the vehicle is better.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 is a schematic structural diagram of a generator chip and a motor chip disposed on a liquid-cooled heat exchange device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a partial structure of a generator chip and a motor chip disposed on a liquid-cooled heat exchange device according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a generator chip and a motor chip in place on a liquid-cooled heat exchange device according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a portion of a liquid-cooled heat exchange device according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a liquid-cooled heat exchange device according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a liquid intake according to an embodiment of the utility model;
fig. 7 is a sectional view of a liquid outlet portion according to an embodiment of the present invention.
Description of reference numerals:
100-liquid-cooled heat exchange device, 1-liquid inlet part, 2-liquid outlet part, 3-heat exchange part, 31-liquid flow space, 32-wave fin, 4-high power chip heat exchange region, 5-low power chip heat exchange region, 30-wave fin group, 6-first buffer gap, 7-second buffer gap, 8-third buffer gap, 11-liquid inlet pipe, 12-first transition communication structure, 121-first end, 122-second end, 21-liquid outlet pipe, 22-second transition communication structure, 221-third end, 222-fourth end, 200-generator chip, 300-motor chip, 201-first substrate, 202-first shell, 301-second substrate, 302-second shell, 203-generator first phase chip set, 204-generator second phase chip set, 205-generator third phase chip set, 303-motor first phase chip set, 304-motor second phase chip set, 305-motor third phase chip set, 9-fourth buffer gap, 10-fifth buffer gap.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
A liquid-cooled heat exchange device 100 for a chip according to an embodiment of the present invention is described below with reference to fig. 1 to 7.
The liquid-cooled heat exchange device 100 for chips according to an embodiment of the present invention may include: a liquid inlet part 1, a liquid outlet part 2 and a heat exchange part 3.
As shown in fig. 1 to 4, the liquid-cooled heat exchange device 100 according to the embodiment of the present invention is suitable for exchanging heat for an IGBT (Insulated Gate Bipolar Transistor) chip. The main driving motor of the new energy automobile generally uses a controller based on an IGBT chip to provide current for the main driving motor. During the operation of the high-speed switch of the IGBT chip, loss and heat are brought. In order to ensure the normal operation of the IGBT chip, a certain heat dissipation structure is required to control the maximum temperature thereof to below the limiting junction temperature.
Because under the traditional condition, generally adopt the forced air cooling to the lower generator chip of the temperature that generates heat during operation, and generally adopt the liquid cooling device to cool off to the higher motor chip of the temperature that generates heat during operation, perhaps, generator chip and motor chip adopt two mutually independent liquid cooling devices to cool off respectively, above-mentioned two kinds of modes all lead to the cooling heat transfer effect to the chip relatively poor, influence the normal operating of chip and vehicle, and the overall structure of the latter is more complicated, and the arrangement space who occupies is great.
Therefore, in the embodiment of the present invention, two conventional liquid cooling devices for independently cooling two chips are integrated into a whole, so as to design a novel integrated liquid cooling heat exchanging device 100, and the liquid cooling heat exchanging device 100 has heat exchanging regions with different structures for the two chips. Therefore, the device of the liquid cooling heat exchange device 100 can simultaneously exchange heat for the generator chip 200 and the motor chip 300, not only can the overall structure be simplified, but also the arrangement is more convenient, and the cooling and heat exchange effects are better.
Wherein, liquid inlet portion 1 is suitable for and the feed liquor pipeline intercommunication to in introducing the coolant liquid to liquid cooling heat transfer device 100, liquid outlet portion 2 is suitable for and goes out the liquid pipeline intercommunication, in order to discharge the higher coolant liquid of temperature through the heat transfer in liquid cooling heat transfer device 100, heat transfer portion 3 communicates between liquid inlet portion 1 and liquid outlet portion 2, and has liquid flow space 31 in the heat transfer portion 3, the coolant liquid that flows into in liquid flow space 31 is suitable for to carry out the heat transfer through heat transfer portion 3 and chip, thereby cool down the processing to the chip.
Further, be provided with water conservancy diversion heat transfer fin in the liquid flow space 31 to in the heat transfer area between increase coolant liquid and the heat transfer portion 3, and can make the heat transfer more even, and then can make heat transfer portion 3 better to the heat transfer effect of chip. Wherein, the heat exchange part 3 has a high power chip heat exchange area 4 and a low power chip heat exchange area 5, the high power chip heat exchange area 4 is suitable for cooling and heat exchanging the motor chip 300 with higher temperature generated in operation, and the low power chip heat exchange area 5 is suitable for cooling and heat exchanging the generator chip 200 with lower temperature generated in operation, and the setting density of the diversion heat exchange fins corresponding to the high power chip heat exchange area 4 is larger than that of the diversion heat exchange fins corresponding to the low power chip heat exchange area 5, so that the cooling efficiency of the high power chip heat exchange area 4 is higher than that of the low power chip heat exchange area 5, and further the heat exchange areas with different cooling efficiencies can correspondingly generate chips with different temperatures, thereby ensuring the heat exchange effect and the heat exchange uniformity when the liquid cooling heat exchange device 100 exchanges heat to the motor chip 300 and the generator chip 200 simultaneously, so that the heat exchange of two different chips by one heat exchange device can ensure that the two chips operate in a proper temperature range.
According to the liquid-cooled heat exchange device 100 for chips, provided by the embodiment of the utility model, the liquid-cooled heat exchange device 100 can simultaneously exchange heat for the motor chip 300 and the generator chip 200, so that one heat exchange structure can exchange heat for different chips, the structure is simpler, the arrangement is more convenient, and the heat exchange effect for different chips can be further improved.
In connection with the embodiments shown in fig. 2 and 3, the low power chip heat exchanging area 5 is located upstream of the high power chip heat exchanging area 4. Because the temperature of the generator chip 200 cooled by the low-power chip heat exchange region 5 is low, and the temperature of the motor chip 300 cooled by the high-power chip heat exchange region 4 is high, the low-power chip heat exchange region 5 is arranged at the upstream, so that the cooling liquid flowing into the heat exchange portion 3 can exchange heat with the generator chip 200 at first, and then the temperature of the cooling liquid is not raised too high, which affects the normal heat exchange of the cooling liquid with the motor chip 300 at the downstream. Therefore, the cooling and heat exchanging effects of the generator chip 200 and the motor chip 300 can be simultaneously ensured, so that the overall cooling and heat exchanging effect of the liquid cooling and heat exchanging device 100 is better.
As shown in fig. 3 and 4, the flow guiding heat exchange fin is a wave-shaped fin 32 extending along the flowing direction of the liquid in the heat exchange portion 3, the wave-shaped fin 32 not only can make the flow guiding effect better, so that the flowing of the cooling liquid is more uniform, but also can further increase the heat exchange area between the cooling liquid and the heat exchange portion 3, so as to further increase the heat exchange efficiency of the liquid cooling heat exchange device 100, and further can make the cooling heat exchange effect of the liquid cooling heat exchange device 100 on the chip better.
Further, the undulation degree of the wavy fins 32 corresponding to the high-power chip heat exchange area 4 is greater than the undulation degree of the wavy fins 32 corresponding to the low-power chip heat exchange area 5. The larger the undulation degree of the wavy fin 32 is, the larger the contact area between the wavy fin 32 and the coolant is, the larger the turbulence degree of the coolant is, and the larger the heat exchange efficiency is. Therefore, the heat exchange efficiency of the high-power chip heat exchange area 4 is higher than that of the low-power chip heat exchange area 5.
Referring to fig. 3-5, the high-power chip heat exchange region 4 corresponds to three groups of wavy fin groups 30 distributed along the liquid flow direction, a first buffer gap 6 is formed between two adjacent groups of wavy fin groups 30, and the wavy fins 32 in the upstream wavy fin group 30 have a greater waviness degree than the wavy fins 32 in the downstream wavy fin group 30. Specifically, the motor first phase chipset 303 (motor U-phase chip) corresponds to the downstream-most wavy fin group 30 in the three groups of wavy fin groups 30, the motor second phase chipset 304 (motor V-phase chip) corresponds to the midstream wavy fin group 30, the motor third phase chipset 305 (motor W-phase chip) corresponds to the upstream-most wavy fin group 30, and since the temperature of the motor first phase chipset 303 during operation is higher than that of the motor second phase chipset 304 and the temperature of the motor second phase chipset 304 during operation is higher than that of the third phase chipset 305, the motor first phase chipset 303, the motor second phase chipset 304 and the motor third phase chipset 305 correspond to the downstream wavy fin group 30 with the highest heat exchange efficiency, the midstream wavy fin group 30 with the medium heat exchange efficiency and the upstream wavy fin group 30 with the low heat exchange efficiency respectively, thereby the heat exchange effect is better.
Further, the low-power chip heat exchange region 5 corresponds to three groups of wavy fin groups 30 distributed along the liquid flowing direction, a second buffer gap 7 is formed between two adjacent groups of wavy fin groups 30, and the wavy fin 32 in the wavy fin group 30 at the upstream has a greater undulation degree than the wavy fin 32 in the wavy fin group 30 at the downstream. Specifically, the downstream corrugated fin group 30 of the three groups of corrugated fin groups 30 is a generator first phase chip set 203 (a generator U-phase chip), the midstream corrugated fin group 30 is a generator second phase chip set 204 (a generator V-phase chip), the upstream corrugated fin group 30 is a generator third phase chip set 205 (a generator W-phase chip), and the first phase chip set 203, the second phase chip set 204 and the third phase chip set 205 correspond to the downstream corrugated fin group 30 with the highest heat exchange efficiency, the midstream corrugated fin group 30 with the medium heat exchange efficiency and the upstream corrugated fin group 30 with the low heat exchange efficiency respectively because the temperature of the first phase chip set 203 is higher than that of the second phase chip set 204 and the temperature of the second phase chip set 204 is higher than that of the third phase chip set 205, thereby the heat exchange effect is better.
Wherein, the setting of first buffer clearance 6 and second buffer clearance 7, the setting of third buffer clearance 8 between high power chip heat transfer region 4 and the low-power chip heat transfer region 5, the setting of fourth buffer clearance 9 between the inlet end of low-power chip heat transfer region 5 and heat transfer portion 3 and the setting of fifth buffer clearance 10 between the play liquid end of high power chip heat transfer region 4 and heat transfer portion 3, not only can reduce the flow resistance loss of coolant liquid, but also can play the steady coolant liquid flow state, reduce eddy current loss's effect, and can laminate unanimous as far as possible with the heat exchange scope of wave fin 32 and the scope of generating heat of chip, thereby can further effectual promotion heat exchange efficiency and heat transfer effect.
With reference to the embodiment shown in fig. 1 to 7, the liquid inlet portion 1 includes: feed liquor pipe 11 and first transition communicating structure 12, feed liquor pipe 11 is suitable for and communicates with the feed liquor pipeline mutually, first transition communicating structure 12 communicates between the feed liquor end of feed liquor pipe 11 and heat transfer portion 3, wherein, the open area of first end 121 that first transition communicating structure 12 and feed liquor pipe 11 communicate is less than the open area of second end 122 that first transition communicating structure 12 and heat transfer portion 3 communicate, so as to guarantee that the feed liquor area of heat transfer portion 3 is greater than the feed liquor area of feed liquor pipe 11, so as to reduce the impact, guarantee that the coolant can be stable and even flow into in heat transfer portion 3, so as to guarantee liquid cooling heat transfer device 100's heat transfer effect.
Further, the liquid outlet portion 2 includes: drain pipe 21 and second transition communicating structure 22, drain pipe 21 is suitable for and communicates with the drain pipe mutually, second transition communicating structure 22 communicates between the play liquid end of drain pipe 21 and heat transfer portion 3, wherein, the opening area of the third end 221 of second transition communicating structure 22 and drain pipe 21 intercommunication is less than the opening area of the fourth end 222 of second transition communicating structure 22 and heat transfer portion 3 intercommunication, in order to guarantee that the play liquid area of heat transfer portion 3 is greater than the play liquid area of drain pipe 21, in order to reduce the impact, guarantee that the coolant liquid can be stable and even outflow heat transfer portion 3, in order to further guarantee the heat transfer effect of liquid cooling heat transfer device 100.
Further, referring to fig. 6 and 7, the first transition communicating structure 12 gradually increases in width from the first end 121 to the second end 122, and gradually decreases in thickness, and the second transition communicating structure 22 gradually increases in width from the third end 221 to the fourth end 222, and gradually decreases in thickness, so as to reduce as much as possible the eddy current and the resistance when the cooling liquid suddenly changes from the circular liquid inlet pipe 11 to the rectangular heat exchanging portion 3, and similarly, the eddy current and the resistance when the cooling liquid suddenly changes from the rectangular heat exchanging portion 3 to the circular liquid outlet pipe 21 can also be reduced, so as to ensure the stability of liquid inlet and outlet.
The first transition communicating structure 12 and the second transition communicating structure 22 can both adopt a five-section gradually-changed transition cross-sectional shape, and transition is carried out by adopting a smooth and round curve.
As a preferred embodiment, the liquid-cooled heat exchange device 100 is constructed as one of a stamped aluminum weldment, a rolled aluminum weldment, or an extruded aluminum weldment. That is, the entire liquid-cooled heat exchange device 100 may be constructed as an aluminum structure member, so as to improve the heat exchange effect, facilitate the processing, and make the entire weight lighter. And the wavy fins 32 can be formed on the aluminum structural member by stamping, rolling or extruding. Therefore, more wavy fins 32 can be formed in the same area than the traditional welding mode, so as to improve the heat exchange effect of the liquid-cooling heat exchange device 100.
As shown in fig. 1 and 2, at least one side wall of the heat exchanging part 3 is configured as a heat exchanging wall. That is to say, different chips can be set up in heat transfer portion 3 with one side, also can set up in heat transfer portion 3's different homonymies, consequently, can realize the heat transfer simultaneously to two or four chips.
Specifically, the generator chip 200 is clamped between the first housing 202 and the first substrate 201 to protect the generator chip 200 through the first housing 202, and the generator chip 200 is stably disposed on the liquid-cooled heat exchange device 100 through the first substrate 201, wherein the first housing 202 is disposed at the outermost side, the first substrate 201 is disposed between the generator chip 200 and the heat exchange portion 3, the first substrate 201 is provided with bolt holes, and an installer is suitable for passing bolts through the bolt holes to connect with the controller housing, and the liquid-cooled heat exchange device 100 is also disposed in the controller housing, so that the generator chip 200 can be stably disposed on the liquid-cooled heat exchange device 100. Similarly, the motor chip 300 is clamped between the second housing 302 and the second substrate 301, so as to protect the motor chip 300 through the second housing 302, and the motor chip 300 is stably disposed on the liquid-cooled heat exchange device 100 through the second substrate 301, wherein the second housing 302 is disposed on the outermost side, the second substrate 301 is disposed between the motor chip 300 and the heat exchange portion 3, the second substrate 301 has bolt holes thereon, and an installer is adapted to pass through the bolt holes by using bolts to connect with the controller housing, since the liquid-cooled heat exchange device 100 is also disposed in the controller housing, so that the motor chip 300 can be stably disposed on the liquid-cooled heat exchange device 100.
In the case that the chips are disposed on both sides of the heat exchanging portion 3, the two substrates corresponding to the two chips can be fastened together by using the bolt assembly, so that the two substrates can clamp the liquid-cooled heat exchanging device 100, and the chips on both sides can be stably disposed on the liquid-cooled heat exchanging device 100.
According to another aspect of the present invention, the vehicle comprises the liquid-cooled heat exchange device 100 for a chip described in the above embodiments. Other configurations of the vehicle, such as transmissions, braking systems, steering systems, etc., are known in the art and well known to those skilled in the art, and therefore will not be described in detail herein.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A liquid-cooled heat exchange device (100) for chips, comprising:
a liquid inlet part (1) and a liquid outlet part (2);
the liquid inlet and outlet heat exchange device comprises a heat exchange part (3), wherein the heat exchange part (3) is communicated with the liquid inlet part (1) and the liquid outlet part (2), a liquid flowing space (31) is formed in the heat exchange part (3), flow guide heat exchange fins are arranged in the liquid flowing space (31), the heat exchange part (3) is provided with a high-power chip heat exchange area (4) and a low-power chip heat exchange area (5), and the setting density of the flow guide heat exchange fins corresponding to the high-power chip heat exchange area (4) is greater than that of the flow guide heat exchange fins corresponding to the low-power chip heat exchange area (5).
2. The apparatus (100) for cold liquid heat exchange for chips of claim 1, wherein said low power chip heat exchange area (5) is located upstream of said high power chip heat exchange area (4).
3. The liquid-cooled heat exchange device (100) for chips as claimed in claim 1, wherein said flow-guiding heat exchange fins are configured as wave-shaped fins (32) extending in the direction of liquid flow inside said heat exchange portion (3).
4. The liquid-cooled heat exchange device (100) for chips as claimed in claim 3, wherein the undulation degree of the wavy fin (32) corresponding to the high-power chip heat exchange region (4) is greater than the undulation degree of the wavy fin (32) corresponding to the low-power chip heat exchange region (5).
5. The liquid-cooled heat exchange device (100) for chips as claimed in claim 4, wherein the high power chip heat exchange region (4) is corresponding to three groups of corrugated fin sets (30) distributed along the flowing direction of the liquid, and a first buffer gap (6) is formed between two adjacent groups of the corrugated fin sets (30).
6. The liquid-cooled heat exchange device (100) for chips as claimed in claim 4, wherein the low power chip heat exchange region (5) is corresponding to three groups of corrugated fin sets (30) distributed along the flowing direction of the liquid, and a second buffer gap (7) is formed between two adjacent groups of the corrugated fin sets (30).
7. The liquid-cooled heat exchange device (100) for chips as claimed in claim 5 or 6, wherein the undulation degree of the undulating fin (32) in the undulating fin group (30) at the upstream is smaller than the undulation degree of the undulating fin (32) in the undulating fin group (30) at the downstream.
8. The apparatus (100) for liquid-cooled heat exchange for chips of claim 1, wherein said liquid inlet portion (1) comprises: feed liquor pipe (11) and first transition communicating structure (12), first transition communicating structure (12) intercommunication is in feed liquor pipe (11) with between the feed liquor end of heat transfer portion (3), first transition communicating structure (12) with the open area of first end (121) of feed liquor pipe (11) intercommunication is less than first transition communicating structure (12) with the open area of second end (122) of heat transfer portion (3) intercommunication, it includes to go out liquid portion (2): the liquid outlet pipe (21) and the second transition communicating structure (22), the second transition communicating structure (22) is communicated between the liquid outlet pipe (21) and the liquid outlet end of the heat exchanging part (3), and the opening area of the third end (221) communicated with the liquid outlet pipe (21) of the second transition communicating structure (22) is smaller than that of the fourth end (222) communicated with the heat exchanging part (3) of the second transition communicating structure (22).
9. The apparatus (100) for cold heat exchange with liquid for a chip of claim 8, wherein said first transitional communication structure (12) has a gradually increasing width and a gradually decreasing thickness from said first end (121) to said second end (122), and said second transitional communication structure (22) has a gradually increasing width and a gradually decreasing thickness from said third end (221) to said fourth end (222).
10. A vehicle, characterized by comprising a liquid-cooled heat exchange device (100) for chips according to any one of claims 1 to 9.
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| CN202122068750.0U CN215644485U (en) | 2021-08-30 | 2021-08-30 | Liquid cooling heat exchange device for chip and vehicle |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115209711A (en) * | 2022-08-24 | 2022-10-18 | 广东福德电子有限公司 | High-performance liquid cooling load |
| CN116193840A (en) * | 2023-04-25 | 2023-05-30 | 苏州浪潮智能科技有限公司 | Heat exchange system and electronic equipment |
| CN117038473A (en) * | 2023-09-19 | 2023-11-10 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
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2021
- 2021-08-30 CN CN202122068750.0U patent/CN215644485U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115209711A (en) * | 2022-08-24 | 2022-10-18 | 广东福德电子有限公司 | High-performance liquid cooling load |
| CN115209711B (en) * | 2022-08-24 | 2024-05-24 | 广东福德电子有限公司 | High-performance liquid cooling load |
| CN116193840A (en) * | 2023-04-25 | 2023-05-30 | 苏州浪潮智能科技有限公司 | Heat exchange system and electronic equipment |
| CN117038473A (en) * | 2023-09-19 | 2023-11-10 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
| CN117038473B (en) * | 2023-09-19 | 2024-01-23 | 毫厘机电(苏州)有限公司 | Manufacturing method of liquid cooling radiator and liquid cooling radiator |
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