CN215641649U - Test circuit board structure - Google Patents

Abstract

The utility model discloses a test circuit board structure, which comprises a first board and a second board, wherein the first board is provided with a test area, the first board and the second board are mutually stacked through gluing or screwing, the second board is provided with a hollow area, the test area is configured corresponding to the hollow area and is exposed out of the hollow area, a plane of the second board far away from the first board is formed with a flat surface, and the thickness formed by overlapping the first board and the second board is the required preset thickness. Therefore, the test circuit board has the advantages of being flat in the measurement reference surface and helping to detect accurately.

Description

Test circuit board structure

Technical Field

The present invention relates to a test board for testing a wafer, and more particularly, to a test circuit board structure.

Background

In the semiconductor field, semiconductor testing of either ICs or chips is required at various stages of the manufacturing process, and each IC must be tested both on the wafer and on the package to ensure its functionality, and as chip functionality becomes more complex, the need for accurate testing becomes more important.

In practical applications, a testing fixture is installed on the electrical testing machine for fixing the testing board, and at this time, the electrical testing machine can be pressed against the upper surface of the testing board by the pressing fixture, so as to fix the position of the testing board by the fixing fixture and the testing fixture. Therefore, for the electrical testing machine, the thickness of the testing plate must meet a certain thickness specification, so as to facilitate the clamping action between the fixing device and the testing fixture.

However, the conventional test board is directly placed on the test fixture for electrical measurement, which may cause the following disadvantages, because the conventional test board is manufactured by pressing a common substrate, the conventional test board is prone to uneven phenomena such as warpage, uneven thickness, twisting, etc., so the flatness of the conventional test board cannot be effectively controlled, and the conventional test board may have uneven probe pressure effect under the condition of poor flatness, thereby causing an error in the electrical measurement result.

In view of the above, the present inventor has made an intensive study on the above prior art and applied the study to solve the above problems, which is an improved objective of the present inventor.

SUMMERY OF THE UTILITY MODEL

The utility model provides a test circuit board structure, which utilizes a plane of a second plate far away from a first plate to carry out mechanical processing to form a flat surface, so as to achieve the advantages of flat measurement reference surface and accurate detection.

In an embodiment of the present invention, the present invention provides a test circuit board structure, including: a first plate having a test area; and the second plate is mutually stacked through gluing or screwing, the second plate is provided with a hollowed-out area, the test area is arranged corresponding to the hollowed-out area and exposed out of the hollowed-out area, a plane of the second plate, which is far away from the first plate, is provided with a flat surface, and the thickness formed by overlapping the first plate and the second plate is the required preset thickness.

Preferably, the flat surface has a flatness with an error value controlled to 0.01mm or less.

Preferably, the first plate is a test main plate, and the second plate is a pad.

Preferably, the first sheet material has a test zone, and the second sheet material surrounds the test zone.

Preferably, the second plate is formed with a hollow area corresponding to the test area configuration.

Preferably, the area of the flat surface is larger than the area of the supporting surface.

Preferably, the area of the flat surface is equal to the area of the supporting surface

Based on the above, the first board is made by pressing the substrate, so that the first board is prone to uneven phenomena such as board bending, board thickness unevenness and board twisting, but the second board is used for machining a plane far away from the first board to form a flat surface, so that the problem of uneven reference surface of the test circuit board is greatly reduced, and the test probe of the test machine is further assisted in accurate measurement, so that the test circuit board has the advantages of flat measurement reference surface and accurate detection.

Drawings

The foregoing and other objects, features and advantages of the utility model will be apparent from the following more particular description of preferred embodiments of the utility model, as illustrated in the accompanying drawings. Like reference numerals refer to like parts throughout the drawings, and the drawings are not intended to be drawn to scale in actual dimensions, emphasis instead being placed upon illustrating the principles of the utility model.

FIG. 1 is a flow chart illustrating the steps of a method for manufacturing a test circuit board according to the present invention;

FIG. 2 is an exploded perspective view of the test circuit board structure of the present invention;

FIG. 3 is a schematic diagram illustrating a usage status of the test circuit board structure according to the present invention;

FIG. 4 is a schematic view of another usage status of the test circuit board structure according to the present invention;

FIG. 5 is a schematic view of another embodiment of a test circuit board structure according to the present invention;

FIG. 6 is a flowchart illustrating steps of a method for manufacturing a test circuit board according to another embodiment of the present invention.

Reference numerals:

10: test circuit board

1: first plate

2: second plate

21: hollow-out area

22: plane surface

3: test area

100: test fixture

101: support surface

102: hollow part

200: down-pressure piece

Steps a to f

Detailed Description

In the description, numerous specific details are provided to provide a thorough understanding of embodiments of the utility model; one skilled in the relevant art will recognize, however, that the utility model can be practiced without one or more of the specific details; in other instances, well-known details are not shown or described to avoid obscuring aspects of the utility model. The technical content and the detailed description of the present invention are described below with reference to the drawings, which are only for illustrative purposes and are not intended to limit the present invention.

The following detailed description and technical contents of the present invention will be described with reference to the drawings, which are provided for illustrative purposes only and are not intended to limit the present invention by .

Referring to fig. 1 to 4, the present invention provides a test circuit board structure, the test circuit board 10 mainly includes a first board 1 and a second board 2, the first board 1 is a test motherboard, and the second board 2 is a pad.

Referring to fig. 1, steps of the manufacturing method of the test circuit board according to the present invention are further described as follows. First, as shown in step a of fig. 1 and fig. 2, a first plate 1 and a second plate 2 are provided, the second plate 2 has a hollow 21, the first plate 1 is the test motherboard, and the second plate 2 is the pad.

Secondly, as shown in step d of fig. 1 and fig. 2, a circuit process is performed on the first board 1 to form a test area 3. Wherein the circuit process is a drilling process, an electroplating process, an outer layer etching process or a metallization process.

Further, the first board 1 (test motherboard) is subjected to a circuit process, so that the first board 1 (test motherboard) has a test area 3 or an electronic circuit for testing an electronic component (not shown), and the test area 3 has a probe.

In addition, the second plate 2 (the pad thickness member) surrounds the testing area 3 of the first plate 1 (the testing motherboard), and the hollow area 21 is isolated from the testing area 3 of the first plate 1 (the testing motherboard), so as to prevent the testing area 3 of the first plate 1 (the testing motherboard) from being damaged during the manufacturing process.

Thirdly, as shown in step b of fig. 1 and fig. 2 to 4, the first plate 1 and the second plate 2 are stacked together by gluing or screwing, the test area 3 is disposed corresponding to the hollow area 21 and exposed in the hollow area 21, and the first plate 1 and the second plate 2 of the embodiment are stacked by gluing, that is, the first plate 1 and the second plate 2 are bonded together by an adhesive, but not limited thereto.

In addition, the first board 1 (test motherboard) is a multi-layer circuit board with electronic circuits or probes, such as a printed circuit board, a flexible/rigid circuit board, a ceramic board, a component board, a multi-chip module board, or a general motherboard, etc., and the second board 2 (pad thickness member) is made of rigid and insulating materials, such as glass, ceramic, etc., so that the second board 2 (pad thickness member) is not easily deformed by stress, and the flatness of the upper and lower surfaces thereof can be maintained, so that the first board 1 (test motherboard) on the second board 2 (pad thickness member) can perform measurement operation of electrical functions with better parallel characteristics.

Fourthly, as shown in step c of fig. 1 and fig. 2 to 4, a flat surface 22 is formed on the plane of the second plate 2 away from the first plate 1. The second plate 2 is machined to form a flat surface 22, the machining is polishing, and the flat surface 22 has a true flatness with an error value controlled to be 0.01mm or less.

Fifth, as shown in step f of fig. 1 and fig. 3 to 4, a test fixture 100 is provided, the test fixture 100 has a supporting surface 101, and the flat surface 22 is attached to the supporting surface 101. Wherein the area of the flat surface 22 is larger than or equal to the area of the supporting surface 101.

In detail, the testing machine is provided with a testing fixture 100 (for example, a Ring Insert) for mounting the testing circuit board 10, and specifically, the testing circuit board 10 of the present invention is placed on the supporting surface 101 of the testing fixture 100, and the flat surface 22 is attached to the supporting surface 101 of the testing fixture 100, and the testing machine can use a pressing member 200, for example, a pressing fixing post (POGO PIN), to abut against the upper surface of the testing circuit board 10, so that when the pressing member 200 presses the testing circuit board 10 and reaches an abutting position, the testing machine can clamp the testing circuit board 10 between the pressing member 200 and the supporting surface 101 of the testing fixture 100, so as to fix the testing circuit board 10, thereby facilitating the subsequent electrical measurement operation using a testing probe (not shown).

In addition, the center of the testing fixture 100 may have a hollow portion 102, and the hollow area 21 of the second board 2 (pad thickness member) is disposed corresponding to the hollow portion 102, so that the testing probe can pass through the hollow portion 102 and the hollow area 21 to contact the needle surface of the first board 1 (testing motherboard) for electrical measurement.

Thus, the test circuit board 10 of the present invention can be obtained through the above steps, wherein the thickness formed by overlapping the first board 1 (test motherboard) and the second board 2 (pad thickness member) is the required predetermined thickness, and the required predetermined thickness is the specification requirement of the test board for the thickness of the test board.

As shown in fig. 4, in the using state of the test circuit board 10 of the present invention, since the first board 1 (test motherboard) is manufactured by pressing the substrate, the first board 1 (test motherboard) is prone to be uneven such as warpage, uneven thickness, and twisting of the board, but the second board 2 (pad-thick member) is used to perform mechanical processing on the plane far away from the first board 1 (test motherboard) to form the flat surface 22, and the flat surface 22 is attached to the supporting surface 101 of the test fixture 100, so as to greatly reduce the problem of uneven reference surface (the plane attached to the test fixture 100) of the test circuit board 10, thereby helping the test probe of the test machine to measure accurately, so that the test circuit board 10 of the present invention has the advantages of flat measurement reference surface and helping to detect accurately.

In addition, for the testing machine, a preset distance is formed between the position of the pressing member 200 abutting against the testing circuit board 10 and the supporting surface 101 of the testing fixture 100, and the thickness formed by overlapping the first plate 1 (testing main board) and the second plate 2 (pad thickness member) is utilized by the utility model to meet the requirement of the preset distance, so as to form the testing machine conforming to various preset distances.

Furthermore, taking the conventional test board with a thickness of 6.5mm as an example, the test circuit board 10 of the present invention is formed by the thickness of the first board 1 (test motherboard) and the second board 2 (pad thickness member) stacked together to be 6.5mm, so the thickness of the first board 1 (test motherboard) can be greatly smaller than 6.5mm, and the thinner first board 1 (test motherboard) has a higher process yield in the process of drilling and metallization, and is more suitable for the application range of high frequency operation.

In addition, the testing circuit board 10 of the present invention can utilize the second board 2 (pad thick member) to manufacture the hollow area 21 for accommodating the electronic component (not shown) to be tested, so that more electronic components, such as capacitors, resistors, etc., can be placed on the first board 1 (testing motherboard), and the testing circuit board 10 has a larger effective space.

Referring to fig. 5, another embodiment of a test circuit board 10 according to the present invention is shown, the embodiment of fig. 5 is substantially the same as the embodiment of fig. 2 to 4, and the embodiment of fig. 5 is different from the embodiment of fig. 2 to 4 in that the first board 1 and the second board 2 of this embodiment are stacked by screwing, that is, the first board 1 and the second board 2 are fastened to each other by screws, but not limited thereto.

Referring to fig. 6, another embodiment of the method for manufacturing a test circuit board according to the present invention is shown, the embodiment of fig. 6 is substantially the same as the embodiment of fig. 1, and the difference between the embodiment of fig. 6 and the embodiment of fig. 1 is that step d can be performed between step c and step f, that is, after the flat surface of the second board 2 disposed away from the first board 1 is machined to form the flat surface 22, the first board 1 is subjected to a circuit manufacturing process to form the test area 3 or an electronic circuit, and the test area 3 is disposed corresponding to and exposed from the hollowed-out area 21.

It should be noted, however, that the above-mentioned embodiments are merely preferred examples of the present invention, and the scope of the present invention should not be limited by the above-mentioned embodiments. The present invention is capable of other embodiments, and various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model.

Claims (7)

1. A kind of test circuit board structure, is used in a test fixture, characterized by, the said test fixture has a bearing surface, the said test circuit board structure includes:

a first plate having a test area; and

the second plate is stacked with the first plate through gluing or screwing, a hollowed-out area is arranged on the second plate, the test area is configured corresponding to the hollowed-out area and exposed out of the hollowed-out area, a plane, far away from the first plate, of the second plate is provided with a flat surface, the flat surface is attached to the supporting surface, and the thickness formed by stacking the first plate and the second plate is the required preset thickness.

2. The test circuit board structure of claim 1, wherein the flat surface has a flatness with an error value controlled below 0.01 mm.

3. The test circuit board structure of claim 1, wherein the first board is a test motherboard and the second board is a pad.

4. The test circuit board structure of claim 1, wherein the first board has a test area and the second board surrounds the test area.

5. The test circuit board structure of claim 4, wherein the second board is formed with a hollow area corresponding to the test area configuration.

6. The test circuit board structure of claim 1, wherein the area of the planar surface is greater than the area of the support surface.

7. The test circuit board structure of claim 1, wherein the area of the planar surface is equal to the area of the support surface.

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