CN215641015U - Magnetic sensing eddy current nondestructive flaw detection system - Google Patents
Magnetic sensing eddy current nondestructive flaw detection system Download PDFInfo
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- G01N27/82—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws
- G01N27/90—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating magnetic variables for investigating the presence of flaws using eddy currents
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Abstract
The utility model relates to a magnetic sensing eddy current nondestructive inspection detection system. The magnetic sensing array probe is composed of a plurality of magnetic sensing probe units, wherein each magnetic sensing probe unit is wrapped by a magnetic shielding cover and then vertically arranged in a groove of an array framework; analog voltage acquired by the probe array is automatically acquired by a data acquisition card after passing through a multi-channel signal conditioning module and then output to an upper computer to display a detection result; the utility model effectively inhibits the influence of the lifting distance in the eddy current nondestructive testing, has higher testing speed and larger testing range, effectively reduces the influence of mutual inductance between the probe units, improves the anti-interference capability and the testing precision, and finally utilizes the upper computer to display the testing result in real time, thereby being capable of more intuitively obtaining the tested defect information.
Description
Technical Field
The utility model belongs to the technical field of eddy current detection, and relates to a magnetic sensing eddy current nondestructive flaw detection system.
Background
The eddy current detection technology is a new comprehensive application science, does not damage the use performance of a detected object, and is widely applied to effective inspection and test of engineering materials, parts and structural components in the fields of aerospace, nuclear power, ships, transportation, petrochemical industry and the like. When an alternating current excitation signal is applied to the coil, an alternating magnetic field is generated around the coil and in the conductive medium, and as is known from the principle of electromagnetic induction, a vortex-like electric field is generated in the conductive medium, thereby forming a vortex-like current, i.e., an eddy current. If the surface of the conductor structure has defects, eddy current changes, so that a magnetic field generated by the eddy current also changes, and the existence and the severity of the defects on the surface of the conductor material can be judged by measuring the change of the magnetic field through a coil, a Hall sensor and other magnetic field sensors.
The existing eddy current nondestructive detection probe part based on the magnetic sensor is of a single probe structure, so that time and labor are wasted for large-area detection due to small area and long detection time, and missed detection and blind vision are easy to occur; at present, some array eddy current detection methods exist, probe units of the array eddy current detection methods are easily affected by a lift-off effect, the anti-interference capability is poor, electromagnetic coupling between adjacent probes is not considered, so that deviation of detection results is caused, and detected signals are not displayed more intuitively.
There are also some cases of eddy current array type inspection,
for example: the utility model discloses a method for detecting the existence of a plurality of defects in a certain area of the surface of a structure by adopting an array probe composed of double differential type pulse eddy current probe units, which is disclosed as CN107167516A and is named as a double differential type pulse eddy current probe unit, an array probe and a detection device. However, electromagnetic coupling between adjacent probes is not considered, which may cause attenuation between eddy currents generated on the tested piece by the adjacent probes, and the array probe is large in size and poor in operation due to too large distance between the probes.
The patent publication No. CN111812193A is named as an invention patent of an array eddy current probe for actively releasing electromagnetic coupling between adjacent coils, and the utility model proposes that two auxiliary coils coaxial with a detection coil are arranged outside the detection coil of the probe, and the magnetic field generated by the auxiliary coils weakens the external magnetic field generated by the detection coil, thereby reducing the magnetic field interference of the adjacent detection coils. According to the method, two auxiliary coils are arranged on the periphery of each detection coil of the array probe, so that the structure of the system is more complex, and in different application scenes, the weakening degree of the magnetic field of the auxiliary coil to the magnetic field of the detection coil needs to be adjusted by moving a metal sliding sheet on the auxiliary coil, so that the operation is troublesome, and the method is not suitable for practical application.
Therefore, an eddy current testing method and device with more precise testing precision, smaller size and convenient operation are needed to solve the above problems.
Disclosure of Invention
The utility model aims to provide a magnetic sensing eddy current nondestructive inspection system which can effectively inhibit the influence of the lifting distance in eddy current nondestructive inspection, has higher inspection speed and larger inspection range, effectively reduces the electromagnetic coupling between probe units, and improves the anti-interference capability and the inspection precision; compared with other array probes, the array probe disclosed by the utility model is smaller in size, convenient for actual detection, and capable of more intuitively determining the defect position by displaying the detection result in real time by using an upper computer.
The utility model comprises a small-size anti-crosstalk array probe with a magnetic shielding structure, a signal processing circuit and an upper computer;
the array probe comprises a plurality of magnetic sensing probe units, and the magnetic sensing probe units are vertically fixed in a groove below the array framework; the multi-channel signal conditioning module is arranged on the bottom surface of the array framework in parallel, provides the same input signal for each magnetic sensing probe unit, receives the output of the magnetic sensing probe unit, and is fixed in the array framework by a second baffle right below the magnetic sensing probe unit; a through hole is formed in the center of the end cover, and the wiring of the multi-path signal conditioning module penetrates out of the through hole; the directions of the sensitive axes of the magnetic sensors in each magnetic sensing probe unit are consistent, the output signals of the magnetic sensors are connected to the multi-path signal conditioning module through wiring for signal processing, and each path of signals processed by the multi-path signal conditioning module are automatically acquired by the data acquisition card and then output to the upper computer for display.
The probe unit comprises a coil framework, an excitation coil, a magnetic sensor, a PCB (printed circuit board), a terminal, a magnetic shield and a first baffle; the inner side of the coil framework comprises two first baffle plates for fixing the PCB, the first baffle plates are in strip structures and are positioned on the same horizontal line, the outer side of the first baffle plates is wound with an excitation coil for generating an alternating magnetic field, and the outer layer of the excitation coil is completely wrapped with a layer of magnetic shielding cover; the PCB is arranged in the coil framework, is fixed above the baffle and is in a round cake shape, and the radius of the PCB is slightly smaller than the inner radius of the coil framework; the magnetic sensor is fixed at the central position of the PCB, and the sensitive axis direction of the sensor is vertical to the PCB; the pins of the magnetic sensor are connected with an external circuit through the terminal heads below the PCB.
The coil framework of probe unit is the opening pipe, and first baffle and coil framework are as an organic whole, and photosensitive resin material 3D prints or ceramic fiber material is chooseed for use to first baffle and coil framework.
The excitation coil of the probe unit is an enameled copper wire round hollow coil and is formed by winding an enameled copper wire.
The magnetic shield of the probe unit is a flexible sheet, completely wraps the outer surface of the exciting coil and is made of nickel series, cobalt series or iron series soft magnetic materials.
Further, the magnetic sensor of the probe unit is a giant magnetoresistance sensor or a magnetic tunnel junction sensor.
The distance between the first baffle of the probe unit and the top of the coil framework is 7.0-8.0 mm; the PCB board uses industry to glue to fix on first baffle, and magnetic sensor sets up in PCB board top.
The array framework, the end cover and the second baffle of the array probe are printed by photosensitive resin materials in a 3D mode or made of ceramic fiber materials.
The distance between adjacent probe units of the array probe is 2.0-4.0 mm; the size of the array skeleton 9 is 120mm multiplied by 40mm multiplied by 100 mm.
The differential signal generated by the magnetic sensor is amplified by a multi-path signal conditioning module, and the multi-path signal conditioning module comprises a plurality of instrument amplifier chips AD623 and a low-pass filter. The chip is an integrated single-power-supply instrument amplifier with adjustable gain, can output signals with full power supply amplitude under the condition that the single-power-supply voltage is +3V to +12V, and can obtain better flexibility by changing the resistance to perform gain programming.
Analog voltage acquired by the array probe is automatically acquired and output to a PC (personal computer) end through a data acquisition card after passing through a multi-channel signal conditioning module; and the upper computer at the PC end converts each acquired sampling signal into a pixel point, and a plane image is finally formed along with the continuous movement of the probe, so that real-time and visual imaging display is performed on the defects.
The utility model has the beneficial effects that:
(1) the magnetic sensor is welded on the PCB, and when a detected test piece is not defective, the output of the magnetic sensor is kept unchanged, so that the lift-off effect can be effectively inhibited.
(2) The array probe greatly improves the detection efficiency and the detection range of the detection device, increases the detection area, reduces the detection time, improves the system reliability, and avoids missing detection and blind vision.
(3) The probe units in the array probe are isolated by using the magnetic shielding covers, so that the electromagnetic coupling between the adjacent probe units is reduced, and the interference between the probe units is reduced.
(4) The PC end upper computer display module can display the detection result in real time, and if a defect occurs, the transmission signal of the magnetic sensor can be changed, and the defect is imaged in real time in the upper computer.
Drawings
FIG. 1 is a block diagram of a nondestructive inspection process of a magnetic sensor array probe of the present invention;
FIG. 2 is a front cross-sectional view of a magnetic sensor array probe in accordance with the present invention;
FIG. 3(a) is a top cross-sectional view of a magnetic sensor array probe of the present invention;
FIG. 3(b) is a side cross-sectional view of a magnetic sensor array probe of the present invention;
FIGS. 4-5 are front cross-sectional and top cross-sectional views of a magnetic sensor based eddy current probe unit of the present invention;
FIG. 6 is a circuit diagram of a single-channel signal conditioning module employed in the present invention;
fig. 7 is an internal structure diagram of an instrumentation amplifier AD623 adopted by a signal conditioning module;
FIG. 8 is an interface diagram of the upper computer displaying real-time data collection according to the present invention;
FIG. 9 is an interface diagram of real-time imaging display detection signals of the upper computer.
Detailed Description
The utility model is further described with reference to the following figures and specific examples.
As shown in fig. 1, the array probe acquires an analog voltage signal sent by the signal generating module, and the analog voltage acquired by the array probe is transmitted to the data acquisition module after passing through the multi-channel signal conditioning module;
the signal generation module generates sine wave signals by using a Direct Digital Synthesizer (DDS), clutter and some high-frequency signals generated in the output process of the signal generation module are filtered by a low-pass filter, and then the sine wave signals with stable frequency pass through a power amplification chip, so that the driving capability is improved;
the data acquisition module comprises a data acquisition card NI USB-6281 and an upper computer, and analog voltage acquired by the probe array is automatically acquired and transmitted to a PC (personal computer) end through the data acquisition card after passing through the multi-channel signal conditioning module.
As shown in figure 2, the array probe comprises 5 high-sensitivity probe units 8 based on magnetic sensors, and the probe units 8 are vertically arranged in a groove below an array framework 9 and are in the same horizontal line. The number and arrangement mode of the probe units in the probe array can be expanded or changed as required.
As shown in fig. 3(a) and 3(b), the probe wiring is connected to the multi-path signal conditioning module 10 and fixed inside the array framework by the second baffle plate 11; a through hole is formed in the middle of the end cover 12, and the wiring of the multi-path signal conditioning module 10 penetrates out of the through hole.
As shown in fig. 4, the probe unit 8 includes a bobbin 1, an excitation coil 2, a magnetic sensor 3, a PCB 4, a terminal 5, a magnetic shield 6, and a first baffle 7; the coil bobbin 1 and the first shutter 7 are made of a photosensitive resin material by 3D printing, and the magnetic shield 6 is made of permalloy 1J85, which is a soft magnetic material in this embodiment.
As shown in fig. 5, the inner side of the coil frame 1 is an open circular tube, the outer side of the coil frame is wound with an excitation coil 2, and the outer layer of the excitation coil 2 is wrapped with a layer of magnetic shield 6; the PCB 4 is positioned in the coil framework 1 and is in a round cake shape, and the radius of the PCB is slightly smaller than the inner radius of the coil framework; the magnetic sensor 3 is welded on the PCB 4 and is positioned at the center of the PCB, so that the detection result can be prevented from being influenced by the change of the lifting distance in the detection process, and the direction of the sensitive axis of the sensor is vertical to the PCB; two sides of the PCB 4 are respectively provided with a first baffle 7, the two first baffles 7 are positioned on the same horizontal line, and the PCB is fixed in the coil framework; the pins of the magnetic sensor are connected to an external circuit through terminal pins 5 below the PCB.
The magnetic shield cover is thin, the size of the probe unit cannot be influenced, and the external magnetic field of the excitation magnetic field generated by the excitation coil in the adjacent probe unit is weakened through the magnetic shield cover, so that the mutual interference of the magnetic fields generated by the adjacent probe units of the array eddy current probe is reduced.
The magnetic sensing probe units eliminate the crosstalk between the adjacent probe units through the magnetic shielding cover, so that the probe units can be closely arranged to prevent missing detection, the size of a probe array is reduced, and the eddy current detection range of the array probe is enlarged; the directions of the sensitive axes of the magnetic sensors in each probe unit are consistent, the output signals of the magnetic sensors are connected to the multi-channel signal conditioning module through wiring for signal processing, and the processed signals of each channel are automatically acquired by the data acquisition card and then output to an upper computer at the PC end for display.
As shown in fig. 6, the multi-channel signal conditioning module mainly comprises 5 instrumentation amplifiers AD623 and a low-pass filter; the amplification factor is adjusted by an external adjustable resistor RGAnd (6) carrying out adjustment. The gain adjustable range is 1-1000 times, and the gain adjustable range is obtained by
And (4) calculating.
As shown in fig. 7, the PNP transistor in the instrumentation amplifier AD623 functions as a voltage buffer and provides a common mode signal for the input amplifier, and the differential signal after gain is converted into a single-ended voltage by the output amplifier. The function of the instrumentation amplifier is to amplify the output voltage value of the sensor, because the voltage generated by the sensor chip is a tiny voltage, generally in millivolt level, and is inconvenient for subsequent processing. The amplification factor is adjusted through an external adjustable resistor, and the gain adjustable range is 1-1000 times.
As shown in fig. 8, the input of the interface for collecting data in real time by the upper computer is a digital signal after analog-to-digital conversion, the abscissa in the figure is the position of a sampling point, the ordinate is a voltage value, 5 paths of signals are displayed in total, and the signals correspond to the outputs of 5 magnetic sensors.
As shown in fig. 9, switching to an imaging display interface, where the abscissa in the figure is the position of the sampling point and the ordinate is the output of the pixel value corresponding to 5 channels; after a file path of the collected data is input, real-time reading is clicked to start imaging display, each path of the collected data is converted into a pixel point, and a plane image is finally formed along with the continuous movement of the probe; the pixel value corresponding to the position where the defect exists in the moving process is changed and is distinguished from the pixel value without the defect, so that the defect is imaged in real time.
The specific working mode of the utility model is as follows: a sine wave signal generated by the signal generating module is introduced into the exciting coil 2 to generate an alternating magnetic field around the exciting coil, and a tested piece in the magnetic field range generates an eddy current to generate a secondary magnetic field so as to change the magnetic field around the magnetic sensor 3; when the detected conductor has defects, the current vortex is distorted and partially lost, the bridge balance in the sensor is broken, and differential output is generated; the differential output signal generated by the sensor is very weak, and is amplified by the AD623 instrument amplifier and then automatically acquired and output to an upper computer at the PC end through a data acquisition card to display the detection result in real time.
The method specifically comprises the following steps: the analog voltage acquired by the array probe passes through the signal conditioning module 10, the signal is automatically acquired by the data acquisition card NI USB-6281 and then output to the PC end, and the defect position is displayed on the upper computer.
While the present invention has been described in detail and with reference to the drawings, the present invention is not limited to the embodiments, and various changes and modifications can be made without departing from the spirit and scope of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. The magnetic sensing eddy current nondestructive flaw detection system comprises a small-size anti-crosstalk array probe with a magnetic shielding structure, a signal processing circuit and an upper computer; the method is characterized in that:
the array probe comprises a plurality of magnetic sensing probe units (8), and the magnetic sensing probe units are vertically fixed in a groove below an array framework (9); the multi-channel signal conditioning module (10) is arranged on the bottom surface of the array framework in parallel, provides the same input signal for each magnetic sensing probe unit, receives the output of the magnetic sensing probe unit, and is fixed in the array framework (9) by a second baffle (11) right below; a through hole is formed in the center of the end cover (12), and the wiring of the multi-path signal conditioning module (10) penetrates out of the through hole; the directions of the sensitive axes of the magnetic sensors in each magnetic sensing probe unit are consistent, the output signals of the magnetic sensors are connected to a multi-path signal conditioning module through wiring for signal processing, and each path of signals processed by the multi-path signal conditioning module are automatically acquired by a data acquisition card and then output to an upper computer for display;
the probe unit comprises a coil framework (1), an exciting coil (2), a magnetic sensor (3), a PCB (printed circuit board) board (4), a terminal (5), a magnetic shield (6) and a first baffle (7); the inner side of the coil framework (1) is provided with two first baffle plates (7) for fixing a PCB, the first baffle plates are in strip structures and are positioned on the same horizontal line, the outer side of the first baffle plates is wound with an excitation coil (2) for generating an alternating magnetic field, and the outer layer of the excitation coil is completely wrapped with a layer of magnetic shielding cover (6); the PCB (4) is arranged in the coil framework, is fixed above the baffle and is in a round cake shape, and the radius of the PCB is slightly smaller than the inner radius of the coil framework; the magnetic sensor (3) is fixed at the central position of the PCB, and the sensitive axis direction of the sensor is vertical to the PCB; the pins of the magnetic sensor are connected with an external circuit through a terminal (5) below the PCB.
2. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: coil skeleton (1) of probe unit is the opening pipe, and first baffle (7) and coil skeleton are as an organic whole, and photosensitive resin material 3D prints or ceramic fiber material is selected for use to first baffle (7) and coil skeleton.
3. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the excitation coil (2) of the probe unit is an enameled copper wire round hollow coil and is formed by winding an enameled copper wire.
4. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the magnetic shield (6) of the probe unit is a flexible sheet, completely wraps the outer surface of the exciting coil and is made of nickel series, cobalt series or iron series soft magnetic materials.
5. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the magnetic sensor (3) of the probe unit adopts a giant magnetoresistance sensor or a magnetic tunnel junction sensor.
6. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the distance between the first baffle (7) of the probe unit and the top of the coil framework (1) is 7.0-8.0 mm; the PCB (4) is fixed on the first baffle (7) by glue, and the magnetic sensor (3) is arranged above the PCB (4).
7. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the array framework (9), the end cover (12) and the second baffle (11) of the array probe are printed by photosensitive resin materials in a 3D mode or made of ceramic fiber materials.
8. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the distance between adjacent probe units of the array probe is 2.0 mm-4.0 mm, and the size of the array framework (9) is 120mm multiplied by 40mm multiplied by 100 mm.
9. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: the differential signal generated by the magnetic sensor (3) is amplified by a multi-path signal conditioning module (10), and the multi-path signal conditioning module (10) comprises a plurality of instrument amplifier chips AD623 and a low-pass filter.
10. The magnetically-sensed eddy current nondestructive inspection system of claim 1 wherein: analog voltage acquired by the array probe passes through the multi-channel signal conditioning module (10), is automatically acquired and output to an upper computer through a data acquisition card.
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| CN113390957A (en) * | 2021-04-27 | 2021-09-14 | 杭州电子科技大学 | Anti-crosstalk eddy current nondestructive flaw detection system based on magnetic sensing probe |
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| CN114646255A (en) * | 2022-02-23 | 2022-06-21 | 四川大学 | Hub bearing spinning surface height array eddy current non-contact measuring probe |
| CN116413332B (en) * | 2023-06-12 | 2023-09-08 | 中国石油大学(华东) | Flexible array monitoring probe for underwater structural crack |
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| DE19615254C2 (en) * | 1996-04-18 | 1999-03-11 | Diagnostikforschung Inst | Device for the highly sensitive magnetic detection of analytes |
| CN104458895A (en) * | 2014-12-08 | 2015-03-25 | 清华大学 | Three-dimensional pipeline leakage flux imaging detection method and system |
| GB2533953A (en) * | 2015-01-08 | 2016-07-13 | Sharp Kk | Active matrix device and method of driving |
| CN104897774B (en) * | 2015-05-13 | 2018-11-09 | 南京航空航天大学 | A kind of current vortex of carbon fibre composite carefully sees structure imaging method |
| CN107167516B (en) * | 2017-05-24 | 2023-09-26 | 昆明理工大学 | Double differential pulse eddy current probe unit, array probe and detection device |
| CN108515694B (en) * | 2018-04-18 | 2020-07-24 | 西安交通大学 | Flexible pressure sensor chip based on 3D printing technology and manufacturing method thereof |
| CN110146590A (en) * | 2019-05-28 | 2019-08-20 | 杭州电子科技大学 | Eddy Current Nondestructive Testing device based on array-type sensor |
| CN110244204A (en) * | 2019-06-27 | 2019-09-17 | 国网湖南省电力有限公司 | A kind of switchgear method for diagnosing faults, system and the medium of multiple characteristic values |
| CN111122697B (en) * | 2019-12-26 | 2023-03-24 | 兰州空间技术物理研究所 | High-precision imaging detection method for defects of conductive material based on pulse eddy current |
| CN113390957A (en) * | 2021-04-27 | 2021-09-14 | 杭州电子科技大学 | Anti-crosstalk eddy current nondestructive flaw detection system based on magnetic sensing probe |
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