CN215581903U

CN215581903U - Mini LED glass-based six-layer printed board structure

Info

Publication number: CN215581903U
Application number: CN202121721102.4U
Authority: CN
Inventors: 龙亚山; 赵宏静; 乔鹏程
Original assignee: Tongyuan Technology Huizhou Co ltd
Current assignee: Tongyuan Technology Huizhou Co ltd
Priority date: 2021-07-27
Filing date: 2021-07-27
Publication date: 2022-01-18
Anticipated expiration: 2031-07-27

Abstract

The utility model provides a Mini LED glass-based six-layer printed board structure, which relates to the field of printed circuit boards and comprises a mother board, wherein the mother board comprises a daughter board and a glass substrate, the bottom surface of the daughter board is fixedly bonded with the top surface of the glass substrate, the daughter board comprises an L1 layer, an L2 layer, an L3 layer and an L4 layer, the L1 layer and the L4 layer are respectively positioned on the top surface and the bottom surface of the daughter board, the L2 layer and the L3 layer are positioned between the L1 layer and the L4 layer, the L1 layer, the L2 layer, the L3 layer and the L4 layer are sequentially fixedly bonded, and the glass substrate 8 comprises an L5 layer 5 and an L6 layer 6. The mother board is composed of the daughter board and the glass substrate, the formed glass-based six-layer printed board is high in structural flatness, good in stability and low in thermal expansion rate, high-density Mini LED assembly can be effectively met, the glass substrate is adopted to replace a traditional epoxy resin base material, and the problems of product heat dissipation, stability, thermal expansion rate, processing precision and the like are solved.

Description

Mini LED glass-based six-layer printed board structure

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a Mini LED glass-based six-layer printed board structure.

Background

In order to adapt to the market development of the Mini LED, a printed circuit board (PCB for short) applied to the Mini LED backlight product needs to be correspondingly developed, and the printed circuit board applied to the Mini LED product at present cannot be produced in large scale according to the conventional manufacturing method of the printed circuit board due to the fact that the number of the bonding pads is small and large, the production difficulty is high, the cost is high, the yield is low, and the printed circuit board is large in number. Nowadays, Mini LED chips become smaller and smaller, and Mini LEDs have more chip bonding per unit area, and the heat intensity is higher than that of the current LED backlight products.

The PCB is limited by the self heat dissipation of the epoxy resin substrate, and thus has influences on product stability, thermal expansion rate, processing accuracy and the like, and thus cannot meet the processing requirements of the high-density Mini LED.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a Mini LED glass-based six-layer printed board structure.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides a six layer printed board structures of Mini LED glass base, includes the mother board, the mother board includes daughter board and glass substrate, and the bottom surface of daughter board and glass substrate's top surface bonding is fixed, the daughter board includes L1 layer, L2 layer, L3 layer and L4 layer, and L1 layer and L4 layer are located the top surface and the bottom surface of daughter board respectively, and L2 layer and L3 layer are located between L1 layer and L4 layer, and L1 layer, L2 layer, L3 layer and L4 layer bond fixedly in proper order, the glass substrate includes L5 layer and L6 layer.

Preferably, the L1 layer includes outer copper foil and prepreg, and outer copper foil and prepreg bonding are fixed, two second blind holes have been seted up to the L1 layer is inside, and two second blind holes all run through outer copper foil and prepreg.

Preferably, the layer L2 comprises a copper layer and an FR4 core board, the copper layer is fixedly bonded with the FR4 core board, and the copper layer is fixedly bonded with the prepreg in the layer L1.

Preferably, the layer L3 includes a copper layer and a prepreg, and the copper layer and the prepreg are adhesively fixed, and the copper layer in the layer q and L3 and the FR4 core board in the layer L2 are adhesively fixed.

The L4 layer comprises an inner-layer copper foil and a prepreg, the inner-layer copper foil and the prepreg are fixedly bonded, and the inner-layer copper foil in the L4 layer and the prepreg in the L3 layer are fixedly bonded.

Preferably, the L5 layer includes an inner copper foil, a pure glue film and a glass substrate, the inner copper foil, the pure glue film and the glass substrate are sequentially bonded and fixed, and the inner copper foil in the L5 layer and the prepreg in the L4 layer are bonded and fixed.

Preferably, the L6 layer comprises an outer copper foil, and the outer copper foil in the L6 layer and the pure glue film in the L5 layer are fixedly bonded.

Preferably, the glass substrate is internally provided with two first blind holes, the first blind hole positioned at the top of the glass substrate sequentially penetrates through the inner copper foil and the pure glue film, the first blind hole positioned at the bottom of the glass substrate sequentially penetrates through the outer copper foil and the pure glue film, the glass substrate is internally filled with glass-based through hole plug conductive paste, and the glass-based through hole plug conductive paste is positioned inside the pure glue film and the glass base layer.

Preferably, the outer copper foil is an electroplated copper foil having a thickness of 0.5 ounces.

The first blind hole and the second blind hole are equal in aperture, and the aperture is 75 micrometers.

Advantageous effects

In the utility model, the glass substrate is adopted to replace the traditional epoxy resin base material, thus solving the problems of heat dissipation, stability, thermal expansion rate, processing precision and the like of the product.

According to the utility model, the mother board is composed of the daughter board and the glass substrate, the formed glass-based six-layer printed board has high structural flatness, good stability and low thermal expansion rate, and can effectively meet the requirement of high-density Mini LED assembly.

Drawings

FIG. 1 is a cross-sectional view of the present invention;

FIG. 2 is a cross-sectional view of the present invention;

FIG. 3 is a cross-sectional view of the daughter board of the present invention;

FIG. 4 is a cross-sectional view of a glass substrate according to the present invention.

Illustration of the drawings:

1. a layer of L1; 2. a layer of L2; 3. a layer of L3; 4. a layer of L4; 5. a layer of L5; 6. a layer of L6; 7. a daughter board; 8. a glass substrate; 9. an outer layer copper foil; 10. a prepreg; 11. a copper layer; 12. FR4 core board; 13. an inner layer copper foil; 14. a pure glue film; 15. a glass substrate; 16. a glass-based via plug conductive paste; 17. a first blind hole; 18. a second blind hole; 19. a motherboard.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, a Mini LED glass-based six-layer printed board structure comprises a mother board 19, wherein the mother board 19 comprises a daughter board 7 and a glass substrate 8, the bottom surface of the daughter board 7 is fixedly bonded to the top surface of the glass substrate 8, the daughter board 7 comprises an L1 layer 1, an L2 layer 2, an L3 layer 3 and an L4 layer 4, the L1 layer 1 and the L4 layer 4 are respectively located on the top surface and the bottom surface of the daughter board 7, the L2 layer 2 and the L3 layer 3 are located between the L1 layer 1 and the L4 layer 4, the L1 layer 1, the L2 layer 2, the L3 layer 3 and the L4 layer 4 are sequentially fixedly bonded, and the glass substrate 8 comprises an L5 layer 5 and an L6 layer 6. The mother board 19 is composed of the daughter board 7 and the glass substrate 8, the formed glass-based six-layer printed board has high structural flatness, good stability and low thermal expansion rate, can effectively meet the assembly requirement of a high-density Mini LED, and solves the problems of product heat dissipation, stability, thermal expansion rate, processing precision and the like by adopting the glass substrate 8 to replace the traditional epoxy resin base material.

L1 layer 1 includes outer copper foil 9 and prepreg 10, and outer copper foil 9 and prepreg 10 bond fixedly, and two second blind holes 18 have been seted up to L1 layer 1 is inside, and two second blind holes 18 all run through outer copper foil 9 and prepreg 10, and outer copper foil 9 is the electroplating copper foil, and thickness is 0.5 ounce.

The L2 layer 2 comprises a copper layer 11 and an FR4 core board 12, the copper layer 11 and the FR4 core board 12 are fixedly bonded, the copper layer 11 and a prepreg 10 in the L1 layer 1 are fixedly bonded, the copper layer 11 is plated through outer-layer copper deposition and outer-layer hole filling, the copper plating thickness is 25-35 mu m, 106 prepregs 10 are adopted for the prepreg 10, and the resin content is 70-76%.

The L3 layer 3 comprises a copper layer 11 and a prepreg 10, the copper layer 11 and the prepreg 10 are fixedly bonded, and the copper layer 11 in the L3 layer 3 and the FR4 core board 12 in the L2 layer 2 are fixedly bonded.

The L4 layer 4 comprises an inner copper foil 13 and a prepreg 10, the inner copper foil 13 and the prepreg 10 are fixedly bonded, and the inner copper foil 13 in the L4 layer 4 and the prepreg 10 in the L3 layer 3 are fixedly bonded.

The L5 layer 5 comprises an inner copper foil 13, a pure glue film 14 and a glass substrate 15, the inner copper foil 13, the pure glue film 14 and the glass substrate 15 are sequentially bonded and fixed, and the inner copper foil 13 in the L5 layer 5 and the prepreg 10 in the L4 layer are bonded and fixed.

The L6 layer 6 comprises an outer copper foil 9, and the outer copper foil 9 in the L6 layer 6 is fixedly bonded with the pure glue film 14 in the L5 layer 5. The L2 layer 2 and the L3 layer 3 are pressed with two prepregs 10 and two outer copper foils 9 to form a daughter board 7L1-L4, the prepregs 10 are arranged at the edge of the glass substrate 8 after copper plating, and the daughter board 7(L1-L4) is pressed to form a mother board 19 structure (L1-L6) under the action of high temperature and high pressure.

The inside two first blind holes 17 that are equipped with of glass substrate 8, the first blind hole 17 that is located 8 tops of glass substrate runs through inlayer copper foil 13 and pure glued membrane 14 in proper order, and the first blind hole 17 that is located 8 bottoms of glass substrate runs through outer copper foil 9 and pure glued membrane 14 in proper order, and the inside packing of glass substrate 8 has glass base through-hole stopper conductive paste 16, and glass base through-hole stopper conductive paste 16 is located inside pure glued membrane 14 and glass basic unit 15. The fine particles of zinc, nickel, chromium and the like in the glass-based via plug conductive paste 16 are filled in the gaps of the contact surface, which is equivalent to enlarging the conductive contact surface, and the printing of the glass-based via plug conductive paste 16 can reduce the contact resistance, resist oxidation, prevent corrosion and the like. Set up first blind hole 17, glass basic unit 15 after first blind hole 17 metallization bonds with pure glued membrane 14, outer copper foil 9 and is in the same place, forms the glass substrate 8 of inferior outer circuit through fast pressing, then carries out laser to glass substrate 8 and bores the blind hole, inferior outer filler hole electroplating, inferior outer dry film, inferior outer etching, inferior outer AOI, brown ization, realizes the high density interconnection function of 8 outer blind holes of glass substrate. The glass base layer 15 is made of the glass base raw material which is the plain glass, the thickness of the glass base layer is 0.15 mm-0.3 mm, the aperture of each of the first blind holes 17 is equal to that of each of the second blind holes 18, and the aperture of each of the first blind holes 17 is 75 micrometers.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a six layer printed board structures of Mini LED glass base, includes motherboard (19), its characterized in that: mother board (19) include daughter board (7) and glass substrate (8), and the bottom surface of daughter board (7) and the top surface bonding of glass substrate (8) are fixed, daughter board (7) include L1 layer (1), L2 layer (2), L3 layer (3) and L4 layer (4), and L1 layer (1) and L4 layer (4) are located the top surface and the bottom surface of daughter board (7) respectively, and L2 layer (2) and L3 layer (3) are located between L1 layer (1) and L4 layer (4), and L1 layer (1), L2 layer (2), L3 layer (3) and L4 layer (4) bond fixedly in proper order, glass substrate (8) include L5 layer (5) and L6 layer (6).

2. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: l1 layer (1) includes outer copper foil (9) and prepreg (10), and outer copper foil (9) and prepreg (10) bond fixedly, two second blind holes (18) have been seted up to L1 layer (1) inside, and two second blind holes (18) all run through outer copper foil (9) and prepreg (10).

3. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the L2 layer (2) comprises a copper layer (11) and an FR4 core board (12), the copper layer (11) and the FR4 core board (12) are fixedly bonded, and the copper layer (11) and a prepreg (10) in the L1 layer (1) are fixedly bonded.

4. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the L3 layer (3) comprises a copper layer (11) and a prepreg (10), the copper layer (11) and the prepreg (10) are fixedly bonded, and the copper layer (11) in the L3 layer (3) and the FR4 core board (12) in the L2 layer (2) are fixedly bonded.

5. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the L4 layer (4) comprises an inner copper foil (13) and a prepreg (10), the inner copper foil (13) and the prepreg (10) are fixedly bonded, and the inner copper foil (13) in the L4 layer (4) and the prepreg (10) in the L3 layer (3) are fixedly bonded.

6. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the L5 layer (5) comprises an inner copper foil (13), a pure glue film (14) and a glass base layer (15), the inner copper foil (13), the pure glue film (14) and the glass base layer (15) are sequentially bonded and fixed, and the inner copper foil (13) in the L5 layer (5) and a prepreg (10) in the L4 layer (4) are bonded and fixed.

7. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the L6 layer (6) comprises an outer copper foil (9), and the outer copper foil (9) in the L6 layer (6) is fixedly bonded with the pure glue film (14) in the L5 layer (5).

8. The Mini LED glass-based six-layer printed board structure of claim 1, wherein: the glass substrate (8) is inside to be equipped with two first blind holes (17), and first blind hole (17) that are located glass substrate (8) top run through inlayer copper foil (13) and pure glue membrane (14) in proper order, and first blind hole (17) that are located glass substrate (8) bottom run through outer copper foil (9) and pure glue membrane (14) in proper order, glass substrate (8) inside is filled with glass base through-hole stopper electrically conductive paste (16), and glass base through-hole stopper electrically conductive paste (16) are located inside pure glue membrane (14) and glass basic unit (15).

9. The Mini LED glass-based six-layer printed board structure of claim 2, wherein: the outer layer copper foil (9) is an electroplated copper foil and has a thickness of 0.5 ounce.

10. The Mini LED glass-based six-layer printed board structure of claim 8, wherein: the first blind hole (17) and the second blind hole (18) are equal in aperture, and the aperture is 75 micrometers.