CN215578466U - Heat setting electric press for semiconductor production - Google Patents

Heat setting electric press for semiconductor production Download PDF

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Publication number
CN215578466U
CN215578466U CN202121732408.XU CN202121732408U CN215578466U CN 215578466 U CN215578466 U CN 215578466U CN 202121732408 U CN202121732408 U CN 202121732408U CN 215578466 U CN215578466 U CN 215578466U
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CN
China
Prior art keywords
sliding
heat setting
electric press
adjusting
block
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Expired - Fee Related
Application number
CN202121732408.XU
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Chinese (zh)
Inventor
张秉仁
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Dongguan Hongyang Packaging Products Co ltd
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Dongguan Hongyang Packaging Products Co ltd
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Priority to CN202121732408.XU priority Critical patent/CN215578466U/en
Application granted granted Critical
Publication of CN215578466U publication Critical patent/CN215578466U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a heat setting electric press for semiconductor production, which relates to the technical field of heat setting electric presses and comprises a processing table, an electric press main body, a heat setting plate, a placing table, a placing groove, a sliding plate, a sliding groove, a sliding block, a pulling block, a driving rod, a paper tube, a dustproof film, a replacing device and a limiting device, wherein the electric press main body is arranged on the upper surface of the processing table through bolts, and the heat setting plate is arranged outside the electric press main body. According to the utility model, the dustproof film can be quickly replaced after being used by arranging the replacing device, and under the mutual matching of the dustproof film and the dustproof film, the outer surface of the semiconductor can be prevented from being contaminated by external oil stains or dust in the process of centralized placement, so that after impurities are adsorbed on the outer surface of the semiconductor, a worker can clean the semiconductor before further deep processing of the semiconductor, and the unnecessary workload of the worker is avoided.

Description

Heat setting electric press for semiconductor production
Technical Field
The utility model relates to the technical field of heat setting electric presses, in particular to a heat setting electric press for semiconductor production.
Background
With the continuous development of science and technology, various high-tech products are also increasingly popularized in daily life of people, semiconductors are installed in the main boards of the various high-tech products, and a heat setting electric press is needed to process the semiconductors in the manufacturing process of the semiconductors.
After a semiconductor is processed by a traditional heat setting electric press, workers need to take out the processed semiconductor to be intensively placed, then the semiconductor is processed on the next step, the outer surface of the semiconductor is easily polluted by external oil stains or dust in the centralized placing process, the impurities are adsorbed on the outer surface of the semiconductor, the workers need to clean the semiconductor firstly when the semiconductor is further deeply processed, and the workload of the workers is increased.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art and provides a heat setting electric press for semiconductor production.
In order to achieve the purpose, the utility model adopts the following technical scheme: a thermal setting electric press for semiconductor production comprises a processing table, an electric press main body, a thermal setting plate, a placing table, a placing groove, a sliding plate, a sliding groove, a sliding block, a pulling block, a driving rod, a paper tube, a dustproof film, a replacing device and a limiting device, wherein the electric press main body is arranged on the upper surface of the processing table through bolts, the thermal setting plate is arranged on the outer portion of the electric press main body, the placing table is arranged on the upper surface of the processing table through bolts, the placing groove is arranged on two sides of the upper surface of the placing table, the bottom end of the sliding plate is welded on two sides of the upper surface of the processing table, the sliding groove is arranged on the outer surface of the sliding plate, the pulling block is fixedly arranged on the outer surface of the sliding block, the driving rod is fixedly arranged on the outer surface of one side of the pulling block, the dustproof film is wound on the outer portion of the paper tube, the replacing device is arranged inside the driving rod, the limiting device is arranged on the upper surface of the processing table.
In order to facilitate the replacement of the paper tube, the utility model is improved in that the replacement device comprises an adjusting groove, an adjusting column, a spring, an adjusting block, a rotating disc and a mounting column, wherein the adjusting groove is formed in the side wall of the driving rod, the adjusting column is fixedly arranged on the inner wall of the adjusting groove, the spring is sleeved outside the adjusting column, the adjusting block is connected to the outer surface of the adjusting column in a sliding mode, the rotating disc is rotatably connected to the side wall of the adjusting block through a rotating shaft, and the mounting column is fixedly arranged on the outer surface of the rotating disc.
In order to facilitate the film coating of the processed semiconductor, the utility model has the improvement that the outer surface of the sliding block is connected with the inner wall of the sliding groove in a sliding manner, and the outer surface of the pulling block is provided with a pulling groove.
In order to facilitate the installation of the paper tube on the installation column, the utility model has the improvement that the outer surface of the installation column is in sliding connection with the inner wall of the paper tube, and the outer surface of the adjusting block is in sliding connection with the inner wall of the adjusting groove.
In order to clamp the paper tube, the utility model is improved in that two ends of the spring are fixedly arranged on the outer surface of the adjusting block and the inner wall of the adjusting groove respectively, and the dustproof film is made of PPS (polyphenylene sulfide).
In order to facilitate film coating of the processed semiconductor, the utility model improves that the limiting device comprises an upright post, a sliding rod, a pull handle, a limiting post and a limiting hole, wherein the bottom end of the upright post is fixedly arranged on two sides of the upper surface of the processing table respectively, the sliding rod is connected to the outer surface of the upright post in a sliding manner, the bottom end of the pull handle is fixedly arranged on the upper surface of the sliding rod, the top end of the limiting post is fixedly arranged on the lower surface of the sliding rod, and the limiting hole is formed in the upper surface of the processing table.
In order to conveniently limit one end of the dustproof film, the dustproof film is improved in the utility model that sliding holes are formed in two ends of the sliding rod, the outer surface of the upright post is connected with the inner wall of the sliding hole in a sliding mode, and the outer surface of the limiting post is connected with the outer surface of the limiting hole in a sliding mode.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. according to the utility model, the processing table, the electric press main body, the heat setting plate, the placing table and the placing groove are basic components of the heat setting electric press, the processed semiconductor can be coated with films by arranging the sliding plate, the sliding groove, the sliding block, the pulling block, the driving rod, the paper tube and the dustproof film, the dustproof film can be quickly replaced after being used, under the mutual matching with the dustproof film, the outer surface of the semiconductor can be prevented from being infected with external oil stains or dust in the process of centralized placement, further, after sundries are prevented from being adsorbed on the outer surface of the semiconductor, a worker can clean the semiconductor before further deep processing, and the unnecessary work burden of the worker is prevented from being increased.
2. According to the utility model, one end of the dustproof film can be limited by arranging the limiting device, so that the processed semiconductor can be conveniently coated.
Drawings
FIG. 1 is a schematic perspective view of a heat setting press for semiconductor manufacturing according to the present invention;
FIG. 2 is an exploded perspective view of a portion of a heat setting press for semiconductor manufacturing according to the present invention;
FIG. 3 is an enlarged view taken at A of FIG. 2 in accordance with the present invention;
fig. 4 is a partial perspective sectional view of a heat setting electric press for semiconductor manufacturing according to the present invention.
Illustration of the drawings:
1. a processing table; 2. a main body of the electric compressor; 3. a heat setting plate; 4. a placing table; 5. a placement groove; 6. a sliding plate; 7. a sliding groove; 8. a slider; 9. pulling the block; 10. driving the rod; 11. a paper tube; 12. a dust-proof film; 13. an adjustment groove; 14. an adjustment column; 15. a spring; 16. an adjusting block; 17. rotating the disc; 18. mounting a column; 19. a column; 20. a slide bar; 21. pulling a handle; 22. a limiting column; 23. and a limiting hole.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be further described with reference to the accompanying drawings and examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and thus the present invention is not limited to the specific embodiments of the present disclosure.
Referring to fig. 1-4, the present invention provides a technical solution: a heat setting electric press for semiconductor production comprises a processing table 1, an electric press main body 2, a heat setting plate 3, a placing table 4, a placing groove 5, a sliding plate 6, a sliding groove 7, a sliding block 8, a pulling block 9, a driving rod 10, a paper tube 11 and a dustproof film 12, wherein the electric press main body 2 is installed on the upper surface of the processing table 1 through bolts, the heat setting plate 3 is installed outside the electric press main body 2, the placing table 4 is installed on the upper surface of the processing table 1 through bolts, the placing groove 5 is formed in two sides of the upper surface of the placing table 4, the bottom end of the sliding plate 6 is welded on two sides of the upper surface of the processing table 1, the sliding groove 7 is formed in the outer surface of the sliding plate 6, the pulling block 9 is fixedly installed on the outer surface of the electric press 8, the driving rod 10 is fixedly installed on the outer surface of one side, far away from the sliding block 8, the dustproof film 12 is wound outside the paper tube 11, the processing table 1 and the electric press main body 2, The heat setting plate 3, the placing table 4 and the placing groove 5 are basic components of a heat setting electric press, a processed semiconductor can be coated by arranging a sliding plate 6, a sliding groove 7, a sliding block 8, a pulling block 9, a driving rod 10, a paper tube 11 and a dustproof film 12, the semiconductor is placed in the placing groove 5 during processing, then the semiconductor is processed by starting the electric press main body 2 through the heat setting plate 3, the pulling block 9 is held after the processing is finished, the paper tube 11 is driven to move through the driving rod 10, the dustproof film 12 is covered on the processed semiconductor during moving, a cutter is used for cutting the dustproof film 12 immediately, then the redundant dustproof film 12 is wrapped on the semiconductor, the sliding plate 6, the sliding groove 7 and the sliding block 8 are arranged to facilitate the coating of the semiconductor by using the dustproof film 12 and are matched with the dustproof film 12, the outer surface of the semiconductor in the process of being placed in a concentrated mode can be prevented from being contaminated by external oil stains or dust, and therefore after sundries are prevented from being adsorbed on the outer surface of the semiconductor, workers need to clean the semiconductor before further deep processing is carried out on the semiconductor, and unnecessary workload of the workers is prevented from being increased.
The replacing device is arranged inside the driving rod 10 and comprises an adjusting groove 13, an adjusting column 14, a spring 15, an adjusting block 16, a rotating disc 17 and mounting columns 18, wherein the adjusting groove 13 is formed in the side wall of the driving rod 10, the adjusting column 14 is fixedly arranged on the inner wall of the adjusting groove 13, the spring 15 is sleeved outside the adjusting column 14, the adjusting block 16 is connected to the outer surface of the adjusting column 14 in a sliding mode, the rotating disc 17 is rotatably connected to the side wall of the adjusting block 16 through a rotating shaft, the mounting column 18 is fixedly arranged on the outer surface of the rotating disc 17, after the dustproof film 12 is used, the adjusting block 16 is pulled towards the opposite direction of the paper tube 11, the adjusting block 16 drives the spring 15 to retract when moving, then the paper tube 11 is taken down, the paper tube 11 with the dustproof film 12 wrapped on the outer surface is taken out to align with the mounting column 18, then the paper tube 11 is sleeved on one of the mounting columns 18 to release the adjusting block 16, the rotating disc 17 is driven by the resilience force of the spring 15 to clamp the paper tube 11, thereby completing the replacement.
The limiting device is arranged on the upper surface of the processing table 1 and comprises an upright post 19, a sliding rod 20, a pull handle 21, a limiting post 22 and a limiting hole 23, the bottom end of the upright post 19 is fixedly arranged on two sides of the upper surface of the processing table 1 respectively, the sliding rod 20 is connected to the outer surface of the upright post 19 in a sliding mode, the bottom end of the pull handle 21 is fixedly arranged on the upper surface of the sliding rod 20, the top end of the limiting post 22 is fixedly arranged on the lower surface of the sliding rod 20, the limiting hole 23 is formed in the upper surface of the processing table 1, when film covering is needed, the pull handle 21 is held first to pull the sliding rod 20, the sliding rod 20 drives the limiting post 22 to be separated from the limiting hole 23, then the dustproof film 12 is pulled to cover one end of the dustproof film 12 on the limiting hole 23, and the sliding rod 20 is pressed down to drive the limiting post 22 to be inserted into the limiting hole 23 to limit the dustproof film 12.
The slide opening has all been seted up at slide bar 20's both ends, the surface of stand 19 and the inner wall sliding connection in slide opening, spacing post 22's surface and spacing hole 23's surface, spacing post 22 and spacing hole 23 mutually support be for the convenience spacing is carried out to the one end of dust-proof membrane 12, the setup of slide opening is for making slide bar 20 slide along stand 19's surface, can not misplace when guaranteeing slide bar 20 to remove.
The outer surface of the sliding block 8 is connected with the inner wall of the sliding groove 7 in a sliding manner, the outer surface of the pulling block 9 is provided with a pulling groove, the outer surface of the mounting column 18 is connected with the inner wall of the paper tube 11 in a sliding manner, the outer surface of the adjusting block 16 is connected with the inner wall of the adjusting groove 13 in a sliding manner, two ends of the spring 15 are fixedly arranged on the outer surface of the adjusting block 16 and the inner wall of the adjusting groove 13 respectively, the dustproof film 12 is made of PPS, the sliding groove 7 and the sliding block 8 are arranged so that the driving rod 10 can move on the same horizontal plane through the sliding plate 6, the pulling groove is arranged so that a hand can be inserted into and hold the pulling block 9 conveniently, the mounting column 18 is arranged so as to limit the paper tube 11, the adjusting groove 13 is arranged so that the adjusting column 14 can be conveniently, the spring 15 and the adjusting block 16 are installed inside the driving rod 10, the spring 15 is arranged to drive the adjusting block 16 to reset, and the dust-proof film 12 made of PPS material has the advantages of high temperature resistance, high elasticity and the like.
The working principle is as follows: when in processing, a semiconductor is firstly placed in the placing groove 5, then the electric press main body 2 is started to process the semiconductor through the heat setting plate 3, after the processing is finished, the pull handle 21 is held to pull up the sliding rod 20, the sliding rod 20 drives the limiting column 22 to be separated from the limiting hole 23, then the dustproof film 12 is pulled to cover one end of the dustproof film on the limiting hole 23, the sliding rod 20 is pressed down to drive the limiting column 22 to be inserted into the limiting hole 23 to limit the dustproof film 12, then the pull block 9 is held to drive the paper tube 11 to move through the drive rod 10, when in moving, one end of the dustproof film 12 is limited on the processing table 1, so the rotary disk 17 drives the paper tube 11 to rotate in the moving process, the dustproof film 12 on the outer surface is discharged in the rotating process to cover the processed semiconductor, the dustproof film 12 is cut off by a cutter immediately, the sliding rod 20 is pulled up to drive the limiting column 22 to be separated from the limiting hole 23, and then the redundant dustproof film 12 is wrapped on the semiconductor, so that the film covering work can be completed, after the dustproof film 12 is used up, the adjusting block 16 is pulled towards the opposite direction of the paper tube 11, the adjusting block 16 is driven to retract when moving, the paper tube 11 is taken down, the paper tube 11 with the dustproof film 12 wrapped on the outer surface is taken out to align the mounting column 18, the adjusting block 16 is sleeved on one mounting column 18, the adjusting block 16 is loosened by the adjusting block 16, the rotating disc 17 is driven to clamp the paper tube 11 through the adjusting block 16 under the driving of the resilience force of the spring 15, and therefore the replacement is completed.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a heat setting electric press for semiconductor manufacture, includes processing table (1), electric press main part (2), heat setting board (3), places platform (4), standing groove (5), sliding plate (6), sliding tray (7), sliding block (8), pulling piece (9), drive pole (10), fiber container (11), dust-proof membrane (12), change device and stop device, its characterized in that: the electric press main body (2) is arranged on the upper surface of the processing table (1) through bolts, the heat setting plate (3) is arranged outside the electric press main body (2), the placing table (4) is arranged on the upper surface of the processing table (1) through bolts, the placing grooves (5) are arranged on two sides of the upper surface of the placing table (4), the bottom ends of the sliding plates (6) are welded on two sides of the upper surface of the processing table (1), the sliding groove (7) is arranged on the outer surface of the sliding plate (6), the pulling block (9) is fixedly arranged on the outer surface of the sliding block (8), the driving rod (10) is fixedly arranged on the outer surface of one side of the pulling block (9) far away from the sliding block (8), the dustproof film (12) is wound outside the paper tube (11), the replacing device is arranged inside the driving rod (10), and the limiting device is arranged on the upper surface of the processing table (1).
2. A heat setting electric press for semiconductor production as claimed in claim 1, wherein: the replacing device comprises an adjusting groove (13), an adjusting column (14), a spring (15), an adjusting block (16), a rotating disc (17) and a mounting column (18), wherein the adjusting groove (13) is formed in the side wall of the driving rod (10), the adjusting column (14) is fixedly arranged on the inner wall of the adjusting groove (13), the spring (15) is sleeved on the outer portion of the adjusting column (14), the adjusting block (16) is slidably connected to the outer surface of the adjusting column (14), the rotating disc (17) is rotatably connected to the side wall of the adjusting block (16) through a rotating shaft, and the mounting column (18) is fixedly arranged on the outer surface of the rotating disc (17).
3. A heat setting electric press for semiconductor production as claimed in claim 1, wherein: the outer surface of the sliding block (8) is connected with the inner wall of the sliding groove (7) in a sliding mode, and the outer surface of the pulling block (9) is provided with a pulling groove.
4. A heat setting electric press for semiconductor production as claimed in claim 2, wherein: the outer surface of the mounting column (18) is in sliding connection with the inner wall of the paper tube (11), and the outer surface of the adjusting block (16) is in sliding connection with the inner wall of the adjusting groove (13).
5. A heat setting electric press for semiconductor production as claimed in claim 2, wherein: the two ends of the spring (15) are fixedly arranged on the outer surface of the adjusting block (16) and the inner wall of the adjusting groove (13) respectively, and the dustproof film (12) is made of PPS.
6. A heat setting electric press for semiconductor production as claimed in claim 1, wherein: the limiting device comprises an upright post (19), a sliding rod (20), a pull handle (21), a limiting post (22) and a limiting hole (23), wherein the bottom end of the upright post (19) is fixedly arranged on two sides of the upper surface of the processing table (1) respectively, the sliding rod (20) is connected to the outer surface of the upright post (19) in a sliding mode, the bottom end of the pull handle (21) is fixedly arranged on the upper surface of the sliding rod (20), the top end of the limiting post (22) is fixedly arranged on the lower surface of the sliding rod (20), and the limiting hole (23) is formed in the upper surface of the processing table (1).
7. A heat setting electric press for semiconductor production as claimed in claim 6, wherein: the slide rod (20) is provided with sliding holes at two ends, the outer surface of the upright post (19) is connected with the inner wall of the sliding hole in a sliding manner, and the outer surface of the limiting post (22) is connected with the outer surface of the limiting hole (23).
CN202121732408.XU 2021-07-28 2021-07-28 Heat setting electric press for semiconductor production Expired - Fee Related CN215578466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121732408.XU CN215578466U (en) 2021-07-28 2021-07-28 Heat setting electric press for semiconductor production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121732408.XU CN215578466U (en) 2021-07-28 2021-07-28 Heat setting electric press for semiconductor production

Publications (1)

Publication Number Publication Date
CN215578466U true CN215578466U (en) 2022-01-18

Family

ID=79829325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121732408.XU Expired - Fee Related CN215578466U (en) 2021-07-28 2021-07-28 Heat setting electric press for semiconductor production

Country Status (1)

Country Link
CN (1) CN215578466U (en)

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220118