CN215499773U - Device for stripping PI film - Google Patents
Device for stripping PI film Download PDFInfo
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- CN215499773U CN215499773U CN202121443288.1U CN202121443288U CN215499773U CN 215499773 U CN215499773 U CN 215499773U CN 202121443288 U CN202121443288 U CN 202121443288U CN 215499773 U CN215499773 U CN 215499773U
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Abstract
The utility model discloses a device for stripping a PI film, which belongs to the technical field of FPC (flexible printed circuit) flexible circuit board manufacturing and comprises an installation platform, a first adsorption mechanism, a second adsorption mechanism and an adhesion pressing mechanism, wherein the first adsorption mechanism comprises a first driver and a first adsorption platform; the second adsorption mechanism comprises a second driver and a second adsorption platform, the second driver is installed on the installation platform, the second adsorption platform is connected with the second driver, and the second driver drives the second adsorption platform to move in a direction parallel to the installation platform; the adhesion pressing mechanism is installed on the installation table and comprises an adhesion part and a pressing part, the adhesion part and the installation table enclose an adhesion area, and the pressing part and the installation table enclose an compaction area. The utility model achieves the technical effects of improving the production efficiency and reducing the influence of environmental factors.
Description
Technical Field
The utility model belongs to the technical field of FPC (flexible printed circuit) manufacturing, and particularly relates to a device for stripping a PI (polyimide) film.
Background
An FPC (Flexible Printed Circuit, abbreviated as a Flexible Printed Circuit) is a Flexible Printed Circuit board with high reliability, which is made of a polyimide or polyester film as a base material, and has the characteristics of high wiring density, light weight, thin thickness, and good bendability. With the wide rise of electronic products, FPC flexible circuit boards are used in more and more fields.
In the existing FPC flexible circuit board manufacturing technology, the cover film is an indispensable raw material in the FPC flexible circuit board manufacturing process, the cover film mainly consists of two layers of release paper and a PI film, and the PI film is often required to be peeled off from the release paper in the FPC flexible circuit board manufacturing process. At present, the PI film is peeled off in a way that a cover film of a roll is firstly cut into sheets, and then the PI film is peeled off. However, the production efficiency is low due to the adoption of a mode of firstly dividing the covering film of the coil stock into sheets and then peeling the PI film; meanwhile, the cover film has higher requirements on storage and use environments, and environmental factors such as humidity, temperature and the like can generate adverse effects on the PI film, so that the PI film is easily influenced by the environmental factors by dividing the cover film of the coil stock into sheet stocks.
In summary, in the existing FPC flexible circuit board manufacturing technology, there are technical problems of low production efficiency and great influence from environmental factors.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problems of low production efficiency and great influence of environmental factors.
In order to solve the above technical problem, the present invention provides an apparatus for peeling a PI film, the apparatus comprising: an installation table; the first adsorption mechanism comprises a first driver and a first adsorption platform, the first driver is installed on the installation platform, the first adsorption platform is connected with the first driver, and the direction in which the first driver drives the first adsorption platform to move is a direction perpendicular to the installation platform; the second adsorption mechanism comprises a second driver and a second adsorption platform, the second driver is installed on the installation platform, the second adsorption platform is connected with the second driver, and the direction in which the second driver drives the second adsorption platform to move is parallel to the direction of the installation platform; the adhesion pressing mechanism is installed on the installation table and comprises an adhesion part and a pressing part, the adhesion part and the installation table are enclosed to form an adhesion area, the pressing part and the installation table are enclosed to form a pressing area, and the adhesion area is located between the second adsorption table and the pressing area.
Further, the second driver is a linear motor.
Further, the second adsorption mechanism further includes: the first roller shaft is mounted on the second adsorption platform, and the second roller shaft is mounted on the second adsorption platform.
Further, the first roller shaft and the second roller shaft are parallel.
Further, the adhesion part comprises an adhesive roller and a first air cylinder, the first air cylinder is fixed on the mounting table, the adhesive roller is connected with the first air cylinder, and the adhesive roller is located in the adhesion area.
Further, the adhesion part also comprises a first support frame, the first cylinder is installed on the first support frame, and the adhesive roller is arranged on the first support frame in a sliding mode.
Further, the adhesive roller is parallel to the mounting table.
Furthermore, the pressing part comprises a pressing plate and a second air cylinder, the second air cylinder is fixed on the mounting table and connected with the pressing plate, and the pressing plate is located in the adhesion area.
Furthermore, the pressing part further comprises a second support frame, the second air cylinder is mounted on the second support frame, and the pressing plate is slidably arranged on the second support frame.
Further, the pressing plate is parallel to the mounting table.
Has the advantages that:
the utility model provides a device for stripping a PI film, which is characterized in that a first driver in a first adsorption mechanism is arranged on a mounting table, the first adsorption table is connected with the first driver, and the first driver drives the first adsorption table to move in a direction vertical to the mounting table. The second driver in the second adsorption mechanism is installed on the installation table, the second adsorption table is connected with the second driver, and the direction in which the second driver drives the second adsorption table to move is parallel to the direction of the installation table. Meanwhile, the adhesion pressing mechanism is installed on the installation table, an adhesion area is formed by the adhesion part and the installation table in the adhesion pressing mechanism in a surrounding mode, a pressing area is formed by the pressing part and the installation table in a surrounding mode, and the adhesion area is located between the second adsorption table and the pressing area. After the cover film adsorbed on the second adsorption platform moves to the adhesion area, the adhesion part located above the cover film adheres to the PI film in the cover film, the second driver drives the cover film adsorbed on the second adsorption platform to move back and forth relative to the adhesion part, and the PI film is enabled to be adhered to the release paper for a distance. Then the second driver drives the cover film adsorbed on the second adsorption platform to move to the position below the first adsorption platform, then the adsorption is cut off, the PI film is adsorbed by the first adsorption platform driven by the first driver, and the release paper positioned in the compression area is compressed by the compression part. At the moment, the second adsorption platform moves towards the direction far away from the pressing part to rapidly separate the release paper and the PI film from each other, and the PI film is adsorbed on the first adsorption platform, so that the automatic stripping of the PI film can be completed. And then, the PI film can be quickly and automatically peeled off, the production efficiency is improved, and the influence of environmental factors is reduced. Thereby achieving the technical effects of improving the production efficiency and reducing the influence of environmental factors.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a first schematic diagram of an apparatus for peeling a PI film according to an embodiment of the present invention;
FIG. 2 is a second schematic diagram of an apparatus for peeling off a PI film according to an embodiment of the present invention;
FIG. 3 is a third schematic view of an apparatus for peeling off PI films according to an embodiment of the present invention;
fig. 4 is a partially enlarged schematic view of fig. 3.
Detailed Description
The utility model discloses a device for stripping a PI film, which is characterized in that a first driver 21 in a first adsorption mechanism is arranged on a mounting table 1, a first adsorption table 22 is connected with the first driver 21, and the first driver 21 drives the first adsorption table 22 to move in a direction vertical to the mounting table 1. In the second suction mechanism, a second driver 31 is attached to the mounting table 1, the second suction table 32 is connected to the second driver 31, and the second driver 31 drives the second suction table 32 to move in a direction parallel to the mounting table 1. Meanwhile, the adhesion pressing mechanism is installed on the installation platform 1, an adhesion part and the installation platform 1 in the adhesion pressing mechanism are enclosed to form an adhesion area, the pressing part and the installation platform 1 are enclosed to form a pressing area, and the adhesion area is located between the second adsorption platform 32 and the pressing area. After the cover film 5 adsorbed on the second adsorption stage 32 moves to the adhesion area, the adhesion part located above the cover film 5 adheres to the PI film in the cover film 5, and the second driver 31 drives the cover film 5 adsorbed on the second adsorption stage 32 to move back and forth relative to the adhesion part, so that the PI film is adhered to the release paper for a distance. Then the second driver 31 drives the cover film 5 adsorbed on the second adsorption stage 32 to move to the lower part of the first adsorption stage 22, and then the adsorption is cut off, the first adsorption stage 22 driven by the first driver 21 adsorbs the PI film, and the release paper positioned in the compression area is compressed by the compression part. At this time, the second adsorption stage 32 moves in a direction away from the pressing member to rapidly separate the release paper and the PI film from each other, and the PI film is adsorbed on the first adsorption stage 22, so that the automatic peeling of the PI film can be completed. And then, the PI film can be quickly and automatically peeled off, the production efficiency is improved, and the influence of environmental factors is reduced. Thereby achieving the technical effects of improving the production efficiency and reducing the influence of environmental factors.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention; the "and/or" keyword referred to in this embodiment represents sum or two cases, in other words, a and/or B mentioned in the embodiment of the present invention represents two cases of a and B, A or B, and describes three states where a and B exist, such as a and/or B, which represents: only A does not include B; only B does not include A; including A and B.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments. Spatially relative terms, such as "below," "above," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "lower" would then be oriented "upper" other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Also, in embodiments of the utility model where an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used in the embodiments of the present invention are for illustrative purposes only and are not intended to limit the present invention.
Referring to fig. 1, fig. 2, fig. 3 and fig. 4, fig. 1 is a first schematic diagram of an apparatus for peeling a PI film according to an embodiment of the present invention, fig. 2 is a second schematic diagram of an apparatus for peeling a PI film according to an embodiment of the present invention, fig. 3 is a third schematic diagram of an apparatus for peeling a PI film according to an embodiment of the present invention, and fig. 4 is a partially enlarged schematic diagram of fig. 3 (i.e., fig. 4 is an enlarged schematic diagram of a portion 6 in fig. 3). The device for stripping the PI film according to the embodiment of the present invention includes a mounting table 1, a first adsorption mechanism, a second adsorption mechanism, and an adhesion pressing mechanism, and the following detailed description is respectively made on the mounting table 1, the first adsorption mechanism, the second adsorption mechanism, and the adhesion pressing mechanism:
for the mount table 1 and the first adsorption mechanism:
the first adsorption mechanism includes a first actuator 21 and a first adsorption stage 22, the first actuator 21 is mounted on the mounting stage 1, the first adsorption stage 22 is connected to the first actuator 21, and a direction in which the first actuator 21 drives the first adsorption stage 22 to move is a direction perpendicular to the mounting stage 1 (i.e., a direction perpendicular to an upper side surface of the mounting stage 1 in fig. 1).
Specifically, the first actuator 21 of the first suction mechanism may be mounted on the mounting table 1, the mounting table 1 provides a support for the first actuator 21, the first actuator 21 can drive the first suction table 22 to move in a direction perpendicular to the mounting table 1, and the first suction table 22 can move in a direction perpendicular to the plane of the mounting table 1, that is, the first suction table 22 can move in an upward direction and a downward direction in fig. 1. The first driver 21 may be a motor, and when the motor is powered on, the first driver 21 drives the first adsorption stage 22 to move in an upward or downward direction. The first suction stage 22 has a space for accommodating the PI film in the cover film 5, and when the first suction stage 22 approaches the PI film, the first suction stage 22 can suck the PI film after the opening operation.
For the second adsorption mechanism:
the second suction mechanism includes a second driver 31 and a second suction table 32, the second driver 31 is mounted on the mounting table 1, the second suction table 32 is connected to the second driver 31, and a direction in which the second driver 31 drives the second suction table 32 to move is a direction parallel to the mounting table 1 (i.e., an upper side surface of the mounting table 1 in fig. 1, a direction parallel to the side surface, such as a direction from left to right along the side surface). Wherein the second driver 31 is a linear motor. The second adsorption mechanism further includes a first roller shaft 33 and a second roller shaft 34, the first roller shaft 33 is mounted on the second adsorption stage 32, the second roller shaft 34 is mounted on the second adsorption stage 32, and the first roller shaft 33 and the second roller shaft 34 are parallel to each other.
Specifically, the second driver 31 of the second suction mechanism is mounted on the mounting table 1, and the second driver 31 is a linear motor, and the second suction table 32 can be driven by the second driver 31 to move along a direction parallel to the mounting table 1. The second suction table 32 may be moved in a direction approaching or a direction departing from an adhesion pressing mechanism described below, i.e., the second suction table 32 may be moved leftward or rightward in fig. 1. The first and second roller shafts 33 and 34 may be mounted on the second adsorption stage 32, and the second roller shaft 34 may be movable in a leftward direction in fig. 1. The cover film 5 on the second adsorption stage 32 may be wound around the first roller shaft 33 and the second roller shaft 34.
For the adhesive hold-down mechanism:
the adhesion pressing mechanism is installed on the installation platform 1, the adhesion pressing mechanism comprises an adhesion part and a pressing part, the adhesion part and the installation platform 1 are enclosed to form an adhesion area (namely, a space area capable of accommodating PI films in the covering film 5 is provided, the pressing part can paste the PI films in the adhesion area), the pressing part and the installation platform 1 are enclosed to form a pressing area (namely, a space area capable of accommodating release paper in the covering film 5 is provided, and the pressing part can press the release paper in the pressing area), and the adhesion area is located between the second adsorption platform 32 and the pressing area. The adhering part comprises an adhesive roller 411 and a first air cylinder 412, the first air cylinder 412 is fixed on the mounting table 1, the adhesive roller 411 is connected with the first air cylinder 412, and the adhesive roller 411 is positioned in the adhering area. The adhesion part further comprises a first support frame 413, the first cylinder 412 is mounted on the first support frame 413, and the adhesive roller 411 is slidably arranged on the first support frame 413. The adhesive roller 411 and the mounting table 1 are parallel to each other. The pressing component comprises a pressing plate 421 and a second air cylinder 422, the second air cylinder 422 is fixed on the mounting table 1, the pressing plate 421 is connected with the second air cylinder 422, and the pressing plate 421 is located in the adhesion area. The pressing component further comprises a second supporting frame 423, the second air cylinder 422 is installed on the second supporting frame 423, the pressing plate 421 is slidably arranged on the second supporting frame 423, and the pressing plate 421 and the installation table 1 are parallel to each other.
Specifically, a first support frame 413 of an adhesion component in the adhesion pressing mechanism is installed on the installation table 1, two ends of the adhesive roller 411 are respectively connected with the first support frame 413 in a sliding manner, since a first air cylinder 412 installed on the first support frame 413 is connected with the adhesive roller 411, the adhesive roller 411 can be driven to move towards an upward direction or a downward direction through the first air cylinder 412, and during the reciprocating motion of the cover film 5 located below the adhesive roller 411 towards the left and the right, an adhesive layer on the surface of the adhesive roller 411 can adhere to a PI film in the cover film 5 (the PI film is located in the direction of the release paper, that is, the PI film is located on the side of the release paper close to the adhesive roller 411). The second support frame 423 of the pressing part in the adhesion pressing mechanism is installed on the installation table 1, two ends of the pressing plate 421 are respectively connected with the second support frame 423 in a sliding manner, and the second cylinder 422 installed on the second support frame 423 is connected with the pressing plate 421, so that the pressing plate 421 can be driven to move towards the upward direction or the downward direction through the second cylinder 422. The above-mentioned roller 411 glues the PI membrane in the cover film 5 for after the PI membrane and from a small distance of mutual separation between the type paper, rethread second cylinder 422 drives clamp plate 421 and moves downwards, makes to be located the clamp plate 421 below from the type paper pushed down.
In actual operation, after the cover film 5 is first sucked by the second suction stage 32, the cover film 5 from which the PI film is not peeled is moved by the second driver 31 to a position directly below the adhesive roller 411. The adhesive roller 411 and the release paper in the cover film 5 are brought into contact with each other by moving the adhesive roller 411 toward the cover film 5 (i.e., downward). After the second adsorption table 32 sucks the cover film 5, the second driver 31 moves the un-peeled PI film back and forth a small distance below the adhesive roller 411, and at this time, the PI film can be adhered to the release paper by a small distance through the adhesive roller 411. Then, the cover film 5 is sucked by the second suction stage 32, and after the peeled PI film is retracted to a position directly below the first suction stage 22 by the second driver 31, the second suction stage 32 stops the suction, and at this time, the first driver 21 drives the first suction stage 22 to move downward, and the first suction stage 22 sucks the PI film which has been stuck off for a short distance. Meanwhile, the release paper at the rear end of the cover film 5 (i.e., the position close to the pressing plate 421) is pressed by the pressing plate 421. The second driver 31 drives the second suction table 32 to move backward (i.e. to the left in fig. 1), and since the second suction table 32 has disconnected the suction of the release paper, the second roller shaft 34 mounted on the second suction table 32 and the first roller shaft 33 move backward together, so that the PI film and the release paper are separated from each other, and thus the automatic peeling of the PI film can be completed.
The utility model provides a device for stripping PI film, which is characterized in that a first driver 21 in a first adsorption mechanism is arranged on a mounting table 1, a first adsorption table 22 is connected with the first driver 21, and the first driver 21 drives the first adsorption table 22 to move in a direction vertical to the mounting table 1. In the second suction mechanism, a second driver 31 is attached to the mounting table 1, the second suction table 32 is connected to the second driver 31, and the second driver 31 drives the second suction table 32 to move in a direction parallel to the mounting table 1. Meanwhile, the adhesion pressing mechanism is installed on the installation platform 1, an adhesion part and the installation platform 1 in the adhesion pressing mechanism are enclosed to form an adhesion area, the pressing part and the installation platform 1 are enclosed to form a pressing area, and the adhesion area is located between the second adsorption platform 32 and the pressing area. After the cover film 5 adsorbed on the second adsorption stage 32 moves to the adhesion area, the adhesion part located above the cover film 5 adheres to the PI film in the cover film 5, and the second driver 31 drives the cover film 5 adsorbed on the second adsorption stage 32 to move back and forth relative to the adhesion part, so that the PI film is adhered to the release paper for a distance. Then the second driver 31 drives the cover film 5 adsorbed on the second adsorption stage 32 to move to the lower part of the first adsorption stage 22, and then the adsorption is cut off, the first adsorption stage 22 driven by the first driver 21 adsorbs the PI film, and the release paper positioned in the compression area is compressed by the compression part. At this time, the second adsorption stage 32 moves in a direction away from the pressing member to rapidly separate the release paper and the PI film from each other, and the PI film is adsorbed on the first adsorption stage 22, so that the automatic peeling of the PI film can be completed. And then, the PI film can be quickly and automatically peeled off, the production efficiency is improved, and the influence of environmental factors is reduced. Thereby achieving the technical effects of improving the production efficiency and reducing the influence of environmental factors.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. An apparatus for peeling a PI film, the apparatus comprising:
an installation table;
the first adsorption mechanism comprises a first driver and a first adsorption platform, the first driver is installed on the installation platform, the first adsorption platform is connected with the first driver, and the direction in which the first driver drives the first adsorption platform to move is a direction perpendicular to the installation platform;
the second adsorption mechanism comprises a second driver and a second adsorption platform, the second driver is installed on the installation platform, the second adsorption platform is connected with the second driver, and the direction in which the second driver drives the second adsorption platform to move is parallel to the direction of the installation platform;
the adhesion pressing mechanism is installed on the installation table and comprises an adhesion part and a pressing part, the adhesion part and the installation table are enclosed to form an adhesion area, the pressing part and the installation table are enclosed to form a pressing area, and the adhesion area is located between the second adsorption table and the pressing area.
2. The device for peeling PI film as defined in claim 1, wherein:
the second driver is a linear motor.
3. The apparatus for peeling PI film as claimed in claim 1, wherein the second adsorption mechanism further comprises:
the first roller shaft is mounted on the second adsorption platform, and the second roller shaft is mounted on the second adsorption platform.
4. The device for peeling PI film as defined in claim 3, wherein:
the first roller shaft and the second roller shaft are parallel.
5. The device for peeling PI film as defined in claim 1, wherein:
the adhesion part comprises an adhesive roller and a first air cylinder, the first air cylinder is fixed on the mounting table, the adhesive roller is connected with the first air cylinder, and the adhesive roller is located in the adhesion area.
6. The device for peeling PI film as claimed in claim 5, wherein:
the adhesion part further comprises a first support frame, the first cylinder is installed on the first support frame, and the adhesive roller is arranged on the first support frame in a sliding mode.
7. The device for peeling PI film as claimed in claim 6, wherein:
the adhesive roller is parallel to the mounting table.
8. The device for peeling PI film as defined in claim 1, wherein:
the pressing part comprises a pressing plate and a second air cylinder, the second air cylinder is fixed on the mounting table and connected with the pressing plate, and the pressing plate is located in the adhesion area.
9. The device for peeling PI film as claimed in claim 8, wherein:
the pressing part further comprises a second supporting frame, the second air cylinder is installed on the second supporting frame, and the pressing plate is arranged on the second supporting frame in a sliding mode.
10. The device for peeling PI film as claimed in claim 9, wherein:
the pressing plate is parallel to the mounting table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121443288.1U CN215499773U (en) | 2021-06-28 | 2021-06-28 | Device for stripping PI film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121443288.1U CN215499773U (en) | 2021-06-28 | 2021-06-28 | Device for stripping PI film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215499773U true CN215499773U (en) | 2022-01-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121443288.1U Active CN215499773U (en) | 2021-06-28 | 2021-06-28 | Device for stripping PI film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215499773U (en) |
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2021
- 2021-06-28 CN CN202121443288.1U patent/CN215499773U/en active Active
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