CN215491622U

CN215491622U - Self-adaptive carrier structure of wafer profile measuring instrument

Info

Publication number: CN215491622U
Application number: CN202121779488.4U
Authority: CN
Inventors: 陈海龙
Original assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Current assignee: Xinmao Jiaxing Semiconductor Technology Co ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2022-01-11
Anticipated expiration: 2031-08-02

Abstract

The utility model relates to the technical field of wafer detection, and discloses a self-adaptive carrier structure of a wafer profile measuring instrument, which comprises: the middle part of one side of the support plate is provided with a notch; the limiting mechanism is positioned on one side close to the notch and comprises at least one group of limiting components arranged on the carrier plate, and each limiting component comprises two limiting holes symmetrically arranged on the surface of the carrier plate and a guide pillar placed in each limiting hole; hold-down mechanism, including a pinch roller that rotates the setting, the outside cladding of pinch roller has the rubber sleeve, the pinch roller can to the breach direction is close to or is kept away from. The automatic clamping device disclosed by the utility model has the advantages that the automatic clamping of the wafer is realized by adopting the pressing wheel capable of automatically tensioning, and the positioning of the wafer is realized by the matching of the pressing wheel and the guide pillar, so that the region to be detected of the wafer extends to the outer side of the notch, and the wafer is detected.

Description

Self-adaptive carrier structure of wafer profile measuring instrument

Technical Field

The utility model relates to the technical field of wafer detection, in particular to an adaptive carrier structure of a wafer profile measuring instrument.

Background

The production process flow of the wafer comprises the following steps: in a large aspect, wafer production includes two major steps of boule fabrication and chip fabrication, which can be further divided into the following major processes (wherein boule fabrication includes only the first process, and the rest of the wafer fabrication is all referred to as post-processing of column slicing): the method comprises the steps of crystal bar growth, crystal bar cutting and detection, outer diameter grinding, slicing, round edge grinding, surface layer grinding, etching, defect removal, polishing, cleaning, inspection and packaging, and in the process flows, the detection of polished wafers is particularly important.

After the polishing process, the wafer needs to be subjected to contour inspection of appearance (thickness, angle, depth, etc.), and further because the shapes of the chips used in different devices or electronic instruments are different, the carrier for inspecting the wafer is an important component in the contour inspection of the wafer.

The existing wafer carrier has a single structure and is inconvenient to use; meanwhile, no carrier designed for circular wafers (particularly circular wafers with notches or notches) is currently found in the market, which causes inconvenience in the inspection process.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the defects of the prior art and provides a self-adaptive carrier structure of a wafer profile measuring instrument.

The utility model is realized by the following technical scheme:

an adaptive carrier structure of a wafer profile measuring instrument, comprising:

the middle part of one side of the support plate is provided with a notch;

the limiting mechanism is positioned on one side close to the notch and comprises at least one group of limiting components arranged on the carrier plate, each limiting component comprises two limiting holes symmetrically arranged on the surface of the carrier plate, and guide pillars are placed in the limiting holes;

hold-down mechanism, including a pinch roller that rotates the setting, the outside cladding of pinch roller has the rubber sleeve, the pinch roller can to the breach direction is close to or is kept away from.

Among the above-mentioned technical scheme, at first according to the actual specification of wafer, insert the guide pillar to spacing downthehole, the pinch roller of pulling hold-down mechanism makes the pinch roller move to the direction of keeping away from the breach, then place the wafer on the surface of support plate, slowly loosen the pinch roller this moment, the pinch roller then drives the wafer and removes to the breach direction until the wafer contacts with the guide pillar and accomplishes spacingly, the setting of rubber sleeve can improve the frictional force between wafer and the rubber sleeve, when needs examine the different positions of wafer, only need rotate the rotation that the pinch roller can realize the wafer, the wafer is when being in the compression state, some then can protrusion in the outside of breach of wafer, be convenient for to the detection of this position wafer.

The utility model is further provided in that the guide post comprises:

the fixed shaft is placed in the limiting hole;

and the rotating rod is sleeved outside the fixed shaft.

Among the above-mentioned technical scheme, the guide pillar includes fixed axle and dwang, and the outside of fixed axle is located to the dwang cover, and the dwang can rotate for the fixed axle promptly, because wafer and guide pillar contact, the dwang contacts with the wafer promptly, and the dwang can rotate along with the rotation of wafer, thereby reduces the friction between the two and prevents the damage to the wafer.

The utility model is further provided with a sliding groove formed in the surface of the carrier plate, and the pressing wheel moves in the sliding groove.

Among the above-mentioned technical scheme, the pinch roller can remove in the sliding tray of support plate inside, has realized that the relative breach of pinch roller is close to or keeps away from compact structure novelty.

The utility model is further configured that a sliding mechanism is further arranged at the lower end of the carrier plate, and the sliding mechanism comprises:

the fixing frame is arranged below the support plate;

the sliding block is arranged in the fixed frame in a sliding manner;

the sliding assembly comprises a connecting block and a sliding plate fixed at the upper end of the connecting block, the sliding plate can slide on the surface of the fixing frame, and the pinch roller is fixed above the sliding plate through a connecting shaft;

the spring, spring's one end with the sliding block is connected, spring's the other end is connected with the installation axle, the installation axle is located one side that the support plate below is close to the breach.

Among the above-mentioned technical scheme, the pinch roller set up in the upper end of sliding plate, the sliding plate belongs to sliding assembly's partly, and the sliding plate then removes on the surface of mount, and the setting of connecting block and sliding block can guarantee that the removal of sliding block is more steady, and clockwork spring is connected with sliding block and installation axle respectively, can guarantee like this that the pinch roller presss from both sides the tight wafer clamp, prevents the offset of wafer.

The utility model discloses a self-adaptive carrier structure of a wafer profile measuring instrument, which is compared with the prior art:

1. the automatic clamping device adopts the pressing wheel capable of automatically tensioning to automatically clamp the wafer, and realizes the positioning of the wafer through the matching of the pressing wheel and the guide pillar, so that the region to be detected of the wafer extends to the outer side of the notch, and the wafer is detected;

2. according to the utility model, the rubber sleeve is sleeved outside the pressing wheel, so that the friction force can be increased, when the pressing wheel rotates, the pressing wheel can drive the wafer to rotate, and meanwhile, the damage to the wafer is prevented to a great extent;

3. the limiting mechanisms are in multiple groups, and guide columns of the limiting mechanisms are detachable, so that the limiting mechanisms can be adjusted according to wafers of different specifications, and the detection range of the utility model is greatly improved.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a cross-sectional view of the present invention.

Fig. 3 is a top view of a carrier plate according to the present invention.

FIG. 4 is a schematic diagram illustrating an effect of placing a wafer on a carrier according to the present invention.

Figure 5 is a cross-sectional view of the guide post of the present invention.

Fig. 6 is a schematic structural view of the sliding mechanism of the present invention.

The corresponding part names indicated by the numbers and letters in the drawings:

wherein: 1. a carrier plate; 2. a limiting mechanism; 3. a hold-down mechanism; 4. a sliding mechanism; 5. a wafer; 1a, a gap; 1b, a sliding groove; 2a, limiting holes; 2b, a guide post; 2b1, fixed axle; 2b2, rotating rod; 3a, a pinch roller; 3b, a rubber sleeve; 3c, a connecting shaft; 4a, a fixing frame; 4b, a sliding block; 4c, a sliding component; 4c1, connecting block; 4c2, a slide plate; 4d, a clockwork spring; 4e, installing the shaft.

Detailed Description

The technical scheme of the utility model is further explained by the specific implementation mode in combination with the attached drawings.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms may be understood by those skilled in the art according to specific situations.

Referring to fig. 1 to 6, an adaptive carrier structure of a wafer profile measuring apparatus includes: the device comprises a carrier plate 1, wherein a notch 1a is formed in the middle of one side of the carrier plate 1; the limiting mechanism 2 is positioned at one side close to the notch 1a, the limiting mechanism 2 comprises at least one group of limiting components arranged on the carrier plate 1, the limiting components comprise two limiting holes 2a symmetrically arranged on the surface of the carrier plate 1, and guide pillars 2b are placed in the limiting holes 2 a; the pressing mechanism 3 comprises a pressing wheel 3a which is rotatably arranged, a rubber sleeve 3b is coated outside the pressing wheel 3a, and the pressing wheel 3a can be close to or far away from the gap 1 a.

The notch 1a on the carrier plate 1 is mainly used for detecting a part of the wafer, which exceeds the notch 1a, when the wafer is detected, if the wafer is circular and has no notch, four equal sites are uniformly divided for the wafer to be detected, if the wafer has a notch or a notch, four equal sites are uniformly divided for the wafer to be detected and a single notch or notch is detected, namely five point locations are detected, and overall, the arrangement of the notch 1a is convenient for image acquisition and system analysis and judgment in the contour detection process, and meanwhile, the detection results of the multiple point locations are more accurate;

referring to fig. 1, 3 and 4, it can be seen from fig. 1, 3 and 4 that the number of the limiting assemblies is at least one, and the preferred embodiment of the present technical solution is that the limiting assemblies are four groups, and the four groups of limiting assemblies can be adjusted according to actual requirements to realize the detection of wafers with different specifications; regarding the distribution of the limiting assemblies, the arrangement of the limiting assemblies in the technical scheme is that a longitudinal axis is drawn according to the central point of the carrier plate 1, and each group of limiting assemblies are symmetrically arranged according to the axis; taking the outermost limiting component as an example, the two limiting holes 2a are symmetrically arranged according to the axis, and when a plurality of groups of limiting components need to be arranged, compared with the outermost limiting component, the limiting holes of the rest limiting components are sequentially close to the axis;

as shown in fig. 1, a knob is further fixed at the upper end of the pinch roller 3a, the side wall of the knob is in a stripe shape, meanwhile, a rotation scale is further arranged at the circumferential position of the knob, the stripe-shaped side wall facilitates the rotation of the pinch roller 3a, and in addition, the rotation scale is arranged to facilitate the observation of the rotation angle of the wafer by personnel, so that the rotation scale is very intuitive; and the pinch roller 3a can be close to and keep away from the direction of the notch 1a, so that the wafer can be compressed, and the detection accuracy is improved.

Referring to fig. 1 and 5, the guide post 2b includes: a fixed shaft 2b1, the fixed shaft 2b1 is placed in the limiting hole 2 a; the rotating rod 2b2 is sleeved outside the fixed shaft 2b 1.

Wherein, the fixed axle 2b1 inserts extremely inside spacing hole 2a to dwang 2b2 cover is located fixed axle 2b1 is outside, dwang 2b2 is in fixed axle 2b1 is outside to be rotated just dwang 2b2 is in the surface of support plate 1 rotates, dwang 2b2 include the rotation main part with set up in the turning block of rotation main part upper end, the rotation main part with the turning block is cylindricly, the diameter of turning block is less than the diameter of rotation main part, the rotation main part of dwang 2b2 with wafer 5 contacts, the concave recess that is equipped with in the position that the lower surface of rotation main part corresponds fixed axle 2b1, this recess supplies fixed axle 2b1 to stretch into.

Referring to fig. 1 and 3, a sliding groove 1b is further formed in the surface of the carrier plate 1, and the pressing wheel 3a moves in the sliding groove 1 b.

The sliding groove 1b is located in the middle of the carrier plate 1, and the sliding groove 1b provides a certain space for the movement of the pinch roller 3 a.

Referring to fig. 1 to 6, a sliding mechanism 4 is further disposed at a lower end of the carrier plate 1, and the sliding mechanism 4 includes: the fixing frame 4a is arranged below the carrier plate 1; a sliding block 4b slidably disposed inside the fixing frame 4 a; the sliding assembly 4c comprises a connecting block 4c1 and a sliding plate 4c2 fixed at the upper end of the connecting block 4c1, the sliding plate 4c2 can slide on the surface of the fixed frame 4a, and the pressing wheel 3a is fixed above the sliding plate 4c2 through a connecting shaft 3 c; a clockwork spring 4d, clockwork spring 4 d's one end with sliding block 4b is connected, clockwork spring 4 d's the other end is connected with installation axle 4e, installation axle 4e is located 1 below of support plate is close to one side of breach 1 a.

As shown in fig. 2 and 6 in detail, the fixing frame 4a is a hollow rectangular frame, two opposite long sides of the fixing frame 4a are both provided with a moving groove, the sliding block 4b is a round rod, and two ends of the sliding block 4b penetrate through the moving groove and extend to the outer side of the fixing frame 4 a; the connecting blocks 4c1 are circular ring-shaped, the number of the connecting blocks 4c1 is two, the connecting blocks 4c1 are sleeved outside the sliding block 4b, the two connecting blocks 4c1 are both located inside the fixed frame 4a, the upper end of the connecting block 4c1 is connected with the sliding plate 4c2 through connecting ribs, the sliding block 4c2 can slide on the surface of the fixed frame 4a, and the sliding plate 4c2, the connecting block 4c1 and the sliding block 4b are connected, so that the sliding plate 4c2 can move more stably, and meanwhile, the pressing wheel 3a can move along a predetermined route in the moving process; in addition, one end of the clockwork spring 4d is wound to the outside of the sliding block 4b and the clockwork spring 4d is located between the two connecting blocks 4c1, while the other end of the clockwork spring 4d is connected with the mounting shaft 4e, and due to the characteristics of the clockwork spring 4d, the clockwork spring has elastic potential energy, and can realize automatic tensioning of the sliding block 4c 2; it is known to those skilled in the art that the self-tightening of the sliding plate 4c2 by the spring 4d is achieved, and other structures that can achieve the self-tightening of the sliding block 4b are also possible for the present solution.

It should be noted that, referring to fig. 2, a support plate is further annularly arranged on the outer side of the lower portion of the connecting shaft 3c, and the pressing wheel 3a is sleeved outside the connecting shaft 3c and is limited by the support plate.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Claims

1. An adaptive carrier structure of a wafer profile measuring instrument, comprising:

the device comprises a support plate (1), wherein a notch (1a) is formed in the middle of one side of the support plate (1);

the limiting mechanism (2) is positioned at one side close to the notch (1a), the limiting mechanism (2) comprises at least one group of limiting components arranged on the carrier plate (1), the limiting components comprise two limiting holes (2a) symmetrically arranged on the surface of the carrier plate (1), and guide pillars (2b) are placed in the limiting holes (2 a);

hold-down mechanism (3), including a pinch roller (3a) that rotates the setting, the outside cladding of pinch roller (3a) has rubber sleeve (3b), pinch roller (3a) can be to breach (1a) direction is close to or is kept away from.

2. The adaptive carrier structure of a wafer profile measuring instrument according to claim 1, wherein the guide pillar (2b) comprises:

a fixed shaft (2b1), the fixed shaft (2b1) being placed in the limiting hole (2 a);

and the rotating rod (2b2) is sleeved outside the fixed shaft (2b 1).

3. The adaptive carrier structure of claim 1, wherein: the surface of the carrier plate (1) is further provided with a sliding groove (1b), and the pressing wheel (3a) moves in the sliding groove (1 b).

4. The adaptive carrier structure of a wafer profile measuring instrument according to claim 1, wherein a sliding mechanism (4) is further disposed at a lower end of the carrier plate (1), and the sliding mechanism (4) comprises:

the fixing frame (4a) is arranged below the carrier plate (1);

a sliding block (4b) which is arranged in the fixed frame (4a) in a sliding manner;

the sliding assembly (4c) comprises a connecting block (4c1) and a sliding plate (4c2) fixed at the upper end of the connecting block (4c1), the sliding plate (4c2) can slide on the surface of the fixed frame (4a), and the pressing wheel (3a) is fixed above the sliding plate (4c2) through a connecting shaft (3 c);

clockwork spring (4d), the one end of clockwork spring (4d) with sliding block (4b) are connected, the other end of clockwork spring (4d) is connected with installation axle (4e), installation axle (4e) are located one side that support plate (1) below is close to breach (1 a).