CN215450117U

CN215450117U - Heat radiation structure for CPU chip

Info

Publication number: CN215450117U
Application number: CN202121696320.7U
Authority: CN
Inventors: 林瑾
Original assignee: Shenzhen Kaichuangxin Technology Co ltd
Current assignee: Shenzhen Kaichuangxin Technology Co ltd
Priority date: 2021-07-26
Filing date: 2021-07-26
Publication date: 2022-01-07
Anticipated expiration: 2031-07-26

Abstract

The utility model discloses a heat dissipation structure for a CPU chip, which comprises a main body, wherein the bottom of the main body is fixedly connected with a main board, an annular cavity is formed in the main body, a plurality of fixed blocks are fixedly connected to the main body in the annular cavity, one side of the fixed blocks is fixedly connected with a liquid storage bin, a water pump is arranged in the liquid storage bin, the inner wall of the bottom of the main body is fixedly connected with a mounting frame, the top of the mounting frame is fixedly connected with a pin plate, the middle of the mounting frame is fixedly connected with a heat conduction plate, gel is arranged between the pin plate and the heat conduction plate, and the bottom of the heat conduction plate is fixedly connected with a circulation pipe. According to the utility model, the liquid storage bin, the fixing block, the mounting frame, the circulating pipe, the heat conducting plate, the gel, the pin plate, the fan, the fixing frame, the contact frame, the limiting rod, the spring, the rotating rod, the connecting plate and the protective net are arranged, so that when the device is used, the device conducts heat by water cooling and heat by air cooling, and has the advantages of high operation efficiency, good effect, simplicity in operation, stability and practicability.

Description

Heat radiation structure for CPU chip

Technical Field

The utility model relates to the technical field of CPU chip heat dissipation, in particular to a heat dissipation structure for a CPU chip.

Background

The central processing unit is used as the operation and control core of the computer system and is the final execution unit for information processing and program operation. Since the production of CPUs, great developments have been made in the extension of logic structures, operation efficiencies, and functions.

Through the retrieval, chinese patent publication is CN 212135356U's patent, discloses a heat radiation structure for CPU chip, including the quick-witted box, the inside fixed mounting of quick-witted box has the mainboard, the upper end fixed mounting of mainboard has the chip protection frame, the lower extreme fixed mounting of chip protection frame has the CPU chip, the upper end fixed mounting of chip protection frame has the hot support of fan, the fixedly connected with buckle of two legs departments of the hot support of fan, the buckle groove has been seted up to the both sides outer wall of chip protection frame, just the buckle with the buckle groove cooperatees, the upper end fixed mounting of the hot support of fan has the device of fan frame.

One of the heat dissipation structures for CPU chips in the above patents has the following disadvantages: when the device is used, the temperature of ambient air is reduced through the water cooling pipeline, then the heat dissipation is realized by discharging low-temperature air to the chip through the fan, the practicability of the operation mode is extremely low, and the operation effect is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides a heat dissipation structure for a CPU chip.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a heat radiation structure for CPU chip, includes the main part, the bottom fixedly connected with mainboard of main part, the toroidal cavity has been seted up to the inside of main part, and the main part is in a plurality of fixed blocks of the inside fixedly connected with of toroidal cavity, and is a plurality of the same stock solution storehouse of one side fixedly connected with of fixed block, the inside in stock solution storehouse is equipped with the water pump, the bottom inner wall fixedly connected with mounting bracket of main part, the top fixedly connected with pin board of mounting bracket, the middle part fixedly connected with heat-conducting plate of mounting bracket, the pin board with be equipped with the gel between the heat-conducting plate, the bottom fixedly connected with circulating pipe of heat-conducting plate, the both ends of circulating pipe all run through to the inside in stock solution storehouse, the one end of circulating pipe the delivery outlet looks adaptation of water pump, the pin board with mainboard electric connection, the top of main part is equipped with forced air cooling mechanism.

Further, air-cooled mechanism includes the fan, ring groove has been seted up at the top of main part, and the main part is equipped with a plurality of kellies, and is a plurality of in ring groove's inside the same heat dissipation section of thick bamboo of top fixedly connected with of kellies, fixedly connected with mount between the inner wall of heat dissipation section of thick bamboo, the middle part of mount is rotated and is connected with the pivot, the top of fan with the bottom fixed connection of pivot, the top of mount is equipped with actuating mechanism.

Furthermore, the driving mechanism comprises a motor, the motor is fixedly connected with the top of the fixing frame, and one end of an output shaft of the motor is fixedly connected with the top end of the rotating shaft.

Furthermore, the top of the pin plate is rotatably connected with a buckling frame, two sides of the inner wall of the bottom of the buckling frame are fixedly connected with contact frames, the bottom of one side of the buckling frame is fixedly connected with a plurality of springs, and the bottoms of the springs are fixedly connected with the same connecting plate.

Furthermore, one side of the top of the pin plate is rotatably connected with a rotating rod, the top of the rotating rod is fixedly connected with a limiting rod, and the bottom of one side of the limiting rod is in contact with the top of one side of the buckling frame.

Furthermore, a protective net is arranged at the top of the inner wall of the heat dissipation cylinder.

The utility model has the beneficial effects that:

1. by arranging the liquid storage bin, the fixing block, the mounting frame, the circulating pipe, the heat conducting plate, the gel, the pin plate, the fan, the fixing frame, the rotating shaft and the heat dissipation cylinder, when the device is used, after the chip is mounted corresponding to the pin plate on the mounting frame, the gel in the mounting frame guides heat generated by the chip on the pin plate to the heat conducting plate, the water pump in the liquid storage bin takes away the heat from the cooling liquid at the bottom of the heat conducting plate through the circulating pipe, meanwhile, the heat dissipation cylinder is fixed at the top of the main body through the clamping rod, the motor on the fixing frame drives the fan through the rotating shaft, and the fan drives air in the device to flow through the main body and an air inlet hole of the main board;

2. by arranging the buckling frame, the contact frame, the limiting rod, the spring, the rotating rod and the connecting plate, when the device is used, the chip corresponds to the pin plate, the buckling frame is rotated to press the chip, then the limiting rod on the rotating rod is rotated to press one side of the buckling frame, the buckling frame reversely props the buckling frame through the spring at the top of the connecting plate and is always in contact with the limiting rod, the operation is simple, and the operation effect of the device is ensured;

3. through setting up the protection network, when using this device, the security that the protection network improved the device greatly has increased the device practicality.

Through setting up stock solution storehouse, fixed block, mounting bracket, circulating pipe, heat-conducting plate, gel, pin board, fan, mount, pivot, a heat dissipation section of thick bamboo, knot frame, contact frame, gag lever post, spring, bull stick, connecting plate, protection network, when using this device, this device water-cooling heat conduction, the forced air cooling heat dissipation, the operating efficiency is high, and is effectual, easy operation, it is stable practical.

Drawings

Fig. 1 is a schematic front sectional view of a heat dissipation structure for a CPU chip according to embodiment 1;

fig. 2 is a schematic side cross-sectional structural view of a heat dissipation structure for a CPU chip according to embodiment 1;

fig. 3 is a schematic perspective view of a heat dissipation structure for a CPU chip according to embodiment 1

Fig. 4 is a schematic structural diagram of a protective net for a heat dissipation structure of a CPU chip according to embodiment 2.

In the figure: the device comprises a main body 1, a liquid storage bin 2, a fixing block 3, a mounting rack 4, a circulating pipe 5, a heat conducting plate 6, gel 7, a pin plate 8, a fan 9, a fixing rack 10, a rotating shaft 11, a heat dissipation cylinder 12, a clamping rod 13, a buckling rack 14, a contact rack 15, a limiting rod 16, a spring 17, a rotating rod 18, a connecting plate 19 and a protective net 20.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

Example 1

Referring to fig. 1-3, a heat radiation structure for a CPU chip, including main part 1, the bottom fixedly connected with mainboard of main part 1, the toroidal cavity has been seted up to the inside of main part 1, main part 1 is at a plurality of fixed blocks 3 of the inside fixedly connected with of toroidal cavity, the same stock solution storehouse 2 of one side fixedly connected with of a plurality of fixed blocks 3, the inside of stock solution storehouse 2 is equipped with the water pump, the bottom inner wall fixedly connected with mounting bracket 4 of main part 1, the top fixedly connected with pin board 8 of mounting bracket 4, the middle part fixedly connected with heat-conducting plate 6 of mounting bracket 4, be equipped with gel 7 between pin board 8 and the heat-conducting plate 6, the bottom fixedly connected with circulating pipe 5 of heat-conducting plate 6, the inside to stock solution storehouse 2 is all run through at the both ends of circulating pipe 5, the delivery outlet looks adaptation of the one end water pump of circulating pipe 5, pin board 8 and mainboard electric connection, the top of main part 1 is equipped with air-cooled machine structure.

Wherein, air-cooled mechanism includes fan 9, and ring groove has been seted up at the top of main part 1, and main part 1 is equipped with a plurality of kellies 13 in ring groove's inside, and the same heat dissipation section of thick bamboo 12 of top fixedly connected with of a plurality of kellies 13, fixedly connected with mount 10 between the inner wall of heat dissipation section of thick bamboo 12, and the middle part of mount 10 rotates and is connected with pivot 11, and the bottom fixed connection of the top of fan 9 and pivot 11, the top of mount 10 is equipped with actuating mechanism.

The driving mechanism comprises a motor, the motor is fixedly connected with the top of a fixed frame 10, one end of an output shaft of the motor is fixedly connected with the top end of a rotating shaft 11, after a chip is installed corresponding to a pin plate 8 on an installation frame 4, gel 7 in the installation frame 4 guides heat generated by the chip on the pin plate 8 to a heat conducting plate 6, a TL-C06 type water pump in a liquid storage bin 2 takes cooling liquid away heat from the bottom of the heat conducting plate 6 through a circulating pipe 5, meanwhile, a heat dissipation cylinder 12 is fixed at the top of a main body 1 through a clamping rod 13, an S9I60GXHCE type motor on the fixed frame 10 drives a fan 9 through the rotating shaft 11, the fan 9 drives air in the device to flow through air inlet holes of the main body 1 and a main board, and the device is water-cooled to conduct heat, air-cooled to dissipate heat, high in operation efficiency and good in effect;

the top of the pin plate 7 is rotatably connected with a buckling frame 14, two sides of the inner wall of the bottom of the buckling frame 14 are fixedly connected with contact frames 15, the bottom of one side of the buckling frame 14 is fixedly connected with a plurality of springs 17, and the bottoms of the springs 17 are fixedly connected with the same connecting plate 19.

Wherein, top one side of pin foot board 8 is rotated and is connected with bull stick 18, the top fixedly connected with gag lever post 16 of bull stick 18, one side bottom of gag lever post 16 contacts with one side top of detaining frame 14, correspond pin foot board 8 with the chip, and rotate and detain frame 14 and push down the chip, then the gag lever post 16 on the rotation bull stick 18 will be pushed down detain frame 14 one side, detain frame 14 and contact all the time between detaining frame 14 and gag lever post 16 through the reverse top of spring 17 at connecting plate 19 top, and easy operation guarantees the operation effect of device.

The working principle is as follows: when the device is used, after the chip is installed corresponding to the pin plate 8 on the installation frame 4, the gel 7 in the installation frame 4 guides the heat generated by the chip on the pin plate 8 to the heat conduction plate 6, the water pump in the liquid storage bin 2 takes away the heat from the bottom of the heat conduction plate 6 through the circulating pipe 5, meanwhile, the heat dissipation cylinder 12 is fixed at the top of the main body 1 through the clamping rod 13, the motor on the fixing frame 10 drives the fan 9 through the rotating shaft 11, and the fan 9 drives the air in the device to flow through the main body 1 and the air inlet hole of the main board;

the chip corresponds to the pin plate 8, the buckling frame 14 is rotated to press the chip, then the limiting rod 16 on the rotating rod 18 is rotated to press one side of the buckling frame 14, the buckling frame 14 reversely props against the buckling frame 14 through the spring 17 at the top of the connecting plate 19 and is in contact with the limiting rod 16 all the time, the operation is simple, and the operation effect of the device is guaranteed.

Example 2

Referring to fig. 4, in comparison with embodiment 1, in this embodiment, in order to increase the practicability of the device, a protective net 20 is disposed on the top of the inner wall of the heat dissipating cylinder 12, and the protective net 20 greatly improves the safety of the device and increases the practicability of the device.

When the device is used, the protective net 20 greatly improves the safety of the device and increases the practicability of the device.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

Claims

1. The utility model provides a heat radiation structure for CPU chip, includes main part (1), its characterized in that, the bottom of main part (1) is equipped with the mainboard, and the toroidal cavity has been seted up to the inside of main part (1), and main part (1) is equipped with a plurality of fixed blocks (3) in the inside of toroidal cavity, and a plurality of one side of fixed block (3) is equipped with same stock solution storehouse (2), the inside of stock solution storehouse (2) is equipped with the water pump, and the bottom inner wall of main part (1) is equipped with mounting bracket (4), the top of mounting bracket (4) is equipped with pin board (8), and the middle part of mounting bracket (4) is equipped with heat-conducting plate (6), be equipped with gel (7) between pin board (8) and heat-conducting plate (6), and the bottom of heat-conducting plate (6) is equipped with circulating pipe (5), the both ends of circulating pipe (5) all run through to the inside of stock solution storehouse (2), the one end of circulating pipe (5) the delivery outlet looks adaptation of water pump, the pin plate (8) is electrically connected with the main board, and the top of the main body (1) is provided with an air cooling mechanism.

2. The heat dissipation structure for the CPU chip according to claim 1, wherein the air cooling mechanism comprises a fan (9), a circular clamping groove is formed in the top of the main body (1), a plurality of clamping rods (13) are arranged inside the circular clamping groove of the main body (1), the top of the plurality of clamping rods (13) is provided with the same heat dissipation cylinder (12), a fixing frame (10) is arranged between inner walls of the heat dissipation cylinder (12), a rotating shaft (11) is arranged in the middle of the fixing frame (10), the top of the fan (9) is fixedly connected with the bottom end of the rotating shaft (11), and a driving mechanism is arranged at the top of the fixing frame (10).

3. The heat dissipation structure for the CPU chip as claimed in claim 2, wherein the driving mechanism includes a motor, the motor is fixedly connected to the top of the fixing frame (10), and one end of an output shaft of the motor is fixedly connected to the top end of the rotating shaft (11).

4. The heat dissipation structure for the CPU chip according to claim 3, wherein a buckling frame (14) is arranged at the top of the pin plate (7), contact frames (15) are arranged on two sides of the inner wall of the bottom of the buckling frame (14), a plurality of springs (17) are arranged at the bottom of one side of the buckling frame (14), and the same connecting plate (19) is arranged at the bottoms of the plurality of springs (17).

5. The heat dissipation structure for the CPU chip according to claim 4, wherein a rotating rod (18) is arranged on one side of the top of the pin plate (8), a limiting rod (16) is arranged on the top of the rotating rod (18), and the bottom of one side of the limiting rod (16) is in contact with the top of one side of the buckle frame (14).

6. The heat dissipation structure for the CPU chip as recited in claim 5, wherein a protective net (20) is disposed on the top of the inner wall of the heat dissipation cylinder (12).