CN215421413U - Heat radiation structure of closed case - Google Patents
Heat radiation structure of closed case Download PDFInfo
- Publication number
- CN215421413U CN215421413U CN202121743438.0U CN202121743438U CN215421413U CN 215421413 U CN215421413 U CN 215421413U CN 202121743438 U CN202121743438 U CN 202121743438U CN 215421413 U CN215421413 U CN 215421413U
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- Prior art keywords
- case
- heat dissipation
- radiating fins
- ion
- fins
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- 230000005855 radiation Effects 0.000 title claims description 3
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 239000002184 metal Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000011324 bead Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 28
- 230000005684 electric field Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation structure of a closed case, which comprises heat dissipation fins, a wind shield and ion fans, wherein the heat dissipation fins, the wind shield and the ion fans are designed on the case, the heat dissipation fins are positioned on the outer side surface of the case, the heat of a chip is transmitted to fins on the outer side surface of the case through the inner side surface of the case, the ion fans are installed at two ends of the fins through screws, the air port planes of the ion fans are vertical to the directions of the heat dissipation fins, one ion fan blows air to the heat dissipation fins, and the other ion fan sucks air to the heat dissipation fins. The wind shield is fixedly installed on the case through screws, completely covers the radiating fins and covers gaps between the ion fan and the radiating fins. The heat dissipation structure design of the utility model can realize the rapid heat dissipation of the chip in the closed case.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a heat dissipation structure of a closed case.
Background
Electronic equipment can produce a large amount of heats in the course of the work, and the chip on the main heat source is the circuit board, to the great totally enclosed machine case of inside chip calorific capacity, still need to take certain heat dissipation measure to prevent that inside device from receiving the damage. At present, heat sources in the closed chassis are mainly radiated in a heat conduction mode, namely, heat of the heat sources is transferred to the chassis shell, and then natural convection cooling is carried out on the chassis shell.
The ion fan based on the corona discharge principle is distinguished in recent years due to the advantages of low noise, low power consumption, high reliability and the like, the principle is that gas ions after the corona discharge phenomenon is generated under the action of a high-voltage electric field and ionized move directionally under the action of electric field force to form airflow, namely ion wind, the ion fan has low noise and high reliability because the ion fan does not have a rotary moving part in a common fan, and meanwhile, the ion fan can be designed and arranged according to the structure of a case and has high flexibility, and the heat dissipation efficiency can be greatly improved by utilizing the ion fan to dissipate heat of the closed case.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation structure aiming at the defects of the prior art, and the heat dissipation structure can realize the rapid heat dissipation of a chip in a closed case.
In order to achieve the above object, the present invention provides a heat dissipation structure for a closed chassis, comprising a chassis, heat dissipation fins located on the chassis, a wind shield and an ion fan;
the heat dissipation fins are positioned on the outer side face of the case, and the heat of the chip is transferred to the heat dissipation fins on the outer side face of the case through the inner side face of the case;
the ion fans are arranged at two ends of the radiating fins, the air port planes of the ion fans are perpendicular to the direction of the radiating fins, one ion fan blows air to the radiating fins, and the other ion fan sucks air to the radiating fins;
the wind shield is fixedly installed on the case, completely covers the radiating fins and simultaneously covers the gaps between the ion fan and the radiating fins.
Furthermore, at least one of the heat dissipation fins and the wind shield is made of a material with high thermal conductivity.
Further, the installation gap between the wind shield and the ion fan is filled with structural adhesive to prevent air flow from overflowing from the installation gap.
Further, the ion fan is fixedly installed at two ends of the radiating fin through screws.
Further, the wind shield is fixedly installed on the chassis through screws.
Furthermore, the ion fan comprises a corona electrode, a collector electrode and a connecting piece, wherein the corona electrode is provided with a metal needle, and the collector electrode is provided with a metal wire.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is an assembly schematic view of a heat dissipation structure of a closed chassis according to an embodiment of the present invention.
Fig. 2 is an exploded schematic view of a heat dissipation structure of a closed chassis according to an embodiment of the present invention.
Fig. 3 is a schematic view of an ion fan according to an embodiment of the present invention.
Fig. 4 is an exploded view of an ion fan according to an embodiment of the present invention.
The reference signs are:
10-case, 11-cover, 12-radiating fins, 20-ion fan, 21-corona electrode, 22-collector electrode, 23-connecting piece, 24-metal needle, 25-metal wire, 30-wind shield, 40-structural adhesive, 50-heat source, 60-screw and 61-threaded hole.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The following description is of the preferred embodiment for carrying out the utility model, and is made for the purpose of illustrating the general principles of the utility model and not for the purpose of limiting the scope of the utility model. The scope of the present invention is defined by the appended claims.
Fig. 1 is an assembly schematic view of a heat dissipation structure of a closed chassis according to the present invention, and the heat dissipation structure of the closed chassis provided by the present invention is used for dissipating heat of a chip in the closed chassis, and includes heat dissipation fins 12, an ion fan 20, and a wind shield 30.
Fig. 2 is an exploded schematic view of a heat dissipation structure of a closed chassis according to the present invention, in which heat dissipation fins 12 and the chassis 10 are made of high thermal conductivity material, and the fins have mounting threaded holes 61 around for mounting and fixing wind shields 30, and the wind shields 30 completely cover the heat dissipation fins 12 and the ion fan 20. The ion fans 20 are respectively installed and fixed on two sides of the radiating fins 12, the direction of the radiating fins 12 is perpendicular to the air port plane of the ion fans 20, the air ports of the ion fans 20 are opposite to the radiating fins 12, it is ensured that air passing through the ion fans completely flows through gaps in the radiating fins 12, the ion fans 20 are installed and fixed on the threaded holes 61 through screws, the heat source 50 is tightly attached to the inner side face of the case through a heat-conducting interface material, and chip heat is transferred to the radiating fins 12 on the outer side face of the case from the inner side face of the case through the heat-conducting interface material.
As shown in fig. 3, the wind guard 30 is closely attached to the heat dissipation fin 12, and the assembly gap between the wind guard 30 and the ion fan 20 is filled with a structural adhesive 40 to prevent the air flow from overflowing.
As shown in fig. 4, the ion fan 20 is composed of a corona electrode 21, a collecting electrode 22 and a connecting member 23, the corona electrode 21 is provided with a metal needle 24, the collecting electrode 22 is provided with a metal wire 25, and an air flow flowing from the corona electrode 21 to the collecting electrode 22 of the ion fan is generated by using a corona discharge principle to blow and suck air to the heat radiating fins 12, thereby radiating heat to the heat source 50.
It should be noted that all the directional indicators (such as up-down-left-right-front-back … …) in the embodiment of the present invention are only used to explain the relative positional relationship between the components in a specific posture (as shown in the figure) -the motion situation, etc., and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second" may explicitly or implicitly include at least one such feature.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or which are directly or indirectly applicable to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. The utility model provides a closed quick-witted case heat radiation structure, includes quick-witted case (10), is located radiating fin (12) on quick-witted case, ionic fan (20) and deep bead (30), its characterized in that:
the radiating fins (12) are positioned on the outer side face of the case (10), and the heat of the chip is transferred to the radiating fins (12) on the outer side face of the case (10) through the inner side face of the case (10);
the ion fans (20) are arranged at two ends of the radiating fins, the air opening planes of the ion fans (20) are vertical to the radiating fins, one ion fan (20) blows air to the radiating fins (12), and the other ion fan (20) sucks air to the radiating fins (12);
the wind shield (30) is fixedly arranged on the case (10), and the wind shield (30) completely covers the radiating fins (12) and covers gaps between the ion fan (20) and the radiating fins (12).
2. The heat dissipating structure of a closed casing as claimed in claim 1, wherein one or more of the heat dissipating fins (12) and the wind shielding plate (30) is made of a material with high thermal conductivity.
3. The heat dissipation structure of the enclosed chassis as claimed in claim 1 or 2, wherein the installation gap between the wind shield (30) and the ion fan (20) is filled with a structural adhesive (40) to prevent the air flow from overflowing from the installation gap.
4. A heat dissipating structure of a closed casing as claimed in claim 3, wherein the ion fan (20) is fixed to both ends of the heat dissipating fin (12) by screws.
5. A heat dissipating structure for a closed casing according to claim 3, wherein the wind deflector is fixedly mounted on the casing (10) by screws.
6. The heat dissipation structure of claim 3, wherein the ion fan (20) comprises a corona electrode (21), a collecting electrode (22) and a connector (23), the corona electrode (21) is provided with a metal needle (24), and the collecting electrode (22) is provided with a metal wire (25).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121743438.0U CN215421413U (en) | 2021-07-29 | 2021-07-29 | Heat radiation structure of closed case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121743438.0U CN215421413U (en) | 2021-07-29 | 2021-07-29 | Heat radiation structure of closed case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215421413U true CN215421413U (en) | 2022-01-04 |
Family
ID=79654022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121743438.0U Active CN215421413U (en) | 2021-07-29 | 2021-07-29 | Heat radiation structure of closed case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215421413U (en) |
-
2021
- 2021-07-29 CN CN202121743438.0U patent/CN215421413U/en active Active
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