CN215345215U - High-speed data transmission printed circuit board - Google Patents

High-speed data transmission printed circuit board Download PDF

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Publication number
CN215345215U
CN215345215U CN202121349315.9U CN202121349315U CN215345215U CN 215345215 U CN215345215 U CN 215345215U CN 202121349315 U CN202121349315 U CN 202121349315U CN 215345215 U CN215345215 U CN 215345215U
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CN
China
Prior art keywords
printed circuit
circuit board
buffer structure
movable
outer shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121349315.9U
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Chinese (zh)
Inventor
戴燕兵
戴高发
班代宏
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Hefei Yansheng Electronic Technology Co ltd
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Hefei Yansheng Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hefei Yansheng Electronic Technology Co ltd filed Critical Hefei Yansheng Electronic Technology Co ltd
Priority to CN202121349315.9U priority Critical patent/CN215345215U/en
Application granted granted Critical
Publication of CN215345215U publication Critical patent/CN215345215U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to the technical field of printed circuit boards, and discloses a high-speed data transmission printed circuit board, which comprises an outer shell, wherein the top of the outer shell is uniformly provided with vent holes in a penetrating way, the upper surface of the outer wall of the outer shell is fixedly provided with a dust screen, the left side and the right side inside the outer shell are respectively and movably provided with a movable side plate, a left buffer structure and a right buffer structure are embedded and arranged in the movable side plates, the telescopic ends of the left buffer structure and the right buffer structure are movably connected with an upper buffer structure and a lower buffer structure, the middle part of the lower surface of the inner wall of the outer shell is movably provided with a front buffer structure and a rear buffer structure, the high-speed data transmission printed circuit board can maximally ensure that the printed circuit board can be maximally buffered to protect the connection stability of electronic components on the printed circuit board when violent vibration occurs, thereby ensuring the normal use effect of the equipment.

Description

High-speed data transmission printed circuit board
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a high-speed data transmission printed circuit board.
Background
Printed circuit boards, also known as printed circuit boards, are important electronic components, support bodies for electronic components, carriers for electrical interconnection of electronic components, and printed circuit boards are used for electrical connection of various electronic devices, including watches, calculators, computers, communication electronic devices, and the like, as long as integrated circuits and other electronic components are provided.
Due to the gradual development of science and technology, the degree of integration is higher and higher, the number of electronic components integrated on the circuit board is more and more, so that the weight of the circuit board is larger and larger, the printed circuit board is fixedly installed in the equipment for use, once the external equipment vibrates violently in the use process, the internally installed printed circuit board is driven to vibrate violently together, the long-term vibration can cause the welding spots of the electronic components on the printed circuit board to loosen or even disjointed, and finally cause poor contact, thereby affecting the normal use of the equipment, meanwhile, the printed circuit board is difficult to avoid vibration in the transportation process, and the printed circuit board can be damaged similarly, so that the service life of the printed circuit board is reduced when the printed circuit board is not used, and the practicability is greatly reduced, to this end, we propose a high-speed data transmission printed circuit board.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides a high-speed data transmission printed circuit board which has the advantages of good damping and buffering effects and long service life and solves the problems in the background technology.
The utility model provides the following technical scheme: a high-speed data transmission printed circuit board comprises an outer shell, wherein the top of the outer shell is uniformly provided with vent holes in a penetrating manner, the upper surface of the outer wall of the outer shell is fixedly provided with a dustproof net, the left side and the right side inside the outer shell are respectively and movably provided with a movable side plate, a left buffer structure and a right buffer structure are embedded and installed in the movable side plates, the telescopic ends of the left buffer structure and the right buffer structure are movably connected with an upper buffer structure and a lower buffer structure, the middle part of the lower surface of the inner wall of the outer shell is movably provided with a front buffer structure and a rear buffer structure, the top end of the front buffer structure and the rear buffer structure is movably connected with a printed circuit board, and the upper surface of the inner wall of the outer shell is fixedly provided with a heat conduction silica gel sheet;
the left and right buffer structures comprise first outer cylinders fixedly installed in the movable side plates, first springs are movably installed in the first outer cylinders, and first movable rods are fixedly installed at the end parts of the first springs;
the upper and lower buffer structures comprise vertical plates, inner grooves are formed in the vertical plates, movable ends are movably connected in the inner grooves, and the upper ends and the lower ends of the movable ends are positioned in the inner grooves and are respectively and fixedly provided with second springs;
the front and back buffer structure comprises a second outer barrel movably mounted on the lower surface of the inner wall of the outer shell, a third spring is fixedly mounted inside the second outer barrel, a second movable rod is fixedly mounted at the top end of the third spring, the top end of the second movable rod is fixedly mounted on the lower surface of the printed circuit board, and two ends of the printed circuit board are located in the vertical plate and are respectively and movably connected with a connecting sliding head.
Preferably, the dust screen covers the whole area of the upper surface of the outer shell body containing the ventilation openings.
Preferably, the first spring is normally in a compressed state.
Preferably, the movable end is movably connected in the inner groove in a T shape, and the movable end is fixedly connected with the telescopic end of the first movable rod.
Preferably, the third spring is in a slightly stretched state in a stable condition, the second movable lever is rotatable about a bottom end of the printed circuit board, and the second outer cylinder is rotatable about a lower surface of an inner wall of the outer housing.
Compared with the prior art, the utility model has the following beneficial effects:
1. this high-speed data transmission printed circuit board through be provided with quadruple shock attenuation buffering protection architecture around current printed circuit board, has guaranteed to the at utmost that printed circuit board can obtain the biggest buffering and protect the connection stability of above-mentioned electronic components when taking place comparatively violent vibrations to the normal result of use of equipment has been guaranteed.
2. The high-speed data transmission printed circuit board is characterized in that upper and lower buffer structures are respectively arranged at two ends of the printed circuit board, the buffer effect of the upper and lower vibration of the printed circuit board is realized by the buffer effect of the second spring, left and right buffer structures are arranged at the outer ends of the upper and lower buffer structures at the two ends of the printed circuit board, the effect of buffering and damping when the printed circuit board vibrates left and right can be realized by the buffer effect of the first spring, the front and rear buffer structures which are movably connected with the lower surface of the inner wall of the outer shell and can rotate at the upper and lower ends are arranged in the middle of the lower surface of the printed circuit board, the amplitude of vibration can be reduced to the maximum degree when the printed circuit board vibrates front and rear, the third spring can quickly return to the middle position under the stretching effect of the third spring, and a plurality of heat-conducting silica gel sheets are fixedly arranged at the top end of the outer shell, when the printed circuit board vibrates in an overlarge amplitude, the connection integrity of the electronic components on the printed circuit board can be guaranteed by the upper surface under the buffer protection effect of the heat-conducting silica gel sheet, and the integrity and the service life of the printed circuit board are greatly improved.
Drawings
FIG. 1 is a schematic cross-sectional front view of the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1 according to the present invention;
FIG. 3 is an enlarged view of the structure at B in FIG. 1 according to the present invention.
In the figure: 1. an outer housing; 2. a ventilation opening; 3. a dust screen; 4. a movable side plate; 5. a left and right buffer structure; 51. a first outer barrel; 52. a first spring; 53. a first movable bar; 6. an upper and lower buffer structure; 61. A vertical plate; 62. an inner tank; 63. a movable end; 64. a second spring; 7. a front and rear buffer structure; 71. a second outer barrel; 72. a third spring; 73. a second movable bar; 74. connecting a sliding head; 8. a printed circuit board; 9. a heat-conducting silica gel sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, a high-speed data transmission printed circuit board comprises an outer shell 1, wherein the top of the outer shell 1 is uniformly provided with vent holes 2 in a penetrating manner, the upper surface of the outer wall of the outer shell 1 is fixedly provided with a dust screen 3, the left side and the right side inside the outer shell 1 are respectively and movably provided with a movable side plate 4, a left buffer structure 5 and a right buffer structure 5 are embedded into the movable side plates 4, the telescopic ends of the left buffer structure 5 and the right buffer structure 5 are movably connected with an upper buffer structure 6 and a lower buffer structure 6, the middle part of the lower surface of the inner wall of the outer shell 1 is movably provided with a front buffer structure 7 and a rear buffer structure 7, the top end of the front buffer structure 7 and the rear buffer structure are movably connected with a printed circuit board 8, and the upper surface of the inner wall of the outer shell 1 is fixedly provided with a heat-conducting silica gel sheet 9;
the left and right buffer structure 5 comprises a first outer cylinder 51 fixedly arranged in the movable side plate 4, a first spring 52 is movably arranged in the first outer cylinder 51, and a first movable rod 53 is fixedly arranged at the end part of the first spring 52;
the upper and lower buffer structures 6 comprise a vertical plate 61, an inner groove 62 is formed in the vertical plate 61, a movable end 63 is movably connected in the inner groove 62, and second springs 64 are respectively and fixedly installed at the upper end and the lower end of the movable end 63 in the inner groove 62;
the front and rear buffer structure 7 comprises a second outer cylinder 71 movably mounted on the lower surface of the inner wall of the outer shell 1, a third spring 72 is fixedly mounted inside the second outer cylinder 71, a second movable rod 73 is fixedly mounted at the top end of the third spring 72, the top end of the second movable rod 73 is fixedly mounted on the lower surface of the printed circuit board 8, and two ends of the printed circuit board 8 are respectively and movably connected with a connecting sliding head 74 in the vertical plate 61.
Wherein, the dust screen 3 covers the region that whole shell body 1 upper surface contains ventilative mouthful 2, can guarantee like this that shell body 1 carries out effectual giving off to the heat that printed circuit board 8's use produced, combines dust screen 3 to guarantee whole printed circuit board 8's inside clean degree to ventilative mouthful 2 protection simultaneously, avoids outside impurity and a large amount of dust to fall into wherein influence printed circuit board 8's normal use.
Wherein, first spring 52 is in the state of compression under normal conditions, and two left and right buffer structure 5 at both ends can make printed circuit board 8 be in the centre position under the condition that printed circuit board 8 does not receive vibrations jolt like this to compress the first spring 52 of one end when one end receives vibrations, thereby absorb the energy that vibrations produced, and then protect printed circuit board 8 to avoid receiving too big rocking, guarantee the connection integrity of the last welded electrical components of this printed circuit board.
The movable end 63 is movably connected in the inner groove 62 in a T shape, the movable end 63 is fixedly connected with the telescopic end of the first movable rod 53, and therefore the vertical plate 61 can integrally drive the printed circuit board 8 to move up and down under the buffering action of the second spring 64 when the printed circuit board 8 is vibrated, and the integrity of the printed circuit board 8 is protected.
Wherein the third spring 72 is in a slightly stretched state under a stable condition, the second movable rod 73 can rotate around the bottom end of the printed circuit board 8, the second outer cylinder 71 can rotate around the lower surface of the inner wall of the outer housing 1, so that the whole printed circuit board 8 is ensured to be in a bottom-tensioned state by the contraction force of the third spring 72 in the stable state to maintain stability, and when the printed circuit board 8 vibrates in a front-back movement, the front-back short-distance movement of the printed circuit board 8 can be realized by the elastic force of the third spring 72 and the rotatability of the second movable rod 73 and the second outer cylinder 71, and the printed circuit board 8 can be quickly restored to the original position under the stretching action of the third spring 72 to ensure the integrity of the printed circuit board 8.
The working principle is as follows: when the printed circuit board 8 vibrates left and right, the printed circuit board 8 pushes the first movable rod 53 to compress the first spring 52 to absorb energy through the up-down buffer structure 6, the movable side plate 4 moves left and right correspondingly in the outer shell 1, when the printed circuit board 8 vibrates up and down, the printed circuit board 8 drives the vertical plate 61 to move up and down, so as to compress the second spring 64 in the inner groove 62 to absorb energy, when the printed circuit board 8 vibrates front and back, the connecting sliding head 74 moves back and forth in the vertical plate 61, so as to drive the second movable rod 73 at the bottom of the printed circuit board 8 to rotate around the printed circuit board 8, the second outer tube 71 rotates around the lower surface of the inner wall of the outer shell 1, and the second movable rod 73 stretches the third spring 72 to counteract the energy of the front and back vibration and can be quickly reset under the contraction acting force of the third spring 72, when the vibration amplitude is too large, the top of the printed circuit board 8, which is pushed against the top end of the inner wall of the outer shell 1, can be buffered by means of the buffer of the heat-conducting silica gel sheet 9, so that the integrity of the printed circuit board 8 is ensured.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Also in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the present invention. In the drawings of the present invention, the filling pattern is only for distinguishing the layers, and is not limited to any other way.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (5)

1. A high speed data transmission printed circuit board, includes shell body (1), its characterized in that: the top of the outer shell (1) is uniformly provided with ventilation openings (2) in a penetrating manner, the upper surface of the outer wall of the outer shell (1) is fixedly provided with a dustproof net (3), the left side and the right side of the inner part of the outer shell (1) are respectively and movably provided with a movable side plate (4), a left buffer structure (5) and a right buffer structure (5) are embedded into the movable side plates (4), the telescopic ends of the left buffer structure and the right buffer structure (5) are movably connected with an upper buffer structure and a lower buffer structure (6), the middle part of the lower surface of the inner wall of the outer shell (1) is movably provided with a front buffer structure and a rear buffer structure (7), the top end of the front buffer structure and the rear buffer structure (7) is movably connected with a printed circuit board (8), and the upper surface of the inner wall of the outer shell (1) is fixedly provided with a heat-conducting silica gel sheet (9);
the left and right buffer structures (5) comprise first outer cylinders (51) fixedly mounted in the movable side plates (4), first springs (52) are movably mounted in the first outer cylinders (51), and first movable rods (53) are fixedly mounted at the ends of the first springs (52);
the upper and lower buffer structures (6) comprise vertical plates (61), an inner groove (62) is formed in each vertical plate (61), a movable end head (63) is movably connected in each inner groove (62), and second springs (64) are fixedly mounted at the upper end and the lower end of each movable end head (63) in the inner grooves (62) respectively;
buffer structure (7) contain second urceolus (71) of movable mounting at shell body (1) inner wall lower surface around, the inside fixed mounting of second urceolus (71) has third spring (72), the top fixed mounting of third spring (72) has second movable rod (73), the top fixed mounting of second movable rod (73) is at the lower surface of printed circuit board (8), swing joint has connection slip head (74) respectively in the both ends of printed circuit board (8) are located riser (61).
2. A high speed data transmission printed circuit board according to claim 1, wherein: the dust screen (3) covers the area of the upper surface of the whole outer shell (1) containing the ventilation opening (2).
3. A high speed data transmission printed circuit board according to claim 1, wherein: the first spring (52) is normally in a compressed state.
4. A high speed data transmission printed circuit board according to claim 1, wherein: the movable end (63) is movably connected in the inner groove (62) in a T shape, and the movable end (63) is fixedly connected with the telescopic end of the first movable rod (53).
5. A high speed data transmission printed circuit board according to claim 1, wherein: the third spring (72) is in a slightly stretched state in a stable condition, the second movable lever (73) is rotatable around the bottom end of the printed circuit board (8), and the second outer cylinder (71) is rotatable around the lower surface of the inner wall of the outer housing (1).
CN202121349315.9U 2021-06-17 2021-06-17 High-speed data transmission printed circuit board Expired - Fee Related CN215345215U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121349315.9U CN215345215U (en) 2021-06-17 2021-06-17 High-speed data transmission printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121349315.9U CN215345215U (en) 2021-06-17 2021-06-17 High-speed data transmission printed circuit board

Publications (1)

Publication Number Publication Date
CN215345215U true CN215345215U (en) 2021-12-28

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ID=79558723

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121349315.9U Expired - Fee Related CN215345215U (en) 2021-06-17 2021-06-17 High-speed data transmission printed circuit board

Country Status (1)

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CN (1) CN215345215U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114967868A (en) * 2022-06-02 2022-08-30 河南大学 Finance and tax big data storage device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114967868A (en) * 2022-06-02 2022-08-30 河南大学 Finance and tax big data storage device

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CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20211228