CN215299245U

CN215299245U - Package device and electronic apparatus

Info

Publication number: CN215299245U
Application number: CN202121317412.XU
Authority: CN
Inventors: 陈庆; 戴佑岱
Original assignee: Lijing Microelectronics Technology Jiangsu Co ltd
Current assignee: Lijing Microelectronics Technology Jiangsu Co ltd
Priority date: 2021-06-11
Filing date: 2021-06-11
Publication date: 2021-12-24
Anticipated expiration: 2031-06-11

Abstract

The application provides a packaging device and electronic equipment, wherein the packaging device comprises a packaging substrate and a plurality of light-emitting devices, the packaging substrate comprises a plurality of device placing areas arranged at intervals and at least one through hole, the through hole is positioned between every two adjacent device placing areas, and the opening area of the through hole is larger than a preset value; a plurality of light emitting devices are located on a surface of the device placement region. This application is through setting up the through-hole that runs through packaging substrate on packaging substrate, can release the stress that the encapsulation device produced after thermoforming via the through-hole, releases the stress through extrusion or tensile through-hole promptly to alleviate the warpage problem of encapsulation device after the shaping effectively, solved better among the prior art because packaging substrate warpage, influenced the problem of follow-up technology, guaranteed that the yield of follow-up preparation technologies such as cutting is better.

Description

Package device and electronic apparatus

Technical Field

The present application relates to the field of semiconductors, and in particular, to a package device and an electronic apparatus.

Background

The packaging substrate can provide the effects of electric connection, protection, support, heat dissipation, assembly and the like for the chip, so as to realize the purposes of multi-pin, reduction of the volume of the packaged product, improvement of electric performance and heat dissipation, ultrahigh density or multi-chip modularization.

In the package substrate in the prior art, the high-density long board application structure has the problem of warping and deformation after molding, and the subsequent process is influenced.

The above information disclosed in this background section is only for enhancement of understanding of the background of the technology described herein and, therefore, certain information may be included in the background that does not form the prior art that is already known in this country to a person of ordinary skill in the art.

SUMMERY OF THE UTILITY MODEL

The present application mainly aims to provide a package device and an electronic apparatus, so as to solve the problem that the warpage of a package substrate affects the subsequent processes in the prior art.

In order to achieve the above object, according to one aspect of the present application, there is provided a package device including a package substrate and a plurality of light emitting devices, wherein the package substrate includes a plurality of device placement regions arranged at intervals and at least one through hole, the through hole is located between two adjacent device placement regions, and an opening area of the through hole is larger than a predetermined value; a plurality of the light emitting devices are located on a surface of the device placement region.

Optionally, the package substrate further includes a wire region, and the wire region is located around each device placement region.

Optionally, the material of the wire region comprises aluminum.

Optionally, the packaged device further includes a first glue layer, and the first glue layer is located between the device placement region and the light emitting device.

Optionally, the first adhesive layer includes a conductive adhesive or an insulating adhesive.

Optionally, the package device further includes a second adhesive layer, where the second adhesive layer is located on an exposed surface of the light emitting device and an exposed surface of a predetermined region, and the predetermined region is a region of the package substrate except for the through hole.

Optionally, the material of the second glue layer comprises epoxy resin.

Optionally, the Light Emitting device includes an LED (Light Emitting Diode) chip.

According to another aspect of the present application, there is provided an electronic apparatus including any one of the packaged devices.

Use the technical scheme of this application, the encapsulation device in, the encapsulation base plate includes that the device that a plurality of intervals set up places district and at least one through-hole, the through-hole is located adjacent two between the district is placed to the device, a plurality of luminescent device are located the device is placed on the surface in district. The application the encapsulation device runs through setting up on the encapsulation base plate the through-hole of encapsulation base plate can via the through-hole release the stress that the encapsulation device produced behind the thermoforming, through extrusion or tensile promptly the through-hole releases the stress to alleviate effectively after the shaping the warpage problem of encapsulation device has solved better among the prior art because the encapsulation base plate warpage influences the problem of follow-up technology, and it is better to have guaranteed the yield of manufacturing process such as follow-up cutting.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application. In the drawings:

fig. 1 shows a schematic view of a package substrate according to an embodiment of the application;

fig. 2 shows a schematic diagram of a packaged device according to an embodiment of the application.

Wherein the figures include the following reference numerals:

10. a package substrate; 20. a light emitting device; 30. a first glue layer; 100. a device placement area; 101. a through hole; 102. a wire area.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Also, in the specification and claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.

As described in the background art, the warpage of the package substrate in the prior art affects the subsequent processes, and in order to solve the above problems, the present application provides a package device and an electronic apparatus.

According to an exemplary embodiment of the present application, there is provided a packaged device, as shown in fig. 1 and fig. 2, the packaged device includes a package substrate 10 and a plurality of light emitting devices 20, wherein the package substrate 10 includes a plurality of device placement regions 100 arranged at intervals and at least one through hole 101, the through hole 101 is located between two adjacent device placement regions 100, and an opening area of the through hole 101 is greater than a predetermined value; a plurality of the above light emitting devices 20 are positioned on the surface of the above device placing region 100.

In the above package device, the package substrate includes a plurality of device placement regions disposed at intervals and at least one through hole, the through hole is located between two adjacent device placement regions, and the plurality of light emitting devices are located on the surface of the device placement regions. According to the packaging device, the through hole penetrating through the packaging substrate is formed in the packaging substrate, stress generated by the packaging device after heating forming can be released through the through hole, namely, the stress is released through extruding or stretching the through hole, so that the warping problem of the packaging device after forming is effectively relieved, the problem that follow-up processes are influenced due to warping of the packaging substrate in the prior art is well solved, and the good yield of the follow-up cutting and other manufacturing processes is guaranteed.

In the actual application process, a person skilled in the art can flexibly select the size of the through hole according to the size of the package substrate, the stress value and other practical conditions. The package substrate can comprise a through hole, and the stress of the whole package substrate after molding can be released through the through hole; in order to achieve a better stress release effect and further ensure that the packaged device is not warped basically, a person skilled in the art can further arrange one through hole between every two device placement areas, so that a better warpage inhibiting effect can be further ensured.

In a specific embodiment, a plurality of the light emitting devices are disposed on a surface of one of the device placement regions, but of course, one of the light emitting devices may be disposed on a surface of one of the device placement regions.

According to another specific embodiment of the present application, the light emitting device includes an LED chip. Of course, the Light Emitting device is not limited to the LED chip, and may include any feasible Light Emitting chip in the prior art, such as a Micro Light Emitting Diode (Micro LED) chip and a Mini LED (sub-millimeter Light Emitting Diode) chip.

Specifically, the light emitting device is an LED chip.

In general, the above-mentioned package substrate is a Copper Clad Laminate, and in the manufacture of a single-sided or double-sided printed circuit board, a hole processing, an electroless Copper plating, an electrolytic Copper plating, an etching, and the like are selectively performed on a Copper Clad Laminate (CCL) which is a substrate material, to obtain a desired circuit pattern. In the manufacture of another type of multilayer printed board, an inner core thin copper clad laminate is also used as a base, and the conductive pattern layers and the prepregs are alternately laminated and bonded together at one time to form interconnection among more than 3 conductive pattern layers. It has the functions of conducting electricity, insulating and supporting. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, and the like of the printed board greatly depend on the substrate material.

The materials of the package substrate can be divided into two main categories: rigid substrate materials and flexible substrate materials. An important variety of rigid substrate materials is copper clad laminates. The reinforced composite material is prepared by soaking a reinforcing material in a resin adhesive, drying, cutting and overlapping to form a blank, then coating a copper foil, using a steel plate as a mould, and carrying out high-temperature high-pressure forming processing in a hot press. The prepreg for the common multilayer board is a semi-finished product (mostly formed by impregnating glass cloth with resin and drying) in the manufacturing process of the copper-clad plate. Copper-clad laminates are classified into various categories. Generally, the reinforcing materials of the plate are different and can be divided into: paper base, glass fiber cloth base, composite base, laminated multilayer board base and special material base (ceramic, metal core base and the like). If the board is classified according to different resin adhesives, common paper-based CCL includes various types such as phenolic resin, epoxy resin, polyester resin and the like. A common glass cloth based CCL is epoxy, which is the most widely used type of glass cloth based. In addition, other special resins (glass fiber cloth, polyamide fiber, nonwoven fabric, etc. are added): bismaleimide-modified triazine resin, polyimide resin, diphenylene ether resin, maleic anhydride imide-styrene resin, polycyanate resin, polyolefin resin, and the like.

According to a specific embodiment of the present application, as shown in fig. 1, the package substrate further includes a wire area 102, and the wire area 102 is located around each of the device placement areas 100. The wire area comprises a plurality of metal wires, and the light-emitting device and the packaging substrate are connected through the metal wires to be used as a lead for current injection.

In practical applications, the material of the wire region may be any material that is feasible in the prior art, such as copper, aluminum, or gold, and in a specific embodiment of the present application, the material of the wire region includes aluminum. In a more specific embodiment of the present application, the material of the wire region is aluminum.

In another specific embodiment of the present application, as shown in fig. 2, the package device further includes a first adhesive layer 30, and the first adhesive layer 30 is located between the device placement region and the light emitting device 20. The light emitting device may be fixed on the device placing region through the first adhesive layer.

According to another specific embodiment of the present application, the first adhesive layer includes a conductive adhesive or an insulating adhesive. Specifically, for the GaAs and SiC conductive substrate, the red, yellow and yellow-green LED chips with the back electrodes are fixed on the packaging substrate by conductive adhesive, and for the blue and green LED chips with the sapphire insulating substrate, the blue and green LED chips are fixed on the packaging substrate by insulating adhesive. In a more specific embodiment, the conductive adhesive is silver adhesive.

According to another specific embodiment of the present application, the package device further includes a second adhesive layer, where the second adhesive layer is located on an exposed surface of the light emitting device and an exposed surface of a predetermined area, and the predetermined area is an area of the package substrate except for the through hole. The light-emitting device and the bonding wires are sealed and protected by the second adhesive layer, and meanwhile, the through holes are avoided, so that the through holes can further absorb stress, and the packaged device is further prevented from warping basically.

In an actual application process, the second adhesive layer is formed on the surfaces of the package substrate and the light emitting device by three modes of dispensing, glue pouring or mould pressing on the package substrate, and strict requirements are imposed on the shape of the cured second adhesive layer.

In a specific embodiment of the present application, the material of the second adhesive layer includes epoxy resin. Of course, the material of the second adhesive layer is not limited to the epoxy resin, and may be any sealing adhesive material available in the prior art.

In a more specific embodiment of the present application, the material of the second adhesive layer is epoxy resin.

According to another aspect of the present application, there is provided an electronic device including any one of the above-described packaged devices.

The electronic device includes any one of the above-mentioned packaged devices, and the above-mentioned packaged device includes a packaged substrate and a plurality of light-emitting devices, where the packaged substrate includes a plurality of device placement areas arranged at intervals and at least one through hole, the through hole is located between two adjacent device placement areas, and the plurality of light-emitting devices are located on the surface of the device placement areas. In the electronic equipment, the stress generated by the packaging device after heating forming can be released through the through hole penetrating through the packaging substrate on the packaging device, namely, the stress is released by extruding or stretching the through hole, so that the warping problem of the packaging device after forming is effectively relieved, the problem that the subsequent process is influenced due to warping of the packaging substrate in the prior art is well solved, and the good performance of the electronic equipment is ensured.

The relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present application, it is to be understood that the orientation or positional relationship indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc., are generally based on the orientation or positional relationship shown in the drawings, and are used for convenience of description and simplicity of description only, and in the case of not making a reverse description, these directional terms do not indicate and imply that the device or element being referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, should not be considered as limiting the scope of the present application; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:

1) in the package device of the present application, the package substrate includes a plurality of device placement regions disposed at intervals and at least one through hole, the through hole is located between two adjacent device placement regions, and the plurality of light emitting devices are located on the surface of the device placement regions. According to the packaging device, the through hole penetrating through the packaging substrate is formed in the packaging substrate, stress generated by the packaging device after heating forming can be released through the through hole, namely, the stress is released through extruding or stretching the through hole, so that the warping problem of the packaging device after forming is effectively relieved, the problem that follow-up processes are influenced due to warping of the packaging substrate in the prior art is well solved, and the good yield of the follow-up cutting and other manufacturing processes is guaranteed.

2) The electronic device of the present application includes any one of the above-mentioned package devices, where the package device includes a package substrate and a plurality of light-emitting devices, where the package substrate includes a plurality of device placement areas arranged at intervals and at least one through hole, the through hole is located between two adjacent device placement areas, and the plurality of light-emitting devices are located on a surface of the device placement areas. In the electronic equipment, the stress generated by the packaging device after heating forming can be released through the through hole penetrating through the packaging substrate on the packaging device, namely, the stress is released by extruding or stretching the through hole, so that the warping problem of the packaging device after forming is effectively relieved, the problem that the subsequent process is influenced due to warping of the packaging substrate in the prior art is well solved, and the good performance of the electronic equipment is ensured.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A packaged device, comprising:

the packaging substrate comprises a plurality of device placing areas and at least one through hole, wherein the device placing areas are arranged at intervals, the through hole is positioned between every two adjacent device placing areas, and the opening area of the through hole is larger than a preset value;

a plurality of light emitting devices on a surface of the device placement region.

2. The packaged device of claim 1, wherein the package substrate further comprises:

and the conducting wire area is positioned around each device placing area.

3. The packaged device of claim 2, wherein the material of said wire area comprises aluminum.

4. The packaged device of claim 1, further comprising:

and the first adhesive layer is positioned between the device placing area and the light-emitting device.

5. The packaged device of claim 4, wherein the first glue layer comprises a conductive glue or an insulating glue.

6. The packaged device of claim 1, further comprising:

and the second adhesive layer is positioned on the exposed surface of the light-emitting device and the exposed surface of a predetermined area, and the predetermined area is an area of the packaging substrate except the through hole.

7. The packaged device of claim 6, wherein the material of the second glue layer comprises an epoxy.

8. The packaged device according to any one of claims 1 to 7, wherein the light emitting device comprises an LED chip.

9. An electronic device, comprising:

the packaged device of any one of claims 1 to 8.