CN215236478U

CN215236478U - Silicon chip heating device that comes unstuck

Info

Publication number: CN215236478U
Application number: CN202121347168.1U
Authority: CN
Inventors: 章祥静; 魏泽武
Original assignee: Wuxi Jingyuntong Technology Co Ltd
Current assignee: Wuxi Jingyuntong Technology Co Ltd
Priority date: 2021-06-17
Filing date: 2021-06-17
Publication date: 2021-12-21
Anticipated expiration: 2031-06-17

Abstract

The utility model discloses a silicon chip heats device that comes unstuck, which comprises a mounting rack, the top fixedly connected with second motor of mounting bracket, the top swing joint of mounting bracket has the threaded rod, and the one end of second motor output shaft passes mounting bracket and threaded rod fixed mutually, one side swing joint of threaded rod has the removal seat, remove one side swing joint of seat and have the connecting axle, one side fixedly connected with scraper blade of connecting axle, the one end of connecting axle is passed and is removed seat and fixedly connected with runner, and annular groove has been seted up to one side of runner. The utility model discloses not only can make the different angle of scraper blade rotation strike off the glue on the silicon chip through the runner, improve the work efficiency of device, can make the scraper blade reciprocate suitable position through the threaded rod simultaneously and strike off the glue on the silicon chip of co-altitude not, improve the flexibility of device, can also restrict the position of removing the seat through the locating lever, improve the location effect of device.

Description

Silicon chip heating device that comes unstuck

Technical Field

The utility model relates to a silicon chip processing technology field especially relates to a silicon chip heats device that comes unstuck.

Background

The silicon wafer is widely applied in life of people, and is also widely applied to aviation, aerospace, industry, agriculture and national defense, the cleanliness of the surface of the silicon wafer is a key factor influencing the qualification rate of the silicon wafer and the conversion efficiency of a battery, and in order to obtain the silicon wafer with high cleanliness, the silicon wafer is usually subjected to degumming cleaning after linear cutting, and usually a heating degumming mode is adopted for degumming treatment.

At present, when a silicon wafer heating degumming device in the market works, glue heated on the silicon wafer needs to be scraped, and due to the fact that the height of the silicon wafer is different and the scraper is fixed, the scraper needs to be fixed again after the height of the scraper is manually adjusted by a worker, and working efficiency is low, and therefore the silicon wafer heating degumming device is very necessary.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a silicon wafer heating degumming device.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a silicon wafer heating degumming device comprises a mounting frame, wherein a second motor is fixedly connected to the top of the mounting frame, a threaded rod is movably connected to the top of the mounting frame, one end of an output shaft of the second motor penetrates through the mounting frame and is fixed to the threaded rod, a moving seat is movably connected to one side of the threaded rod, a connecting shaft is movably connected to one side of the moving seat, a scraper is fixedly connected to one side of the connecting shaft, one end of the connecting shaft penetrates through the moving seat and is fixedly connected with a rotating wheel, an annular clamping groove is formed in one side of the rotating wheel, a plurality of jacks are formed in one side of the rotating wheel, a force arm is movably connected to one side of the moving seat, a pressing plate is fixedly connected to one end of the force arm, a spring is fixedly connected to one side of the pressing plate and is fixed to the moving seat, a connecting ring is movably connected to one end of the force arm, and an inserting rod is movably connected to one side of the connecting ring, and the inserted link is inserted with the jack.

Furthermore, a heater is fixedly connected to the top of the mounting frame, and an electric heating wire is fixedly connected to one side of the heater.

Further, one side fixedly connected with first motor of mounting bracket, one side top swing joint of mounting bracket has a plurality of running rollers, one side swing joint of mounting bracket has drive sprocket, and the both ends of one of them running roller are fixed mutually with the one end of drive sprocket and first motor output shaft respectively, one side swing joint of mounting bracket has a plurality of driven sprocket, and driven sprocket and other a plurality of running rollers are fixed mutually, one side round trip of driven sprocket and drive sprocket has the chain.

Furthermore, the top of the mounting rack is fixedly connected with a positioning rod, and the positioning rod is connected with the movable seat in a sliding manner.

Further, the upper surface fixed connection of mounting bracket has two to put the thing seat, and puts thing seat evenly distributed.

Further, the bottom of mounting bracket is equipped with collects the box, collects one side fixedly connected with handle of box.

Furthermore, one side of the rotating wheel is fixedly connected with a rotating handle, and one side of the rotating handle is provided with a plurality of anti-skid grains.

Further, the bottom fixedly connected with a plurality of lower margins of mounting bracket, and lower margin evenly distributed.

The utility model has the advantages that:

1. through the setting of installation inserted bar on the arm of force, move out the inserted bar from the jack, rotate and change the handle, make the runner drive the scraper blade and rotate suitable angle from top to bottom, then loosen and press the board, make the arm of force drive the inserted bar and insert in the jack of suitable position, and then make the scraper blade adjust the angle of difference and strike off the gluey on the silicon chip, it is low to avoid needing staff manual adjustment scraper to fix once more behind the height and cause work efficiency, improved the work efficiency of device.

2. Through the setting of installing the removal seat on the mount frame, the second motor rotates and makes the threaded rod drive and remove the seat and reciprocate suitable position to make the scraper blade reciprocate suitable position and strike off the glue on the silicon chip of co-altitude not, improved the flexibility of device.

3. Through the setting of installing the locating lever on the mount frame, the locating lever can restrict the position that removes the seat, avoids the threaded rod to drive and removes the seat and rotate the result of use that influences the device, has improved the location effect of device.

4. Through the setting that is equipped with the collection box on the mounting bracket, collect the glue that the box can strike off the waste gas of silicon chip and collect to make things convenient for the staff to carry out centralized processing, improved the convenience of device.

Drawings

Fig. 1 is a schematic view of a structure of a silicon wafer heating and degumming device according to the present invention;

fig. 2 is a schematic rear view of a silicon wafer heating and degumming device according to the present invention;

fig. 3 is a schematic view of a locally enlarged structure of a silicon wafer heating degumming device according to the present invention.

In the figure: 1. a movable seat; 2. positioning a rod; 3. a heater; 4. an electric heating wire; 5. a roller; 6. a drive sprocket; 7. ground feet; 8. a chain; 9. a driven sprocket; 10. a collection box; 11. a mounting frame; 12. a first motor; 13. a threaded rod; 14. a placement seat; 15. a second motor; 16. a squeegee; 17. pressing a plate; 18. a spring; 19. a force arm; 20. a connecting ring; 21. inserting a rod; 22. a rotating wheel; 23. turning a handle; 24. a jack; 25. and an annular clamping groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. It should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and their meaning in the context of this patent may be understood by those skilled in the art as appropriate.

Referring to fig. 1-3, a silicon wafer heating degumming device comprises a mounting frame 11, a second motor 15 is fixed on the top of the mounting frame 11 through a bolt, a threaded rod 13 is rotatably connected on the top of the mounting frame 11, one end of an output shaft of the second motor 15 penetrates through the mounting frame 11 and is fixed with the threaded rod 13, one side of the threaded rod 13 is in threaded connection with a movable seat 1, one side of the movable seat 1 is rotatably connected with a connecting shaft, a scraper 16 is fixed on one side of the connecting shaft through a bolt, the threaded rod 13 drives the movable seat 1 to move up and down to a proper position through rotation of the second motor 15, so that the scraper 16 moves up and down to a proper position to scrape off glue on silicon wafers with different heights, one end of the connecting shaft penetrates through the movable seat 1 and is fixed with a runner 22 through a bolt, one side of the runner 22 is provided with an annular clamping groove 25, one side of the runner 22 is provided with a plurality of insertion holes 24, move one side of seat 1 and rotate and be connected with arm of force 19, the one end of arm of force 19 is fixed with through the bolt and presses board 17, it has spring 18 to press one side welding of board 17, and spring 18 is fixed mutually with moving seat 1, the one end of arm of force 19 rotates and is connected with go-between 20, one side of go-between 20 rotates and is connected with inserted bar 21, ring groove 25 can restrict the position that inserted bar 21 removed, and inserted bar 21 pegs graft mutually with jack 24, move out inserted bar 21 from jack 24, rotate runner 22, make it drive scraper blade 16 and rotate suitable angle from top to bottom, then loosen and press board 17, make arm of force 19 drive inserted bar 21 insert in the jack 24 of suitable position, and then make scraper blade 16 adjust the angle of difference and strike off the glue on the silicon chip, it is low to fix once more after avoiding needing staff's manual adjustment scraper height.

The utility model discloses a need to explain, the top of mounting bracket 11 is through the bolt fastening has heater 3, one side of heater 3 is through the bolt fastening has heating wire 4, one side of mounting bracket 11 is through the bolt fastening has first motor 12, one side top of mounting bracket 11 is connected with a plurality of running rollers 5 in a rotating manner, one side of mounting bracket 11 is connected with driving sprocket 6 in a rotating manner, and the both ends of one of running rollers 5 are fixed with driving sprocket 6 and one end of first motor 12 output shaft respectively, one side of mounting bracket 11 is connected with a plurality of driven sprocket 9 in a rotating manner, and driven sprocket 9 is fixed with other a plurality of running rollers 5, driven sprocket 9 and one side of driving sprocket 6 are wound and are connected with chain 8, first motor 12 rotates and makes driving sprocket 6 drive driven sprocket 9 and rotate, thereby make running roller 5 convey the silicon chip, the top of mounting bracket 11 is through the bolt fastening has locating lever 2, and locating lever 2 and removal seat 1 sliding connection, locating lever 2 can restrict the position of removing seat 1, avoid threaded rod 13 to drive removal seat 1 and rotate the result of use that influences the device, there are two through the bolt fastening of the upper surface of mounting bracket 11 and put thing seat 14, and put thing seat 14 evenly distributed, the bottom of mounting bracket 11 is equipped with collection box 10, there is the handle one side of collecting box 10 through the bolt fastening, it can collect the glue of the waste gas that the silicon chip struck off to collect box 10, thereby make things convenient for the staff to carry out centralized processing, there is commentaries on classics handle 23 one side of runner 22 through the bolt fastening, it has a plurality of anti-skidding lines to change one side of handle 23, there are a plurality of lower margins 7 bottom through the bolt fastening of mounting bracket 11, and lower margin 7 evenly distributed, lower margin 7 makes the more firm of being connected between device and the ground.

The working principle is as follows: when the silicon wafer needs to be degummed, firstly, the silicon wafer is placed on the roller 5, the first motor 12 is started, the first motor 12 rotates to enable the driving sprocket 6 to drive the driven sprocket 9 to rotate, so that the roller 5 conveys the silicon wafer, when the silicon wafer is conveyed to a proper position, the heating wire 4 heats the silicon wafer to enable the glue on the silicon wafer to be melted, then the silicon wafer continuously moves forwards to a proper position to be contacted with the scraper 16, so that the scraper 16 scrapes the glue on the silicon wafer, the glue of the waste gas scraped from the silicon wafer falls into the collection box 10 to be collected, when the silicon wafers with different heights need to be degummed, the second motor 15 is started, the second motor 15 rotates to enable the threaded rod 13 to drive the movable seat 1 to move upwards and downwards to a proper position, so that the scraper 16 moves upwards and downwards to a proper position, then the pressing plate 17 is pressed, the spring 18 contracts, so that the force arm 19 drives the insertion rod 21 on the connecting ring 20 to move backwards, the silicon wafer is moved out of the insertion hole 24, then the rotating handle 23 is rotated, the rotating wheel 22 drives the scraper 16 to rotate up and down to a proper angle, then the pressing plate 17 is loosened, the spring 18 rebounds and extends, the force arm 19 drives the insertion rod 21 to be inserted into the insertion hole 24 at a proper position, and further the scraper 16 is adjusted to different angles to scrape off the glue on the silicon wafer.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The silicon wafer heating degumming device comprises a mounting frame (11) and is characterized in that a second motor (15) is fixedly connected to the top of the mounting frame (11), a threaded rod (13) is movably connected to the top of the mounting frame (11), one end of an output shaft of the second motor (15) penetrates through the mounting frame (11) and is fixed to the threaded rod (13), a moving seat (1) is movably connected to one side of the threaded rod (13), a connecting shaft is movably connected to one side of the moving seat (1), a scraper (16) is fixedly connected to one side of the connecting shaft, one end of the connecting shaft penetrates through the moving seat (1) and is fixedly connected to a rotating wheel (22), an annular clamping groove (25) is formed in one side of the rotating wheel (22), a plurality of inserting holes (24) are formed in one side of the rotating wheel (22), and a force arm (19) is movably connected to one side of the moving seat (1), one end of the force arm (19) is fixedly connected with a pressing plate (17), one side of the pressing plate (17) is fixedly connected with a spring (18), the spring (18) is fixed with the movable seat (1), one end of the force arm (19) is movably connected with a connecting ring (20), one side of the connecting ring (20) is movably connected with an inserted bar (21), and the inserted bar (21) is inserted into the insertion hole (24).

2. The silicon wafer heating degumming device according to claim 1, wherein a heater (3) is fixedly connected to the top of the mounting frame (11), and an electric heating wire (4) is fixedly connected to one side of the heater (3).

3. The silicon wafer heating degumming device according to claim 2, wherein a first motor (12) is fixedly connected to one side of the mounting frame (11), a plurality of rollers (5) are movably connected to the top of one side of the mounting frame (11), a driving sprocket (6) is movably connected to one side of the mounting frame (11), two ends of one of the rollers (5) are respectively fixed to one ends of the driving sprocket (6) and an output shaft of the first motor (12), a plurality of driven sprockets (9) are movably connected to one side of the mounting frame (11), the driven sprockets (9) are fixed to the other rollers (5), and a chain (8) is wound around one side of each of the driven sprockets (9) and the driving sprocket (6).

4. The silicon wafer heating degumming device according to claim 3, wherein the top of the mounting frame (11) is fixedly connected with a positioning rod (2), and the positioning rod (2) is slidably connected with the moving seat (1).

5. The silicon wafer heating degumming device according to claim 4, wherein two object holders (14) are fixedly connected to the upper surface of the mounting frame (11), and the object holders (14) are uniformly distributed.

6. The silicon wafer heating degumming device according to claim 5, wherein a collecting box (10) is arranged at the bottom of the mounting frame (11), and a handle is fixedly connected to one side of the collecting box (10).

7. The silicon wafer heating degumming device according to claim 1, wherein one side of the rotating wheel (22) is fixedly connected with a rotating handle (23), and one side of the rotating handle (23) is provided with a plurality of anti-skid grains.

8. The silicon wafer heating degumming device according to claim 6, wherein a plurality of ground feet (7) are fixedly connected to the bottom of the mounting frame (11), and the ground feet (7) are uniformly distributed.