CN215219252U - Optical fiber array and coupling structure for silicon optical module - Google Patents

Optical fiber array and coupling structure for silicon optical module Download PDF

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Publication number
CN215219252U
CN215219252U CN202121621041.4U CN202121621041U CN215219252U CN 215219252 U CN215219252 U CN 215219252U CN 202121621041 U CN202121621041 U CN 202121621041U CN 215219252 U CN215219252 U CN 215219252U
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Prior art keywords
optical fiber
fiber array
optical
silicon
coupling
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梁巍
尤炎炎
杨恒毅
杨建民
于泽晖
施伟
丁昱文
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Suzhou Zhuoyu Photon Technology Co ltd
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Hengtong Rockley Technology Co Ltd
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Abstract

The utility model provides a coupling structure that is used for silicon optical module's fiber array and is used for silicon optical module, its simple structure of fiber array, the processing degree of difficulty is low, and is with low costs, does benefit to mass production, and coupling structure can realize with the accurate coupling of silicon optical chip, and has better reliability for the fiber array of silicon optical module, the on-line screen storage device comprises a base, the bottom of base is equipped with the fiber array groove, can place a plurality of optic fibre, adjacent two side by side in the fiber array groove the range is hugged closely to optic fibre, the bottom surface in fiber array groove is the plane, optic fibre passes through sticky the fixing in the fiber array groove, the optic fibre lower extreme has the apron through sticky fixing.

Description

Optical fiber array and coupling structure for silicon optical module
Technical Field
The utility model relates to an optical communication technical field, concretely relates to an optical fiber array and coupling structure for silicon optical module.
Background
The silicon optical chip is used as a core device of the silicon optical module, an electric port at one end is connected with an electric chip arranged on the circuit board in an electric signal mode through gold wire bonding, and the other end is butted with the optical port in a waveguide mode. At present, most optical module manufacturers adopt optical fibers to realize the butt joint of a waveguide and an optical port, that is, one end of the optical fiber is connected with a connector at the optical port end of the optical module, and the other end of the optical fiber is directly coupled and connected with the waveguide end face on a silicon optical chip through an optical fiber array.
In the prior art, an optical fiber array for optical coupling disclosed in chinese patent publication No. CN105717577A and a lens optical fiber array disclosed in chinese patent publication No. CN208125949U are provided with a V-groove structure to ensure coupling accuracy, which increases the processing difficulty of a glass optical fiber mechanism, and is complex in process, high in cost, and not suitable for mass production.
In addition, optical path butt joint can be realized only by precisely coupling the optical fiber array with the waveguide end face on the silicon optical chip, and micron-scale deviation is not allowed, so that a clamp is required to be used for fully clamping the optical fiber array during coupling. Among the prior art, this fiber array mechanism generally chooses the glass material preparation for use, because the glass surface is more smooth, too loose can lead to skidding during anchor clamps centre gripping, and too tight can lead to glass to break, also is the big problem that exists among the current coupling process.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the utility model provides a coupling structure that is used for silicon optical module's fiber array and is used for silicon optical module, its simple structure of fiber array, the processing degree of difficulty is low, and is with low costs, does benefit to mass production, and coupling structure can realize with the accurate coupling of silicon optical chip, and has better reliability.
The technical scheme is as follows: an optical fiber array for a silicon optical module, comprising a base, characterized in that: the optical fiber array device comprises a base and is characterized in that an optical fiber array groove is formed in the bottom of the base, a plurality of optical fibers can be placed in the optical fiber array groove side by side, two adjacent optical fibers are arranged in a closely attached mode, the bottom surface of the optical fiber array groove is a plane, the optical fibers are fixed in the optical fiber array groove through gluing, and a cover plate is fixed at the lower end of each optical fiber through gluing.
Further, the upper end of base still is provided with clamping part.
Furthermore, one side surface of the clamping part is a vertically arranged plane, and the other side surface opposite to the vertically arranged plane is an inclined surface inclined from top to bottom.
Furthermore, the base is made of kovar alloy with the thermal expansion coefficient similar to that of glass, and the cover plate is made of kovar alloy with the thermal expansion coefficient similar to that of glass or glass.
Further, the kovar alloy includes an iron-nickel-cobalt alloy.
Further, the width of the optical fiber array groove is larger than or equal to the sum of the widths of the optical fibers in the optical fiber array groove.
Further, the optical fiber includes a bare fiber and an outer cladding layer included outside the bare fiber.
The utility model provides a coupling structure for silicon optical module, its characterized in that includes foretell fiber array that is used for silicon optical module, still includes silicon optical chip, be equipped with a plurality of V type grooves that set up side by side on the silicon optical chip, the tip of the optic fibre in the fiber array sets to naked fibre, is used for connecting silicon optical chip, every naked fibre is different respectively fix a position in the V type groove, the front end of naked fibre is provided with the coupling fiber end face that is used for the coupling, coupling fiber end face hugs closely silicon optical chip's waveguide terminal surface.
Furthermore, the coupling optical fiber end face is manufactured by precision grinding or laser cutting.
Further, the distance between the centers of the V-shaped grooves is equal to the width of the optical fiber.
The utility model discloses an have following advantage:
the utility model discloses an optical fiber array for silicon optical module cancels and digs the structure of establishing V type groove in optical fiber array mechanism among the prior art, with the base, optic fibre and apron assemble into an organic whole, moreover, the steam generator is simple in structure and reliable, the processing technology degree of difficulty has been reduced, when lieing in that silicon optical chip carries out the coupling, direct V type groove through setting up on the silicon optical chip advances line location, because the waveguide end face of silicon optical chip has set up V type groove, can restrict the degree of freedom of optic fibre on the horizontal plane completely, thereby optical fiber array can adopt simple structure, the processing degree of difficulty is low, and is low in cost, does benefit to mass production.
The utility model discloses an optical fiber array for silicon optical module chooses for use the kovar alloy preparation close with glass thermal expansion coefficient, and difficult fracture is out of shape during the coupling centre gripping, has better reliability, and optical fiber array mechanism chooses for use the metal material preparation, compares in the glass material, and the cost is reduced an order of magnitude, and the producer of also being convenient for simultaneously carries out the centre gripping in the course of working.
The utility model discloses a coupling structure for silicon optical module realizes based on the fiber array who is used for silicon optical module, when guaranteeing the coupling precision, reduces the technology degree of difficulty, reduces the processing cost, improves the reliability.
Drawings
FIG. 1 is a schematic diagram of a mount for an optical fiber array of a silicon optical module in an embodiment;
FIG. 2 is a schematic diagram of an optical fiber array for a silicon optical module in an embodiment;
FIG. 3 is a schematic side view of an optical fiber array for a silicon optical module according to an embodiment;
FIG. 4 is a schematic front view of an optical fiber array for a silicon optical module according to an embodiment;
FIG. 5 is a schematic diagram of a coupling structure for a silicon optical module in an embodiment;
FIG. 6 is a side view of a coupling structure for a silicon light module in an embodiment.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, it should be noted that the drawings provided in the present embodiment illustrate only the basic idea of the present invention in a schematic manner, and only the components related to the present invention are shown in the drawings rather than being drawn according to the number, shape and size of the components in actual implementation, and the form, quantity and proportion of each component may be changed at will in actual implementation, and the component layout form may be more complicated.
See fig. 1 to 4, an optical fiber array for silicon optical module, including base 1, the bottom of base is equipped with optical fiber array groove 2, can place a plurality of optic fibre 3 side by side in the optical fiber array groove 2, and two adjacent optic fibre are hugged closely and are arranged, and the bottom surface in optical fiber array groove 2 is the plane to can ensure the highly uniform of the optic fibre setting in optical fiber array groove 2, optic fibre 3 is through adhesive fixation in optical fiber array groove 2, and optic fibre 2 lower extreme has apron 4 through adhesive fixation.
Specifically, the lower surface of the cover plate 4 can be leveled with the lower surface of the base 1, the optical fibers 3 are placed in the optical fiber array groove 2 in a flush mode, and when the cover plate 4 is glued, the lower surface of the cover plate 4 and the lower surface of the base 1 are in the same plane, so that the precision degree of the optical fiber array and the silicon optical chip in the coupling process is guaranteed.
In addition, the upper end of the base 1 is further provided with a clamping portion 5, specifically, one side surface of the clamping portion 5 is a vertically arranged plane 51, the other side surface opposite to the vertically arranged plane is an inclined surface 52 inclined from top to bottom, the clamping portion 5 can be matched with a clamping fixture, the plane 51 can be used for positioning, and the inclined surface 52 can be used for matching and correcting when the fixture and the clamping portion have an angular deviation.
In this embodiment, base 1 forms through the kovar alloy preparation that is close with glass thermal expansion coefficient, and the apron forms through kovar alloy or glass preparation that are close with glass thermal expansion coefficient, and the kovar alloy can adopt current iron nickel cobalt alloy, is difficult for breaking deformation during the coupling centre gripping, has better reliability, and fiber array mechanism chooses for use the metal material preparation, compares in the glass material, and the cost has reduced an order of magnitude, and the producer of also being convenient for simultaneously carries out the centre gripping in the course of working.
Specifically, the optical fiber 3 comprises a bare fiber 31 and an outer cladding 32 outside the bare fiber, the width of the optical fiber array groove is larger than or equal to the sum of the widths of all optical fibers in the optical fiber array groove, a gap of about 0.05mm can be reserved, and poor assembly is avoided.
In this embodiment, the optical fibers are fixed between the base and the cover plate by gluing to limit the degree of freedom in the height direction, two adjacent optical fibers are arranged in close contact, and the width of the optical fiber array groove is equal to or slightly greater than the sum of the widths of all the optical fibers to limit the degree of freedom in the left and right directions. The structure that V type groove was dug to establish on fiber array mechanism among the prior art is cancelled with this, assembles base, optic fibre and apron an organic whole, and simple structure is reliable, has reduced the processing technology degree of difficulty.
See fig. 5 and fig. 6, in the embodiment of the present invention, a coupling structure for a silicon optical module is further provided, including the optical fiber array for a silicon optical module in the above-mentioned embodiment, further including a silicon optical chip 6, a plurality of V-shaped grooves 61 arranged side by side are provided on the silicon optical chip 6, the distance between the centers of the V-shaped grooves is equal to the width of the optical fiber, the end of the optical fiber in the optical fiber array is set to be a bare fiber 31 for connecting the silicon optical chip, each bare fiber 31 is respectively positioned in different V-shaped grooves 61, by such a setting, when the optical fiber 3 of the optical fiber array is coupled with the silicon optical chip 6, the optical fiber 3 cannot be bent and can be straightly matched with the V-shaped groove 61, the front end of the bare fiber 31 is provided with a coupling fiber end face 33 for coupling, and the coupling fiber end face 33 is tightly attached to the waveguide end face 62 of the silicon optical chip.
In this embodiment, the coupling fiber end face is manufactured by precision grinding or laser cutting, and the coupling precision can be ensured.
When the optical fiber array is coupled with the silicon optical chip, the optical fiber array components are assembled firstly, placed at preset positions through the clamping fixture, and then positioned through the V-shaped groove of the silicon optical chip, so that the optical fiber array is coupled with the waveguide end face. Optical fiber has certain elasticity, and the V type groove plays the guide effect, and optic fibre atress can not be crooked, and naked fibre is direct fixes a position through the V type groove that sets up on the silicon optical chip, because the waveguide terminal surface of silicon optical chip has set up the V type groove, can restrict the degree of freedom of optic fibre on the horizontal plane completely to the optical fiber array can adopt simple structure, and the processing degree of difficulty is low, and is with low costs, does benefit to mass production.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An optical fiber array for a silicon optical module, comprising a base, characterized in that: the optical fiber array device comprises a base and is characterized in that an optical fiber array groove is formed in the bottom of the base, a plurality of optical fibers can be placed in the optical fiber array groove side by side, two adjacent optical fibers are arranged in a closely attached mode, the bottom surface of the optical fiber array groove is a plane, the optical fibers are fixed in the optical fiber array groove through gluing, and a cover plate is fixed at the lower end of each optical fiber through gluing.
2. An optical fiber array for a silicon optical module as defined in claim 1, wherein: the upper end of the base is also provided with a clamping part.
3. An optical fiber array for a silicon optical module as defined in claim 2, wherein: one side surface of the clamping part is a vertically arranged plane, and the other side surface opposite to the vertically arranged plane is an inclined surface inclined downwards from top to bottom.
4. An optical fiber array for a silicon optical module as defined in claim 1, wherein: the base is made of kovar alloy with the thermal expansion coefficient similar to that of glass, and the cover plate is made of kovar alloy with the thermal expansion coefficient similar to that of glass or glass.
5. An optical fiber array for a silicon optical module according to claim 4, wherein: the kovar alloy includes an iron-nickel-cobalt alloy.
6. An optical fiber array for a silicon optical module according to claim 4, wherein: the width of the optical fiber array groove is larger than or equal to the sum of the widths of the optical fibers in the optical fiber array groove.
7. An optical fiber array for a silicon optical module as defined in claim 1, wherein: the optical fiber includes a bare fiber and an outer cladding included outside the bare fiber.
8. A coupling structure for a silicon optical module, characterized by: the optical fiber array for the silicon optical module according to any one of claims 1 to 7, further comprising a silicon optical chip, wherein the silicon optical chip is provided with a plurality of V-shaped grooves arranged side by side, the end portions of the optical fibers in the optical fiber array are arranged as bare fibers for connecting the silicon optical chip, each bare fiber is respectively positioned in different V-shaped grooves, the front end of each bare fiber is provided with a coupling optical fiber end face for coupling, and the coupling optical fiber end face is tightly attached to the waveguide end face of the silicon optical chip.
9. A coupling structure for a silicon light module as claimed in claim 8, characterized in that: the coupling optical fiber end face is manufactured by precision grinding or laser cutting.
10. A coupling structure for a silicon light module as claimed in claim 8, characterized in that: the distance between the centers of the V-shaped grooves is equal to the width of the optical fiber.
CN202121621041.4U 2021-07-16 2021-07-16 Optical fiber array and coupling structure for silicon optical module Active CN215219252U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113376774A (en) * 2021-07-16 2021-09-10 亨通洛克利科技有限公司 Optical fiber array and coupling structure for silicon optical module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113376774A (en) * 2021-07-16 2021-09-10 亨通洛克利科技有限公司 Optical fiber array and coupling structure for silicon optical module

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Address after: No. 168 Jiaotong North Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province

Patentee after: Suzhou Zhuoyu Photon Technology Co.,Ltd.

Address before: 215200 Hengdao 88, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province

Patentee before: HENGTONG ROCKLEY TECHNOLOGY Co.,Ltd.