CN215188121U - Foam assembly and electronic equipment - Google Patents

Abstract

The application discloses cotton subassembly of bubble and electronic equipment, foretell cotton subassembly of bubble includes: insulating bubble is cotton, electrically conductive coating and resistance strain structure, resistance strain structure inlays to be located in the insulating bubble is cotton, be used for detecting the cotton compressive capacity of insulating bubble, the outer cladding of insulating bubble has electrically conductive coating. This application is through inlaying resistance strain structure and establishing in the cotton inside of insulating bubble, and insulating bubble cotton and resistance strain structure at this moment are as piezoresistive sensor, and the resistance value through piezoresistive sensor changes and acquires the cotton compressive capacity of insulating bubble to confirm whether electronic equipment's functional device ground connection is good.

Description

Foam assembly and electronic equipment

Technical Field

The application belongs to the technical field of electron, concretely relates to bubble cotton subassembly and electronic equipment.

Background

With the development of modern electronic technology, electronic devices such as mobile phones and computers have become essential tools for people to work and live. The electronic equipment is often provided with a foam component, and the foam component is used for solving the electronic requirements in the fields of antennas, radio frequency, base bands and the like and is an indispensable composition structure in the electronic equipment. In the related art, a foam component is often used for realizing the grounding of a functional device, and in the process of realizing the application, the inventor finds that at least the following problems exist in the prior art: the ground state of the functional device cannot be determined in real time.

Disclosure of Invention

The application aims at providing a foam component and electronic equipment, and the problem that the grounding state of a functional device cannot be determined in real time can be solved.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a foam assembly, including: insulating bubble is cotton, electrically conductive coating and resistance strain structure, resistance strain structure inlays to be located in the insulating bubble is cotton, be used for detecting the cotton compressive capacity of insulating bubble, the outer cladding of insulating bubble has electrically conductive coating.

According to the cotton subassembly of bubble that this application embodiment provided, resistance strain structure is metal foil form foil gage or filiform foil gage, metal foil form foil gage or filiform foil gage set up in the insulating bubble is cotton under the condition that the cotton subassembly of bubble received pressure, metal foil form foil gage or filiform foil gage detects the cotton compressive capacity of insulating bubble.

According to the foam assembly provided by the embodiment of the application, the metal foil-shaped strain gauge or the filiform strain gauge is bonded in the insulating foam.

According to the foam assembly provided by the embodiment of the application, at least one end face of the insulating foam is provided with the bonding layer.

According to the cotton subassembly of bubble that provides of this application embodiment, the cotton relative both ends of insulating bubble all are equipped with the adhesive linkage.

According to the foam component provided by the embodiment of the application, the bonding layer is an insulating double-sided adhesive tape or a conductive double-sided adhesive tape.

According to the foam component provided by the embodiment of the application, the conductive coating layer is conductive cloth or aluminum foil.

In a second aspect, an embodiment of the present application provides an electronic device, including: functional device, circuit board and foretell cotton subassembly of bubble, functional device passes through the cotton subassembly of bubble is located on the circuit board.

According to the electronic equipment provided by the embodiment of the application, the electronic equipment further comprises a processor, wherein the processor is connected with the resistance strain structure and used for determining the compression amount of the insulation foam according to the resistance value of the resistance strain structure and determining the grounding state of the functional device and the circuit board according to the compression amount.

According to an electronic device provided by an embodiment of the application, the processor determines that the functional device and the circuit board are grounded when the compression amount is within a target compression amount range.

In the embodiment of the application, the resistance strain structure is embedded in the insulation foam, the insulation foam and the resistance strain structure are used as piezoresistive sensors, and the compression amount of the insulation foam is obtained through the resistance value change of the piezoresistive sensors, so that whether the functional device of the electronic equipment is well grounded is determined.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is one of the schematic structural views of a foam assembly according to an embodiment of the present application;

FIG. 2 is a second schematic structural view of a foam assembly according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 4 is a circuit diagram of an electronic device according to an embodiment of the application;

reference numerals:

1: a conductive coating layer; 2: insulating foam;

3: a metal foil-like strain gauge; 4: a first adhesive layer;

5: a second adhesive layer; 6: a filamentous strain gauge;

7: a first foam assembly; 8: a second foam assembly;

9: and the third foam component.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "top," "bottom," and the like, as used herein, refer to an orientation or positional relationship based on that shown in the drawings for convenience in describing the present application and simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present application.

The foam component has the advantages of good conductivity, large design freedom degree and the like, and is often used as a conductive auxiliary material for electronic equipment of different types. Due to the fact that incoming material management and control, SMT (surface mount technology) problems and assembling methods are abnormal, the problem of compression amount of the foam assembly can occur, the problem of compression amount of the foam assembly can cause poor grounding, and once the functional device is poor in grounding, a plurality of new problems can be caused, such as RSE (remote side effect) regulation problems, interference problems and ESD (electro-static discharge) problems.

There is not the compression volume that better mode can detect the cotton subassembly of bubble at present, and the shortcoming that current compression volume detection technique exists has: the whole machine slices need to be damaged, so that resources are wasted and time is consumed; each complete machine cannot be detected; the poor grounding caused by falling and vibration after the electronic equipment is sold cannot be detected.

In order to solve the above problem, the foam assembly of the embodiment of the present application includes: insulating foam 2, conductive coating 1 and resistance strain structure.

The resistance strain structure inlays and locates the inside of insulating bubble cotton 2, and insulating bubble cotton 2 is as the base member, and when the base member was under the effect of external force, during the stress variation, the resistance strain structure also can produce deformation, because piezoresistive effect, can make the resistance change of resistance strain structure.

The outer cladding of insulating bubble cotton 2 has electrically conductive coating 1, that is to say, the surface of insulating bubble cotton 2 covers there is electrically conductive coating 1, and the shape of electrically conductive coating 1 and the shape looks adaptation of insulating bubble cotton 2 to make electrically conductive coating 1 and the cotton 2 of insulating bubble closely laminate. For example, in the case where the insulating foam 2 has a rectangular shape, the conductive coating layer 1 also has a rectangular shape.

In the embodiment of the application, the resistance strain structure is embedded in the insulation foam 2, the insulation foam 2 and the resistance strain structure are used as piezoresistive sensors, the compression amount of the insulation foam 2 is obtained through the resistance value change of the piezoresistive sensors, and the functional device of the electronic equipment can be determined to be well grounded under the condition that the compression amount of the foam is within the preset range; otherwise, the functional device is deemed not to achieve good grounding.

In an optional embodiment, the compression amount is compared with a target value, so that whether the compression amount is in a standard range or not is judged, the detection and judgment of the grounding effect are completed, the grounding reliability of some key grounding points can be detected, the risks of the key grounding points are judged according to the compression amount of the foam assembly, and some measures for avoiding RSE or interference are introduced.

For example, through detection, the compression amount of the foam component is 2mm, and the target value is 1-3 mm, which indicates that the grounding effect of the functional device is good; if the compression amount of the foam component is 3.5mm, the grounding effect of the functional device is general at the moment, and active measures are not needed at the moment; if the compression amount of the foam assembly is 4mm, the grounding effect of the functional device is poor, and active measures, such as measures for avoiding RSE or interference, need to be taken at the moment.

In an alternative embodiment, the resistance strain structure is a metal foil-shaped strain gauge 3 or a wire-shaped strain gauge 6, the metal foil-shaped strain gauge 3 or the wire-shaped strain gauge 6 is arranged in the insulation foam 2, and the metal foil-shaped strain gauge 3 or the wire-shaped strain gauge 6 detects the compression amount of the insulation foam 2 under the condition that the foam assembly is under pressure.

As shown in fig. 1, when the metal resistance strain gauge is a metal foil-shaped strain gauge 3, the metal foil-shaped strain gauge 3 is bonded inside the insulating foam 2.

Under the condition that the metal foil-shaped strain gauge 3 is implanted into the insulating foam 2, when the foam component is compressed, the resistivity of the metal foil-shaped strain gauge 3 changes along with the change of the acting stress, and at the moment, the compression amount of the insulating foam 2 can be obtained by detecting the size of the resistance, so that the compression amount of the foam component is obtained.

As shown in fig. 2, when the metal resistance strain gauge is a filament strain gauge 6, the filament strain gauge 6 is bonded inside the insulating foam 2.

Under the condition that the filamentous strain gauge 6 is doped in the insulating foam 2, when the foam component is compressed, the resistivity of the filamentous strain gauge 6 changes along with the change of the acting stress, and at the moment, the compression amount of the insulating foam 2 can be obtained by detecting the size of the resistance, so that the compression amount of the foam component is obtained.

In an optional embodiment, in order to improve the measurement accuracy, ensure the close fitting degree of the insulating foam 2 and the conductive coating layer 1 and prevent the insulating foam 2 and the conductive coating layer 1 from dislocation, at least one end face of the insulating foam 2 is provided with an adhesive layer.

For example, a first adhesive layer is disposed on the top of the insulating foam 2, and the top of the insulating foam 2 is opposite to the first end face of the conductive coating layer 1, that is, the top of the insulating foam 2 and the first end face of the conductive coating layer 1 are adhered together by the first adhesive layer.

In an alternative embodiment, the insulating foam 2 is provided with adhesive layers at opposite ends.

For example, a first adhesive layer 4 is arranged on the top of the insulating foam 2, and the top of the insulating foam 2 is opposite to the first end face of the conductive coating layer 1, that is, the top of the insulating foam 2 and the first end face of the conductive coating layer 1 are adhered together through the first adhesive layer 4;

the bottom of the insulating foam 2 is provided with a second bonding layer 5, and the bottom of the insulating foam 2 is opposite to the second end surface of the conductive coating layer 1, that is, the bottom of the insulating foam 2 and the second end surface of the conductive coating layer 1 are bonded together through the second bonding layer 5.

In an alternative embodiment, in order to ensure the bonding effect between the insulating foam 2 and the conductive coating layer 1, the first bonding layer 4 may be an insulating double-sided tape, and the second bonding layer 5 may be an insulating double-sided tape or a conductive double-sided tape.

In an alternative embodiment, the conductive coating layer 1 is a conductive cloth or an aluminum foil. For example, the conductive coating layer 1 is a conductive cloth. That is, the conductive coating layer 1 needs to have a conductive capability, and a specific material type thereof is not particularly limited herein.

An electronic device according to an embodiment of the present application is described below with reference to fig. 3 to 4.

As shown in fig. 3 and 4, electronic devices according to further embodiments of the present application include: functional device, circuit board and above-mentioned bubble cotton subassembly.

The functional device is arranged on the circuit board through the foam component, namely the foam component is arranged between the functional device and the circuit board, namely the functional device is grounded through the foam component.

Of course, in the embodiments of the present application, the electronic device includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer, and the like. The embodiment of the present application does not specifically limit the specific type of the electronic device.

Taking the electronic device as a mobile phone as an example, as the mobile phone integrates more and more functions (such as fast charging, photographing, 4G, Wi-Fi, NFC, wireless charging, etc.), and the appearance of the mobile phone is developing towards being small and light, and many functions are converged in a narrow space, so that the ESD and EMI problems in the mobile phone become more serious. The foam component as a conductive auxiliary material has the advantages of good conductive performance, large design freedom degree and the like, is an ideal solution for the ESD and EMI problems of the mobile phone, and is widely applied to the mobile phone at present.

According to the electronic equipment of this application embodiment, adopt and to embed the cotton subassembly of bubble at insulating bubble cotton 2 to realize the ground connection of functional device resistance strain structure, insulating bubble cotton 2 and resistance strain structure at this moment are as piezoresistive sensor, when the cotton subassembly pressurized of bubble, insulating bubble cotton 2 can produce the deformation, resistance strain structure also can produce deformation, resistance strain structure is according to the stress size, its resistance value changes, voltage through detecting piezoresistive sensor, obtain the compressive capacity of the cotton subassembly of bubble, thereby confirm whether the functional device of electronic equipment ground connection is good. The compression amount of the foam component can be detected in real time under the condition of not disassembling the machine, so that the detection time is saved; the whole inspection of each whole machine can be realized, and the grounding consistency of all the machines is ensured; the starting detection can be realized, and the poor grounding of the electronic equipment caused by unexpected factors can be detected.

In an alternative embodiment, as shown in fig. 3, the electronic device further includes a processor connected to the resistance strain structure, and configured to determine a compression amount of the insulating foam 2 according to a resistance value of the resistance strain structure, and determine a grounding state of the functional device and the circuit board according to the compression amount.

The following description will be given by taking an electronic device as an example, a first foam component 7, a second foam component 8 and a third foam component 9 are arranged in the mobile phone, at this time, the first foam component 7 is a main board foam, and the second foam component 8 and the third foam component 9 are both under-screen foam.

At this time, the baseband chip in the mobile phone may serve as a processor, and the GPIO port of the baseband chip is connected to the resistance strain structure in the first foam component 7, so as to obtain the resistance value sent by the resistance strain structure in the first foam component 7, so as to obtain the compression amount of the first foam component 7.

The base band chip GPIO port is connected with a resistance strain structure in the second foam component 8 and a resistance strain structure of the third foam component 9, and is used for obtaining resistance values sent by the resistance strain structure in the second foam component 8 and the resistance strain structure in the third foam component 9 so as to obtain the compression amount of the second foam component 8 and the third foam component 9.

As shown in fig. 4, the resistance R1 of the resistance strain structure can change along with the deformation of itself, and under the condition that the resistance strain structure deforms along with at least one of the functional device or the circuit board, the resistance R1 of the resistance strain structure changes, and further the voltage values at the two ends of the resistance strain structure also change, so that the baseband chip can obtain and detect the voltage values at the two ends of the resistance strain structure, and the compression amount of the foam component is obtained.

The voltage division circuit in the mobile phone comprises a pull-up resistor R2, a pull-up resistor R2 is connected with a resistor strain structure in series, one end of a voltage source is electrically connected with the pull-up resistor R2, and the other end of the voltage source is electrically connected with the resistor strain structure. The voltage source may be configured to output a fixed voltage. When the pull-up resistor R2 and the voltage source are adopted to form the voltage division circuit, the structure of the voltage division circuit can be simpler, and the realization is easier.

In an optional embodiment, the baseband chip compares the compression amount with a target compression amount to judge whether the compression amount is in a standard range so as to complete detection and judgment of a grounding effect, and under the condition that the compression amount is in the target compression amount range, the baseband chip determines that a functional device and a circuit board are grounded, can detect the grounding reliability of some key grounding points, judges the risk of the key grounding points according to the compression amount of the foam assembly, and introduces some measures for avoiding RSE or interference. The grounding reliability can be detected without damaging the whole machine, and the detection efficiency is improved; and all complete machine full-inspection can be realized, the situation that poor products flow into the market is avoided, and the laws and regulations and the risk of complete machine interference are avoided.

In the description herein, references to the description of "alternative implementations," "other embodiments," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A foam assembly, comprising: insulating bubble is cotton, electrically conductive coating and resistance strain structure, resistance strain structure inlays to be located in the insulating bubble is cotton, be used for detecting the cotton compressive capacity of insulating bubble, the outer cladding of insulating bubble has electrically conductive coating.

2. The foam assembly according to claim 1, wherein the electrical resistance strain structure is a metal foil strain gauge or a wire strain gauge, the metal foil strain gauge or the wire strain gauge is disposed in the insulation foam, and the metal foil strain gauge or the wire strain gauge detects a compression amount of the insulation foam when the foam assembly is under pressure.

3. The foam assembly of claim 2 wherein the foil or wire strain gauge is bonded within the insulating foam.

4. Foam assembly according to any of claims 1 to 3, wherein at least one end face of the insulating foam is provided with an adhesive layer.

5. The foam assembly of claim 4 wherein the insulation foam has adhesive layers on opposite ends.

6. The foam assembly of claim 4, wherein the adhesive layer is an insulating double-sided tape or a conductive double-sided tape.

7. The foam assembly of any one of claims 1 to 3, wherein the conductive coating is a conductive cloth or an aluminum foil.

8. An electronic device, comprising: functional device, circuit board and according to claim 1 to 7 any one bubble cotton subassembly, functional device passes through the bubble cotton subassembly and locates on the circuit board.

9. The electronic device of claim 8, further comprising a processor connected to the resistive strain structure for determining a compression amount of the insulating foam according to a resistance value of the resistive strain structure and determining a ground state of the functional device and the circuit board according to the compression amount.

10. The electronic device of claim 9, wherein the processor determines that the functional device and the circuit board are grounded if the compression amount is within a target compression amount range.

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