CN215121324U - PCB consent copper thick liquid structure of environmental protection saving - Google Patents
PCB consent copper thick liquid structure of environmental protection saving Download PDFInfo
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- CN215121324U CN215121324U CN202120482855.8U CN202120482855U CN215121324U CN 215121324 U CN215121324 U CN 215121324U CN 202120482855 U CN202120482855 U CN 202120482855U CN 215121324 U CN215121324 U CN 215121324U
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Abstract
The utility model discloses a PCB consent copper thick liquid structure of environmental protection saving, which comprises an insulating layer, insulating layer top and bottom all are equipped with the conducting layer, it puts into the mouth to have seted up in the middle of the insulating layer, it is equipped with consent copper thick liquid to put into the mouth, consent copper thick liquid includes epoxy, phenol-formaldehyde resin and acrylic resin, be equipped with the diluent layer between epoxy and the phenol-formaldehyde resin, be equipped with the curing agent layer between epoxy and the acrylic resin, be equipped with silver-coated copper powder between phenol-formaldehyde resin and the acrylic resin, the diluent layer is glycidyl ether active diluent, the curing agent layer is organic peroxyl class curing agent, this PCB consent copper thick liquid structure of environmental protection saving has low in production cost, the technology environmental protection, production cycle is short, high conductivity and oxidation resistance's advantage, the problem among the prior art has been solved.
Description
Technical Field
The utility model relates to a material science technical field specifically is a PCB consent copper thick liquid structure of environmental protection saving.
Background
Pcb (printed Circuit board), which is called printed Circuit board in chinese, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing.
In the conductive interconnection of the circuits on two sides of the PCB, the traditional method is to deposit copper and electroplate in a hole after drilling. The copper deposition and electroplating process has the problems of high equipment cost, large occupied area, large water consumption for electroplating, large waste water discharge amount, long time consumption and great pollution.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a PCB consent copper thick liquid structure of environmental protection saving has low in production cost, technology environmental protection, production cycle is short, high conductivity and oxidation resistance's advantage, has solved the problem among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a PCB consent copper thick liquid structure of environmental protection saving, includes the insulating layer, insulating layer top and bottom all are equipped with the conducting layer, seted up in the middle of the insulating layer and put the mouth into, it is equipped with consent copper thick liquid to put into the mouth, consent copper thick liquid includes epoxy, phenolic resin and acrylic resin, be equipped with the diluent layer between epoxy and the phenolic resin, be equipped with the curing agent layer between epoxy and the acrylic resin, be equipped with silver-coated copper powder between phenolic resin and the acrylic resin.
Preferably, the diluent layer is a glycidyl ether based reactive diluent.
Preferably, the curing agent layer is an organic peroxide curing agent.
Preferably, the phenolic resin is a phenol formaldehyde type phenolic resin.
Preferably, the epoxy resin is a novolac type epoxy resin.
Preferably, the acrylic resin is an epoxy acrylate.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. this PCB consent copper thick liquid structure that environmental protection was practiced thrift adopts epoxy resin, phenolic resin and acryl resin and carries out the mixed cost structure through silver-coated copper powder, thinner layer and curing agent layer, makes it have with low costs, production cycle is short and technology environmental protection advantage, has higher electric conductivity and oxidation resistance compared with traditional copper thick liquid.
Drawings
FIG. 1 is a schematic view of the overall structure of an environment-friendly and economical PCB plughole copper paste structure of the present invention;
fig. 2 is the utility model relates to a consent copper thick liquid structural schematic diagram of PCB consent copper thick liquid structure of environmental protection saving.
The figures are labeled as follows: 1 insulating layer, 2 conducting layers, 3 plugged copper paste, 4 epoxy resin, 5 phenolic resin, 6 acrylic resin, 7 curing agent layer, 8 diluent layer and 9 silver-coated copper powder.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1 and 2, an environment-friendly and energy-saving PCB hole-plugging copper paste structure includes an insulating layer 1, conductive layers 2 are disposed on the top and bottom of the insulating layer 1, a placing opening is formed in the middle of the insulating layer 1, hole-plugging copper paste 3 is disposed in the placing opening, the hole-plugging copper paste 3 includes epoxy resin 4, phenolic resin 5 and acrylic resin 6, a diluent layer 8 is disposed between the epoxy resin 4 and the phenolic resin 5, a curing agent layer 7 is disposed between the epoxy resin 4 and the acrylic resin 6, silver-coated copper powder 9 is disposed between the phenolic resin 5 and the acrylic resin 6, the diluent layer 8 is glycidyl ether type active diluent, the curing agent layer 7 is an organic peroxide curing agent, the phenolic resin 5 is phenol formaldehyde type phenolic resin, the epoxy resin 4 is phenol formaldehyde type epoxy resin, and the acrylic resin 6 is epoxy acrylate.
Specifically, the epoxy resin 4, the phenolic resin 5 and the acrylic resin 6 are mixed through the silver-coated copper powder 9, the diluent layer 8 and the curing agent layer 7 to form a cost structure, so that the copper paste has the advantages of low cost, short production period and environment-friendly process, and has higher conductivity and oxidation resistance compared with the traditional copper paste.
The working principle is as follows: the utility model relates to a PCB consent copper thick liquid structure of environmental protection saving, mix epoxy 4 and phenolic resin 5, add diluent layer 8 during the mixing, add acrylic resin 6 and curing agent layer 7 after the mixing is accomplished, continue to mix, after the mixing is accomplished, add silver-coated copper powder 9 and carry out high-speed stirring, after the stirring is accomplished, defoaming ten minutes under vacuum fifty Pa, after the defoaming is accomplished, pour consent copper thick liquid 3 into insulating layer 1 can, when using have with low costs, production cycle is short and technology environmental protection advantage, compare with traditional copper thick liquid and have higher electric conductivity and oxidation resistance.
Having shown and described the basic principles and principal features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The utility model provides a PCB consent copper thick liquid structure of environmental protection saving which characterized in that: including insulating layer (1), insulating layer (1) top and bottom all are equipped with conducting layer (2), it puts the mouth to have seted up in the middle of insulating layer (1), it is equipped with consent copper thick liquid (3) to put into the mouth, consent copper thick liquid (3) include epoxy (4), phenolic resin (5) and acrylic resin (6), be equipped with diluent layer (8) between epoxy (4) and phenolic resin (5), be equipped with curing agent layer (7) between epoxy (4) and acrylic resin (6), be equipped with silver-coated copper powder (9) between phenolic resin (5) and acrylic resin (6).
2. The environmentally friendly economical PCB plug hole copper paste structure as claimed in claim 1, wherein: the diluent layer (8) is glycidyl ether reactive diluent.
3. The environmentally friendly economical PCB plug hole copper paste structure as claimed in claim 1, wherein: the curing agent layer (7) is an organic peroxide curing agent.
4. The environmentally friendly economical PCB plug hole copper paste structure as claimed in claim 1, wherein: the phenolic resin (5) is phenol formaldehyde type phenolic resin.
5. The environmentally friendly economical PCB plug hole copper paste structure as claimed in claim 1, wherein: the epoxy resin (4) is phenolic epoxy resin.
6. The environmentally friendly economical PCB plug hole copper paste structure as claimed in claim 1, wherein: the acrylic resin (6) is epoxy acrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120482855.8U CN215121324U (en) | 2021-03-07 | 2021-03-07 | PCB consent copper thick liquid structure of environmental protection saving |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120482855.8U CN215121324U (en) | 2021-03-07 | 2021-03-07 | PCB consent copper thick liquid structure of environmental protection saving |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215121324U true CN215121324U (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120482855.8U Active CN215121324U (en) | 2021-03-07 | 2021-03-07 | PCB consent copper thick liquid structure of environmental protection saving |
Country Status (1)
| Country | Link |
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| CN (1) | CN215121324U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334221A (en) * | 2022-01-10 | 2022-04-12 | 珠海方正科技多层电路板有限公司 | Hole plugging copper paste, preparation method thereof and printed circuit board |
-
2021
- 2021-03-07 CN CN202120482855.8U patent/CN215121324U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334221A (en) * | 2022-01-10 | 2022-04-12 | 珠海方正科技多层电路板有限公司 | Hole plugging copper paste, preparation method thereof and printed circuit board |
| CN114334221B (en) * | 2022-01-10 | 2024-02-09 | 珠海方正科技多层电路板有限公司 | Plug hole copper paste, preparation method thereof and printed circuit board |
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