CN215118939U - Display module and projector - Google Patents

Abstract

The utility model discloses a display module and a projector, wherein the display module comprises a ceramic substrate, a circuit layer and a self-luminous pixel array; the circuit layer is arranged on the first surface of the ceramic substrate; the circuit layer comprises at least one metal circuit layer, at least one inorganic insulating layer, at least one first external bonding pad and at least one second external bonding pad which are in conductive connection with the metal circuit layer; the metal circuit layer is arranged on and/or in the inorganic insulating layer; the self-luminous pixel array is arranged on the surface of the circuit layer far away from the ceramic substrate and is in conductive connection with the metal circuit layer. The utility model discloses a ceramic substrate cooperation inorganic circuit layer replaces traditional two-sided multilayer circuit board, effectively solves the heat conduction problem of the display module assembly of taking self-luminous pixel array, satisfies the projecting apparatus to its display module assembly's requirements such as stability, precision and flatness, improves projection brightness, contrast and colour gamut scope etc. provides high projection image quality.

Description

Display module and projector

Technical Field

The utility model relates to a display module assembly technical field especially relates to a display module assembly and projecting apparatus.

Background

Projectors have been widely used in the fields of conferences, video viewing, games, and the like as a large-sized mobile display device.

A common projector structure is shown in fig. 1, and includes a heat sink 1, an LED light source 2 disposed on the heat sink, a liquid crystal display module 3, a projection imaging module 4, a driving module 5, a control module 6, a power supply 7, a peripheral screen 8, a heat insulating glass 9 disposed between the liquid crystal display module 3 and the LED light source 2, a parallel light fresnel lens 101 for parallelizing light emitted from the LED light source 2, and a condensing fresnel lens 102 disposed between the liquid crystal display module 3 and the projection imaging module 4. In order to prevent light leakage and reduce light loss, a reflective cup 103 is usually disposed between the liquid crystal panel module 3 and the LED light source 2.

As can be seen from the projector structure shown in fig. 1, light emitted from the LED light source 2 needs to pass through the heat insulation glass 9, the parallel light fresnel lens 101, the liquid crystal screen module 3, the condensing fresnel lens 102, and the projection imaging module 4 to be projected and imaged on the peripheral screen 8, and the effective utilization rate of light is very low. Particularly, the transmittance of the liquid crystal display module 3 is very low, which is only 4% -10%, resulting in very low projection brightness. In order to increase the brightness, the power of the LED light source 2 can be continuously increased, but the power consumption is large, and the heat sink and the fan are bulky, and the liquid crystal display module 3 under the irradiation of the high-power light is burnt due to overheating despite the heat insulation glass 9. The image quality projected by the liquid crystal screen module 3 is limited by the performance defect of the liquid crystal display, and has the defects of small color gamut range, poor contrast, long response time and the like.

In addition, the LED light source 2 is usually a planar point light source, and the emitted light needs to pass through the parallel fresnel lens 101 before being projected onto the liquid crystal panel module 3, but the uniformity is still poor, so that the brightness of the projected picture in the center area is high, and the brightness around the projected picture is low.

Another common projector structure, for example, the projection display device disclosed in chinese patent CN110855968A, includes a self-luminous pixel array, a collimated light uniform series, and a projection lens, where the self-luminous pixel array actively emits light, and each image display pixel included in the self-luminous pixel array is an independent point light source, so as to implement single-pixel independent control or independent control after partitioning a plurality of pixels. The light generated by the pixels passes through the collimation and light uniformization system and is amplified by the projection lens, and then the image generated by the self-luminous pixel array can be amplified and projected on a screen. Compared with the projector structure shown in fig. 1, the projection display device does not use a liquid crystal screen module with very low light transmittance, but generates an image by the self-luminous pixel array and directly enlarges and projects the image on the screen, so that the brightness, the uniformity, the contrast, the color gamut range and the like of projection can be greatly improved, and the image quality of projection is greatly improved. The self-luminous pixel array is usually realized by micro-LED, mini-LED, OLED, laser and the like.

Self-emissive pixel arrays typically employ self-emissive pixels fixed to a double-sided multi-layer circuit board (PCB), which typically employs a fiberglass epoxy (e.g., FR-4) copper clad laminate. When the size of the self-luminous pixel is reduced to dozens of micrometers to hundreds of micrometers, the traditional multilayer circuit board manufactured based on the glass fiber epoxy resin copper-clad plate cannot meet the requirement that the self-luminous pixel array is used as a projector display module in the aspects of stability, precision, flatness and the like. In the welding process, the factors of easy deformation, poor high temperature resistance and the like inherent in the traditional circuit board can also cause the deformation, the warping and the like of the circuit board.

In addition, the glass fiber epoxy resin copper-clad plate has very poor conductivity, heat generated by the self-luminous pixel array cannot be led out as soon as possible, and a large amount of heat accumulated in the self-luminous pixel array can cause the temperature of the projector display module to rise, so that the service life and the luminous efficiency of the projector display module are influenced, the range of the working power of the projector display module is also severely limited, and the further improvement of the projection brightness is limited.

Therefore, the projector display module structure with the self-luminous pixel array manufactured by the traditional double-sided multilayer circuit board has essential defects and defects, cannot meet the requirements of the projector on the display module in the aspects of stability, flatness, precision and the like, cannot effectively solve the heat conduction problem of the display module, and limits the further improvement of projection brightness.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the present invention is to provide a display module with self-luminous pixel array and a projector using the same, which have excellent heat conductivity.

The utility model provides a technical scheme that its technical problem adopted is: a display module is provided, which comprises a ceramic substrate, a circuit layer and a self-luminous pixel array consisting of a plurality of self-luminous pixel points;

the ceramic substrate has a first surface and a second surface which are opposite; the circuit layer is arranged on the first surface of the ceramic substrate;

the circuit layer comprises at least one metal circuit layer, at least one inorganic insulating layer, at least one first external bonding pad and at least one second external bonding pad which are in conductive connection with the metal circuit layer; the metal circuit layer is arranged on the inorganic insulating layer and/or in the inorganic insulating layer;

the self-luminous pixel array is arranged on the surface of the circuit layer far away from the ceramic substrate and is in conductive connection with the metal circuit layer.

Preferably, the circuit layer comprises two metal circuit layers, namely a first metal circuit layer and a second metal circuit layer; the first metal circuit layer is arranged on the surface of the inorganic insulating layer, and the second metal circuit layer is arranged between the first surface of the ceramic substrate and the inorganic insulating layer;

the circuit layer also comprises a plurality of groups of welding pad assemblies arranged on the surface of the inorganic insulating layer, and each welding pad assembly comprises a first welding pad and a second welding pad; the first welding pad is electrically connected with the first metal circuit layer, and the second welding pad is electrically connected with the second metal circuit layer; and the first bonding pad and the second bonding pad of each self-luminous pixel point are respectively in conductive connection with the first bonding pad and the second bonding pad.

Preferably, the circuit layer further comprises a plurality of conductive channels penetrating through the inorganic insulating layer; the second welding pad is in conductive connection with the second metal circuit layer through the conductive channel.

Preferably, the first external connection pad is arranged on the surface of the inorganic insulating layer and is in conductive connection with the first metal circuit layer; the second external bonding pad is arranged on the first surface of the ceramic substrate and is in conductive connection with the second metal circuit layer.

Preferably, the self-luminous pixel array comprises a plurality of surface mount light emitting diodes, and each surface mount light emitting diode comprises at least one self-luminous pixel point;

each self-luminous pixel point comprises at least three luminous chips, and the at least three luminous chips comprise a red light chip, a blue light chip and a green light chip.

Preferably, the self-luminous pixel array comprises a plurality of light-emitting chips, and at least three adjacent light-emitting chips form one self-luminous pixel point; the at least three light emitting chips include a red light chip, a blue light chip and a green light chip.

Preferably, the display module further comprises at least one protective layer; the protective layer covers the self-luminous pixel array and is filled between the self-luminous pixel points.

Preferably, the display module further comprises at least one protective layer; the protective layer is filled in the self-luminous pixel array.

Preferably, the display module further comprises a first protective layer and a second protective layer; the first protective layer is arranged on the surface of the circuit layer and is filled in the self-luminous pixel array; the second protective layer covers the surface of the self-luminous pixel array.

Preferably, the display module further comprises a third protective layer; the third protective layer is arranged above the second protective layer, and through holes are formed in the third protective layer and correspond to the upper portions of the self-luminous pixel points.

Preferably, the display module further comprises a heat sink disposed on the second surface of the ceramic substrate.

Preferably, a heat conducting pad is arranged on the second surface of the ceramic substrate, and the heat radiator is connected with the heat conducting pad in a heat conducting manner.

Preferably, a fan is arranged on the heat sink.

The utility model also provides a projector, including above arbitrary display module assembly.

Preferably, the projector further comprises a projection imaging module, which is arranged on the light-emitting side of the display module;

the projection imaging module comprises a lens; or the projection imaging module comprises a lens and a condensing Fresnel lens; or, the projection imaging module comprises a lens, a light-gathering Fresnel lens and a light-transmitting mirror.

The utility model has the advantages that: the ceramic substrate is matched with the inorganic circuit layer to replace a traditional double-sided multilayer circuit board, so that the heat conduction problem of the display module with the self-luminous pixel array is effectively solved, the requirements of a projector on the stability, the precision, the flatness and the like of the display module are met, the projection brightness, the contrast, the color gamut range and the like are improved, and the high projection image quality is provided.

Drawings

The invention will be further explained with reference to the drawings and examples, wherein:

fig. 1 is a schematic structural diagram of a conventional projector;

fig. 2 is a schematic cross-sectional view of a display module according to a first embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of a display module according to a second embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a display module according to a third embodiment of the present invention;

fig. 5 is a schematic cross-sectional view of a display module according to a fourth embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a display module according to a fifth embodiment of the present invention

Fig. 7 is a schematic structural view of a projector according to a first embodiment of the present invention;

fig. 8 is a schematic structural view of a projector according to a second embodiment of the present invention;

fig. 9 is a schematic structural view of a projector according to a third embodiment of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 2, the display module 100 according to the first embodiment of the present invention is suitable for a projector, and the display module 100 may include a ceramic substrate 10, a circuit layer 20, and a self-luminous pixel array 30 composed of a plurality of self-luminous pixels 31.

The ceramic substrate 10 has first and second opposing surfaces. The wiring layer 20 is disposed on a first surface of the ceramic substrate 10, and the self-luminous pixel array 30 is disposed on a surface of the wiring layer 20 remote from the ceramic substrate 10 and is electrically connected to the wiring layer 20.

Compared with the traditional glass fiber epoxy resin copper-clad plate (such as FR-4) used for preparing the PCB, the ceramic substrate 10 has the advantages of high processing precision, stable shape, small thermal expansion coefficient, low warpage, good flatness, flat surface, good chemical stability, corrosion resistance, good electrical insulation performance and the like. The ceramic substrate 10 may further be made of materials such as aluminum oxide and aluminum nitride, which can meet the requirements of the projector on the stability, flatness, precision, etc. of the display module 100.

In addition, the heat conductivity coefficient of the ceramic substrate 10 is 20-150 times of that of FR-4 in the traditional glass fiber epoxy resin copper-clad plate, and the heat conductivity is excellent.

The circuit layer 20 comprises at least one metal circuit layer, at least one inorganic insulating layer 23, at least one first external bonding pad 24 and at least one second external bonding pad 25 which are electrically connected with the metal circuit layer; the metal wiring layer is disposed on the inorganic insulating layer 23 and/or within the inorganic insulating layer 23; the self-emissive pixel array 30 is electrically connected to the metal wiring layer. The inorganic insulating layer 23 may be formed of, but not limited to, at least one of a glazing, a dielectric layer, silicon oxide, and silicon nitride.

Due to the fact that the heat conductivity coefficient of the inorganic insulating layer 23 in the circuit layer 20 is larger than that of insulating resin in a traditional glass fiber epoxy resin copper-clad plate, heat generated by the self-luminous pixel array 30 on the circuit layer 20 can be quickly conducted to the inorganic insulating layer 23 from the metal circuit layer and then conducted to the ceramic substrate 10 from the inorganic insulating layer 23, and the heat cannot be accumulated in the self-luminous pixel array 30 to cause temperature rise.

In this embodiment, as shown in fig. 2, the metal circuit layer has two layers, namely a first metal circuit layer 21 and a second metal circuit layer 22. The first metal wiring layer 21 is provided on the surface of the inorganic insulating layer 23; the second metal wiring layer 22 is disposed on the first surface of the ceramic substrate 10 so as to be located between the first surface of the ceramic substrate 10 and the inorganic insulating layer 23.

For the metal circuit layer, it can be disposed on the surface of the inorganic insulating layer 23 or covered under the inorganic insulating layer 23, and the inorganic insulating layer 23 can be filled between the circuits in the metal circuit layer

It is to be understood that, in other embodiments, when the metal wiring layers are three or more layers, the inorganic insulating layer 23 is disposed between each adjacent two metal wiring layers.

The first external connection pad 24 is arranged on the surface of the inorganic insulating layer 23 and is electrically connected with the first metal circuit layer 21; the second external pad 25 is disposed on the first surface of the ceramic substrate 10 and is electrically conductively connected to the second metal wiring layer 22.

The circuit layer 20 further includes a plurality of sets of pad assemblies, each pad assembly including a first pad 211 and a second pad 221, which are respectively a positive pad and a negative pad. Each self-luminous pixel 31 has a first pad 311 and a second pad 312 as a positive pad and a negative pad, respectively. The first pad 311 and the second pad 312 are electrically connected with the first pad 211 and the second pad 221 of the pad assembly, respectively; the conductive connection means includes, but is not limited to, laser welding, reflow soldering, or conductive adhesive bonding. The second pad 221 is electrically connected to the second metal wiring layer 22 through the conductive via 26.

In this embodiment, the pad assembly is disposed on the surface of the inorganic insulating layer 23, and the first pad 211 and the first metal circuit layer 21 are located on the same plane, and may be directly connected to the first metal circuit layer 21. The circuit layer 20 further includes a plurality of conductive vias 26 penetrating through the inorganic insulating layer 23 corresponding to the second pads 221 and the second metal circuit layer 22 disposed on different planes; the second pad 221 is electrically connected to the second metal wiring layer 22 through the conductive via 26.

The bonding pad of each metal circuit layer in the circuit layer 20 is interconnected and communicated with the first external bonding pad 24 and the second external bonding pad 25, so that the independent control of each self-luminous pixel point 31 in the self-luminous pixel array 30 or the independent control of a self-luminous pixel combination composed of a plurality of self-luminous pixel points 31 is realized.

The self-emissive pixel array 30 is formed in a variety of ways.

In an alternative embodiment, the self-emissive pixel array 10 includes a plurality of surface mount light emitting diodes (SMDs), each including at least one self-emissive pixel 31; each of the self-luminous pixel points 31 includes at least three light emitting chips including a red light chip, a blue light chip, and a green light chip.

In another alternative embodiment, the self-luminous pixel array 10 includes a plurality of light-emitting chips, and at least three adjacent light-emitting chips constitute a self-luminous pixel 31; the at least three light emitting chips include a red light chip, a blue light chip, and a green light chip.

Further, in the display module 100 of the present invention, in order to better dissipate the heat conducted to the ceramic substrate 10 to the atmosphere, the display module 100 further includes a heat sink 40 disposed on the second surface of the ceramic substrate 10. Corresponding to the heat sink 40, a heat conducting pad 11 may be further disposed on the second surface of the ceramic substrate 10, and the heat sink 40 is thermally connected to the heat conducting pad 11. The thermally conductive connection means includes, but is not limited to, one or more of reflow soldering, vacuum soldering, thermal adhesive bonding, and mechanical fastening.

In order to enhance the heat dissipation function of the heat sink 40, a fan (not shown) may be additionally installed on the heat sink 40, so as to satisfy the heat conduction and heat dissipation problem of the projector on the display module 100 under the high-power and high-brightness working condition.

As shown in fig. 3, a display module 100 according to a second embodiment of the present invention includes a ceramic substrate 10, a circuit layer 20, and a self-luminous pixel array 30 composed of a plurality of self-luminous pixels 31.

The arrangement of the ceramic substrate 10, the wiring layer 20, and the self-luminous pixel array 30 is the same as that of the first embodiment. The present embodiment is different from the first embodiment in that: the display module 100 further includes at least one protection layer 50; the protective layer 50 covers the self-emissive pixel array 30 and fills between the self-emissive pixel sites 31.

The protective layer 50 also extends to the surface of the wiring layer 20. The surface of the protective layer 50 may be a flat surface or an uneven surface. For a rugged surface form, the hills preferably correspond to above the array of light emitting pixels 30 and the valleys preferably correspond to the surface of the wiring layer 20 where the array of self-emitting pixels 30 is not located.

Further, the protective layer 50 of the present embodiment is preferably applied to the self-luminous pixel array 30 composed of a plurality of light-emitting chips.

The protective layer 50 is made of silica gel or epoxy resin; the protective layer 50 may also be light transmissive or semi-transmissive; the surface of the protective layer 50 may be a bright surface or a matte surface.

As shown in fig. 4, a display module 100 according to a third embodiment of the present invention includes a ceramic substrate 10, a circuit layer 20, and a self-luminous pixel array 30 composed of a plurality of self-luminous pixels 31.

The arrangement of the ceramic substrate 10, the wiring layer 20, and the self-luminous pixel array 30 is the same as that of the first embodiment. The present embodiment is different from the first embodiment in that: the display module 100 further includes at least one protection layer 50; the protective layer 50 is filled in the self-luminous pixel array 10, and fills the space between the self-luminous pixel points 31 and the space between the light-emitting chips. The protective layer 50 also extends to the surface of the wiring layer 20.

Further, the protective layer 50 of the present embodiment is preferably applied to the self-luminous pixel array 30 composed of a plurality of light-emitting chips.

The protective layer 50 is made of one or a combination of a photosensitive ink, a photosensitive resist, a green oil and a glazing.

As shown in fig. 5, a display module 100 according to a fourth embodiment of the present invention includes a ceramic substrate 10, a circuit layer 20, and a self-luminous pixel array 30 composed of a plurality of self-luminous pixels 31.

The arrangement of the ceramic substrate 10, the wiring layer 20, and the self-luminous pixel array 30 is the same as that of the first embodiment. The present embodiment is different from the first embodiment in that: the display module 100 further includes a first protective layer 51 and a second protective layer 52.

The first protective layer 51 is arranged on the surface of the circuit layer 20 and filled in the self-luminous pixel array 30, and fills the space between the self-luminous pixel points 31 and the space between the light-emitting chips; the second protective layer 52 covers the surface of the self-light emitting pixel array 30.

Further, the first protective layer 51 and the second protective layer 52 of the present embodiment are preferably applied to the self-luminous pixel array 30 composed of a plurality of light-emitting chips.

The first protective layer 51 is made of one or a combination of photosensitive ink, photosensitive resist, green oil and a glass glazing. The second protective layer 52 is made of silicon gel or epoxy resin, and can be transparent or semi-transparent, and the surface thereof can be a bright surface or a matte surface.

As shown in fig. 6, a display module 100 according to a fifth embodiment of the present invention includes a ceramic substrate 10, a circuit layer 20, and a self-luminous pixel array 30 composed of a plurality of self-luminous pixels 31.

The arrangement of the ceramic substrate 10, the wiring layer 20, and the self-luminous pixel array 30 is the same as that of the first embodiment. The present embodiment is different from the first embodiment in that: the display module 100 further includes a first protective layer 51, a second protective layer 52, and a third protective layer 53.

The specific arrangement of the first protective layer 51 and the second protective layer 52 is the same as that of the fourth embodiment described above. The third protective layer 53 is disposed above the second protective layer 52, and the third protective layer 53 is provided with a through hole 531, the through hole 531 corresponding to above the self-luminous pixel points 31, thereby exposing a portion of the second protective layer 52 above the self-luminous pixel points 31.

The third protective layer 53 may be made of the same material as the first protective layer 51, and may be made of one or a combination of photosensitive ink, photosensitive resist, green oil, and a glazing composition. The surface of the third protective layer 53 may be a bright surface or a matte surface.

The utility model discloses a display module assembly 100 is applicable to the projecting apparatus.

As shown in fig. 7, the projector according to the first embodiment of the present invention includes the display module 100 according to any of the above embodiments, and further includes a projection imaging module 200, a driving module 300, a control module 400, a power module 500, and a chassis (not shown). The display module 100, the projection imaging module 200, the driving module 300, the control module 400, and the power module 500 may be integrated in a chassis.

The projection imaging module 200 is located between the display module 100 and the projection screen 600. The driving module 300 is electrically connected to the display module 100 through the first external connection pad 24 and the second external connection pad 25, and drives and controls the on/off, light emitting form, and the like of the self-light emitting pixel array 30. The control module 400 receives external image data or uses self-stored image data, and controls the driving module 300 after processing, and the driving module 300 directly displays the external image received by the control module 40 or uses self-stored image by the self-emissive pixel array 30 by controlling the operating current of each light-emitting chip in each self-emissive pixel 31 on the display module 100.

The power module 500 is connected to the projection imaging module 200, the driving module 300, the control module 400, and the display module 100, for supplying power thereto.

In this embodiment, the projection imaging module 200 includes a lens disposed on the light-emitting side of the display module 100. The image generated by the display module 100 is projected onto the projection screen 600 after being amplified by the projection imaging module 20, and no component which may cause light loss passes through the image, so that the light utilization rate is the highest, and the brightness projected onto the projection screen 600 is the highest.

The projection imaging module 200 may also have functions including, but not limited to, manual focusing, auto focusing, keystone correction, etc.

The control module 400 may include a control panel, and further includes but is not limited to input and output interfaces such as video input and output interfaces, USB interfaces, audio input and output interfaces, network interfaces, and computer input and output interfaces; the control panel and the input and output interface are arranged outside the case.

The control module 400 may further have but not limited to communication functions such as a WIFI communication function, a bluetooth communication function, and a remote control function, but may also have but not limited to an image distortion compensation function, a trapezoid correction function, a direct display module white balance adjustment function, and a brightness adjustment function.

The driving module 300 is scan driving or static driving.

As shown in fig. 8, the projector according to the second embodiment of the present invention includes the display module 100 according to any of the above embodiments, and further includes a projection imaging module 200, a driving module 300, a control module 400, a power module 500, and a chassis (not shown). The display module 100, the projection imaging module 200, the driving module 300, the control module 400, and the power module 500 may be integrated in a chassis.

Unlike the first embodiment described above, in the present embodiment, the projection imaging module 20 includes a lens 210 and a condensing fresnel lens 220. The light-collecting Fresnel lens 22 is disposed above the light-emitting surface of the display module 100 in parallel to collect the image generated by the display module 100 onto the lens 210.

The image generated by the display module 100 is magnified by the focusing fresnel lens 220 and the lens 210 and projected onto the projection screen 600. The light-collecting fresnel lens 220 has a light-collecting function, and can improve the light-collecting capability and quality of the lens 210, and further improve the image quality and brightness on the projection screen 600.

As shown in fig. 9, the projector according to the third embodiment of the present invention includes the display module 100 according to any of the above embodiments, and further includes a projection imaging module 200, a driving module 300, a control module 400, a power module 500, and a chassis (not shown). The display module 100, the projection imaging module 200, the driving module 300, the control module 400, and the power module 500 may be integrated in a chassis.

Unlike the first embodiment described above, in the present embodiment, the projection imaging module 20 includes a lens 210, a condensing fresnel lens 220, and a mirror 230. The condensing Fresnel lens 22 is arranged above the light-emitting surface of the display module 100 in parallel, the lens 210 is arranged on one side of the condensing Fresnel lens 22 far away from the display module 100 and is not in line with the condensing Fresnel lens 22 any more, and the reflector 230 is arranged between the condensing Fresnel lens 22 and the lens 210 and is used for changing the light path.

The image generated by the display module 100 is projected onto the projection screen 600 after being magnified by the condensing fresnel lens 220, the reflector 230 and the lens 210. The light-collecting fresnel lens 220 has a light-collecting function, so that the light-collecting capability and quality of the lens 210 can be improved, and the image quality and brightness on the projection screen 600 can be further improved. The reflector 23 mainly changes the light path to facilitate the design of the whole structure.

Further, the projector according to the first to third embodiments may further include an audio module (not shown), and the control module 400 receives external audio data or uses audio data stored in itself, controls the audio module after processing, and synchronously plays the received external audio or uses audio stored in itself by the audio module.

With the projectors of the first to third embodiments, instead of using the liquid crystal display module, the heat insulating glass, and the parallel fresnel lens with low light transmittance, the light emitting chip in each self-emitting pixel 31 of the self-emitting pixel array 30 in the display module 100 directly emits light to form an image, and the light generated by the imaging is projected onto the projection screen 600 through the projection imaging module 200, so that the light loss generated along the way is small, and the purposes of low power and high brightness can be achieved.

In addition, since the liquid crystal display module is not used, the disadvantages of low contrast, small color gamut range, and long response time, which are peculiar to liquid crystal display, do not exist, and the imaging by directly emitting light from the light emitting chip in each self-luminous pixel point 31 of the self-luminous pixel array 30 in the display module 100 has the advantages of high contrast, wide color gamut range, short response time, and the like.

Because the image is formed by the mode of directly emitting light from the light emitting pixel array 30, the problem of uneven projection brightness caused by uneven light intensity distribution of a light source projected to the liquid crystal display module through the parallel light Fresnel lens) can be solved, and the uniform and high-brightness projection effect can be realized.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all the equivalent structures or equivalent processes that are used in the specification and the attached drawings or directly or indirectly applied to other related technical fields are included in the patent protection scope of the present invention.

Claims (15)

1. A display module is characterized by comprising a ceramic substrate, a circuit layer and a self-luminous pixel array consisting of a plurality of self-luminous pixel points;

the ceramic substrate has a first surface and a second surface which are opposite; the circuit layer is arranged on the first surface of the ceramic substrate;

the circuit layer comprises at least one metal circuit layer, at least one inorganic insulating layer, at least one first external bonding pad and at least one second external bonding pad which are in conductive connection with the metal circuit layer; the metal circuit layer is arranged on the inorganic insulating layer and/or in the inorganic insulating layer;

the self-luminous pixel array is arranged on the surface of the circuit layer far away from the ceramic substrate and is in conductive connection with the metal circuit layer.

2. The display module according to claim 1, wherein the circuit layer comprises two metal circuit layers, namely a first metal circuit layer and a second metal circuit layer; the first metal circuit layer is arranged on the surface of the inorganic insulating layer, and the second metal circuit layer is arranged between the first surface of the ceramic substrate and the inorganic insulating layer;

the circuit layer also comprises a plurality of groups of welding pad assemblies arranged on the surface of the inorganic insulating layer, and each welding pad assembly comprises a first welding pad and a second welding pad; the first welding pad is electrically connected with the first metal circuit layer, and the second welding pad is electrically connected with the second metal circuit layer; and the first bonding pad and the second bonding pad of each self-luminous pixel point are respectively in conductive connection with the first bonding pad and the second bonding pad.

3. The display module of claim 2, wherein the circuit layer further comprises a plurality of conductive vias extending through the inorganic insulating layer; the second welding pad is in conductive connection with the second metal circuit layer through the conductive channel.

4. The display module according to claim 2, wherein the first external connection pad is disposed on the surface of the inorganic insulating layer and electrically connected to the first metal circuit layer; the second external bonding pad is arranged on the first surface of the ceramic substrate and is in conductive connection with the second metal circuit layer.

5. The display module as recited in claim 1, wherein said self-emissive pixel array comprises a plurality of surface mount light emitting diodes, each of said surface mount light emitting diodes comprising at least one of said self-emissive pixels;

each self-luminous pixel point comprises at least three luminous chips, and the at least three luminous chips comprise a red light chip, a blue light chip and a green light chip.

6. The display module of claim 1, wherein the self-emissive pixel array comprises a plurality of light-emitting chips, at least three adjacent light-emitting chips forming one self-emissive pixel; the at least three light emitting chips include a red light chip, a blue light chip and a green light chip.

7. The display module of claim 1, wherein the display module further comprises at least one protective layer; the protective layer covers the self-luminous pixel array and is filled between the self-luminous pixel points.

8. The display module of claim 1, wherein the display module further comprises at least one protective layer; the protective layer is filled in the self-luminous pixel array.

9. The display module of claim 1, wherein the display module further comprises a first protective layer and a second protective layer; the first protective layer is arranged on the surface of the circuit layer and is filled in the self-luminous pixel array; the second protective layer covers the surface of the self-luminous pixel array.

10. The display module of claim 9, further comprising a third passivation layer; the third protective layer is arranged above the second protective layer, and through holes are formed in the third protective layer and correspond to the upper portions of the self-luminous pixel points.

11. The display module according to any one of claims 1-10, further comprising a heat sink disposed on the second surface of the ceramic substrate.

12. The display module assembly according to claim 11, wherein the second surface of the ceramic substrate is provided with a heat conducting pad, and the heat sink is thermally connected to the heat conducting pad.

13. The display module assembly of claim 11, wherein the heat sink has a fan disposed thereon.

14. A projector comprising the display module of any one of claims 1-13.

15. The projector according to claim 14, further comprising a projection imaging module disposed on a light exit side of the display module;

the projection imaging module comprises a lens; or the projection imaging module comprises a lens and a condensing Fresnel lens; or, the projection imaging module comprises a lens, a light-gathering Fresnel lens and a light-transmitting mirror.

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