CN215073419U

CN215073419U - Integrated bottom shell and LED display module comprising same

Info

Publication number: CN215073419U
Application number: CN202121429092.7U
Authority: CN
Inventors: 王训; 李阳; 刘世良; 左霞光; 汤仁君
Original assignee: Shenzhen Zhouming Technology Co Ltd
Current assignee: Shenzhen Zhouming Technology Co Ltd
Priority date: 2021-06-25
Filing date: 2021-06-25
Publication date: 2021-12-07
Anticipated expiration: 2031-06-25

Abstract

The utility model discloses an integral type drain pan and LED display module assembly including this integral type drain pan belongs to LED display screen technical field. The integrated bottom shell comprises a main shell body and a receiving card heat dissipation part used for receiving heat dissipation of a card, wherein the main shell body is provided with an avoiding opening used for supplying wires, and the receiving card heat dissipation part is located at a position corresponding to the receiving card of the avoiding opening. Because the main shell and the heat radiating part of the receiving card are integrated, compared with the existing bottom shell processing and heat radiator processing which are completely independent from each other, the production process steps can be obviously reduced, and the assembly process steps during the subsequent assembly of the LED display module can also be reduced; when the heat dissipation is carried out, the heat generated by the receiving card is conducted to the heat dissipation part of the receiving card, and the heat dissipation part of the receiving card can be conducted to the main shell again, so that the whole heat dissipation area of the integrated bottom shell can be fully utilized, the heat dissipation speed can be effectively accelerated, and the heat dissipation effect can be improved.

Description

Integrated bottom shell and LED display module comprising same

Technical Field

The utility model relates to a LED display screen technical field, more specifically say, it relates to integral type drain pan and the LED display module assembly including this integral type drain pan.

Background

At present, in an LED display screen product, a heat generating component mainly includes an LED lamp bead, an IC chip, a power supply, and a receiving card. For outdoor products, the power supply and the receiving card are usually placed in a power supply box, and the power supply conducts and dissipates heat by contacting with the power supply box; the heat of the receiving card is dissipated through the additionally arranged radiator; the heat on the LED display module is mainly the heat that LED lamp pearl and IC chip produced, usually dispels through the drain pan.

However, currently, the bottom case and the heat sink for receiving the heat of the card are two completely independent components, which not only increases the production process and the assembly process, but also makes the heat dissipation area of the bottom case not fully utilized.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an integral type drain pan and including the LED display module assembly of this integral type drain pan, solve the drain pan and be used for receiving the radiating radiator of card and be two complete completely independent parts, this has not only increased production technology process and assembly technology process to the heat radiating area of drain pan does not have by make full use of's technical problem.

The above technical purpose of the present invention can be achieved by the following technical solutions:

according to the utility model discloses an aspect provides an integral type drain pan, including the main casing body and be used for receiving the radiating card heat dissipation part of receiving of card, the main casing body is equipped with and is used for supplying the mouth of dodging of walking the line, it is located to receive card heat dissipation part dodge the position that the mouth corresponds the receiving card.

Preferably, the heat dissipating part of the receiving card is provided with a first boss for contacting the receiving card.

As a further optimization, the heat dissipation part of the receiving card is provided with a plurality of heat dissipation fins.

As a further optimization, the side wall of the avoiding opening is provided with a mounting column for mounting and fixing the power supply box.

As a further optimization, the side wall of the avoiding opening is provided with a convex edge for contacting with the power supply box.

According to another aspect of the utility model, a LED display module assembly is provided, include the power pack and install receiving card and power in the power pack, still include as aforementioned integral type drain pan, the power pack is installed and is corresponded on this integral type drain pan dodge the position of mouth, the position of receiving the card with the position of receiving card heat dissipation part corresponds.

As a further refinement, the receiving card is provided with a second boss for contact with the receiving card heat dissipation portion.

Preferably, the second boss is provided with a first heat-conducting member for contacting with the heat dissipation portion of the receiving card.

Preferably, a second heat-conducting member is disposed between the power supply box and the heat dissipating portion of the receiving card.

Preferably, a third heat-conducting member is arranged between the power supply and the power supply box.

To sum up, the utility model discloses following beneficial effect has: the integrated bottom shell in the utility model has the advantages that the main shell and the heat radiating part of the receiving card are integrated, so that the production process steps can be obviously reduced and the assembly process steps during the assembly of the subsequent LED display module can be reduced from the perspective of the production process compared with the existing bottom shell processing and radiator processing which are completely independent from each other; when the heat dissipation is carried out, the heat generated by the receiving card is conducted to the heat dissipation part of the receiving card, and the heat dissipation part of the receiving card can be conducted to the main shell again, so that the whole heat dissipation area of the integrated bottom shell can be fully utilized, the heat dissipation speed can be effectively accelerated, and the heat dissipation effect can be improved.

Drawings

FIG. 1 is a schematic structural diagram of an integrated bottom case according to a first embodiment;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is a cross-sectional view of the one-piece bottom housing in contact with a receiving card according to one embodiment;

FIG. 4 is an enlarged view of a portion of FIG. 3 at B;

FIG. 5 is a schematic diagram of a partially exploded structure of an LED display module according to a second embodiment;

fig. 6 is an exploded schematic view of a receiving card, a power supply and a power supply box of the LED display module according to the second embodiment.

In the figure: 11. a main housing; 111. avoiding the mouth; 112. mounting a column; 1121. mounting holes; 113. a convex edge; 12. receiving a card heat dissipation portion; 121. a first boss; 122. a heat dissipating fin; 2. receiving a card; 21. a second boss; 3. a power supply box; 4. a power source; 5. a first heat-conducting member; 6. a second heat-conducting member; 7. a third thermally conductive member.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "in contact" with another element, it can be directly in contact with the other element or may be indirectly in contact with the other element through intervening elements. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments. It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example one

The present embodiment provides an integrated bottom case, as shown in fig. 1-4, the integrated bottom case includes a main case 11 and a card receiving and heat dissipating portion 12 for receiving heat dissipation of a card 2, the main case 11 is provided with an avoiding opening 111 for routing wires, the avoiding opening 111 penetrates through the main case 11, and the card receiving and heat dissipating portion 12 is located at a position where the avoiding opening 111 corresponds to the card 2. It should be noted that the integral structure of the integral bottom case, including the main case 11 and the card-receiving heat-dissipating portion 12, is preferably integrally formed, for example, by injection molding or casting.

In the integrated bottom case in the embodiment, because the main case 11 and the card receiving and heat dissipating portion 12 are integrated, from the perspective of the production process, compared with the existing bottom case processing and heat sink processing which are completely independent from each other, the steps of the production process can be significantly reduced, and the steps of the assembly process during the subsequent assembly of the LED display module can also be reduced; when the heat is radiated, the heat generated by the receiving card 2 is conducted to the receiving card heat radiation portion 12, and the receiving card heat radiation portion 12 can be conducted to the main casing 11 again, so that not only can the whole heat radiation area of the integrated bottom casing be fully utilized, but also the heat radiation speed can be effectively accelerated and the heat radiation effect can be improved. In addition, the volume of the card receiving and radiating portion 12 in this embodiment may be smaller than the volume of the existing separate heat sink, but since the card receiving and radiating portion 12 can radiate heat through the main housing 11, the radiating effect at the card receiving position 2 can still be significantly improved, and the maximum temperature at the card receiving position 2 can be reduced by more than 7 ℃ by applying the scheme of the integrated bottom case in this embodiment, compared with the scheme of the existing separate heat sink, through the temperature cloud detection at the card receiving position 2.

In the present embodiment, as shown in fig. 1, 3 and 4, the receiving-card heat-radiating portion 12 is provided with the first bosses 121 for contact with the receiving card 2, and the receiving-card heat-radiating portion 12 is in contact with the receiving card 2 through the first bosses 121 with higher heat conduction efficiency and speed than without contact, so that the heat radiation efficiency and speed can be improved. In this embodiment, the heat-dissipating portion 12 of the card receiving device is provided with a plurality of heat-dissipating fins 122, the plurality of heat-dissipating fins 122 are uniformly spaced, the first bosses 121 are located between the plurality of heat-dissipating fins 122, and the first bosses 121 and the heat-dissipating fins 122 are mutually avoided. In the present embodiment, the first bosses 121 are not in contact with the heat dissipation fins 122. In other embodiments, the first bosses 121 may be in contact with the surrounding heat dissipation fins 122. After the heat on the receiving card 2 is conducted to the receiving card heat dissipation portion 12 through the first bosses 121, the heat can be dissipated through the heat dissipation fins 122, and the heat dissipation area is effectively increased by the plurality of heat dissipation fins 122. In the present embodiment, the heat dissipating fins 122 have a square plate shape. In other embodiments, the heat dissipation fins 122 may also be curved, or a plurality of heat dissipation fins 122 are connected in sequence to form a wave shape.

In the present embodiment, as shown in fig. 1 and fig. 2, a mounting column 112 for mounting and fixing a power supply box is provided on a side wall of the avoidance opening 111, the mounting column 112 is provided with a mounting hole 1121, and the power supply box is screwed into the mounting hole 1121 of the mounting column 112 for mounting and fixing. In this embodiment, a convex edge 113 for contacting with the power supply box is disposed on a side wall of the avoiding opening 111, the convex edge 113 surrounds the side wall of the avoiding opening 111 by a circle, and the power supply box contacts with the convex edge 113 when being installed. Protruding edge 113's setting, the installation of the power pack of being convenient for on the one hand is fixed, can realize contact heat-conduction between on the other hand power pack and the main casing body 11, and the heat that the power produced can be via the main casing body 11 effluvium, and the heat that produces such as LED lamp pearl and IC component also can be via the power pack effluvium.

In the integrated bottom case of the embodiment, the main case 11 and the card receiving and heat dissipating portion 12 are integrated, which not only can significantly reduce the steps of the production process, but also can reduce the steps of the assembly process during the assembly of the subsequent LED display module, when heat is dissipated, the heat generated by the card receiving 2 is conducted to the card receiving and heat dissipating portion 12, and the card receiving and heat dissipating portion 12 can be conducted to the main case 11 again, so that not only can the whole heat dissipating area of the integrated bottom case be fully utilized, but also the heat dissipating speed can be effectively increased and the heat dissipating effect can be effectively improved.

Example two

As shown in fig. 5, the LED display module includes a power box 3, and a power source 4 and a receiving card 2 installed in the power box 3, and the LED display module further includes an integrated bottom case in the first embodiment, the power box 3 is installed on the integrated bottom case at a position corresponding to the avoidance opening 111, the receiving card 2 is at a position corresponding to the receiving card heat dissipation portion 12 of the integrated bottom case, and the specific structure of the integrated bottom case is described in the first embodiment, which is not repeated herein.

In the present embodiment, as shown in fig. 5 and 6 in conjunction, the receiving card 2 is provided with the second bosses 21 for contact with the receiving card heat-radiating portion 12, the positions of the second bosses 21 correspond to the positions of the first bosses 121, and the contact of the second bosses 21 with the first bosses 121 achieves contact heat conduction between the receiving card 2 and the receiving card heat-radiating portion 12. When the receiving card 2 generates heat during use, the heat on the receiving card 2 is conducted to the receiving-card heat-dissipating portion 12 via the second bosses 21 and the first protrusions 121 due to the temperature difference, and then dissipated through the receiving-card heat-dissipating portion 12 and the main housing 11. Preferably, the first heat-conducting member 5 is disposed on the second boss 121, and the first heat-conducting member 5 contacts with the first boss 21. The first heat-conducting member 5 is preferably a silicone heat-conducting member, and the first heat-conducting member 5 is provided to increase the heat-conducting and heat-dissipating area on the one hand and to use a material having a better heat-conducting property, such as silicone, on the other hand, so that the heat-conducting speed between the receiving card 2 and the receiving-card heat-dissipating portion 12 can be effectively increased.

In the present embodiment, as shown in fig. 5 and 6, the second heat-conducting member 6 is provided between the power supply box 3 and the card-receiving heat-radiating portion 12, and the contact heat conduction between the power supply box 3 and the card-receiving heat-radiating portion 12 is achieved by the second heat-conducting member 6. The second heat conducting member 6 is preferably a silica gel heat conducting member, and the second heat conducting member 6 is provided to increase heat conducting and heat dissipating areas, and to adopt a material with better heat conducting property, such as silica gel, so as to effectively improve the heat dissipating speed and the heat dissipating effect of the power supply box 3. In the present embodiment, a third heat conduction member 7 is disposed between the power source 4 and the power source box 3, and the contact heat conduction between the power source 4 and the power source box 3 is enhanced by the third heat conduction member 7. The third heat conducting member 7 is preferably a silica gel heat conducting member, the third heat conducting member 7 increases heat conducting and heat dissipating areas on one hand, and the other hand adopts a material with better heat conducting property, such as silica gel, so that the heat dissipating speed and the heat dissipating effect of the power supply 6 can be effectively improved.

The LED display module in this embodiment adopts the integral type drain pan, main casing 11 and receiving card radiating portion 12 are as an organic whole, not only can reduce production technology process step remarkably, also can reduce the assembly technology process step when follow-up LED display module assembles, when dispelling the heat, the heat that the receiving card 2 produced conducts to receiving card radiating portion 12, receiving card radiating portion 12 can conduct again for main casing 11, not only can fully utilize the holistic heat radiating area of this integral type drain pan, also can accelerate the radiating rate effectively and improve the radiating effect.

The above embodiments are to be considered illustrative, and not restrictive, and all changes, equivalents, and modifications that come within the spirit and scope of the invention are desired to be protected by the following claims.

Claims

1. An integral type drain pan, its characterized in that: including the main casing body with be used for receiving the radiating receiving card heat dissipation part of card, the main casing body is equipped with and is used for supplying the mouth of dodging of walking the line, receiving card heat dissipation part is located dodge the position that the mouth corresponds the receiving card.

2. The one-piece bottom case of claim 1, wherein: the receiving card radiating part is provided with a first boss used for being in contact with a receiving card.

3. The one-piece bottom case of claim 1, wherein: the heat dissipation part of the receiving card is provided with a plurality of heat dissipation fins.

4. The one-piece bottom case of claim 1, wherein: the side wall of the avoiding opening is provided with a mounting column for mounting and fixing the power supply box.

5. The one-piece bottom case of claim 1, wherein: the side wall of the avoiding opening is provided with a convex edge used for being in contact with the power supply box.

6. The utility model provides a LED display module assembly, includes the power pack and installs receiving card and power in the power pack, its characterized in that: the integrated bottom shell is characterized by further comprising an integrated bottom shell as claimed in any one of claims 1 to 5, wherein the power supply box is mounted on the integrated bottom shell at a position corresponding to the avoidance port, and the position of the receiving card corresponds to the position of the heat dissipation part of the receiving card.

7. The LED display module of claim 6, wherein: the receiving card is provided with a second boss for contacting with the heat dissipation part of the receiving card.

8. The LED display module of claim 7, wherein: and a first heat-conducting piece which is used for being in contact with the heat dissipation part of the receiving card is arranged on the second boss.

9. The LED display module of claim 6, wherein: and a second heat-conducting piece is arranged between the power box and the heat dissipation part of the receiving card.

10. The LED display module of claim 6, wherein: and a third heat-conducting piece is arranged between the power supply and the power supply box.