CN215073232U - Improve bonding die board of solder support - Google Patents
Improve bonding die board of solder support Download PDFInfo
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- CN215073232U CN215073232U CN202121712400.7U CN202121712400U CN215073232U CN 215073232 U CN215073232 U CN 215073232U CN 202121712400 U CN202121712400 U CN 202121712400U CN 215073232 U CN215073232 U CN 215073232U
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- tin
- bonding die
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- die board
- solder
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Abstract
The utility model discloses an improve bonding die board of solder support, its structure is that support is established to bonding die board body both sides bottom, establish control panel on the outer wall of bonding die board body one side, it opens the spout that sets up from top to bottom to correspond on the inner wall of bonding die board body both sides, the horizontal pole both ends are equipped with slider and both sides spout sliding connection, an electric telescopic handle output is connected respectively to horizontal pole both sides bottom surface, electric telescopic handle sets up on the bonding die board body, the solder support is established to horizontal pole lateral surface middle part cover, the dead lever parallel with the horizontal pole is worn to be equipped with on solder support top, be equipped with the tin dish on the outer wall of dead lever both sides respectively, install on the bonding die board body roof and draw the tin machine, it is located the dead lever top to draw the tin machine. The utility model has the advantages that: structural design is reasonable, draws tin machine and solder support separation design, and electric telescopic handle promotes the horizontal pole of installation solder support, slides from top to bottom, and the solder support does not remove together with drawing the tin machine, can prevent that soldering tin oxidation in the tin dish can improve the bonding die board and draw the tin quality, improves welding quality.
Description
Technical Field
The utility model relates to an improve bonding die board of solder support.
Background
When the sheet sticking machine works, the soldering tin is uniformly tiled on the surface of the frame in a tin drawing mode, and the tin drawing device can move quickly in the tin drawing process.
In the prior art, a solder support for fixing solder is designed on a tin drawing device, and the solder on the solder support can move at a high speed along with the tin drawing device, so that the surface of the solder generates frictional oxidation to influence the tin drawing quality.
SUMMERY OF THE UTILITY MODEL
The utility model provides an improve bonding die board of solder support, its purpose aims at overcoming the above-mentioned not enough that prior art exists, realizes the mobility of solder support, improves the bonding die board and draws tin quality.
The technical solution of the utility model is as follows: the utility model provides an improve bonding die board of solder support, its structure includes bonding die board body, the support is established to bonding die board body both sides bottom, establish control panel on the outer wall of bonding die board body one side, it has the spout that sets up from top to bottom to correspond to open on the inner wall of bonding die board body both sides, the horizontal pole both ends are equipped with slider and both sides spout sliding connection, an electric telescopic handle output is connected respectively to horizontal pole both sides bottom surface, electric telescopic handle sets up on bonding die board body, the solder support is established to horizontal pole lateral surface middle part cover, the dead lever parallel with the horizontal pole is worn to be equipped with on solder support top, be equipped with the tin dish on the outer wall of dead lever both sides respectively, install the tin machine of drawing on bonding die board body roof, the tin machine of drawing is located the dead lever top.
Preferably, the cross rod is detachably connected with the solder support through a first bolt, and the cross rod is detachably connected with the solder support through a second bolt.
The utility model has the advantages that: structural design is reasonable, draws tin machine and solder support separation design, and electric telescopic handle promotes the horizontal pole of installation solder support, slides from top to bottom, and the solder support does not remove together with drawing the tin machine, can prevent that soldering tin oxidation in the tin dish can improve the bonding die board and draw the tin quality, improves welding quality.
Drawings
Fig. 1 is a schematic structural view of the improved bonding sheet machine of the solder support of the present invention.
Fig. 2 is a schematic view of the structure of the solder support of fig. 1.
In the figure, 1 is a bonding machine table body, 2 is a bracket, 3 is an electric telescopic rod, 4 is a control panel, 5 is a tin drawing machine, 6 is a solder bracket, 7 is a chute, 8 is a sliding block, 9 is a cross rod, 10 is a first bolt, 11 is a second bolt, 12 is a fixed rod, and 13 is a tin plate.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments.
As shown in fig. 1 and 2, a die bonder for improving a solder support structurally comprises a die bonder machine table body 1, supports 2 are arranged at the bottom ends of two sides of the die bonder machine table body 1, a control panel 4 is arranged on the outer wall of one side of the die bonder machine table body 1, sliding grooves 7 which are arranged up and down are correspondingly formed in the inner walls of two sides of the die bonder machine table body 1, sliding blocks 8 and the sliding grooves 7 on two sides are arranged at two ends of a cross rod 9, an output end of an electric telescopic rod 3 is respectively connected to the bottom surfaces of two sides of the cross rod 9, the electric telescopic rod 3 is arranged on the die bonder machine table body 1, the solder support 6 is sleeved at the middle part of the outer side surface of the cross rod 9, a fixing rod 12 which is parallel to the cross rod 9 is arranged at the top end of the solder support 6, tin plates 13 are respectively arranged on the outer walls of two sides of the fixing rod 12, a tin drawing machine 5 is arranged on the top plate of the die bonder machine table body 1, and the tin drawing machine 5 is positioned above the fixing rod 12.
The cross bar 9 is detachably connected with the solder support 6 through a first bolt 10, and the cross bar 9 is detachably connected with the solder support 6 through a second bolt 11. The installation angle can be adjusted, and the solder brackets 6 with different models can be replaced.
According to the structure, in work, the tin drawing machine 5 and the solder support 6 are designed to be separated, the electric telescopic rod 3 pushes the cross rod 9, the sliders 8 on the two sides of the cross rod 9 slide up and down in the sliding grooves 7, height change of the solder support 6 is achieved, the solder support 6 does not move together with the tin drawing machine 5, oxidation of soldering tin in the tin plate 13 can be prevented, welding quality is improved, and practicability of the solder support 6 can be improved.
All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, many modifications and improvements can be made without departing from the inventive concept, and all of them belong to the protection scope of the present invention.
Claims (2)
1. A chip bonding machine table with improved solder supports is characterized by comprising a chip bonding machine table body (1), supports (2) are arranged at the bottom ends of two sides of the chip bonding machine table body (1), a control panel (4) is arranged on the outer wall of one side of the chip bonding machine table body (1), sliding grooves (7) which are arranged up and down are correspondingly formed in the inner walls of two sides of the chip bonding machine table body (1), sliding blocks (8) are arranged at two ends of a cross rod (9) and are in sliding connection with the sliding grooves (7) of the two sides, the bottom surfaces of two sides of the cross rod (9) are respectively connected with the output end of an electric telescopic rod (3), the electric telescopic rod (3) is arranged on the chip bonding machine table body (1), the solder supports (6) are sleeved in the middle of the outer side surfaces of the cross rod (9), fixing rods (12) which are parallel to the cross rod (9) are penetrated through the top ends of the solder supports (6), tin plates (13) are respectively arranged on the outer walls of two sides of the fixing rods (12), a tin drawing machine (5) is arranged on a top plate of the chip bonding machine table body (1), the tin drawing machine (5) is positioned above the fixing rod (12).
2. The die bonder with the improved solder support as claimed in claim 1, wherein the cross bar (9) is detachably connected with the solder support (6) through a first bolt (10), and the cross bar (9) is detachably connected with the solder support (6) through a second bolt (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121712400.7U CN215073232U (en) | 2021-07-26 | 2021-07-26 | Improve bonding die board of solder support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121712400.7U CN215073232U (en) | 2021-07-26 | 2021-07-26 | Improve bonding die board of solder support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073232U true CN215073232U (en) | 2021-12-07 |
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ID=79219431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121712400.7U Active CN215073232U (en) | 2021-07-26 | 2021-07-26 | Improve bonding die board of solder support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073232U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639764A (en) * | 2022-03-10 | 2022-06-17 | 深圳市聚飞光电股份有限公司 | LED support, LED lamp bead and manufacturing method thereof |
-
2021
- 2021-07-26 CN CN202121712400.7U patent/CN215073232U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114639764A (en) * | 2022-03-10 | 2022-06-17 | 深圳市聚飞光电股份有限公司 | LED support, LED lamp bead and manufacturing method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 88, Zhongtong East Road, Shuofang street, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jiangsu Donghai Semiconductor Co.,Ltd. Address before: No. 88, Zhongtong East Road, Shuofang street, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI ROUM SEMICONDUCTOR TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |